JPS63278367A - Solid-state image sensor - Google Patents
Solid-state image sensorInfo
- Publication number
- JPS63278367A JPS63278367A JP62115216A JP11521687A JPS63278367A JP S63278367 A JPS63278367 A JP S63278367A JP 62115216 A JP62115216 A JP 62115216A JP 11521687 A JP11521687 A JP 11521687A JP S63278367 A JPS63278367 A JP S63278367A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- solid
- ceramic container
- vessel
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000003384 imaging method Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は固体撮像装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a solid-state imaging device.
光電変換、蓄積、走査の３８１能を有する固体撮像装置
は、小型、軽量のイメージセンサとして工業用、民生用
の各種用途に使用されるようになっている。Solid-state imaging devices having 381 functions of photoelectric conversion, storage, and scanning have come to be used as small, lightweight image sensors in various industrial and consumer applications.
第２図および第３図は従来の固体撮像装置を示す一部切
欠斜視図である。FIGS. 2 and 3 are partially cutaway perspective views showing a conventional solid-state imaging device.
第２図および第３図に示すように、セラミック容器１の
内側中央に素子載置部が設けられ、該素子載置部の周囲
に設けられた内部リード（図示せず）かセラミック容器
１の壁を貫いてセラミック容器１の外側に設けられた外
部リード２に接続されてなるパッケージの前記素子載置
部に固体撮像用半導体チップ３を搭載して前記内部リー
ドに電気的に接続する。次に、ガラス等の透明受光板４
をセラミック容器１の外縁最上面の上に載置するか又は
外縁最上面と表面を一致させるように埋込んで封止する
。As shown in FIGS. 2 and 3, an element mounting part is provided at the center inside the ceramic container 1, and an internal lead (not shown) provided around the element mounting part is connected to the ceramic container 1. A semiconductor chip 3 for solid-state imaging is mounted on the element mounting portion of the package, which is connected to external leads 2 provided on the outside of the ceramic container 1 through the wall, and electrically connected to the internal leads. Next, a transparent light receiving plate 4 such as glass
is placed on the top surface of the outer edge of the ceramic container 1 or embedded so that its surface coincides with the top surface of the outer edge and sealed.
上述した従来の固体撮像装置は、受光板の表面に傷がつ
きやすく、その結果映像信号に不用な信号が混入すると
いう問題点がある。The conventional solid-state imaging device described above has a problem in that the surface of the light receiving plate is easily scratched, and as a result, unnecessary signals are mixed into the video signal.
又、製造工程中および輸送中の事故を防ぐため受光板表
面を保護する目的で表面にシールをはると、シールをは
がす際に接着剤が残る等の問題点がある。Furthermore, when a seal is applied to the surface of the light receiving plate for the purpose of protecting the surface to prevent accidents during the manufacturing process and transportation, there are problems such as adhesive remaining when the seal is removed.
本発明の固体撮像装置は、最上面内側に段が設けられた
セラミック容器の内側中央に素子載置部が設けられ該素
子載置部の周囲に設けられた内部リードが前記セラミッ
ク容器の壁を貫いて前記セラミック容器の外側に設けら
れた外部リードに接続されてなるパッケージと、前記素
子載置部に搭載され且つ前記内部リードと電気的に接続
された固体撮像用半導体チップと、前記段の上面に載置
されｉ「記セラミック容器の最上面より低く封止された
透明受光板とを含んで構成される。In the solid-state imaging device of the present invention, an element mounting section is provided at the center of the inside of a ceramic container with a step provided on the inside of the top surface, and an internal lead provided around the element mounting section extends along the wall of the ceramic container. a package formed by passing through the ceramic container and connected to an external lead provided on the outside of the ceramic container; a solid-state imaging semiconductor chip mounted on the element mounting section and electrically connected to the internal lead; and a transparent light-receiving plate placed on the top surface and sealed below the top surface of the ceramic container.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を説明するための一部切欠斜
視図である。FIG. 1 is a partially cutaway perspective view for explaining one embodiment of the present invention.
第１図に示すように、最上面内側に段５が設けられたセ
ラミック容器１の内側中央に素子載置部が設けられ、該
素子載置部の周囲に設けられた内部リード（１示せず）
がセラミック容器１の壁を貫いてセラミック容器１の外
側に設けられた外部リード２に接続されてなるパッケー
ジの前記素子載置部に固体撮像用半導体チップ３を搭載
して前記内部リードと電気的に接続する。次に、ガラス
等の透明受光板４を段５の上面に載置し、透明受光板４
の表面がセラミック容器１の最上面より低くなるように
封止される。As shown in FIG. 1, an element mounting section is provided at the center of the inside of a ceramic container 1 having a step 5 on the inside of the top surface, and an internal lead (1 not shown) provided around the element mounting section. )
The semiconductor chip 3 for solid-state imaging is mounted on the element mounting portion of the package, which penetrates the wall of the ceramic container 1 and is connected to the external leads 2 provided on the outside of the ceramic container 1, and is electrically connected to the internal leads. Connect to. Next, a transparent light receiving plate 4 made of glass or the like is placed on the top surface of the stage 5, and the transparent light receiving plate 4 is placed on the upper surface of the step 5.
The ceramic container 1 is sealed such that its surface is lower than the top surface of the ceramic container 1.
以上説明したように本発明は、透明受光板の表面がセラ
ミック容器の最上面よりも低く封止されているため、製
造工程中に透明受光板を下側にして取扱っても透明受光
板に傷が付く機会が格段に減少するという効果を有する
。As explained above, in the present invention, the surface of the transparent light receiving plate is sealed lower than the top surface of the ceramic container, so even if the transparent light receiving plate is handled with the transparent light receiving plate facing downward during the manufacturing process, the transparent light receiving plate will not be damaged. This has the effect of significantly reducing the chances of being stuck.
又表面保護のシールをは・る場合にも、シールはセラミ
ック容器の最上面で支えられ、直接透明受光板の表面に
付着しないため、従来問題であった透明受光板表面の接
着剤の残りの問題もなくなるという効果を有する。Also, when applying a surface protection seal, the seal is supported by the top surface of the ceramic container and does not adhere directly to the surface of the transparent light receiving plate, so there is no possibility of residual adhesive remaining on the surface of the transparent light receiving plate, which was a problem in the past. This has the effect of eliminating problems.
第１図は本発明の一実施例を説明するための一部切欠斜
視図、第２図および第３図は従来の固体撮像装置を示す
一部切欠斜視図である。
１・・・セラミック容器、２・・・外部リード、３・・
・半導体チップ、４・・・透明受光板、５・・・段。
−二′ｔ
・・′［
第７図
ｒ２；
７） ％２［］第３図FIG. 1 is a partially cutaway perspective view for explaining an embodiment of the present invention, and FIGS. 2 and 3 are partially cutaway perspective views showing a conventional solid-state imaging device. 1... Ceramic container, 2... External lead, 3...
- Semiconductor chip, 4...transparent light receiving plate, 5...stage. -2't...'[Figure 7 r2; 7) %2[]Figure 3
Claims (1)
に素子載置部が設けられ該素子載置部の周囲に設けられ
た内部リードが前記セラミック容器の壁を貫いて前記セ
ラミック容器の外側に設けられた外部リードに接続され
てなるパッケージと、前記素子載置部に搭載され且つ前
記内部リードと電気的に接続された固体撮像用半導体チ
ップと、前記段の上面に載置され前記セラミック容器の
最上面より低く封止された透明受光板とを含むことを特
徴とする固体撮像装置。An element mounting part is provided at the center of the inside of a ceramic container having a step on the inside of the top surface, and an internal lead provided around the element mounting part penetrates the wall of the ceramic container and extends to the outside of the ceramic container. a package connected to the provided external leads; a solid-state imaging semiconductor chip mounted on the element mounting section and electrically connected to the internal leads; and a ceramic container mounted on the top surface of the stage. a transparent light-receiving plate sealed below the top surface of the solid-state imaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62115216A JPS63278367A (en) | 1987-05-11 | 1987-05-11 | Solid-state image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62115216A JPS63278367A (en) | 1987-05-11 | 1987-05-11 | Solid-state image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63278367A true JPS63278367A (en) | 1988-11-16 |
Family
ID=14657238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62115216A Pending JPS63278367A (en) | 1987-05-11 | 1987-05-11 | Solid-state image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63278367A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318158A (en) * | 1987-06-22 | 1988-12-27 | Hitachi Ltd | Solid-state image sensing device |
| JP2019519967A (en) * | 2016-04-28 | 2019-07-11 | ▲寧▼波舜宇光▲電▼信息有限公司 | Imaging module, molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly, method of manufacturing the same, and electronic device |
-
1987
- 1987-05-11 JP JP62115216A patent/JPS63278367A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318158A (en) * | 1987-06-22 | 1988-12-27 | Hitachi Ltd | Solid-state image sensing device |
| JP2019519967A (en) * | 2016-04-28 | 2019-07-11 | ▲寧▼波舜宇光▲電▼信息有限公司 | Imaging module, molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly, method of manufacturing the same, and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR970005706B1 (en) | Ccd and the manufacturing method | |
| US20050285265A1 (en) | Frame scale package using contact lines through the elements | |
| US20070152345A1 (en) | Stacked chip packaging structure | |
| US20080251705A1 (en) | Image sensor chip package | |
| CN111048534A (en) | Sensor package structure | |
| JP2002261260A (en) | Solid-state imaging device | |
| JPH0485859A (en) | Airtightly sealed package and bonding member | |
| JP4899279B2 (en) | Solid-state imaging device | |
| US20060255253A1 (en) | Method for packaging an image sensor die and a package thereof | |
| JPS63278367A (en) | Solid-state image sensor | |
| JPH0728014B2 (en) | Solid-state imaging device | |
| US20040113286A1 (en) | Image sensor package without a frame layer | |
| KR20010064908A (en) | Semiconductor package | |
| JPS60136254A (en) | Solid-state image pickup device and manufacture thereof | |
| JPS6360561A (en) | Solid-state image sensing device | |
| JPS551116A (en) | Manufacture of semiconductor device | |
| JPH02229453A (en) | Semiconductor device and manufacture thereof | |
| JPS6267863A (en) | Solid-state image pickup device | |
| JPH04114456A (en) | Photoelectric converter | |
| JP2684861B2 (en) | Solid-state imaging device | |
| JPS61222384A (en) | Semiconductor device and its production | |
| JPH1168126A (en) | Ultraviolet-ray detector | |
| JPS62154667A (en) | Solid-state image pickup device | |
| JP3397614B2 (en) | Solid-state imaging device | |
| JPS6362358A (en) | Solid-state image sensing device |