JPS63266649A - Production of al substrate for optical disk - Google Patents

Production of al substrate for optical disk

Info

Publication number
JPS63266649A
JPS63266649A JP28024987A JP28024987A JPS63266649A JP S63266649 A JPS63266649 A JP S63266649A JP 28024987 A JP28024987 A JP 28024987A JP 28024987 A JP28024987 A JP 28024987A JP S63266649 A JPS63266649 A JP S63266649A
Authority
JP
Japan
Prior art keywords
stamper
substrate
thermoplastic resin
resin film
grooving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28024987A
Other languages
Japanese (ja)
Inventor
Toshikazu Sato
佐藤 敏和
Hideo Fujimoto
日出男 藤本
Hideyoshi Usui
碓井 栄喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP28024987A priority Critical patent/JPS63266649A/en
Publication of JPS63266649A publication Critical patent/JPS63266649A/en
Pending legal-status Critical Current

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  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To form a heat insulating pregrooved layer having high adhesion to an Al alloy substrate by sticking a thermoplastic resin film to the surface of an Al alloy disk, then superposing a stamper for grooving thereon, pressuring the stamper under heating and stripping the stamper for grooving after the pressurization. CONSTITUTION:An adhesive agent 2 is coated on the surface of the Al alloy disk 1 and a PC film 3 having 50mum thickness is placed thereon and is stuck to the disk 1. The film and disk are then subjected to hot pressing by using an upper platen 7 which has the nickel stamper 5 and is controlled to the temp. (165-200 deg.C) higher by 15-50 deg.C than the glass transition temp. of the film 3 and a lower platen 6 which is controlled to the temp. above 100 deg.C and lower (110 deg.C) than the glass transition temp. Tg of the film 3. The nickel stamper 5 is thereafter stripped from the film 3 and the Al substrate 9 for the optical disk with heat insulating pregrooves is obtd.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、光ディスク基盤に関するものであリ、更に詳
しくは追記型、消去書換型で高信頼性、高強度の断熱、
グループ層を有する光ディスク用アルミニウム(Alと
略記する)基盤の製造方法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an optical disc substrate, and more specifically, it is a write-once type, erasable/rewritable type, highly reliable, high-strength heat insulating,
The present invention relates to a method of manufacturing an aluminum (abbreviated as Al) substrate for optical discs having a group layer.

[従来の技術] レーザー光を利用した光ディスクは高記録密度が得られ
る記憶媒体として開発・実用化が進められており、基盤
材料としてはポリカーボネート(以下PCと言う)やア
クリル(以下PMMAと言う)等の透明プラスチックや
ガラスが用いられている。
[Prior art] Optical disks that use laser light are being developed and put into practical use as storage media that can obtain high recording density, and the base materials used are polycarbonate (hereinafter referred to as PC) and acrylic (hereinafter referred to as PMMA). Transparent plastics and glass such as are used.

プラスチック基盤は射出成形やスタンピングによって低
コスト大量生産が可能なため、コンパクトディスクやレ
ーザーディスク等の読出専用形に多用されており、一部
の追記型にも使用されている。しかしながら長期間保存
した場合の吸湿等による性能劣化、ソリによる形状変化
、また複屈折等、種々の問題を含んでおり信頼性には懸
念が残っている。更にコンピュータ等のバックアップメ
モリとして使用する場合には、磁気ディスクに比較して
アクセスタイムが長く、さらにデータ転送速度も遅い等
、性能面でも改善の余地がある。
Because plastic substrates can be mass-produced at low cost by injection molding or stamping, they are often used in read-only formats such as compact discs and laser discs, and are also used in some write-once discs. However, when stored for a long time, there are various problems such as performance deterioration due to moisture absorption, shape change due to warping, and birefringence, and there are still concerns about reliability. Furthermore, when used as a backup memory for computers, etc., there is room for improvement in terms of performance, such as longer access times and slower data transfer speeds than with magnetic disks.

データ転送速度を上げるためにはディスク基盤の高速回
転が要求されるが、プラスチック基盤では機械的強度が
不充分である。
In order to increase the data transfer rate, the disk substrate must rotate at high speed, but the mechanical strength of the plastic substrate is insufficient.

また、ガラスディスクの場合には、長期信頼性には優れ
るものの割れに対する信頼性が小さく高速回転には適当
でない。
Further, in the case of a glass disk, although it has excellent long-term reliability, it has low reliability against cracking and is not suitable for high-speed rotation.

このようにプラスチックおよびガラスによる光ディスク
用基盤においては、高信頼性・高性能化の面で充分とは
言えない。
As described above, optical disc substrates made of plastic and glass are not sufficient in terms of high reliability and performance.

[従来技術の問題点] 上記のような問題点を改善するために一部には金属製基
盤を用いた光ディスク基盤が検討されている0例えばA
l合金製基盤は磁気ディスクに多用されている通り長期
信頼性や高速回転に対する機械的強度はプラスチックや
ガラス基盤に比較して著しく優れている。しかしながら
、光ディスクとして使用する場合にはA42合金製基盤
は熱伝導性が良いため、基盤と記録媒体との間に断熱層
が不可欠となる。また記録媒体をコーティングする面に
はトラッキング、フォーカシングのためのグループも必
要となる。
[Problems with the prior art] In order to improve the above-mentioned problems, some optical disc substrates using metal substrates are being considered.
L-alloy substrates, which are often used in magnetic disks, are significantly superior in long-term reliability and mechanical strength against high-speed rotation compared to plastic or glass substrates. However, when used as an optical disk, since the A42 alloy substrate has good thermal conductivity, a heat insulating layer is essential between the substrate and the recording medium. Groups for tracking and focusing are also required on the surface coated with the recording medium.

従来、基盤との断熱や、グループ層の形成はガラス製透
明スタンパーと紫外線硬化樹脂の組合せで、検討されて
いたが、未だ満足できる結果は得られていない。すなわ
ち紫外線硬化樹脂とAft合金製基盤の密着性を向上さ
せるとガラススタンパーの剥離が困難となり、また、ガ
ラススタンパーの剥離性を向上させると紫外線硬化樹脂
とAfL合金製基盤との密着性が不充分となっていた。
Conventionally, a combination of a transparent glass stamper and an ultraviolet curing resin has been considered for insulation with the base and for forming a group layer, but no satisfactory results have been obtained yet. In other words, if the adhesion between the UV-curable resin and the AfL alloy substrate is improved, it becomes difficult to remove the glass stamper, and if the releasability of the glass stamper is improved, the adhesion between the UV-curable resin and the AfL alloy substrate becomes insufficient. It became.

[問題点を解決する為の手段] 本発明の目的は前述の如き問題点を解決し基盤との密着
性に優れた断熱、グループ層を有する高信頼性・高性能
光ディスク用Al合金基盤の製造方法を提供することに
ある。
[Means for Solving the Problems] The purpose of the present invention is to solve the above-mentioned problems and to manufacture a highly reliable and high-performance Al alloy substrate for optical discs having a heat-insulating and group layer with excellent adhesion to the substrate. The purpose is to provide a method.

すなわち本発明の光ディスク用AfL基盤の製造方法は
、A1合金製ディスクの表面に熱可塑性樹脂を貼り合わ
せた後、該熱可塑性樹脂にグルービング用スタンパーを
重ねて、該グルービング用スタンパーを前記熱可塑性樹
脂のガラス転移温度Tg以上に加熱しつつ、全体を加熱
、加圧し、しかるのち前記グルービング用スタンパーを
熱可塑性樹脂より剥離することを特徴としている。
That is, in the method of manufacturing an AfL substrate for an optical disk of the present invention, after bonding a thermoplastic resin to the surface of an A1 alloy disk, a grooving stamper is superimposed on the thermoplastic resin, and the grooving stamper is bonded to the thermoplastic resin. The grooving stamper is then peeled off from the thermoplastic resin by heating and pressurizing the whole while heating to a glass transition temperature Tg or higher.

本発明を更に詳しく説明すると次の3工程から成る。To explain the present invention in more detail, it consists of the following three steps.

第1工程として、研磨されたA42合金製基盤表面に5
μm〜50μmの厚さを有する例えばPC,PES%P
EIのような軟化温度が110℃以上の熱可塑性樹脂フ
ィルムを貼り合わせる。
As the first step, the surface of the polished A42 alloy substrate is
e.g. PC, PES%P with a thickness of μm to 50 μm
A thermoplastic resin film such as EI having a softening temperature of 110° C. or higher is laminated.

基盤と前記熱可塑性樹脂フィルムの密着性をより向上さ
せる目的で、Al合金製基盤表面に予めベーマイト、ク
ロメート、アルマイト等の表面処理を施すことが望まし
い。
In order to further improve the adhesion between the substrate and the thermoplastic resin film, it is desirable to previously perform a surface treatment such as boehmite, chromate, alumite, etc. on the surface of the Al alloy substrate.

また更に必要な場合にはAl合金との密着性に優れかつ
グルービング用の前記熱可塑性樹脂フィルムとの接着性
に優れる例えばホットメルト型、嫌気性硬化型の無溶剤
接着剤を基盤と熱可塑性樹脂フィルムの間に薄く均一に
塗布することが好ましい。この接着剤は、熱可塑性樹脂
フィルムを貼り合わせる前に基盤上に塗布しても良いし
、予め熱可塑性樹脂フィルムの貼着面に塗布しておいて
も何らさしつかえない。
Furthermore, if necessary, a thermoplastic resin based on a hot-melt type or anaerobic curing type solvent-free adhesive that has excellent adhesion to the Al alloy and to the thermoplastic resin film for grooving, for example, can be used. It is preferable to apply it thinly and uniformly between the films. This adhesive may be applied onto the substrate before bonding the thermoplastic resin film together, or may be applied to the adhesive surface of the thermoplastic resin film in advance.

第2工程として、第1工程で得たディスク全体にホット
プレスを施す。この場合、熱可塑性樹脂フィルム側の定
盤にはグルービング用スタンパーが張りつけられており
スタンバ一温度は熱可塑性樹脂フィルムのガラス転移温
度Tgより高温に設定すべきことは当然であるが、Aj
2合金製基盤の温度は熱可塑性樹脂フィルム全体の形状
変化を避けるためにガラス転移温度より低温であること
が望ましい。この工程でグルービング用スタンパ−のグ
ループ形状が熱可塑性樹脂フィルム上に転写される。
As a second step, the entire disk obtained in the first step is subjected to hot pressing. In this case, a grooving stamper is attached to the surface plate on the thermoplastic resin film side, and it is natural that the standby temperature should be set higher than the glass transition temperature Tg of the thermoplastic resin film.
The temperature of the 2-alloy base is preferably lower than the glass transition temperature in order to avoid changes in the overall shape of the thermoplastic resin film. In this step, the group shape of the grooving stamper is transferred onto the thermoplastic resin film.

第3工程として、前記グルービング用スタンパ−を熱可
塑性樹脂フィルムより剥離する。この場合、グループ形
状の転写性をより良くするためにはグルービング用スタ
ンパ−の温度を熱可塑性樹脂フィルムのガラス転移温度
以下にして剥離することが望ましい。
As a third step, the grooving stamper is peeled off from the thermoplastic resin film. In this case, in order to improve the transferability of the group shape, it is desirable to peel the grooving stamper at a temperature below the glass transition temperature of the thermoplastic resin film.

以上の工程により密着した断熱グループ層を有する光デ
ィスク用A1合金製基盤が得られる。なおこの方法に用
いるグルービング用スタンパ−は透明である必要はなく
、むしろスタンバ一温度の調節を高精度で行なうために
例えばニッケルのような金属製スタンパーが好ましい。
Through the above steps, an A1 alloy substrate for optical discs having a closely-adhered heat insulating group layer is obtained. Note that the grooving stamper used in this method does not need to be transparent; rather, a metal stamper such as nickel is preferable in order to precisely control the temperature of the stamper.

[実施例] 実施例1 以下本発明の実施例を図面により説明する。[Example] Example 1 Embodiments of the present invention will be described below with reference to the drawings.

まずアルマイト処理を施された3、5インチサイズのA
J!合金製ディスク1の表面に接着剤2を塗布し、厚さ
50μmのPCフィルム3を截せA1合金製ディスク1
に貼合わせる0次いでこのディスク4に、ニッケルスタ
ンパー5を有し、温度がPCフィルム3のガラス転移温
度Tgより15〜50℃高温(165〜200℃)に調
節された上定盤7と、温度が100℃以上で、かつPC
フィルム3のガラス転移温度Tg以下(110℃)に調
節された下定盤6を用いて、第2図の如くホットプレス
を施す、しかるのち、ニッケルスタンパ−5をPCフィ
ルム3より剥離し、断熱グループ付光ディスク用Aft
基盤9を得る。
First, a 3.5-inch size A that has been anodized.
J! Apply adhesive 2 to the surface of the alloy disc 1 and cut off the 50 μm thick PC film 3 to form the A1 alloy disc 1.
Next, this disk 4 is attached to an upper surface plate 7 having a nickel stamper 5 and whose temperature is adjusted to 15 to 50 degrees Celsius higher (165 to 200 degrees Celsius) than the glass transition temperature Tg of the PC film 3, is 100℃ or higher, and the PC
Using the lower surface plate 6 adjusted to below the glass transition temperature Tg of the film 3 (110°C), hot pressing is performed as shown in Fig. 2.Then, the nickel stamper 5 is peeled off from the PC film 3, and the insulation group Aft for attached optical disc
Obtain base 9.

実施例2 実施例1と同様の条件にて、PCおよびPES樹脂フィ
ルムを用いて、種種のスタンバ一温度にてホットプレス
を施し、適切なスタンバ一温度を求めた。グループ転写
性はPCやPES上の粗度がスタンパー粗度と同程度に
なるかどうかで評価した。
Example 2 Under the same conditions as in Example 1, PC and PES resin films were hot pressed at various standby temperatures to determine appropriate standby temperatures. Group transferability was evaluated by whether the roughness on PC or PES was comparable to the roughness of the stamper.

第4図にこれらの評価の結果を示す。Figure 4 shows the results of these evaluations.

第4図より、熱可塑性樹脂フィルムの種類によらず、そ
れらのTgの1.1倍から1.5倍のスタンバ一温度に
てホットプレスを施すことにより良好なグループ転写性
が得られることがわかった。
From Figure 4, regardless of the type of thermoplastic resin film, good group transfer properties can be obtained by hot pressing at a standby temperature of 1.1 to 1.5 times the Tg of the film. Understood.

[発明の効果] 以上に説明した通り、本発明によればAjZ合金製基慇
との密着性に優れた断熱グループ層を形成することが出
来る。
[Effects of the Invention] As explained above, according to the present invention, it is possible to form a heat insulating group layer with excellent adhesion to the AJZ alloy base.

即ち、本発明は今後実用化が進む相変態型や光磁気型等
の消去書換型光ディスク基盤として長期信頼性に優れ、
かつ高速回転にも充分耐える光ディスク基盤を得る上で
極めて有効である。
In other words, the present invention has excellent long-term reliability as a base for erasable/rewritable optical disks such as phase transformation type and magneto-optical type, which will be put into practical use in the future.
Moreover, it is extremely effective in obtaining an optical disk substrate that can sufficiently withstand high-speed rotation.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例におけるホットプレス前の説明
図、第2図は同じくホットプレス時の説明図、第3図は
本発明の実施例で製造した光ディスク用A1基盤の措造
図である。第4図はスタンバ一温度によるグループ転写
性を示すグラフである。 1・・・A1合金製ディスク、2・・・接着剤、3・・
・PCフィルム、5・・・ニッケルスタンパ−16・・
・下定盤、7・・・上定盤、9・・・光ディスク用Al
基盤。 第4図 T/Tg
Fig. 1 is an explanatory diagram before hot pressing in an embodiment of the present invention, Fig. 2 is an explanatory diagram during hot pressing, and Fig. 3 is a construction diagram of an A1 substrate for an optical disc manufactured in an embodiment of the present invention. be. FIG. 4 is a graph showing group transferability depending on standby temperature. 1...A1 alloy disc, 2...adhesive, 3...
・PC film, 5...Nickel stamper-16...
・Lower surface plate, 7... Upper surface plate, 9... Al for optical disc
basis. Figure 4 T/Tg

Claims (1)

【特許請求の範囲】 (1)Al合金製ディスクの表面に熱可塑性樹脂フィル
ムを貼り合わせた後、該熱可塑性樹脂フィルムにグルー
ビング用スタンパーを重ねて、該グルービング用スタン
パーを前記熱可塑性樹脂フィルムのガラス転移温度Tg
以上に加熱しつつ、全体を加熱加圧し、しかるのち前記
グルービング用スタンパーを熱可塑性樹脂フィルムより
剥離することを特徴とする光ディスク用Al基盤の製造
方法。 (2)Al合金製ディスクの表面は、ベーマイト、クロ
メート又はアルマイト等の表面処理を施す特許請求の範
囲第1項記載の光ディスク用Al基盤の製造方法。 (3)Al合金製ディスクと熱可塑性樹脂フィルムの貼
着面にはホットメルト型、嫌気性硬化型の無溶剤接着剤
を介在させる特許請求の範囲第1項又は第2項記載の光
ディスク用Al基盤の製造方法。 (4)グルービング用スタンパーは、熱可塑性樹脂フィ
ルムのガラス転移温度Tgの1.1乃至1.5倍の温度
とする特許請求の範囲第1項記載の光ディスク用基盤の
製造方法。(5)加熱加圧は、Al合金製ディスクの温
度を熱可塑性樹脂フィルムのガラス転移温度Tgより低
い温度に保って行う特許請求の範囲第1項記載の光ディ
スク用Al基盤の製造方法。 (6)グルービング用スタンパーは、熱可塑性樹脂フィ
ルムのガラス転移温度Tgより低い温度で剥離する特許
請求の範囲第1項記載の光ディスク用Al基盤の製造方
法。 (7)グルービング用スタンパーは、金属製とした特許
請求の範囲第1項記載の光ディスク用Al基盤の製造方
法。
[Scope of Claims] (1) After bonding a thermoplastic resin film to the surface of an Al alloy disk, a grooving stamper is superimposed on the thermoplastic resin film, and the grooving stamper is attached to the thermoplastic resin film. Glass transition temperature Tg
A method for producing an Al substrate for an optical disk, which comprises heating and pressurizing the entire body while heating to the above temperature, and then peeling off the grooving stamper from the thermoplastic resin film. (2) The method for manufacturing an Al substrate for an optical disk according to claim 1, wherein the surface of the Al alloy disk is subjected to a surface treatment such as boehmite, chromate, or alumite. (3) Al for optical disks according to claim 1 or 2, wherein a hot-melt type, anaerobic curing type, solvent-free adhesive is interposed on the bonding surface of the Al alloy disk and the thermoplastic resin film. Method of manufacturing the base. (4) The method for manufacturing an optical disk substrate according to claim 1, wherein the temperature of the grooving stamper is 1.1 to 1.5 times the glass transition temperature Tg of the thermoplastic resin film. (5) The method of manufacturing an Al substrate for an optical disk according to claim 1, wherein the heating and pressing is performed while maintaining the temperature of the Al alloy disk at a temperature lower than the glass transition temperature Tg of the thermoplastic resin film. (6) The method for manufacturing an Al substrate for an optical disk according to claim 1, wherein the grooving stamper is peeled off at a temperature lower than the glass transition temperature Tg of the thermoplastic resin film. (7) The method for manufacturing an Al substrate for an optical disk according to claim 1, wherein the grooving stamper is made of metal.
JP28024987A 1986-12-12 1987-11-05 Production of al substrate for optical disk Pending JPS63266649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28024987A JPS63266649A (en) 1986-12-12 1987-11-05 Production of al substrate for optical disk

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29731286 1986-12-12
JP61-297312 1986-12-12
JP28024987A JPS63266649A (en) 1986-12-12 1987-11-05 Production of al substrate for optical disk

Publications (1)

Publication Number Publication Date
JPS63266649A true JPS63266649A (en) 1988-11-02

Family

ID=26553698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28024987A Pending JPS63266649A (en) 1986-12-12 1987-11-05 Production of al substrate for optical disk

Country Status (1)

Country Link
JP (1) JPS63266649A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2870978A1 (en) * 2004-05-28 2005-12-02 Commissariat Energie Atomique POROUS THERMAL BARRIER RECORDING DEVICE
KR20190020266A (en) * 2017-08-18 2019-02-28 삼성디스플레이 주식회사 Display device and fabricating method of the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2870978A1 (en) * 2004-05-28 2005-12-02 Commissariat Energie Atomique POROUS THERMAL BARRIER RECORDING DEVICE
WO2005119672A1 (en) * 2004-05-28 2005-12-15 Commissariat A L'energie Atomique Recording device with a porous heat barrier
JP2008501206A (en) * 2004-05-28 2008-01-17 コミツサリア タ レネルジー アトミーク Recording device having a porous thermal barrier
US7729231B2 (en) 2004-05-28 2010-06-01 Commissariat A L'energie Atomique Recording device with a porous heat barrier
KR20190020266A (en) * 2017-08-18 2019-02-28 삼성디스플레이 주식회사 Display device and fabricating method of the same
CN109411511A (en) * 2017-08-18 2019-03-01 三星显示有限公司 Display device
CN109411511B (en) * 2017-08-18 2023-11-03 三星显示有限公司 display device

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