JPS63273582A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS63273582A JPS63273582A JP62106342A JP10634287A JPS63273582A JP S63273582 A JPS63273582 A JP S63273582A JP 62106342 A JP62106342 A JP 62106342A JP 10634287 A JP10634287 A JP 10634287A JP S63273582 A JPS63273582 A JP S63273582A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- laser processing
- optical path
- oscillation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 claims abstract description 39
- 230000005540 biological transmission Effects 0.000 claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000003754 machining Methods 0.000 abstract 7
- 238000010586 diagram Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は加工対象物にレーザ光を照射して孔明加工、溶
接、切断等を行うレーザ加工機に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing machine that performs drilling, welding, cutting, etc. by irradiating a workpiece with laser light.
（従来の技術）
従来のレーザ加工機は、加工対牟物にレーザ光を照射し
てレーザ加工を行うレーザ加工部と、このレーザ加工部
にレーザ光を供給するレーザ発振部とを有し、レーザ発
振部から出射したレーザ光を伝送光路によりレーザ加工
部へ伝送するように構成されている。(Prior Art) A conventional laser processing machine includes a laser processing section that performs laser processing by irradiating a laser beam onto a solid object to be processed, and a laser oscillation section that supplies laser light to the laser processing section. The laser beam emitted from the laser oscillation section is configured to be transmitted to the laser processing section through a transmission optical path.
ところが、上記のようなレーザ加工機はレーザ加工部と
レーザ発振部とが１対１の構成となっているため、レー
ザ発振部に故障等が生じた場合にはレーザ加工部にレー
ザ光を供給できなくなり、レーザ加工、が中断される不
具合があった。However, since the laser processing machine described above has a one-to-one configuration between the laser processing section and the laser oscillation section, if a failure occurs in the laser oscillation section, the laser beam cannot be supplied to the laser processing section. There was a problem where laser processing was interrupted.
（発明が解決しようとする問題点）
以上のように従来のレーザ加工機は、レーザ発振部が故
障等を起すとレーザ加工部にレーザ光を供給できなくな
り、レーザ加工が中断されることがあった。(Problems to be Solved by the Invention) As described above, in conventional laser processing machines, if a failure occurs in the laser oscillation section, laser light cannot be supplied to the laser processing section, and laser processing may be interrupted. Ta.
本発明はこのような事情を考慮してなされたもので、そ
の目的とするところは、レーザ加工部の故障等によりレ
ーザ加工が中断されることのない信頼性の高いレーザ加
工機を提供することにある。The present invention has been made in consideration of these circumstances, and its purpose is to provide a highly reliable laser processing machine in which laser processing is not interrupted due to failure of the laser processing section, etc. It is in.
［発明の構成］
（問題点を解決するための手段）
かかる目的を達成するために本発明は、加工対歳物にレ
ーザ光を照射してレーザ加工を行うレーザ加工部と、こ
のレーザ加工部にレーザ光を供給する２台のレーザ発振
部と、これらレーザ発振部より出射されたレーザ光を前
記レーザ加工部へ伝送する伝送光路と、この伝送光路に
入射されるレーザ光の供＠源を切換える切換手段とを具
備したことを特徴とするものである。[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a laser processing section that performs laser processing by irradiating a laser beam onto an old object to be processed, and this laser processing section. two laser oscillation units that supply laser light to the laser oscillation units, a transmission optical path that transmits the laser light emitted from these laser oscillation units to the laser processing unit, and a source of the laser light that enters the transmission optical path. The present invention is characterized by comprising a switching means for switching.
（作 用）
本発明は上記の如く構成することにより一方のレーザ発
振部が故障した場合にレーザ光の供給源を他方のレーザ
発振部に切換えることによりレーザ光をレーザ加工部に
供給することができる。(Function) By configuring the present invention as described above, when one laser oscillation section fails, the laser light supply source can be switched to the other laser oscillation section to supply laser light to the laser processing section. can.
（実 施 例） 以下、本発明を図面に示す実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on embodiments shown in the drawings.
第１図および第２図は本発明によるレーザ加工機の第１
実施例を示す構成図である。このレーザ加工機は図示し
ない加工対象物にレーザ光１６を照射してレーザ加工を
行うレーザ加工部１０と、このレーザ加工部１０にレー
ザ光１６を供給する２台のレーザ発振部１１．１２と、
これらレーザ発振部１１．１２より出射されたレーザ光
１６をレーザ加工部１０へ伝送する伝送光路１５とを有
し、伝送光路１５内にはレーザ光１６の供給源を切換え
るための切換１１３ａ、１３ｂと、レーザ光１６をレー
ザ加工部１０へ導くための複数の反射［１１４が設けら
れている。FIGS. 1 and 2 show a first diagram of a laser processing machine according to the present invention.
FIG. 2 is a configuration diagram showing an example. This laser processing machine includes a laser processing section 10 that performs laser processing by irradiating a workpiece (not shown) with a laser beam 16, and two laser oscillation sections 11 and 12 that supply the laser beam 16 to the laser processing section 10. ,
It has a transmission optical path 15 that transmits the laser beams 16 emitted from these laser oscillation units 11 and 12 to the laser processing unit 10, and in the transmission optical path 15 there are switches 113a and 13b for switching the supply source of the laser beams 16. A plurality of reflections [114] are provided for guiding the laser beam 16 to the laser processing section 10.
上記切換１＊１３ａはレーザ発振部１１からのレーザ光
１６をレーザ加工部１０へ導くもので、レーザ発振部１
１が作動している時には第１図のように伝送光路１５内
に位置し、レーザ発振部１１が停止している時には伝送
光路１５内から退去するようになっている。また、切換
鏡１３ｂはレーザ発振部１２からのレーザ光１６をレー
ザ加工部１０へ導くもので、レーザ発振部１２が作動し
ている時には第２図のように伝送光路１５内に位置し、
レーザ発振部１２が停止している時には伝送光路１５内
から退去するようになっている上記の構成によると、レ
ーザ発振部１１より出射されたレーザ光１６は伝送光路
１５内に入り、反射！［１４および切換１１１３ａによ
りレーザ加工部１０へ導かれる。また、レーザ発振部１
２より出射されたレーザ光１６は伝送光路１５内に入り
、反射鏡１４および切換鏡１３ｂによりレーザ加工部１
０へ導かれる。ここで、切換１］ｔ１３ａ。The above switching 1*13a is for guiding the laser beam 16 from the laser oscillation section 11 to the laser processing section 10.
When the laser oscillation section 11 is in operation, it is located within the transmission optical path 15 as shown in FIG. 1, and when the laser oscillation section 11 is stopped, it is moved out of the transmission optical path 15. The switching mirror 13b guides the laser beam 16 from the laser oscillation section 12 to the laser processing section 10, and is located within the transmission optical path 15 as shown in FIG. 2 when the laser oscillation section 12 is in operation.
According to the above configuration in which the laser oscillation section 12 exits from the transmission optical path 15 when it is stopped, the laser beam 16 emitted from the laser oscillation section 11 enters the transmission optical path 15 and is reflected! [14 and the switch 1113a lead to the laser processing section 10. In addition, the laser oscillation unit 1
The laser beam 16 emitted from the laser beam 16 enters the transmission optical path 15 and is transmitted to the laser processing section 1 by the reflecting mirror 14 and the switching mirror 13b.
It leads to 0. Here, switching 1] t13a.
１３ｂを伝送光路１５内に出し入れすることにょリレー
ザ発撮部１１．１２がらのレーザ光１６をレーザ加工部
１０に選択的に導くことができる。13b into and out of the transmission optical path 15, the laser beam 16 from the laser emission section 11.12 can be selectively guided to the laser processing section 10.
従って、一方のレーザ発振部１１が故障した場合にレー
ザ光１６の供給源を他方のレーザ発振部１２に切換える
ことによりレーザ光１６をレーザ加工部１０に供給する
ことができる。よって、従来のようにレーザ発振部の放
陣等によりレーザ加工が中衛されるようなことがなく、
レーザ加工機の信頼性を向上させることができる。また
、レーザ発振部１１．１２から出射したレーザ光１６は
・約１％程度の吸収率を有する切換！１１１３ａ、
・１３ｂおよび反射鏡１４で反射を繰り返し、レーザ加
工部１０へ到達するが、本実施例では鏡の枚数が等しい
ため伝送中の吸収量も等しくなる。従って、レーザ発振
部１１．１２の出力が同じであればほぼ一定のレーザ出
力が加工点で得ることができる。Therefore, when one laser oscillation section 11 fails, the laser light 16 can be supplied to the laser processing section 10 by switching the supply source of the laser light 16 to the other laser oscillation section 12. Therefore, unlike in the past, laser processing is not interrupted due to the firing of the laser oscillation unit, etc.
The reliability of laser processing machines can be improved. In addition, the laser light 16 emitted from the laser oscillation units 11 and 12 has an absorption rate of about 1%! 1113a,
- The light is repeatedly reflected by the mirror 13b and the reflecting mirror 14 and reaches the laser processing section 10, but in this embodiment, since the number of mirrors is the same, the amount of absorption during transmission is also the same. Therefore, if the outputs of the laser oscillation units 11 and 12 are the same, a substantially constant laser output can be obtained at the processing point.
なお、本発明は上記実施例に限定されるものではない。Note that the present invention is not limited to the above embodiments.
たとえば上記実施例では伝送光路１５に入射されるレー
ザ光１６の供給源を切換える手段として２枚の切換！１
１１３ａ、１３ｂを用いたが、レーザ発振部１１．１２
を第３図および第４図の如く配置し、切換鏡１３を伝送
光路１５内に出し入れすることにより１枚の切換１１１
３でレーザ光１６の供給源を切換えることができる。ま
た、第５図および第６図に示すようにレーザ発振部１１
゜１２からレーザ加工部１０までの伝送光路１５の伝送
距離を等しくすることによりほぼ同じ加工性能を得るこ
とができる。For example, in the above embodiment, two switching devices are used as means for switching the source of the laser beam 16 incident on the transmission optical path 15! 1
113a and 13b were used, but the laser oscillation part 11.12
are arranged as shown in FIGS. 3 and 4, and by inserting and removing the switching mirror 13 into and out of the transmission optical path 15, one switching mirror 111 can be formed.
3, the source of the laser beam 16 can be switched. Further, as shown in FIGS. 5 and 6, the laser oscillation section 11
By making the transmission distances of the optical transmission paths 15 from 12 to the laser processing section 10 equal, substantially the same processing performance can be obtained.
［発明の効果］
以上説明したように本発明によれば、加工対象物にレー
ザ光を照射してレーザ加工を行うレーザ加工部と、この
レーザ加工部にレーザ光を供給する２台のレーザ発振部
と、これらレーザ発振部より出射されたレーザ光を前記
レーザ加工部へ伝送する伝送光路と、この伝送光路に入
射されるレーザ光の供給源を切換える切換手段とを備え
た構成としたので、レーザ発振部の故障等によりレーザ
加工が中断されることのない信頼性の高いレーザ加工機
を提供できる。[Effects of the Invention] As explained above, according to the present invention, there is a laser processing unit that performs laser processing by irradiating a workpiece with laser light, and two laser oscillators that supply laser light to this laser processing unit. A transmission optical path for transmitting the laser beams emitted from these laser oscillation sections to the laser processing section, and a switching means for switching the source of the laser beam incident on the transmission optical path, It is possible to provide a highly reliable laser processing machine in which laser processing is not interrupted due to failure of the laser oscillation unit or the like.
第１図および第２図は本発明の第１実施例を示し、レー
ザ光の供給源を切換える手段として２枚の切換鏡を用い
た場合のレーザ加工機の構成図、第３図および第４図、
は本発明の第２実施例を示し、レーザ光の供給源を切換
える手段として１枚の切換鏡を用いた場合のレーザ加工
機の構成図、第５図および第６図は本発明の第３及び第
４実施例を示し、伝送光路の伝送距離を等しくした場合
のレーザ加工機の構成図である。
１０・・・レーザ加工部、１１．１２・・・レーザ発振
部、１３・・・切換鏡、１４・・・反射鏡、１５・・・
伝送光路。
第１図
第２図
第一回
第５図
第６図FIGS. 1 and 2 show a first embodiment of the present invention, and FIGS. figure,
1 shows a second embodiment of the present invention, and FIGS. 5 and 6 show a configuration diagram of a laser processing machine in which one switching mirror is used as means for switching the source of laser light, and FIGS. 5 and 6 show a third embodiment of the present invention. and 4th Example is shown, and is a block diagram of the laser processing machine when the transmission distance of a transmission optical path is made equal. 10... Laser processing section, 11.12... Laser oscillation section, 13... Switching mirror, 14... Reflecting mirror, 15...
Transmission optical path. Figure 1 Figure 2 Figure 1 Figure 5 Figure 6
Claims (1)
ザ加工部と、このレーザ加工部にレーザ光を供給する２
台のレーザ発振部と、これらレーザ発振部より出射され
たレーザ光を前記レーザ加工部へ伝送する伝送光路と、
この伝送光路に入射されるレーザ光の供給源を切換える
切換手段とを具備したことを特徴とするレーザ加工機。A laser processing section that performs laser processing by irradiating the workpiece with laser light, and 2 that supplies laser light to this laser processing section.
a laser oscillation section of the stand; a transmission optical path that transmits the laser light emitted from these laser oscillation sections to the laser processing section;
A laser processing machine characterized by comprising: switching means for switching a supply source of laser light incident on the transmission optical path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62106342A JPS63273582A (en) | 1987-05-01 | 1987-05-01 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62106342A JPS63273582A (en) | 1987-05-01 | 1987-05-01 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63273582A true JPS63273582A (en) | 1988-11-10 |
Family
ID=14431156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62106342A Pending JPS63273582A (en) | 1987-05-01 | 1987-05-01 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63273582A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444213A (en) * | 1992-04-27 | 1995-08-22 | Kabushiki Kaisha Toshiba | Remote maintenance method and system for a fusion reactor |
| GB2327059A (en) * | 1997-07-10 | 1999-01-13 | Honda Motor Co Ltd | Method and apparatus for welding with laser beams |
| JP2004055771A (en) * | 2002-07-18 | 2004-02-19 | Nec Lcd Technologies Ltd | Method for manufacturing semiconductor thin film and laser irradiation system |
| CN110315077A (en) * | 2019-07-29 | 2019-10-11 | 佛山根固激光科技有限公司 | A kind of laser switching module and 3D printing equipment |
-
1987
- 1987-05-01 JP JP62106342A patent/JPS63273582A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444213A (en) * | 1992-04-27 | 1995-08-22 | Kabushiki Kaisha Toshiba | Remote maintenance method and system for a fusion reactor |
| GB2327059A (en) * | 1997-07-10 | 1999-01-13 | Honda Motor Co Ltd | Method and apparatus for welding with laser beams |
| GB2327059B (en) * | 1997-07-10 | 2000-08-23 | Honda Motor Co Ltd | Method of and apparatus for welding workpiece with laser beams |
| US6127647A (en) * | 1997-07-10 | 2000-10-03 | Honda Giken Kogyo Kabushiki Kaisha | Methods of and apparatus for welding workpiece with laser beams |
| JP2004055771A (en) * | 2002-07-18 | 2004-02-19 | Nec Lcd Technologies Ltd | Method for manufacturing semiconductor thin film and laser irradiation system |
| CN110315077A (en) * | 2019-07-29 | 2019-10-11 | 佛山根固激光科技有限公司 | A kind of laser switching module and 3D printing equipment |
| CN110315077B (en) * | 2019-07-29 | 2021-06-01 | 佛山根固激光科技有限公司 | Laser switching module and 3D printing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5589089A (en) | YAG laser machine with safety system for beam path adjustment | |
| US5323269A (en) | System for transmitting and monitoring laser light and method for optical monitoring of a transmission path | |
| JPH02281678A (en) | Apparatus and method for multiplexing coherent high energy continuous wave laser beam | |
| JP2006281268A (en) | Laser beam machine | |
| US4873417A (en) | Laser machining apparatus | |
| JPS63273582A (en) | Laser beam machine | |
| TW375547B (en) | Laser beam dividing apparatus | |
| CN112620930A (en) | Semiconductor laser processing multi-focus optical path system, laser system and processing method | |
| JPS5455184A (en) | Semiconductor laser light source unit | |
| EP0298490A3 (en) | Semiconductor laser optical system | |
| JP3942585B2 (en) | Laser processing method and apparatus | |
| JPS6363589A (en) | Laser beam machining method for high reflection factor material | |
| JPS61293694A (en) | Laser beam machine | |
| US5740194A (en) | Solid-state laser apparatus | |
| US4507790A (en) | Laser system with partitioned prism | |
| JP2019181534A (en) | Laser oscillator and laser processing device using the same | |
| TWI705869B (en) | Laser integrated switching device | |
| JPH07294833A (en) | Laser beam splitting device | |
| JPH04270091A (en) | Laser beam machine | |
| JP3177775B2 (en) | Photosynthesis method and synthetic emission optical system | |
| JP2875952B2 (en) | Laser beam splitter | |
| JPH0270396A (en) | Laser processing machine | |
| JPH0766903B2 (en) | Semiconductor manufacturing method | |
| JPS6037185Y2 (en) | Laser processing equipment | |
| JPH01271089A (en) | Laser beam machine |