JPS63253693A - Method of fitting component - Google Patents
Method of fitting componentInfo
- Publication number
- JPS63253693A JPS63253693A JP8915787A JP8915787A JPS63253693A JP S63253693 A JPS63253693 A JP S63253693A JP 8915787 A JP8915787 A JP 8915787A JP 8915787 A JP8915787 A JP 8915787A JP S63253693 A JPS63253693 A JP S63253693A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- paste
- leaded
- parts
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はリード付部品の半田付けをペースト半田にて行
う部品の取付は方法に関するものである０〈発明の概要
〉
本発明はリード付部品を基板に挿入し、ランドに半田ペ
ーストを塗布して、リフロー炉を通すことでペースト半
田付けが出来る様にした部品の取付は方法である。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for soldering leaded parts using paste solder. The method for attaching parts is to insert the board into the board, apply solder paste to the land, and pass it through a reflow oven so that paste soldering can be performed.
〈従来の技術〉
リード付部品は、基板に挿入した後半田槽を通してディ
ップされていた。<Prior art> Leaded components were dipped through a solder tank inserted into the board.
〈発明が解決しようとする問題点〉
現在は、チップ部品が部品点数上、かなりの割合をしめ
ているが、わずかなリード付部品の之めに半田槽でディ
ップ半田付けするといった工程が必要である。<Problems to be solved by the invention> At present, chip parts account for a considerable proportion of the number of parts, but the few parts with leads require a process such as dip soldering in a solder bath. .
く問題点を解決するための手段〉
前記問題点を解決するために、チップ部品半田付けの工
程に、リード付部品も入れて一緒にペースト半田付けを
行う。Means for Solving the Problems> In order to solve the above problems, components with leads are also included in the process of soldering chip components and paste soldering is performed at the same time.
く作用〉
リード付部品がペースト半田で半田付けが出来るため、
半田槽でのディップ半田付けが削減小米コスト低減にな
る。Effect〉 Parts with leads can be soldered with paste solder,
Dip soldering in a solder bath is reduced, resulting in lower costs.
〈実施例〉
図中において、ｌはチップ部品、２はリード付部品、３
はリード付部品用ペースト半田塗布機、４は基板、５は
接着剤、６はペースト半田である。<Example> In the figure, l is a chip component, 2 is a leaded component, and 3 is a chip component.
1 is a paste solder applicator for parts with leads, 4 is a board, 5 is an adhesive, and 6 is a paste solder.
以下、順をおいて説明すると、
１、まず基板４表（部品面）にペースト半田６全印刷す
る。The following will explain the order: 1. First, paste solder 6 is entirely printed on the front side (component side) of the board 4.
２、 チップ部品ｌならＳＣランド、リード付部品２な
らその外形となる部分に、接着剤５を塗布する。2. Apply adhesive 5 to the SC land for chip component 1 and to the outer shape of leaded component 2.
３、 自動機によって最初にチップ部品１を装着し、次
にリード付部品２を挿入する。3. Using an automatic machine, first mount the chip component 1 and then insert the leaded component 2.
４、 リフロー炉によって接着剤５は硬化しリード付部
品２は固定され、チップ部品１はリフローされる。4. The adhesive 5 is cured in a reflow oven, the leaded component 2 is fixed, and the chip component 1 is reflowed.
５、上記１．〜４．までの内容を同じ様に裏面にも行な
うことに工って両面が半田付けされる。5. Above 1. ~4. I decided to do the same thing on the back side and solder both sides.
ただし、裏面のリード付部品２へのペースト半田塗布機
３に工って行なう。However, this is done using a paste solder applicator 3 that applies solder paste to the leaded component 2 on the back side.
〈発明の効果〉
リード付部品がペースト半田で半田付けが出来るため半
田槽を削減出来る。<Effects of the Invention> Since parts with leads can be soldered with paste solder, the number of solder tanks can be reduced.
ＷＪ１図は本発明の手順を示すブロック図、第２図はチ
ップ部品とリード付部品が基板に装着、挿入された状態
を示す側面図である。
ｌ・・・チップ部品、２・・・リード付部品、４・・・
基板、５・・・接着剤、６・・・ペースト半田。Figure WJ1 is a block diagram showing the procedure of the present invention, and Figure 2 is a side view showing a state in which chip components and leaded components are mounted and inserted into a board. l...Chip parts, 2...Leaded parts, 4...
Board, 5...Adhesive, 6...Paste solder.
Claims (1)
付部品のランドに半田ペーストを塗布してリフロー炉に
通すことでリフロー半田付けを行なうことを特徴とする
部品の取付け方法。1. A method for attaching parts, which is characterized by fixing a leaded part to a board with an adhesive, applying solder paste to the land of the leaded part, and performing reflow soldering by passing it through a reflow oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8915787A JPS63253693A (en) | 1987-04-09 | 1987-04-09 | Method of fitting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8915787A JPS63253693A (en) | 1987-04-09 | 1987-04-09 | Method of fitting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63253693A true JPS63253693A (en) | 1988-10-20 |
Family
ID=13963003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8915787A Pending JPS63253693A (en) | 1987-04-09 | 1987-04-09 | Method of fitting component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63253693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03201589A (en) * | 1989-12-28 | 1991-09-03 | Sony Corp | Soldering method for two type components to one-side printed board |
-
1987
- 1987-04-09 JP JP8915787A patent/JPS63253693A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03201589A (en) * | 1989-12-28 | 1991-09-03 | Sony Corp | Soldering method for two type components to one-side printed board |
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