JPS63229166A - Resin coating apparatus - Google Patents
Resin coating apparatusInfo
- Publication number
- JPS63229166A JPS63229166A JP6161787A JP6161787A JPS63229166A JP S63229166 A JPS63229166 A JP S63229166A JP 6161787 A JP6161787 A JP 6161787A JP 6161787 A JP6161787 A JP 6161787A JP S63229166 A JPS63229166 A JP S63229166A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- liquid
- liquid impregnating
- impregnating body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 46
- 229920005989 resin Polymers 0.000 title claims abstract description 46
- 239000011248 coating agent Substances 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000010422 painting Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ＩＣ，ＬＳＩ等のα線速へい、アルミニウム
等の配線シフト、更には保護膜クラック等を防止するた
めに半導体チップ表面保護用として塗布する樹脂の塗布
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applied to semiconductor chip surfaces to be coated to prevent α-ray velocity degradation in ICs, LSIs, etc., wiring shifts in aluminum, etc., and cracks in protective films. This invention relates to a resin coating device.
従来の技術
近年、半導体の進歩は著しく、特にメモリーの集積度は
２５６ＫからＩＭへ、更に４Ｍへと進みつつあり、それ
と共にチップの大きさも拡大方向になり、アルミニウム
等の配線はますます微細化され、表面の保護膜は薄（な
る傾向にあるため、α線によるソフトエラー、封止樹脂
の応力によるアルミニウム配線のシフトや保護膜のクラ
ック発生等が生じやすくなってきている。その対策のひ
とつにポリイミドやシリコーン等の樹脂をチップ表面に
塗布した後にエポキシ等の樹脂で封止を行なう方法がと
られている。Conventional technology In recent years, semiconductors have made remarkable progress.In particular, the density of memory is progressing from 256K to IM and then to 4M.At the same time, the size of chips is also increasing, and wiring made of aluminum etc. is becoming increasingly finer. As the protective film on the surface tends to be thinner, soft errors caused by alpha rays, shifting of the aluminum wiring due to the stress of the sealing resin, and cracks in the protective film are becoming more likely to occur.One of the countermeasures against this problem is The conventional method is to apply a resin such as polyimide or silicone to the surface of the chip and then seal it with a resin such as epoxy.
以下図面を参照しながら、前述した半導体チップ表面保
護用の樹脂の塗布の一例について説明する。An example of applying the resin for protecting the surface of a semiconductor chip will be described below with reference to the drawings.
第５図、第６図は従来の半導体チップ表面保護用樹脂の
塗布装置を示すものである。第５図において、ディスペ
ンサー１によって一定時間圧力をかけて一定量の樹脂を
シリンジ２から吐出させ、シリンジ２の先端に取り付け
られた、いわゆる、注射針状の樹脂吐出口３から半導体
チップの表面に樹脂を塗布する。第６図は第５図のＡ部
拡大断面図で、ワイヤ、たとえば、金細線５がチップ４
からリードフレーム６のインナーリード６ａヘポンディ
ングされており、チップ４はリードフレーム６のダイパ
ッド６ｂにＡｕ−５ｉ共品、グルーもしくはハンダ等で
固着されている。ポリイミドまたはシリコーンでなる樹
脂７は吐出口３から滴下されて拡がり、チップ４の表面
保護樹脂になる。FIGS. 5 and 6 show a conventional coating device for resin for protecting the surface of a semiconductor chip. In FIG. 5, a certain amount of resin is discharged from a syringe 2 by applying pressure for a certain period of time by a dispenser 1, and is applied to the surface of a semiconductor chip from a so-called injection needle-shaped resin discharge port 3 attached to the tip of the syringe 2. Apply resin. FIG. 6 is an enlarged cross-sectional view of part A in FIG.
The chip 4 is bonded to the inner leads 6a of the lead frame 6, and the chip 4 is fixed to the die pad 6b of the lead frame 6 with Au-5i, glue, solder, or the like. The resin 7 made of polyimide or silicone is dripped from the discharge port 3 and spreads to become a surface protection resin for the chip 4.
以上のように構成されたものにおいては、吐出口３から
滴下された樹脂７は先ずチップ上で半球状になり、それ
から徐々に拡がって第６図のようにチップ全面にいきわ
たることになる。In the structure as described above, the resin 7 dropped from the discharge port 3 first forms a hemispherical shape on the chip, and then gradually spreads to cover the entire surface of the chip as shown in FIG.
発明が解決しようとする問題点
しかしながら上記のような構成では樹脂７がチップ全面
にいきわたるまでにかなりの時間を要し、かつチップ中
央部の樹脂７の厚さが厚いものとなって最近とみに要求
の多（なったフラットパッケージのような薄型パッケー
ジに対して用いることができず、しかも樹脂７の使用量
が多くなってコストも高いものとなっていた。Problems to be Solved by the Invention However, with the above configuration, it takes a considerable amount of time for the resin 7 to spread over the entire surface of the chip, and the thickness of the resin 7 at the center of the chip becomes thick, which is not required in recent years. This method cannot be used for thin packages such as flat packages, and the amount of resin 7 used increases, resulting in high costs.
本発明は上記問題点に鑑み、瞬間的にチップ全面に樹脂
を塗布し、しかもチップ全面に均一な厚さの樹脂膜を形
成する樹脂塗布装置を提供するものである。In view of the above problems, the present invention provides a resin coating device that instantaneously coats the entire surface of a chip with resin and forms a resin film of uniform thickness over the entire surface of the chip.
問題点を解決するための手段
本発明の塗布装置は、樹脂吐出口先端に液体含浸体を設
け、これに液体状樹脂を含浸させてチップ全面に一度に
その樹脂を塗布できる構成を備えたものである。Means for Solving the Problems The coating device of the present invention has a structure in which a liquid impregnated body is provided at the tip of the resin discharge port, and the liquid impregnated body is impregnated with a liquid resin so that the entire surface of the chip can be coated with the resin at once. It is.
作用
本発明の構成によって、チップ全面に樹脂が塗布される
のに時間を要せず、しかも樹脂の厚さを均一かつ薄く塗
布することができるため、薄型パッケージにも対応可能
となる。Function: With the structure of the present invention, it does not take time to apply resin to the entire surface of the chip, and the resin can be applied to a uniform and thin thickness, making it possible to apply the resin to thin packages.
実施例
以下、本発明の実施例について、図面を参照しながら説
明する。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の要部を示すもので、吐出口
兼液体含浸体保持部８（以下保持部とする）の先端に底
面がチップとほぼ同形状のスポンジ状の液体含浸体９を
備えており、液体含浸体９は多数の***１０を有する多
孔板１１に取り付けられ、その多孔板１１は保持部８に
、若干の間隙を介して取り付けられている。FIG. 1 shows a main part of an embodiment of the present invention, in which a sponge-like liquid impregnated body whose bottom surface is approximately the same shape as the tip is provided at the tip of a liquid-impregnated body holding part 8 (hereinafter referred to as the holding part) which also functions as a discharge port. The liquid-impregnated body 9 is attached to a perforated plate 11 having a large number of small holes 10, and the perforated plate 11 is attached to the holding part 8 with a slight gap therebetween.
以上のように構成されたものにおいて、多孔板１１と保
持部８との間に設けられた間隙によって、シリンジから
供給された樹脂は均一に液体含浸体９に含浸され、その
液体含浸体９をチップに接触させることによりチップ全
面に瞬時にして樹脂を塗布することが可能となる。In the structure configured as described above, the resin supplied from the syringe is uniformly impregnated into the liquid-impregnated body 9 by the gap provided between the porous plate 11 and the holding part 8. By bringing it into contact with the chip, it becomes possible to instantly apply the resin to the entire surface of the chip.
以上のように本実施例によれば、樹脂吐出口先端に底面
がチップとほぼ同じ大きさの軟らかい液体含浸体を設け
ることにより、瞬時にしてチップ全面に保護樹脂を塗布
することができる。As described above, according to this embodiment, by providing a soft liquid-impregnated body whose bottom surface is approximately the same size as the chip at the tip of the resin discharge port, the protective resin can be instantaneously applied to the entire surface of the chip.
第２図は第２の実施例の要部を示すもので、第１図のス
ポンジ状の液体含浸体９の代りに、きわめて細い繊維の
束状の液体含浸体９゛を用いたもので、繊維の密度を変
えることにより樹脂の含浸量を容易に調節できるうえに
、スポンジ状よりは塗布量を多くすることが比較的簡単
にできるのが特長である。FIG. 2 shows the main part of the second embodiment, in which a liquid-impregnated body 9 in the form of a bundle of extremely thin fibers is used in place of the sponge-like liquid-impregnated body 9 shown in FIG. The feature is that the amount of resin impregnated can be easily adjusted by changing the density of the fibers, and it is relatively easy to increase the amount of resin applied compared to a sponge type.
第３図、第４図は第３の実施例の要部を示すもので、保
持部８の下端を伸ばしてスポンジ状の液体含浸体９”を
囲繞する枠体１２とし、液体含浸体９”と枠体１２との
間に間隙１３を設けるとともに、液体含浸体９″の下端
が枠体１２の下端より突出するようにしである。3 and 4 show the main parts of the third embodiment, in which the lower end of the holding part 8 is extended to form a frame 12 that surrounds the sponge-like liquid-impregnated body 9''. A gap 13 is provided between the liquid-impregnated body 9'' and the frame 12, and the lower end of the liquid-impregnated body 9'' protrudes from the lower end of the frame 12.
上記構成によれば、第４図に断面図で示すように、液体
含浸体９“がチップ４の表面に当接して更に圧縮される
と、液体含浸体９″中の樹脂が間隙１３に紋り出されて
チップ４全面に行きわたる一方、枠体１２とチップ４お
よび液体含浸体９“との間で表面張力の働きで漏れ出す
こともなく、しかもワイヤ５には液体含浸体９“が接す
ることもないのでワイヤーの変形も生じない。また、チ
ップ中央部の液体含浸体９′が当接した部分よりもチッ
プ周辺部の樹脂の塗布量が多（なるが、塗布後しばら（
すると均一化され、従来のように中央部が厚くなること
はない。According to the above configuration, as shown in the cross-sectional view in FIG. On the other hand, the liquid impregnated body 9'' does not leak out from the wire 5 due to surface tension between the frame 12, the chip 4, and the liquid impregnated body 9''. Since there is no contact, there is no deformation of the wire. In addition, the amount of resin applied to the peripheral area of the chip is larger than the area in contact with the liquid-impregnated body 9' at the center of the chip (although the amount of resin applied is larger for a while after application).
This will make the thickness uniform, and the center will not be as thick as in the conventional case.
発明の効果
以上のように本発明によれば、樹脂吐出口先端に軟らか
い液体含浸体を設けることにより、短時間でチップ全面
に樹脂を塗布することが可能となり、また塗布厚さも均
一にかつ厚さ調節も可能で、フラットパッケージのよう
な薄型パッケージに対しても対応可能となり、しかも樹
脂使用量も少なくてすむためにコストも安くなる。Effects of the Invention As described above, according to the present invention, by providing a soft liquid impregnated body at the tip of the resin discharge port, it is possible to coat the entire surface of the chip with resin in a short time, and the coating thickness is also uniform and thick. The height can be adjusted, making it possible to handle thin packages such as flat packages, and because less resin is used, the cost is also lower.
更には、短時間での塗布を可能としたことにより、リー
ドフレームを長尺のフープ材としてダイスポンドから樹
脂封止までを連続的に自動化可能とし、大幅コストダウ
ンの道を開くという大きな効果をも生み出した。Furthermore, by making coating possible in a short time, it is possible to continuously automate the process from die pounding to resin sealing by using the lead frame as a long hoop material, which has the great effect of paving the way for significant cost reductions. also produced.
第１図は本発明の第１の実施例を示す要部拡大断面図、
第２図は本発明の第２の実施例を示す要部拡大断面図、
第３図、第４図は本発明の第３の実施例を過程順に示す
要部拡大断面図、第５図は従来の樹脂塗布装置の概略図
、第６図は第５図Ａ部の拡大断面図である。
４・・・・・・半導体チップ、５・・・・・・ワイヤ、
６・・・・・・リードフレーム、７・・・・・・樹脂、
８・・・・・・保持部、９゜９’、９−・・・・・・液
体含浸体。
第 Ｉ 閏
第 ２ 図
第 ３ 図FIG. 1 is an enlarged sectional view of main parts showing a first embodiment of the present invention;
FIG. 2 is an enlarged sectional view of main parts showing a second embodiment of the present invention;
Figures 3 and 4 are enlarged cross-sectional views of main parts showing the third embodiment of the present invention in the order of processes, Figure 5 is a schematic diagram of a conventional resin coating device, and Figure 6 is an enlarged view of part A in Figure 5. FIG. 4... Semiconductor chip, 5... Wire,
6...Lead frame, 7...Resin,
8... Holding part, 9°9', 9-... Liquid impregnated body. Figure I Leap Figure 2 Figure 3
Claims (2)
とする樹脂塗布装置。(1) A resin coating device comprising a liquid impregnated body at the tip of the resin discharge port.
設けるとともに、液体含浸体の下端を枠体下端より突出
させたことを特徴とする特許請求の範囲第（１）項記載
の樹脂塗布装置。(2) Claim 1, characterized in that a gap is provided between the liquid-impregnated body and the frame surrounding it, and the lower end of the liquid-impregnated body protrudes from the lower end of the frame. resin coating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6161787A JPS63229166A (en) | 1987-03-17 | 1987-03-17 | Resin coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6161787A JPS63229166A (en) | 1987-03-17 | 1987-03-17 | Resin coating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63229166A true JPS63229166A (en) | 1988-09-26 |
Family
ID=13176310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6161787A Pending JPS63229166A (en) | 1987-03-17 | 1987-03-17 | Resin coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63229166A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0448959A (en) * | 1990-06-14 | 1992-02-18 | Matsushita Electric Ind Co Ltd | Solution applying apparatus |
| US9061311B2 (en) | 2012-02-23 | 2015-06-23 | Panasonic Intellectual Property Management Co., Ltd. | Coating apparatus and method thereof |
-
1987
- 1987-03-17 JP JP6161787A patent/JPS63229166A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0448959A (en) * | 1990-06-14 | 1992-02-18 | Matsushita Electric Ind Co Ltd | Solution applying apparatus |
| US9061311B2 (en) | 2012-02-23 | 2015-06-23 | Panasonic Intellectual Property Management Co., Ltd. | Coating apparatus and method thereof |
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