JPS6322949B2 - - Google Patents
Info
- Publication number
- JPS6322949B2 JPS6322949B2 JP58239934A JP23993483A JPS6322949B2 JP S6322949 B2 JPS6322949 B2 JP S6322949B2 JP 58239934 A JP58239934 A JP 58239934A JP 23993483 A JP23993483 A JP 23993483A JP S6322949 B2 JPS6322949 B2 JP S6322949B2
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- thin film
- processing
- resin
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910003460 diamond Inorganic materials 0.000 claims description 9
- 239000010432 diamond Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 3
- 239000010419 fine particle Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000003754 machining Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 229910000889 permalloy Inorganic materials 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Description
【発明の詳細な説明】
本発明は高硬度セラミツクスライダとパーマロ
イ等金属磁性膜との積層端面を同時に研摩加工し
て、スライダ浮上面とパーマロイ磁性面の段差を
極小に加工する薄膜磁気ヘツドの浮上面加工法に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention is a floating thin-film magnetic head that simultaneously polishes the end face of a laminated layer of a high-hardness ceramic slider and a metal magnetic film such as permalloy to minimize the step difference between the slider flying surface and the permalloy magnetic surface. Concerning surface machining methods.
従来、高硬度のセラミツクスライダに磁性薄膜
が積層されてなる薄膜磁気ヘツドの積層端面即ち
ヘツドの浮上面を研摩するには、鉛、錫などの軟
質金属の定盤を使つて、ダイヤモンド粒子により
加工していた。ところが鉛、錫は塑性変形しやす
く、加工、回転中の定盤にわずかな振動が発生し
たり、負荷のアンバランスのために被加工物の姿
勢が傾いたときなど、被加工物のエツジや角が定
盤面を傷つけたり、わずかに切削することがあ
る。このため細い溝や盛り上がりなど局部的な凹
凸が発生する。第１図にこのときの局部状況を示
す。図において、薄膜ヘツドブロツク２はセラミ
ツクスライダ２０１の間に薄膜ヘツド部２０２が
積層介在されて形成されており、該薄膜ヘツドブ
ロツク２の積層端面が回転する軟質金属製定盤１
に接触している。定盤１の表面には砥粒のダイヤ
モンド粒子１０２が介在している。ここで定盤１
の局部的な凸部１０１にダイヤモンド粒子１０２
が集積すると、みかけ上、局部に砥石が突き出し
た形になり、被加工面に局部的な深いスクラツチ
を発生させたり、薄膜ヘツドの端面を削り落とす
ため、セラミツクスライダ面に対して大きな段差
ができるなどの問題を生ずる。 Conventionally, in order to polish the laminated end face of a thin-film magnetic head, in which a magnetic thin film is laminated on a high-hardness ceramic slider, that is, the air bearing surface of the head, a surface plate made of soft metal such as lead or tin was used to polish the head using diamond particles. Was. However, lead and tin are easily plastically deformed, and when a slight vibration occurs in the surface plate during machining or rotation, or when the posture of the workpiece is tilted due to an unbalanced load, the edges of the workpiece or The corners may damage or slightly cut the surface of the surface plate. As a result, local irregularities such as narrow grooves and bulges occur. Figure 1 shows the local situation at this time. In the figure, a thin film head block 2 is formed by laminating a thin film head portion 202 between ceramic sliders 201, and a soft metal surface plate 1 on which the laminated end face of the thin film head block 2 rotates.
is in contact with. Diamond particles 102, which are abrasive grains, are interposed on the surface of the surface plate 1. Here, surface plate 1
Diamond particles 102 are formed on local convex portions 101 of
When the grinding wheel accumulates, the grinding wheel appears to protrude locally, causing local deep scratches on the workpiece surface, and scraping off the end face of the thin film head, resulting in a large step against the ceramic slider surface. This causes problems such as:
一方、上記軟質金属製定盤を用いる方法の他
に、樹脂布系の定盤を用いる方法もある。しかし
ながら樹脂布系定盤を用いる方法においても、該
定盤１の弾性が低いため第２図に示すように定盤
１は被加工物である薄膜ヘツドブロツク２の押圧
により変形し、接触部が沈み込む。このため被加
工物の角部や、あるいは加工性がセラミツクス２
０１より良好な金属薄膜部２０２において加工速
度が大きくなりセラミツクス２０１と金属薄膜部
２０２との間に大きな段差を生ずる等の欠点があ
る。 On the other hand, in addition to the method using the soft metal surface plate, there is also a method using a resin cloth surface plate. However, even in the method using a resin cloth surface plate, since the surface plate 1 has low elasticity, the surface plate 1 is deformed by the pressure of the thin film head block 2, which is the workpiece, as shown in FIG. 2, and the contact part sinks. It's crowded. For this reason, the corners of the workpiece, or the machinability of ceramics
In the metal thin film portion 202 which is better than 01, the machining speed is increased and there are drawbacks such as a large step difference between the ceramic 201 and the metal thin film portion 202.
本発明はこれらの欠点を解決するため、定盤と
して粘弾性のある樹脂を使い、被加工物のエツジ
や角の衝撃に対して塑性変形を起こしにくくし、
定盤の平滑さを維持してセラミツクスライダと薄
膜ヘツドとの加工段差を少なく加工するようにし
たものであり、その構成は、高硬度セラミツクス
ライダに磁性薄膜が積層されてなる薄膜磁気ヘツ
ドの積層端面を研摩する浮上面加工法において、
高い粘弾性を有する樹脂定盤を回転させて、該定
盤面に加工液に懸濁させた1μｍ径以下のダイヤ
モンド微粒子を散布し、該定盤面と対置した被加
工面を相対摺動させながら加工することを特徴と
する。 In order to solve these drawbacks, the present invention uses a viscoelastic resin as the surface plate to make it difficult to cause plastic deformation due to impact from the edges and corners of the workpiece.
This is designed to maintain the smoothness of the surface plate and reduce the difference in processing steps between the ceramic slider and the thin film head.The structure consists of a laminated thin film magnetic head in which a magnetic thin film is laminated on a high hardness ceramic slider. In the floating surface processing method that polishes the end surface,
A resin surface plate with high viscoelasticity is rotated, and fine diamond particles with a diameter of 1 μm or less suspended in a machining fluid are scattered on the surface of the surface plate, and the surface to be machined that is opposed to the surface plate surface is slid relative to each other. It is characterized by
以下に本発明を図面に基づいて詳細に説明す
る。第３図に本発明の加工方法を示す。本発明に
おいては定盤１に高粘弾性を有する樹脂製のもの
が用いられる。該定盤１の表面に上記セラミツク
スライダ２０１と薄膜ヘツド部２０２とが積層さ
れてなる薄膜ヘツドブロツク２の積層端面が接触
され研摩加工される。この場合、予め樹脂製定盤
１をWA＃200前後の砥石で平面研削し、直径200
mmの定盤１に対し1μｍ前後の平面度に仕上げる。
次いで、0.5〜1μｍ径のダイヤモンド粒子１０２
を水溶性オイルに懸濁させ、樹脂定盤１に散布す
る。この上に薄膜ヘツドブロツク２を押しつけ相
互に摺動させて、ヘツド面を加工する。 The present invention will be explained in detail below based on the drawings. FIG. 3 shows the processing method of the present invention. In the present invention, the surface plate 1 is made of resin having high viscoelasticity. The stacked end face of the thin film head block 2, in which the ceramic slider 201 and the thin film head portion 202 are stacked, is brought into contact with the surface of the surface plate 1 and polished. In this case, the surface of the resin surface plate 1 is ground in advance with a grindstone of WA#200 or so, and
Finish to a flatness of around 1 μm for a mm surface plate 1.
Next, diamond particles 102 with a diameter of 0.5 to 1 μm
is suspended in water-soluble oil and sprinkled on the resin surface plate 1. A thin film head block 2 is pressed onto this and slid against each other to process the head surface.
このとき、定盤１は高い粘弾性的な性質を有し
ているので、ヘツドブロツク２の綾線や角が接触
しても、部分的に弾性変形する。このため傷を受
けたり切削されることがなく、かつ適度の剛性も
有するため被加工部の変形も小さく、従つて平面
形状が維持されて、高精度な平面加工ができる。 At this time, since the surface plate 1 has high viscoelastic properties, even if the twills or corners of the head block 2 come into contact with each other, it partially undergoes elastic deformation. Therefore, it is not damaged or cut, and since it has appropriate rigidity, the deformation of the part to be processed is small, and the planar shape is maintained, allowing highly accurate planar processing.
次に、具体的な加工例を示す。被加工試料は、
Al2O3／TiCセラミツクスライダ上にパーマロイ
膜を形成し、その上にSiO2膜を保護膜として形
成したものである。定盤には塩化ビニール樹脂製
のものを用い、該定盤の表面を研削した後、切削
バイトで幅0.5mm深さ0.2mm、ピツチ１mm程度の細
いらせん溝を形成した。これを回転させ、その表
面に0.5〜1μｍ径のダイヤモンド粒子を散布して
被加工物も自転させながら100〜200ｇｆ／cm2の圧
力で加工したところパーマロイとAl2O3／TiC面
の段差は300Å以下になつた。 Next, a specific processing example will be shown. The sample to be processed is
A permalloy film is formed on an Al 2 O 3 /TiC ceramic slider, and a SiO 2 film is formed on top of it as a protective film. A surface plate made of vinyl chloride resin was used, and after grinding the surface of the surface plate, a thin spiral groove with a width of 0.5 mm, a depth of 0.2 mm, and a pitch of about 1 mm was formed using a cutting tool. When this was rotated, diamond particles with a diameter of 0.5 to 1 μm were sprinkled on the surface, and the workpiece was machined at a pressure of 100 to 200 gf/cm 2 while rotating, the level difference between the permalloy and Al 2 O 3 /TiC surfaces was It became less than 300Å.
この他、樹脂定盤として、ナイロン、チクロ
ン、ジユラコン、デルリン、ポリイミドなどを使
つた場合にも低段差の加工特性を得た。 In addition, when using nylon, Zyklon, Diuracon, Delrin, polyimide, etc. as the resin surface plate, we obtained processing characteristics with low step differences.
以上説明したように本発明の加工方法によれば
高硬度のセラミツクス材料上に形成した金属薄膜
磁気ヘツドの浮上面を加工する際に、高い粘弾性
を有する樹脂定盤を使用するので、加工中、被加
工物の運動のバランスがくずれて、姿勢が傾いた
ときなども定盤面を塑性的に変形させることが少
なく、平面も維持しやすいと共に、加工液に1μ
ｍ径以下のダイヤモンド微粒子を用いるので、セ
ラミツクス及び金属材料の双方にに対して良好な
切れ味を示し、その結果セラミツクスと金属間の
段差を少なく高精度に加工できる利点がある。 As explained above, according to the processing method of the present invention, when processing the air bearing surface of a thin metal film magnetic head formed on a highly hard ceramic material, a resin surface plate with high viscoelasticity is used, so that during processing, , even when the movement of the workpiece is unbalanced and its posture is tilted, there is little plastic deformation of the surface plate surface, it is easy to maintain the flat surface, and the machining fluid has 1μ
Since fine diamond particles with a diameter of m or less are used, they exhibit good cutting ability on both ceramics and metal materials, and as a result, there is an advantage that the difference in level between the ceramics and the metal can be reduced and machining can be performed with high precision.
第１図および第２図は従来の加工方法を示す断
面説明図、第３図は本発明の加工方法を示す断面
説明図である。
図中、１……定盤、１０１……凸部、１０２…
…ダイヤモンド粒子、２……薄膜ヘツドブロツ
ク、２０１……セラミツクス、２０２……薄膜ヘ
ツド部。
1 and 2 are cross-sectional explanatory views showing the conventional processing method, and FIG. 3 is a cross-sectional explanatory view showing the processing method of the present invention. In the figure, 1... Surface plate, 101... Convex portion, 102...
...Diamond particles, 2...Thin film head block, 201...Ceramics, 202...Thin film head section.
Claims (1)
されてなる薄膜磁気ヘツドの積層端面を研摩する
浮上面加工法において、高い粘弾性を有する樹脂
定盤を回転させて、該定盤面に加工液に懸濁させ
た1μｍ径以下のダイヤモンド微粒子を散布し、
該定盤面と対置した被加工面を相対摺動させなが
ら加工することを特徴とする薄膜磁気ヘツドの加
工方法。1 In the air bearing surface processing method of polishing the end face of a thin film magnetic head in which a magnetic thin film is laminated on a high-hardness ceramic slider, a resin surface plate with high viscoelasticity is rotated, and a resin suspended in processing fluid is placed on the surface of the surface plate. Sprinkle diamond fine particles with a diameter of 1 μm or less,
A method for processing a thin film magnetic head, characterized in that processing is performed while a surface to be processed opposed to the surface plate is slid relative to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58239934A JPS60135173A (en) | 1983-12-21 | 1983-12-21 | Machining method of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58239934A JPS60135173A (en) | 1983-12-21 | 1983-12-21 | Machining method of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60135173A JPS60135173A (en) | 1985-07-18 |
| JPS6322949B2 true JPS6322949B2 (en) | 1988-05-13 |
Family
ID=17052000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58239934A Granted JPS60135173A (en) | 1983-12-21 | 1983-12-21 | Machining method of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60135173A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62224572A (en) * | 1986-03-26 | 1987-10-02 | Toshiba Corp | Method of processing ceramic product |
| US5456736A (en) * | 1992-04-06 | 1995-10-10 | Hitachi, Ltd. | Lap and lapping liquor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149692A (en) * | 1976-06-07 | 1977-12-12 | Kuraray Co Ltd | Pad for lapping and polishing |
-
1983
- 1983-12-21 JP JP58239934A patent/JPS60135173A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149692A (en) * | 1976-06-07 | 1977-12-12 | Kuraray Co Ltd | Pad for lapping and polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60135173A (en) | 1985-07-18 |
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