JPS6318877U - - Google Patents

Info

Publication number
JPS6318877U
JPS6318877U JP11299586U JP11299586U JPS6318877U JP S6318877 U JPS6318877 U JP S6318877U JP 11299586 U JP11299586 U JP 11299586U JP 11299586 U JP11299586 U JP 11299586U JP S6318877 U JPS6318877 U JP S6318877U
Authority
JP
Japan
Prior art keywords
circuit board
mounting structure
electronic component
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11299586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11299586U priority Critical patent/JPS6318877U/ja
Publication of JPS6318877U publication Critical patent/JPS6318877U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａはこの考案の実施例である回路基板取
付構造を示す図であり、同図Ｂはカバー取付前の
底面図である。また第２図Ａは従来の回路基板取
付構造を示し、同図Ｂはカバー取付前のその底面
図を示している。 １……フレーム、１ａ……膨出部、２……回路
基板、４……カバー、５……電子部品。 FIG. 1A is a diagram showing a circuit board mounting structure according to an embodiment of this invention, and FIG. 1B is a bottom view before the cover is attached. Further, FIG. 2A shows a conventional circuit board mounting structure, and FIG. 2B shows a bottom view thereof before the cover is attached. DESCRIPTION OF SYMBOLS 1...Frame, 1a...Bulging part, 2...Circuit board, 4...Cover, 5...Electronic component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 矩形枠状のフレーム内に回路基板を仮固定した
後半田デイツピングするものにおいて、少なくと
も回路基板の端部に実装されている電子部品に対
向するフレーム部を外側に膨出させたことを特徴
とする回路基板取付構造。 A circuit board temporarily fixed in a rectangular frame for solder dipping, characterized in that at least a portion of the frame facing an electronic component mounted on an end of the circuit board is bulged outward. Circuit board mounting structure.
JP11299586U 1986-07-22 1986-07-22 Pending JPS6318877U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11299586U JPS6318877U (en) 1986-07-22 1986-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11299586U JPS6318877U (en) 1986-07-22 1986-07-22

Publications (1)

Publication Number Publication Date
JPS6318877U true JPS6318877U (en) 1988-02-08

Family

ID=30994376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11299586U Pending JPS6318877U (en) 1986-07-22 1986-07-22

Country Status (1)

Country Link
JP (1) JPS6318877U (en)

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