JPS63249699A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS63249699A JPS63249699A JP62086229A JP8622987A JPS63249699A JP S63249699 A JPS63249699 A JP S63249699A JP 62086229 A JP62086229 A JP 62086229A JP 8622987 A JP8622987 A JP 8622987A JP S63249699 A JPS63249699 A JP S63249699A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- card
- external electrodes
- semiconductor device
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 230000037431 insertion Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分舒〕
この発明は、半導体装置に係り、特に取扱いを容易にし
たＩＣモジュールに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a semiconductor device, and particularly to an IC module that is easy to handle.
第２図は、例えばＩＳＯ規格に準拠したＩＣカードを表
面から見た図であり、この図において、１１は塩化ビニ
ールのシート材からなるカード本体、１２はこのカード
本体１１に埋め込まれた集積回路および回路基板を内部
に含み、表面に外部電極をもつＩＣモジュールである。FIG. 2 is a view of an IC card that complies with the ISO standard, for example, viewed from the surface. In this figure, 11 is a card body made of a vinyl chloride sheet material, and 12 is an integrated circuit embedded in this card body 11. and an IC module that includes a circuit board inside and has external electrodes on its surface.
１３は前記ＩＣモジュール１２の表面に配設された外部
電極である。Reference numeral 13 denotes an external electrode disposed on the surface of the IC module 12.
現行のｔＣカードの標準サイズは、縦２．１２５インチ
（５３、９８１１Ｉ１１）、横３．３７０インチ（８５
゜６０ｍｍ）、厚さ０．０３０インチ（０，７６＋ｎ＋
ａ）であり、携帯時は札入れや名刺入れ、あるいはカー
ドケースに入れて持ち運び、各種機械を操作する時は、
例えば表または裏を上にし、左または右、さらには他の
辺を手前にするような所定の方向に向けて各種ａｍの挿
入口に挿入する。The current standard size of the tC card is 2.125 inches in height (53, 9811I11) and 3.370 inches in width (85
゜60mm), thickness 0.030 inch (0,76+n+
a) When carrying it, it is placed in a bill compartment, business card holder, or card case, and when operating various machines,
For example, insert it into the insertion slot of various AMs with the front or back facing up and facing in a predetermined direction, such as with the left or right side or the other side facing you.
各種＠械に挿入されたＩＣカードは、ＩＣモジュール１
２の外部電Ｐｉ１３から各種ｉ械に備えられいるコンタ
クト端子を介して情報の授受を行う。The IC card inserted into various@machines is IC module 1.
Information is exchanged from the external power Pi 13 of No. 2 through contact terminals provided in various i-machines.
上記のような従来のＩＣカードでは、携帯中または使用
中に曲げ、ねじり等の機械的ストレスによってカード本
体１１とＩＣモジュール１２との間の接着はがれが生じ
たり、カード本体１１の割れが発生する乙とがあった。In the conventional IC card as described above, the adhesive between the card body 11 and the IC module 12 may peel off or the card body 11 may crack due to mechanical stress such as bending or twisting while being carried or used. There was Otsu.
乙のようなはがれ。Peeling like Otsu.
割れの発生は、各種機械のコンタクト端子と外部電極１
３との接触不良を起乙ず欠点があり、また、所定の方向
に向けてＩＣカードを挿入しなければ各種機械のコンタ
クト端子と外部電極１３が接触しない等の問題点があっ
た。Cracks occur in contact terminals and external electrodes 1 of various machines.
There is also a problem that the contact terminals of various machines do not come into contact with the external electrodes 13 unless the IC card is inserted in a predetermined direction.
乙の発明は、上記のような問題点を解消するなめになさ
れたもので、携帯中、使用中の機械的ストレスに対する
耐性があり、各種機械への挿入方向を規定する必要のな
い半導体装置を提供することを目的とする。Party B's invention was made to solve the above-mentioned problems, and it provides a semiconductor device that is resistant to mechanical stress while being carried or used, and does not require specifying the direction of insertion into various machines. The purpose is to provide.
この発明に係る半導体装置は、内部に集積回路が形成さ
れ、所要の硬度を有する回路基板の外形を円形状に形成
するとともに、回路基板の少なくとも表裏両面に外部電
極を配設して構成したものである。The semiconductor device according to the present invention has an integrated circuit formed therein, has a circuit board having a required hardness, has a circular outer shape, and has external electrodes arranged on at least the front and back surfaces of the circuit board. It is.
この発明におけるＩＣカードは、所要の硬度を有する回
路基板を円形状に形成するとともに、少なくとも表裏両
面に外部電極を配設して構成した乙とから、使用中にお
ける曲げ、ねじりなどの機械的ストレスに対して強（な
り、挿入方向の規定もなくなる。The IC card according to the present invention has a circuit board having a required hardness formed into a circular shape, and external electrodes are arranged on at least both the front and back sides. (and there is no regulation on the insertion direction.
以下、この発明の一実施例を図面について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例を示す半導体装置の斜視図
である。FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention.
この図で、１はＩＣモジュールで、内部に集積回路を含
む回路基板２の表裏両面に、例えば同心円状で、かつ表
裏対称の外部電極３が配設され、所要の硬度、例えば硬
貨程度の硬度と大きさを有し、かつ外形が円形状に形成
されて構成されている。In this figure, reference numeral 1 denotes an IC module, in which external electrodes 3, for example concentric and symmetrical, are arranged on both the front and back surfaces of a circuit board 2 containing an integrated circuit, and have a required hardness, for example, the hardness of a coin. It has a size of , and has a circular outer shape.
この発明のＩＣモジュール１は、硬貨と同程度の強度を
有しており、大きさもｒｉ！Ｊ、貨と同程度に形成した
場合には、通常の取扱い時に曲がることがない。Ｌ／た
がって、曲げ、ねじりなどの機械的ス）・レスに注意を
払う乙となく、硬貨と同様に小銭入れなどに入れて持ち
運ぶことができる。The IC module 1 of the present invention has a strength comparable to that of a coin, and the size is also ri! J. If it is formed to the same size as a coin, it will not bend during normal handling. Therefore, it can be carried in a coin purse just like a coin, without having to be careful about mechanical damage such as bending or twisting.
さらに、各ＨＢ＆械を操作するために、各種機械の挿入
に１に挿入する時、外部電極３が表裏対称に、かつ同心
円状に配置されているので、挿入方向を規定する必要が
なく、自動販売機に硬貨を投入するのと同様に、どの方
向からでも挿入できる。Furthermore, when inserting into various machines 1 to operate each HB & machine, since the external electrodes 3 are arranged symmetrically and concentrically, there is no need to specify the insertion direction, and it is automatic. You can insert coins from any direction, just like inserting coins into a vending machine.
なお、上記実施例では円形状の回路基板２の表裏両面に
、対称に、かつ同心円状に外部電極３を配設した例につ
いて説明しｔこが、回路基板２の側面にも外部ＴＸ極３
を配設してもよい。また、挿入する各種機械の構造によ
っては、外部電極３を表裏対称にしなくてもよく、さら
には同心円状でな（ともよい。In the above embodiment, the external electrodes 3 are arranged symmetrically and concentrically on both the front and back surfaces of the circular circuit board 2.
may be placed. Further, depending on the structure of various machines to be inserted, the external electrodes 3 may not be symmetrical on the front and back, and may even be concentric.
また、硬貨状の円形として説明したが、現在流通してい
る硬貨の大きさに拘束される乙とはない。Also, although it has been explained as a coin-shaped circle, it is not limited to the size of coins currently in circulation.
以上説明したように、この発明は、内部に集積回路が形
成され、所要の硬度を有する回路基板の外形を円形状に
形成するとともに、回路基板の少なくとも表裏両面に外
部電極を配設して構成したので、機械的ストレスに強く
、表裏を選択する必要がないため挿入方向が自由なＩＣ
モジュールが得られる効果がある。As explained above, the present invention has a circuit board having an integrated circuit formed therein and having a required hardness, the outer shape of which is circular, and external electrodes arranged on at least both the front and back surfaces of the circuit board. As a result, the IC is resistant to mechanical stress and can be inserted in any direction as there is no need to select the front or back side.
There is an effect that the module can obtain.
第１図はこの発明の一実施例を示すＩＣモジュールの全
体構成を示す斜視図、第２図は従来のＩＣカードを示す
平面図である。
図において、１はＩＣモジュール、２は回路基板、３は
外部電極である。FIG. 1 is a perspective view showing the overall structure of an IC module according to an embodiment of the present invention, and FIG. 2 is a plan view showing a conventional IC card. In the figure, 1 is an IC module, 2 is a circuit board, and 3 is an external electrode.
Claims (1)
板の外形を円形状に形成するとともに、前記回路基板の
少なくとも表裏両面に外部電極を配設して構成したこと
を特徴とする半導体装置。What is claimed is: 1. A semiconductor device comprising: an integrated circuit formed therein; a circuit board having a required hardness having a circular outer shape; and external electrodes disposed on at least the front and back surfaces of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62086229A JPH07121629B2 (en) | 1987-04-06 | 1987-04-06 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62086229A JPH07121629B2 (en) | 1987-04-06 | 1987-04-06 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63249699A true JPS63249699A (en) | 1988-10-17 |
| JPH07121629B2 JPH07121629B2 (en) | 1995-12-25 |
Family
ID=13880962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62086229A Expired - Fee Related JPH07121629B2 (en) | 1987-04-06 | 1987-04-06 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07121629B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5588292U (en) * | 1978-12-14 | 1980-06-18 | ||
| JPS58118297A (en) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | Manufacture of identification card |
| JPS60164884A (en) * | 1984-02-08 | 1985-08-27 | Dainippon Printing Co Ltd | Method for producing in card |
-
1987
- 1987-04-06 JP JP62086229A patent/JPH07121629B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5588292U (en) * | 1978-12-14 | 1980-06-18 | ||
| JPS58118297A (en) * | 1981-12-31 | 1983-07-14 | 共同印刷株式会社 | Manufacture of identification card |
| JPS60164884A (en) * | 1984-02-08 | 1985-08-27 | Dainippon Printing Co Ltd | Method for producing in card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07121629B2 (en) | 1995-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |