JPS63196363U - - Google Patents

Info

Publication number
JPS63196363U
JPS63196363U JP8740187U JP8740187U JPS63196363U JP S63196363 U JPS63196363 U JP S63196363U JP 8740187 U JP8740187 U JP 8740187U JP 8740187 U JP8740187 U JP 8740187U JP S63196363 U JPS63196363 U JP S63196363U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conveyor
solder
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8740187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8740187U priority Critical patent/JPS63196363U/ja
Publication of JPS63196363U publication Critical patent/JPS63196363U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係るはんだリフロ
ー装置の側面図、第２図は、従来の電気式はんだ
リフロー装置の側面図、第３図は、従来の蒸気式
はんだリフロー装置の側面図である。 １：印刷配線基板、２：ヒーター、３：非接触
式赤外線温度センサー、４：制御用コンピユータ
ー、５：コンベアー。 FIG. 1 is a side view of a solder reflow device according to an embodiment of the present invention, FIG. 2 is a side view of a conventional electric solder reflow device, and FIG. 3 is a side view of a conventional steam solder reflow device. It is. 1: Printed wiring board, 2: Heater, 3: Non-contact infrared temperature sensor, 4: Control computer, 5: Conveyor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線基板を載置してリフロー炉内を通過さ
せるコンベアーと、該コンベアー上方に位置し上
記印刷配線基板上のはんだペーストを加熱・溶融
して印刷配線基板上に表面実装部品のはんだ付け
を行わせるヒーターとを備えるはんだリフロー装
置において、上記リフロー炉内を通過する加熱印
刷配線基板の温度を監視するための非接触式赤外
線温度センサーと、この非接触式赤外線温度セン
サーにて感知した温度とあらかじめ設定した温度
条件を比較して上記ヒーターを制御するコンピユ
ーターとを備えることを特徴とするはんだリフロ
ー装置。 A conveyor on which a printed wiring board is placed and passed through a reflow oven, and a conveyor located above the conveyor that heats and melts the solder paste on the printed wiring board to solder surface mount components onto the printed wiring board. In the solder reflow apparatus, the solder reflow apparatus is equipped with a non-contact infrared temperature sensor for monitoring the temperature of the heated printed wiring board passing through the reflow oven, and a temperature sensed by the non-contact infrared temperature sensor and the temperature detected by the non-contact infrared temperature sensor. A computer for controlling the heater by comparing set temperature conditions.
JP8740187U 1987-06-05 1987-06-05 Pending JPS63196363U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8740187U JPS63196363U (en) 1987-06-05 1987-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8740187U JPS63196363U (en) 1987-06-05 1987-06-05

Publications (1)

Publication Number Publication Date
JPS63196363U true JPS63196363U (en) 1988-12-16

Family

ID=30944577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8740187U Pending JPS63196363U (en) 1987-06-05 1987-06-05

Country Status (1)

Country Link
JP (1) JPS63196363U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143304A (en) * 2013-01-24 2014-08-07 Origin Electric Co Ltd Thermal bonding device and method of manufacturing thermally bonded product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143304A (en) * 2013-01-24 2014-08-07 Origin Electric Co Ltd Thermal bonding device and method of manufacturing thermally bonded product

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