JPS6328279U - - Google Patents

Info

Publication number
JPS6328279U
JPS6328279U JP1986123107U JP12310786U JPS6328279U JP S6328279 U JPS6328279 U JP S6328279U JP 1986123107 U JP1986123107 U JP 1986123107U JP 12310786 U JP12310786 U JP 12310786U JP S6328279 U JPS6328279 U JP S6328279U
Authority
JP
Japan
Prior art keywords
socket
package
view
board
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986123107U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986123107U priority Critical patent/JPS6328279U/ja
Publication of JPS6328279U publication Critical patent/JPS6328279U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)
  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案によるICソケツトの一実施
例を示す側面図、第2図は同じくICパツケージ
を搭載した状態の側面図、第3図は同じくICパ
ツケージを基板へ装着する様子を示す斜視図、第
4図は従来のICソケツトの平面図、第5図は従
来のICソケツトへICパツケージを搭載した状
態の平面図、第6図は同じく基板への装着の様子
を示している斜視図である。 図において、1はICソケツト、2はICソケ
ツトのコンタクト、3はICソケツトのリードピ
ン、4はICパツケージ、5はICパツケージの
リードピン、6は基板、7はスルホールである。
尚、図中同一符号は同一又は相当部分を示す。
Fig. 1 is a side view showing an embodiment of the IC socket according to this invention, Fig. 2 is a side view of the same IC package mounted thereon, and Fig. 3 is a perspective view showing how the IC package is attached to the board. , Fig. 4 is a plan view of a conventional IC socket, Fig. 5 is a plan view of an IC package mounted on a conventional IC socket, and Fig. 6 is a perspective view showing how it is attached to a board. be. In the figure, 1 is an IC socket, 2 is a contact of the IC socket, 3 is a lead pin of the IC socket, 4 is an IC package, 5 is a lead pin of the IC package, 6 is a substrate, and 7 is a through hole.
Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICパツケージを搭載して基板へ装着するIC
ソケツトにおいて、ICパツケージを側面に取り
付けたことを特徴とするICソケツト。
An IC that is equipped with an IC package and mounted on a board.
An IC socket characterized in that an IC package cage is attached to the side of the socket.
JP1986123107U 1986-08-11 1986-08-11 Pending JPS6328279U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986123107U JPS6328279U (en) 1986-08-11 1986-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986123107U JPS6328279U (en) 1986-08-11 1986-08-11

Publications (1)

Publication Number Publication Date
JPS6328279U true JPS6328279U (en) 1988-02-24

Family

ID=31013906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986123107U Pending JPS6328279U (en) 1986-08-11 1986-08-11

Country Status (1)

Country Link
JP (1) JPS6328279U (en)

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