JPS6322460B2 - - Google Patents

Info

Publication number
JPS6322460B2
JPS6322460B2 JP7349981A JP7349981A JPS6322460B2 JP S6322460 B2 JPS6322460 B2 JP S6322460B2 JP 7349981 A JP7349981 A JP 7349981A JP 7349981 A JP7349981 A JP 7349981A JP S6322460 B2 JPS6322460 B2 JP S6322460B2
Authority
JP
Japan
Prior art keywords
solder
horn
molten solder
stem
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7349981A
Other languages
Japanese (ja)
Other versions
JPS57188832A (en
Inventor
Katsu Funada
Yoshio Oohashi
Tadashi Ookubo
Hiroshi Kato
Masamichi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP7349981A priority Critical patent/JPS57188832A/en
Publication of JPS57188832A publication Critical patent/JPS57188832A/en
Publication of JPS6322460B2 publication Critical patent/JPS6322460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Description

【発明の詳細な説明】 本発明は半田（含他の鑞材）付方法に関する。
半導体装置の構造の一つとして、電気回路を組み
込んだ半導体小片（ペレツト）を半田によつてス
テム等の金属製基板に固定したものが知られてい
る。このペレツトの基板への取付方法としては、
(1)ステム上に半田箔、ペレツト、重錘を順次積み
重ねた後、これらを水素雰囲気中の炉体内に入れ
て半田の溶融にてペレツトをステムに取り付ける
方法、(2)ステム上に半田粒とフラツクスを混ぜ合
せた半田ペーストをポツテイングによつて塗布し
た後、半田ペースト上にペレツトを重ね合せ、加
熱するとともに、ペレツトを下端に真空吸着保持
するコレツトを振動させてペレツトをステムにこ
すり付け、溶融した半田によつてペレツトをステ
ムに固定する方法が考えられる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of applying solder (and other brazing materials).
2. Description of the Related Art As one of the structures of a semiconductor device, one in which a semiconductor pellet incorporating an electric circuit is fixed to a metal substrate such as a stem using solder is known. The method for attaching this pellet to the board is as follows:
(1) A method in which solder foil, pellets, and a weight are sequentially stacked on the stem, and then these are placed in a furnace in a hydrogen atmosphere and the pellets are attached to the stem by melting the solder. (2) Solder particles are stacked on the stem. After applying solder paste by potting a mixture of solder paste and flux, the pellets are placed on top of the solder paste, heated, and the collet that holds the pellets by vacuum suction at the lower end is vibrated to rub the pellets against the stem. A possible method is to fix the pellet to the stem using molten solder.

しかし、前者の積み重ね方法では生産量向上の
ためには大規模な炉体が必要となり、設備が大掛
りとなるとともに、ペレツトボンデイング後のワ
イヤボンデイング等との連続自動化も困難であ
る。一方、後者の半田ペースト方法ではペレツト
付後、付着しているフラツクスを除去するため洗
浄を行なう必要がある。洗浄作業は面倒であると
ともに、洗浄液も高価であることから、コストア
ツプとなる。また、コレツトにはペレツトの下方
から食み出した半田ペーストが付着し、有機物質
からなるフラツクスが導電性のカーボンとなつて
焼き付く。このカーボンはペレツトに付着する
と、耐圧不良、外観不良を引き起すとともに、次
工程の超音波ワイヤボンデイング時の接続性を不
良とする。 However, the former stacking method requires a large-scale furnace in order to increase production, requiring large-scale equipment, and it is also difficult to continuously automate processes such as wire bonding after pellet bonding. On the other hand, in the latter solder paste method, it is necessary to perform cleaning to remove adhering flux after applying the pellets. The cleaning work is troublesome and the cleaning liquid is expensive, leading to increased costs. In addition, the solder paste that has protruded from below the pellet adheres to the collect, and the flux made of organic material becomes conductive carbon and is baked. When this carbon adheres to the pellets, it causes poor pressure resistance and poor appearance, as well as poor connectivity during the next step of ultrasonic wire bonding.

そこで、本出願人は以上の不都合を解消する方
法として、第１図ａ〜ｄに示す方法を提案してい
る。この方法は、同図ａで示すように、高温かつ
窒素雰囲気下のステム１上に小片からなる半田箔
２を載置した後、同図ｂで示すようにホーン３の
先端を溶融し始めた溶融半田塊５に接触させると
ともに、ホーン３を超音波振動（縦振動）させて
溶融半田塊５とステム１との濡れを図る（予備半
田付工程）。その後、同図ｃで示すように、管状
の吸引具４によつて溶融半田塊５の一部を真空吸
引して半田塊５の大きさを調整するとともに、半
田塊５の表面の酸化物を除去した（半田吸取工
程）後、同図ｄで示すように、コレツト６でペレ
ツト７を溶融半田塊５にこすり付けて固定する
（ペレツトボンデイング工程）。なお、予備半田付
工程からペレツトボンデイング工程間において、
ステム１はヒートコラム８上に載せられ、半田塊
５が溶融する程度に加熱される。 Therefore, the present applicant has proposed the method shown in FIGS. 1a to 1d as a method for solving the above-mentioned inconvenience. In this method, as shown in Figure a, a small piece of solder foil 2 is placed on the stem 1 at high temperature and under a nitrogen atmosphere, and then the tip of the horn 3 begins to melt as shown in Figure b. While contacting the molten solder mass 5, the horn 3 is caused to vibrate ultrasonically (vertical vibration) to wet the molten solder mass 5 and the stem 1 (preliminary soldering step). Thereafter, as shown in FIG. After removing the solder (solder blotting process), as shown in FIG. In addition, between the preliminary soldering process and the pellet bonding process,
The stem 1 is placed on a heat column 8 and heated to such an extent that the solder mass 5 is melted.

このような方法では、振動を利用して溶融半田
塊５とステム１との濡れ性を図るため、フラツク
スは不要となり、前記のような不都合は生じな
い。また、予備半田付工程からペレツトボンデイ
ング工程時にステム１をヒートコラム８上に載せ
るだけでよいことから、大掛りな炉体は不要とな
る。また、この方法では図のａ〜ｄと順次ステム
はステーシヨンを変えて行くだけで各作業は行な
えるとともに、各機構部は簡便で小型である。こ
のため、自動化（連続化）にも適している。 In such a method, since the wettability between the molten solder mass 5 and the stem 1 is achieved using vibration, flux is not required, and the above-mentioned disadvantages do not occur. Further, since it is sufficient to simply place the stem 1 on the heat column 8 during the preliminary soldering process and the pellet bonding process, a large-scale furnace body is not required. Further, in this method, each operation can be performed by simply changing the station of the stem in sequence from a to d in the figures, and each mechanism is simple and compact. Therefore, it is also suitable for automation (continuation).

ところで、ペレツトボンデイング後に行なうペ
レツトの各電極とステム近傍に位置するリードと
をワイヤで接続するワイヤボンデイングにあつて
は、リード表面が酸化するとワイヤの接続性が低
下し、ボンデイングの信頼性が低下する。 By the way, when wire bonding is performed after pellet bonding, in which each electrode of the pellet is connected with a wire to a lead located near the stem, if the lead surface is oxidized, the connectivity of the wire decreases, and the reliability of the bonding decreases. do.

このため、ホーンによる前記半田付作業はリー
ドが酸化しないように、かつステムの酸化による
半田付性の劣化を防ぐために、窒素（N2）ガス
雰囲気中で行なつている。 Therefore, the soldering work using a horn is performed in a nitrogen (N 2 ) gas atmosphere in order to prevent the leads from being oxidized and to prevent deterioration of solderability due to oxidation of the stem.

しかし、この半田付方法では、本来第２図ａに
示すように半田９は四角形状に付着しなければな
らないところを、半田と基板（たとえばニツケル
メツキを施こした銅板）との濡れ性が悪く、同図
ｂで示すように半田９は部分的にしか付着しない
現象が生じた。 However, in this soldering method, the solder 9 should originally be attached in a rectangular shape as shown in FIG. As shown in FIG. 2B, a phenomenon occurred in which the solder 9 was only partially adhered.

この点について究明したところ、溶融半田に接
触させる前のステンレスからなるホーン３の先端
に半田９が付着している（第３図ａ参照）と、第
２図ａに示すように、ホーン３の先端の形状と同
様に四角形状に半田９が付着し、ホーン３の先端
に半田が付着していない（第３図ｂ参照）場合あ
るいは付着量が少ないと、第２図ｂに示すように
半田９の濡れが悪く、半田９が部分的にしか付着
しないことが判明した。これは、所定量の半田９
がホーン３に付着していると、ホーン３の先端が
新な溶融半田塊５に接触した際、ホーン３の先端
部には溶融半田が密着して、ホーン３の縦振動が
確実に溶融半田に伝わり、溶融半田塊５とステム
１の全界面で活性化されて、半田の濡れがよくな
ると考えられる。 When we investigated this point, we found that the solder 9 was attached to the tip of the horn 3 made of stainless steel before it came into contact with the molten solder (see Figure 3a). If the solder 9 adheres to a rectangular shape similar to the shape of the tip, but if no solder adheres to the tip of the horn 3 (see Fig. 3b) or if the amount of adhesion is small, the solder will be attached as shown in Fig. 2b. It was found that solder 9 had poor wetting and that solder 9 only partially adhered. This is a predetermined amount of solder 9
If it is attached to the horn 3, when the tip of the horn 3 comes into contact with a new molten solder mass 5, the molten solder will adhere to the tip of the horn 3, and the longitudinal vibration of the horn 3 will reliably transfer the molten solder. It is thought that this is transmitted and activated at the entire interface between the molten solder mass 5 and the stem 1, resulting in improved solder wetting.

一方、本発明者はホーン３を振動させている状
態で溶融半田塊５から引き上げると常に一定量の
半田が残留付着することを実験により確認した。
なお、第１図ａ〜ｄの方法では、ホーンの振動を
停止させた後にホーンを上昇させて、ホーンを溶
融半田塊から引き抜いていた。 On the other hand, the inventor of the present invention has confirmed through experiments that when the horn 3 is pulled up from the molten solder mass 5 while being vibrated, a certain amount of solder always remains and adheres.
In addition, in the method shown in FIGS. 1A to 1D, the horn was raised after the vibration of the horn was stopped, and the horn was pulled out from the molten solder mass.

そこで、本発明者はホーンを振動させながら溶
融半田塊からホーンを引き上げることによつて、
ホーンに常に一定量の残留半田を付着させてお
き、次の予備半田付作業を確実に行なう本発明を
成した。 Therefore, the inventor of the present invention solved the problem by pulling up the horn from the molten solder mass while vibrating the horn.
The present invention has been achieved in which a certain amount of residual solder is always adhered to the horn, and the next preliminary soldering work can be carried out reliably.

したがつて、本発明の目的は半田の濡れ性を安
定させることのできる半田付方法を提供すること
にある。 Therefore, an object of the present invention is to provide a soldering method that can stabilize the wettability of solder.

このような目的を達成するために本発明は、加
熱される基板上に半田塊を載置する工程と、前記
基板上で溶融した溶融半田にホーンの先端を接触
させるとともにホーンを超音波振動させて基板と
半田との濡れ性を向上させる工程とを有する半田
付方法において、前記溶融半田に先端を浸漬させ
ているホーンは超音波振動しながら溶融半田から
抜け出るようにするものであつて、以下実施例に
より本発明を説明する。 In order to achieve such an object, the present invention includes a step of placing a solder lump on a heated substrate, bringing the tip of a horn into contact with the molten solder melted on the substrate, and causing the horn to vibrate ultrasonically. In the soldering method, the horn whose tip is immersed in the molten solder is made to come out of the molten solder while vibrating ultrasonically; The invention will be explained by examples.

第４図および第５図は本発明の一実施例による
半田付方法を示す図であつて、第４図はホーンの
動きを示すグラフ、第５図ａ〜ｄはホーンの溶融
半田塊からの引抜動作を示す説明図である。この
実施例における予備半田付工程のホーンの動きは
第４図に示すグラフのように動く、すなわち、ホ
ーンはカムによつて下降してａ点に至つた後、ｂ
点からｄ点までの動きはパルスモータによつて行
なわれる。また、一定時間経過すると再びホーン
パルスモータによつてｆ，ｈと上昇し、さらに、、
ｉ点からカムによつて上昇する。このホーンの一
連の動きにおいて、ｃ点でホーンの下端は溶融半
田塊に接した後、さらに深く溶融半田塊中に入
り、ｇ点でホーンの下端は溶融半田塊から引き抜
かれる。また、ｄ〜ｅにあつては第５図ａで示す
ように、ホーン３は先端をステム上の溶融半田塊
５に接触させた状態で超音波振動し、溶融半田塊
５を縦振動させてステム１との界面の活性化を図
り、ステム１と溶融半田塊５との全面的濡れを図
る。また、ｆからｈに至るホーン３の上昇時（第
５図ｂ〜ｄ参照）には再びホーン３を超音波振動
させる。この超音波振動によつて、ステンレスか
らなるホーン３と付着している溶融半田との界面
は活性化され、ホーン３の下端には常に半田が付
き易くなる。このため、半田の表面張力、粘性に
もよつて、第５図ｄで示すように一定量の半田９
が付着する。 4 and 5 are diagrams showing a soldering method according to an embodiment of the present invention, in which FIG. 4 is a graph showing the movement of the horn, and FIGS. It is an explanatory view showing a pulling operation. The movement of the horn during the preliminary soldering process in this embodiment is as shown in the graph shown in FIG.
Movement from point to point d is performed by a pulse motor. In addition, after a certain period of time has passed, the horn pulse motor increases the frequency to f and h, and further...
It rises from point i by a cam. In this series of movements of the horn, the lower end of the horn comes into contact with the molten solder mass at point c and then penetrates deeper into the molten solder mass, and at point g the lower end of the horn is pulled out from the molten solder mass. In addition, in cases d to e, as shown in FIG. 5a, the horn 3 vibrates ultrasonically with its tip in contact with the molten solder mass 5 on the stem, causing the molten solder mass 5 to vibrate longitudinally. The interface with the stem 1 is activated, and the entire surface of the stem 1 and the molten solder mass 5 are wetted. Further, when the horn 3 rises from f to h (see FIGS. 5 b to d), the horn 3 is again caused to vibrate ultrasonically. Due to this ultrasonic vibration, the interface between the horn 3 made of stainless steel and the molten solder attached thereto is activated, and the lower end of the horn 3 is always easily attached with solder. Therefore, depending on the surface tension and viscosity of the solder, a certain amount of solder 9 as shown in FIG.
is attached.

こののように、ホーン３に常に一定量の半田９
が残留付着すると、つぎの予備半田付時にホーン
３の超音波振動が確実に溶融半田に付着する。こ
の結果、常に良好な予備半田付が行なえる。 In this way, a certain amount of solder 9 is always applied to the horn 3.
If residual adhesion occurs, the ultrasonic vibration of the horn 3 will surely adhere to the molten solder during the next preliminary soldering. As a result, good preliminary soldering can always be performed.

なお、本発明は前記実施例に限定されない。す
なわち、ホーンは途中で超音波振動を停止するこ
となくｄ点からｈ点に至るまで連続して振動する
ようにしてもよい。また、この実施例における半
田は錫、鉛による狭い意味での半田以外の他の鑞
材による半田をも意味する。 Note that the present invention is not limited to the above embodiments. That is, the horn may vibrate continuously from point d to point h without stopping the ultrasonic vibration midway. Furthermore, solder in this embodiment also means solder made of other soldering materials other than solder made of tin or lead in a narrow sense.

以上のように、本発明の半田付方法によれば、
常に安定した半田付けを行なうことができる。 As described above, according to the soldering method of the present invention,
Stable soldering can always be performed.

最後に、本願出願日前公知の半田付け方法とし
て、基板と半田との濡れ性を向上するために超音
波ホーンによつて溶融半田に超音波を与える方法
が特開昭55―136562号公報によつて知られている
ことを付記しておく。しかしながら、かかる公報
に開示の発明は、公報第４頁右下欄第11行目〜同
欄第14行目から明らかなように超音波ホーンの振
動を停止させてからそのホーンを半田から離脱さ
せるものであり、本願発明と異なつている。 Finally, as a soldering method known before the filing date of the present application, a method of applying ultrasonic waves to molten solder using an ultrasonic horn in order to improve the wettability between the board and the solder is disclosed in Japanese Patent Laid-Open No. 136562/1983. I would like to add what is known about this. However, as is clear from lines 11 to 14 of the lower right column of page 4 of the publication, the invention disclosed in this publication involves stopping the vibration of the ultrasonic horn and then separating the horn from the solder. This is different from the claimed invention.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ〜ｄは本出願人の提案による半田付方
法を示す説明図、第２図ａ，ｂは付着した半田の
形状を示す平面図、第３図ａ，ｂはホーンの半田
付着状態を示す説明図、第４図および第５図は本
発明の一実施例による半田付方法を示す図であつ
て、第４図はホーンの動きを示すグラフ、第５図
ａ〜ｄはホーンの溶融半田塊からの引抜動作を示
す説明図である。 １……ステム、２……半田箔、３……ホーン、
５……溶融半田塊、７……ペレツト、９……半
田。 Figures 1 a to d are explanatory diagrams showing the soldering method proposed by the applicant, Figures 2 a and b are plan views showing the shape of the adhered solder, and Figures 3 a and b are the state of solder adhesion to the horn. FIGS. 4 and 5 are diagrams showing a soldering method according to an embodiment of the present invention, in which FIG. 4 is a graph showing the movement of the horn, and FIGS. FIG. 3 is an explanatory diagram showing a drawing operation from a molten solder lump. 1...Stem, 2...Solder foil, 3...Horn,
5... Molten solder mass, 7... Pellet, 9... Solder.

Claims (1)

【特許請求の範囲】[Claims] １ 加熱される基板上に半田塊を載置する工程
と、前記基板上で溶融した溶融半田にホーンの先
端を接触させるとともにホーンを超音波振動させ
て基板と半田との濡れ性を向上させる工程とを有
する半田付方法において、前記溶融半田に先端を
浸漬させているホーンは超音波振動しながら溶融
半田から抜け出るようにすることを特徴とする半
田付方法。1. A process of placing a solder lump on a heated substrate, and a process of bringing the tip of a horn into contact with the molten solder melted on the substrate and vibrating the horn ultrasonically to improve the wettability between the substrate and the solder. 1. A soldering method comprising: a horn whose tip is immersed in the molten solder is caused to come out of the molten solder while being vibrated ultrasonically.
JP7349981A 1981-05-18 1981-05-18 Soldering method Granted JPS57188832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7349981A JPS57188832A (en) 1981-05-18 1981-05-18 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7349981A JPS57188832A (en) 1981-05-18 1981-05-18 Soldering method

Publications (2)

Publication Number Publication Date
JPS57188832A JPS57188832A (en) 1982-11-19
JPS6322460B2 true JPS6322460B2 (en) 1988-05-12

Family

ID=13520001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7349981A Granted JPS57188832A (en) 1981-05-18 1981-05-18 Soldering method

Country Status (1)

Country Link
JP (1) JPS57188832A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102059422A (en) * 2010-12-10 2011-05-18 哈尔滨工业大学 Electrical contact welding method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH706712A1 (en) * 2012-07-05 2014-01-15 Besi Switzerland Ag Method and apparatus for dispensing solder onto a substrate.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102059422A (en) * 2010-12-10 2011-05-18 哈尔滨工业大学 Electrical contact welding method

Also Published As

Publication number Publication date
JPS57188832A (en) 1982-11-19

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