JPS63212559A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS63212559A JPS63212559A JP4642687A JP4642687A JPS63212559A JP S63212559 A JPS63212559 A JP S63212559A JP 4642687 A JP4642687 A JP 4642687A JP 4642687 A JP4642687 A JP 4642687A JP S63212559 A JPS63212559 A JP S63212559A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- substrate
- end point
- resistance value
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 32
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板の裏面を斜めに研削し該研削面で記録印
字を行うサーマルヘッドの製造方法に関するもので、枠
に斜方研削の際の終点検出に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a thermal head that obliquely grinds the back surface of a substrate and records and prints on the ground surface. This is related to end point detection.
（発明の概要〕
本発明は、基板上に発熱抵抗体を備え、前記基板の発熱
抵抗体形成位置の裏面側が斜めに研削され、この研削面
で感熱記録を行うサーマルヘッドを製造するに際し、
基板の前記発熱抵抗体形成位置よりも側縁部側位置に抵
抗体を別体として設け、上記抵抗体の抵抗値により上記
基板に対する研削量を検出することにより、
斜方研削の製品価々のバラツキが抑えられ、終点検出が
可能で、自動化に対応可能なサーマルヘッドの製造方法
を提供しようとするものである。(Summary of the Invention) The present invention provides a thermal head in which a heating resistor is provided on a substrate, the back side of the substrate where the heating resistor is formed is obliquely ground, and thermal recording is performed on this ground surface. By providing a separate resistor at a position closer to the side edge than the heating resistor formation position, and detecting the amount of grinding on the substrate based on the resistance value of the resistor, variations in product value due to oblique grinding can be reduced. The present invention aims to provide a method for manufacturing a thermal head that is capable of suppressing the amount of noise, is capable of detecting the end point, and is compatible with automation.
従来、感熱記録方式に使用されるサーマルヘッドには、
基板上に形成した発熱抵抗体形成面で感熱記録を行う平
板型サーマルヘッド、曲面を有するロンド上に発熱抵抗
体を形成したサーマルヘシドを記録紙に対して垂直に設
置して感熱記録を行う端面型サーマルヘッド、その他こ
れらの応用型のサーマルヘッド等が各種提案されている
。Conventionally, the thermal head used for thermal recording method has
A flat type thermal head performs thermal recording on a surface on which a heating resistor is formed on a substrate, and an edge type thermal head performs thermal recording by placing a thermal head, in which a heating resistor is formed on a curved rond, perpendicular to the recording paper. Various thermal heads and other applied thermal heads have been proposed.
例えば、本願出願人は特願昭６１−２１４０７８号明細
書において、発熱抵抗体を形成した基板の裏面を斜めに
研削し、該研削面を記録面としたサーマルヘッドを記録
紙に対して斜めに装着して感熱記録を行う、所謂裏面型
サーマルヘッドを提案した。For example, in the specification of Japanese Patent Application No. 61-214078, the applicant of the present application obliquely grinds the back surface of a substrate on which a heating resistor is formed, and uses the ground surface as a recording surface to attach a thermal head diagonally to the recording paper. We proposed a so-called back-side thermal head that can be worn to perform thermal recording.
上記裏面型サーマルヘッドは、発熱抵抗体、駆動回路部
、配線回路部等が形成された基板主面上に放熱用基板を
設けた構造をしている。そして、発熱抵抗体等が形成さ
れていない基板の裏面側において感熱記録を行うように
なっている。The back type thermal head has a structure in which a heat dissipation substrate is provided on the main surface of the substrate on which a heating resistor, a drive circuit section, a wiring circuit section, etc. are formed. Then, thermal recording is performed on the back side of the substrate on which no heating resistor or the like is formed.
上記裏面型サーマルヘッドの裏面側は、プラテンに対す
る当たり特性を改善するために発熱抵抗体形成部分に当
たる基板の裏面側を斜めに研削し、該研削面を記録面と
して記録紙に対して斜めにサーマルヘッドを装着して良
好な感熱記録特性を得ている。On the back side of the above-mentioned back-type thermal head, in order to improve the contact characteristics against the platen, the back side of the substrate that corresponds to the part where the heating resistor is formed is ground diagonally, and the ground surface is used as the recording surface to thermally print diagonally to the recording paper. The head was attached to obtain good thermal recording characteristics.
上記裏面型サーマルヘッドにおいて基板の裏面側を斜方
研削する際には、
■自動研削により研削量を制限してもサーマルヘッドの
組み立て段階において基板の厚さ、接着剤の塗布厚さ、
ベースプレートの厚さ等にバラツキがあるため発熱抵抗
体から記録面までの距離（厚さ）にバラウキが生じてし
まい、記録印字に悪影響があること、
■上記発熱抵抗体から記録面までの距離（厚さ）は、サ
ーマルヘッドの印字品質、寿命等に深く係わっているた
めバラツキ無く精度よく加工する必要性があること、
■しかしながら、研削量を適切な値に制御したり、その
終点を検出する方法がないこと、
等の各種の問題があった。When obliquely grinding the back side of the substrate with the above-mentioned back-side thermal head, ■ Even if the amount of grinding is limited by automatic grinding, the thickness of the substrate, the thickness of the adhesive applied, etc.
Due to variations in the thickness of the base plate, the distance (thickness) from the heating resistor to the recording surface will vary, which will have an adverse effect on recording and printing. ■The distance from the heating resistor to the recording surface ( Thickness) is closely related to the printing quality and lifespan of the thermal head, so it is necessary to process it with high precision without variation. There were various problems such as the lack of a method.
そこで、本発明は上述の従来の問題点を解決するために
提案されたものであって、斜め研削の製品側々のバラツ
キによる影響がなく、精度良く加工ができ、終点検出が
可能で、自動化に対応可能なサーマルヘッドの製造方法
を提供することを目的とするものである。Therefore, the present invention was proposed in order to solve the above-mentioned conventional problems.It is free from the influence of variations in the products of diagonal grinding, can be machined with high precision, can detect the end point, and can be automated. The purpose of this invention is to provide a method for manufacturing a thermal head that is compatible with the following.
本発明は、上述の目的を達成するために、基板上に発熱
抵抗体を備え、前記基板の発熱抵抗体形成位置の裏面側
が斜めに研削され、この研削面で感熱記録を行うサーマ
ルヘッドを製造するに際し、基板の前記発熱抵抗体形成
位置よりも側縁部側位置に抵抗体を別体として設け、上
記抵抗体の抵抗値により上記基板に対する研削量を検出
することを特徴とするものである。In order to achieve the above-mentioned object, the present invention manufactures a thermal head that includes a heating resistor on a substrate, the back side of the substrate where the heating resistor is formed is ground obliquely, and performs thermal recording on this ground surface. In doing so, a resistor is separately provided at a position closer to the side edge of the substrate than the position where the heating resistor is formed, and the amount of grinding of the substrate is detected based on the resistance value of the resistor. .
基板上に抵抗体を設けておき、斜め研削を行うと、研削
が進むにしたがい抵抗体が削り取られ、抵抗値は大きく
なる。従って、この抵抗体の抵抗値を測定しながら研削
を進め、所定の抵抗値となったところで研削を停止すれ
ば、研削■は確実に所定の値に制御される。When a resistor is provided on a substrate and diagonal grinding is performed, the resistor is removed as the grinding progresses, and the resistance value increases. Therefore, by proceeding with the grinding while measuring the resistance value of this resistor and stopping the grinding when the resistance value reaches a predetermined value, the grinding (2) can be reliably controlled to the predetermined value.
また、研削量検出用の抵抗体は、発熱抵抗体と同時に作
製することが可能であるため、サーマルヘッドの製造工
程及び生産効率等には影響を与えることがない。Furthermore, since the resistor for detecting the amount of grinding can be manufactured at the same time as the heating resistor, it does not affect the manufacturing process and production efficiency of the thermal head.
以下、本発明を適用した実施例について図面を参考にし
て説明する。Embodiments to which the present invention is applied will be described below with reference to the drawings.
本発明を適用するサーマルヘッドは、第６図に示すよう
に、基板（１）の主面（１ａ）上に発熱抵抗体（２）、
配線回路部（５）及び駆動回路部（４）とが設けられ、
その上部に耐酸化層（６）及び接着剤層（７）を介して
支持放熱板（８）が接合一体化された構成をしている。As shown in FIG. 6, the thermal head to which the present invention is applied includes a heating resistor (2) on the main surface (1a) of the substrate (1),
A wiring circuit section (5) and a drive circuit section (4) are provided,
A support heat dissipation plate (8) is integrally bonded to the upper part of the support plate via an oxidation-resistant layer (6) and an adhesive layer (7).
そして、上記サーマルへラドの基板（１）の裏面（１ｂ
）であって、発熱抵抗体（２）形成部分に相当する部分
が、基板側縁部（１ｃ）に向かって傾斜面として研削加
工され、該研削面（９）で感熱記録を行うようになって
いる。Then, the back side (1b) of the substrate (1) of the thermal helad
), the part corresponding to the part where the heating resistor (2) is formed is ground as an inclined surface toward the substrate side edge (1c), and thermal recording is performed on the ground surface (9). ing.
このように基板（１）の裏面（１ｂ）であって、発熱抵
抗体（２）形成部分に相当する部分を基板端部（ｌＣ）
に向かって傾斜面として研削加工し、該研削面（９）で
印字を行うこととすることにより、サーマルヘッドをプ
ラテン（１０）に対して斜めに装着することができ、上
記プラテン（ｌＯ）に対する当たり特性が向上し印字品
質に優れたサーマルヘッドとなる。In this way, the back surface (1b) of the substrate (1), which corresponds to the part where the heating resistor (2) is formed, is connected to the edge of the substrate (1C).
The thermal head can be mounted obliquely to the platen (10) by grinding it as an inclined surface toward the platen (10) and printing on the ground surface (9). The thermal head has improved contact characteristics and excellent printing quality.
上述のような構成で示される裏面型サーマルヘッドは、
次に示すような抵抗体からなる研削終点検出パターン（
３）を設けて作製する。The back-side thermal head shown in the above configuration is
Grinding end point detection pattern consisting of a resistor as shown below (
3) is prepared.
先ず、第３図Ａに示すように、石英からなる基板（１）
上にＴａ、Ｎ、Ｔａ−３ｔ０．等の通常の発熱抵抗体材
料を使用した発熱抵抗体（２）を基板側縁部（１ｃ）か
ら所定路離隔てた位置に形成する。First, as shown in FIG. 3A, a substrate (1) made of quartz is prepared.
Ta, N, Ta-3t0. A heat generating resistor (2) using a conventional heat generating resistor material such as the above is formed at a position spaced a predetermined distance from the substrate side edge (1c).
上記発熱抵抗体形成時に同時に研削終点検出パターン（
３）を形成する。上記研削終点検出パターン（３）は、
発熱抵抗体（２）と同一の材料を用いて作製すればよく
、したがって発熱抵抗体（２）と同時に形成することが
できる。そのため、サーマルヘッドの製造工程としては
何等工程の増加、煩雑さを招くことなく研削終点検出パ
ターン（３）を形成することができる。Grinding end point detection pattern (
3) Form. The above grinding end point detection pattern (3) is
It may be manufactured using the same material as the heating resistor (2), and therefore it can be formed at the same time as the heating resistor (2). Therefore, the grinding end point detection pattern (3) can be formed without increasing the number of steps or complicating the manufacturing process of the thermal head.
上記研削終点検出パターン（３）は、第１図に示すよう
に、基板主面（ｌａ）上であって、発熱抵抗体（２）と
基板側縁部（ｌｃ）との間に所定の幅を有した帯状抵抗
体として形成されるものである。そして、上記研削終点
検出パターン（３）の両端には、基板他側縁部（１ｄ）
側に向かって引き出された導体線（３ａ）が導出されて
おり、研削終点検出パターン（３）全体としては、略コ
字形状となっている。上記導体＆’！（３ａ）は、外部
抵抗測定器と接続され、基板（１）を斜方研削した場合
に変化する研削終点検出パターン（３）の抵抗値が測定
できるようになっている。As shown in FIG. 1, the grinding end point detection pattern (3) is formed on the main surface (la) of the substrate and has a predetermined width between the heating resistor (2) and the edge of the substrate (lc). It is formed as a strip-shaped resistor with At both ends of the grinding end point detection pattern (3), there are edges (1d) on the other side of the substrate.
A conductor wire (3a) is drawn out toward the side, and the grinding end point detection pattern (3) as a whole has a substantially U-shape. Above conductor &'! (3a) is connected to an external resistance measuring device so that the resistance value of the grinding end point detection pattern (3) that changes when the substrate (1) is obliquely ground can be measured.
また、上記研削終点検出パターン（３）は、第２図に示
すように、基板（１）上に形成された発熱抵抗体（２）
の並び方向左右両端部に二箇所に分けてそれぞれ形成し
てもよい、上述のように基板上三箇所に分けて研削終点
検出パターン（３）を形成することにより斜め研削時の
左右の研削バランスを調整することができる。Furthermore, the grinding end point detection pattern (3) is based on the heating resistor (2) formed on the substrate (1), as shown in FIG.
The left and right grinding balance during diagonal grinding can be improved by forming the grinding end point detection pattern (3) in three places on the board as described above. can be adjusted.
次に、第３図已に示すように、外部からの信号を発熱抵
抗体（２）に伝える駆動回路部（４）（本実施例では駆
動用ＩＣチップ）を形成する。上記駆動回路部（４）は
、駆動用ＩＣチップを接着取りつけしてもよく、また薄
膜技術を用いて駆動回路部を形成したタイプのものであ
ってもよい。Next, as shown in FIG. 3, a drive circuit section (4) (in this embodiment, a drive IC chip) for transmitting external signals to the heating resistor (2) is formed. The drive circuit section (4) may have a drive IC chip attached thereto by adhesive, or may be of a type in which the drive circuit section is formed using thin film technology.
そして、第３図Ｃに示すように、基板（１）上に研削終
点検出パターン（３）１発熱抵抗体（２）、駆動回路部
（４）及び配線回路部（５）を形成した上部に耐酸化Ｆ
Ｊ （６）及び接着剤Ｎ（７）を介して支持放熱板（８
）を接合一体化してサーマルヘッドが構成される。As shown in FIG. 3C, a grinding end point detection pattern (3), a heating resistor (2), a drive circuit section (4), and a wiring circuit section (5) are formed on the substrate (1). Oxidation resistance F
J (6) and the support heat sink (8) via adhesive N (7).
) are joined together to form a thermal head.
続いて、上述のように形成したサーマルヘッドの基板（
１）の裏面（１ｂ）側であって、発熱抵抗体（２）の形
成部分に当たる場所に対して、第３図りに示すように、
所定の角度を有した研削ＷＪ（９）を形成するように斜
め研削を行いサーマルヘッドを完成する。この場合、発
熱抵抗体（２）中心部上の基板（１）厚さを所定の厚さ
ｔとなるように制御するために、次に示す斜方研削方法
を用いて行う。Next, the thermal head substrate formed as described above (
As shown in the third diagram, on the rear surface (1b) side of 1), where the heating resistor (2) is formed,
Diagonal grinding is performed to form a grinding WJ (9) having a predetermined angle, and the thermal head is completed. In this case, in order to control the thickness of the substrate (1) above the central portion of the heating resistor (2) to a predetermined thickness t, the following oblique grinding method is used.
すなわち、第４図に示すように、基板の裏面（１ｂ）を
傾斜角度θとして順次研削を進めた場合、第４図中人で
示される第１研削状態、第４図中Ｂで示される第２研削
状態、第４図中Ｃで示される第３研削状態、第４図中り
で示される第４研削状態と研削状態は徐々に進行してい
く、上記第１研削状態は、基板の端部を研削したのみで
未だ研削終点検出パターン（３）に研削量が至っていな
い状態を示しており、この状態では第５図中Ａで示すよ
うに研削終点検出パターン（３）の示す抵抗値には何等
変化は生じておらず初期状態を示している。That is, as shown in FIG. 4, when the back surface (1b) of the substrate is sequentially ground at an angle of inclination θ, the first grinding state is shown by the middle circle in FIG. 4, and the first grinding state is shown by B in FIG. The grinding state gradually progresses to the second grinding state, the third grinding state shown by C in FIG. 4, and the fourth grinding state shown in the middle of FIG. This shows a state in which the grinding amount has not yet reached the grinding end point detection pattern (3) after only grinding the part, and in this state, as shown by A in Fig. 5, the resistance value indicated by the grinding end point detection pattern (3) shows the initial state without any change.
この状態から研削を進めていくと第２研削状態に達する
。この状態は、研削終点検出パターン（３）に研削量が
ちょうど達した状態を示しており、第５図中Ｂで示すよ
うに研削終点検出パターン（３）の示す抵抗値が次第に
大きくなり始める状態を示している。さらに基板の研削
を進めていくと第３研削状態に至る。この状態は、研削
終点検出パターン（３）の略中心に研削量が達した状態
を示しており、第２研削状態より研削状態は進行し、第
５図中Ｃで示すように研削終点検出パターン（３）の示
す抵抗値も大きくなり、残存厚さｔも減少している。さ
らに、基板に対して研削を進行させると第４研削状態に
至る。この状態は、研削終点検出パターン（３）を略研
削し終わった状態を示しており、第５図中りで示すよう
に研削終点検出パターン（３）の示す抵抗値は無限大を
示し、基板の残存厚も非常に薄くなる。As the grinding progresses from this state, the second grinding state is reached. This state shows a state in which the amount of grinding has just reached the grinding end point detection pattern (3), and the resistance value indicated by the grinding end point detection pattern (3) begins to gradually increase, as shown by B in Fig. 5. It shows. As the substrate is further ground, a third grinding state is reached. This state shows a state in which the amount of grinding has reached approximately the center of the grinding end point detection pattern (3), and the grinding state progresses from the second grinding state, and the grinding end point detection pattern as shown by C in FIG. The resistance value shown in (3) also increases, and the remaining thickness t also decreases. Furthermore, when the substrate is ground, a fourth grinding state is reached. This state indicates that the grinding end point detection pattern (3) has almost finished grinding, and as shown in the middle of FIG. The remaining thickness also becomes very thin.
このように、基板を研削するにしたがい、研削終点検出
パターンが徐々に削り取られ、研削終点検出パターン（
３）の示す抵抗値が上昇し、基板（１）の残存厚さ【は
減少する。In this way, as the board is ground, the grinding end point detection pattern is gradually removed, and the grinding end point detection pattern (
The resistance value indicated by 3) increases, and the remaining thickness of the substrate (1) decreases.
したがって、研削終点検出パターン（３）の示す抵抗値
を測定し、所定の抵抗値を示したところで研削を停止す
ることにより、基板の厚さｔは常に一定の所望の基板厚
に確実に制御することができる。Therefore, by measuring the resistance value indicated by the grinding end point detection pattern (3) and stopping grinding when a predetermined resistance value is shown, the thickness t of the substrate can be reliably controlled to always be a constant desired substrate thickness. be able to.
例えば、研削終点検出パターン（３）を全て研削し終わ
る状態で研削を終了することとした場合には、第５図中
りで示されるように、研削終点検出パターン（３）の示
す抵抗値が無限大になる瞬間を確認し、その時に研削を
終了することにより、基板の残存厚は常に１．に制御す
ることができる。For example, if you decide to end the grinding after all the grinding end point detection patterns (3) have been ground, the resistance value indicated by the grinding end point detection pattern (3) will change as shown in Figure 5. By checking the moment when it reaches infinity and finishing the grinding at that time, the remaining thickness of the substrate is always 1. can be controlled.
尚、研削終点検出パターン（３）を研削することによる
研削■と基板（１）と発熱抵抗体（２）との残存厚さｔ
の量の制御は、研削角度によってその関係は異なるもの
となることから研削角度に応じた抵抗値を予め知ってお
く必要があり、研削角度と抵抗値の相互関係を正確に把
握しておくことにより基板の斜方研削が精度よく行うこ
とができるようになる。In addition, the residual thickness t of the grinding end point detection pattern (3) and the remaining thickness of the substrate (1) and heating resistor (2)
To control the amount of , the relationship differs depending on the grinding angle, so it is necessary to know the resistance value according to the grinding angle in advance, and it is necessary to accurately understand the mutual relationship between the grinding angle and the resistance value. This makes it possible to perform diagonal grinding of the substrate with high precision.
また、研削量と研削角度及び抵抗値の相互関係を正確に
把握することにより斜方研削の自動化にも対応すること
ができることになる。Furthermore, by accurately understanding the interrelationship between the amount of grinding, the grinding angle, and the resistance value, it becomes possible to automate oblique grinding.
以上のように基板の裏面を斜めに研削する場合に発熱抵
抗体と基板側縁部との間に研削終点検出パターンを形成
することにより研削量と残存厚さとの関係が研削量と研
削角度及び抵抗値の相互関係により正確に導き出せるこ
ととなり、斜め研削の製品側々のバラツキが抑えられ、
終点検出が可能で、自動化に対応可能となる。As described above, when grinding the back surface of a board diagonally, by forming a grinding end point detection pattern between the heating resistor and the side edge of the board, the relationship between the amount of grinding and the remaining thickness can be determined by It is possible to accurately derive the resistance value based on the mutual relationship between the resistance values, suppressing variations between diagonal grinding products, and
End point detection is possible and automation is possible.
以上の説明から明らかなように、本発明においては、基
板の裏面を斜めに研削する場合に発熱抵抗体と基板側縁
部との間に研削終点検出パターンを形成しているので、
研削量と残存厚さとの関係が研削量と研削角度及び抵抗
（直の相互関係により正確に導き出せ、的確な終点検出
が可能となって、斜め研削の製品側々のバラツキが抑え
られる。As is clear from the above description, in the present invention, when the back surface of the substrate is ground obliquely, the grinding end point detection pattern is formed between the heating resistor and the side edge of the substrate.
The relationship between the amount of grinding and the remaining thickness can be accurately derived from the direct correlation between the amount of grinding, the grinding angle, and the resistance (direct relationship), making it possible to accurately detect the end point and suppressing variations between products during diagonal grinding.
また、同時に研削工程の自動化にも対応することができ
ることになる。At the same time, it will also be possible to automate the grinding process.
さらに、基板に不透明なセラミックス板やガラス板等を
用いた場合に特に有効な方法である。Furthermore, this method is particularly effective when an opaque ceramic plate, glass plate, or the like is used as the substrate.
第１図は研削終点検出パターンの一例を示す概略平面図
である。
第２図は研削終点検出パターンの他の例を示す概略平面
図である。
第３図Ａ乃至第３図りは本発明を適用したサーマルヘッ
ドの製造工程を示す概略断面図であり、第３図Ａは発熱
抵抗体及び研削終点検出パタニンの形成工程、第３図Ｂ
は駆動回路部形成工程、第３図Ｃは支持放熱板取り付は
工程、第３図りは基板斜方研削工程をそれぞれ示してい
る。
第４図はサーマルヘッドの研削状態を示す概略模式図で
ある。
第５図は研削量と研削終点検出パターンの示す抵抗値と
の関係及び研削量と基板の残存厚さＬとの関係を示す特
性図である。
第６図は本発明を適用して作製したサーマルへ・７ドの
一構成例を示す概略断面図である。
■・・・基板
１ａ・・・基板主面
２・・・発熱抵抗体
３・・・抵抗体（研削終点検出パターン）９・・・研削
面
特許出願人 ソニー株式会社
代理人 弁理士 小泡 晃
同 印材 榮−FIG. 1 is a schematic plan view showing an example of a grinding end point detection pattern. FIG. 2 is a schematic plan view showing another example of the grinding end point detection pattern. 3A to 3D are schematic cross-sectional views showing the manufacturing process of a thermal head to which the present invention is applied.
3C shows the step of forming the drive circuit section, FIG. 3C shows the step of attaching the supporting heat sink, and the third figure shows the step of obliquely grinding the substrate. FIG. 4 is a schematic diagram showing the grinding state of the thermal head. FIG. 5 is a characteristic diagram showing the relationship between the amount of grinding and the resistance value indicated by the grinding end point detection pattern, and the relationship between the amount of grinding and the remaining thickness L of the substrate. FIG. 6 is a schematic cross-sectional view showing an example of the structure of a thermal guide 7 manufactured by applying the present invention. ■...Substrate 1a...Board principal surface 2...Heating resistor 3...Resistor (grinding end point detection pattern) 9...Grinding surface Patent applicant Akira Kowa, Sony Corporation representative Patent attorney Same stamp material Sakae
Claims (1)
位置の裏面側が斜めに研削され、この研削面で感熱記録
を行うサーマルヘッドを製造するに際し、 基板の前記発熱抵抗体形成位置よりも側縁部側位置に抵
抗体を別体として設け、 上記抵抗体の抵抗値により上記基板に対する研削量を検
出することを特徴とするサーマルヘッドの製造方法。[Scope of Claims] In manufacturing a thermal head, a heating resistor is provided on a substrate, the back side of the substrate where the heating resistor is formed is obliquely ground, and thermal recording is performed on this ground surface. A method for manufacturing a thermal head, characterized in that a resistor is separately provided at a position closer to a side edge than a position where the resistor is formed, and the amount of grinding of the substrate is detected based on the resistance value of the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4642687A JPS63212559A (en) | 1987-02-28 | 1987-02-28 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4642687A JPS63212559A (en) | 1987-02-28 | 1987-02-28 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63212559A true JPS63212559A (en) | 1988-09-05 |
Family
ID=12746824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4642687A Pending JPS63212559A (en) | 1987-02-28 | 1987-02-28 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63212559A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5181046A (en) * | 1990-01-09 | 1993-01-19 | Seiko Instruments Inc. | Thermal head |
-
1987
- 1987-02-28 JP JP4642687A patent/JPS63212559A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5181046A (en) * | 1990-01-09 | 1993-01-19 | Seiko Instruments Inc. | Thermal head |
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