JPS63186877A - Plating method with laser light - Google Patents
Plating method with laser lightInfo
- Publication number
- JPS63186877A JPS63186877A JP1927287A JP1927287A JPS63186877A JP S63186877 A JPS63186877 A JP S63186877A JP 1927287 A JP1927287 A JP 1927287A JP 1927287 A JP1927287 A JP 1927287A JP S63186877 A JPS63186877 A JP S63186877A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- laser light
- metal
- excimer laser
- irradiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229920000098 polyolefin Polymers 0.000 claims abstract description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims abstract description 13
- 238000007772 electroless plating Methods 0.000 claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 230000001133 acceleration Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 13
- 229920002799 BoPET Polymers 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ポリエチレンテレフタレート（ＰＥＴ）等
のポリオレフインチレフクレート製品に対するレーザー
メッキ法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser plating method for polyolefin inch reflectorate products such as polyethylene terephthalate (PET).
従来、ポリエチレンテレフタレート（以下「ＰＥＴＪと
略す）等のポリオレフィンテレフタレートからなる製品
、特に、ＰＥＴフィルムあるいはシートの表面に対する
メッキは、前処理としてＰＥＴフィルムにブリディッピ
ング（エツチング処理工程）、キャタライジング（スズ
イオンをＰＥＴフィルム表面に吸着させる工程）、アク
セラレーティング（塩化パラジウムの塩酸酸性液に浸漬
する工程）を行フたのちに無電解メッキ法で金属をメッ
キし、さらに、その後電解メッキ法を併用して行ってい
た。Conventionally, when plating the surface of products made of polyolefin terephthalate such as polyethylene terephthalate (hereinafter abbreviated as "PETJ"), especially PET films or sheets, the PET film was pre-treated by bri-dipping (etching process) and catalyzing (tin ion irradiation). After performing the process of adsorbing palladium chloride onto the surface of the PET film) and accelerating (the process of immersing palladium chloride in an acidic solution of hydrochloric acid), metal is plated using an electroless plating method, and then an electrolytic plating method is also used. was.
しかしながら、従来知られている上記の方法でメッキを
施したものは、ＰＥＴフィルムと金属との密着力が不充
分であった。その原因は、ポリエチレンが高い不活性度
と疎水性を有しているため、前記従来の前処理だけでは
金属メッキに効果的なフィルム表面の粗面化現象および
フィルム表面の活性化現象が起こらないためと考えられ
る。このように、実用上支障のないＰＥＴフィルムへの
金属メッキ法が確立されていないのが実情であり、この
開発が強く要望されている。However, in those plated using the conventionally known method described above, the adhesion between the PET film and the metal was insufficient. The reason for this is that polyethylene has high inertness and hydrophobicity, so the conventional pretreatment alone does not cause the film surface roughening phenomenon and film surface activation phenomenon that are effective for metal plating. It is thought that this is because of this. As described above, the reality is that no practical method of metal plating on PET film has been established, and the development of this method is strongly desired.
この発明は、このような事情に鑑みなされたもので、従
来のメッキ法の欠点である密着力の弱さを解消し、ＰＥ
Ｔフィルム等のポリオレフィンテレフタレート製品とメ
ッキ金属、特にメッキ銅との密着力を強固にすることを
その目的とする。This invention was made in view of these circumstances, and it eliminates the weak adhesion that is the drawback of conventional plating methods, and
The purpose is to strengthen the adhesion between polyolefin terephthalate products such as T-film and plated metal, especially plated copper.
Ｃ問題点を解決するための手段〕
上記の目的を達成するため、この発明のレーザーメッキ
法は、エキシマレーザ−光を照射したポリオレフィンテ
レフタレート製品の照射面に、無電解メッキ法を利用し
て金属をメッキするという構成をとる。Means for Solving Problem C] In order to achieve the above object, the laser plating method of the present invention uses electroless plating to coat the irradiated surface of a polyolefin terephthalate product with excimer laser light. It has a structure of plating.
すなわち、上記エキシマレーザ−光の照射によりポリオ
レフィンテレフタレート製品、例えばＰＥＴ、フィルム
の表面が適度な粗面状態になると同時に活性化状態にな
り、それによって、金属メッキ層が上記フィルム表面に
強固に密着するようになる。That is, by irradiating the excimer laser light, the surface of the polyolefin terephthalate product, such as PET, becomes appropriately rough and at the same time becomes activated, whereby the metal plating layer firmly adheres to the surface of the film. It becomes like this.
この発明は、上記のように、エキシマレーザ−光を利用
してＰＥＴフィルム等のポリオレフィンテレフタレート
製品の表面に金属メッキを施すものである。As described above, the present invention applies metal plating to the surface of a polyolefin terephthalate product such as a PET film using excimer laser light.
上記エキシマレーザ−光は、励起状態においてのみ存在
できる不安定な分子を形成する原子を材料として得られ
るレーザー（現代レーザー工学。The above-mentioned excimer laser light is a laser (modern laser technology) obtained from atoms that form unstable molecules that can only exist in an excited state.
オーム社参照）のことであり、ＬＡＭＢＤＡ ＰＩＩＹ
ＳＩＫ社製他の機械によって発振される。特に好適な照
射条件としては、１０〜１００００ｍＪ／ｃ＋ｆｌ、よ
り好適な条件は５０〜３０００ｍＪ／ＣｒＡ、最も好適
な条件は１００−１０００ｍＪ／ａａである。Ohmsha), and LAMBDA PIIY
It is oscillated by another SIK machine. Particularly preferred irradiation conditions are 10 to 10,000 mJ/c+fl, more preferred conditions are 50 to 3,000 mJ/CrA, and most preferred conditions are 100 to 1,000 mJ/aa.
また、上記エキシマレーザ−光のレーザー照射の対象と
なるＰＥＴ等のポリオレフィンテレフタレート製品は、
従来公知のＰＥＴやポリブチレンテレフタレート（ＰＢ
Ｔ）があげられ、通常は、フィルム状のものが対象とな
る。しかし、フィルム等の柔軟な形状のものではなく、
固形状の製品も対象とすることができる。In addition, polyolefin terephthalate products such as PET that are subject to laser irradiation with the excimer laser light are
Conventionally known PET and polybutylene terephthalate (PB)
T), and film-like products are usually targeted. However, it is not a flexible shape such as a film,
Solid products can also be targeted.
このようなポリオレフィンテレフタレート製品にエキシ
マレーザ−光が照射されると、そのレーザー光の作用に
より、照射面に粗面化と同時に活性化が生じる。これに
より、ポリオレフィンテレフタレート製品の照射面が金
属メッキに対して望ましい状態となる。When such a polyolefin terephthalate product is irradiated with excimer laser light, the irradiated surface is roughened and simultaneously activated due to the action of the laser light. This leaves the irradiated surface of the polyolefin terephthalate product in a desirable state for metal plating.
このようにして表面粗化されたポリオレフィンテレフタ
レート製品に対して、通常、従来の前処理であるブリデ
ィッピング、キャタライジング。For polyolefin terephthalate products whose surface has been roughened in this way, conventional pretreatments such as bri-dipping and catalyzing are usually applied.
アクセラレーティングを施したのち、メッキがなされる
。このメッキは、■無電解メッキのみと、■無電解メッ
キ＋電解メッキの２通りの方法がある。メッキに使用さ
れる金属としては、銅、ニッケル、コバルトがあるが、
特に好結果が得られるのは銅である。■の場合は条件と
して高温の硫酸銅浴でメッキが施され、■の条件として
は硫酸銅浴またはシアン化銅浴でメッキが施される。After accelerating, plating is performed. There are two methods for this plating: (1) electroless plating only, and (2) electroless plating + electrolytic plating. Metals used for plating include copper, nickel, and cobalt.
Particularly good results are obtained with copper. In the case of (1), plating is performed in a high-temperature copper sulfate bath, and in the case (2), plating is performed in a copper sulfate bath or a copper cyanide bath.
以上のようにして得られたものは、メッキ層が強固に形
成されており、プリント回路基板等の用途に好適に用い
ることができる。特に、ＰＥＴフィルム等の柔軟性を有
しているものに対しても金属メッキが強固に付着してお
り、それを曲げても丸めても、その付着状態が損なわれ
ることがない。The product obtained as described above has a strongly formed plating layer and can be suitably used for applications such as printed circuit boards. In particular, the metal plating adheres firmly even to flexible materials such as PET films, and the adhesion will not be impaired even if the metal plating is bent or rolled.
この発明によれば、ポリオレフィンテレフタレート製品
の表面にエキシマレーザ−光を照射することによって、
上記照射面に対する金属メッキの密着性を非常に強固な
ものにしうるようになる。According to this invention, by irradiating the surface of a polyolefin terephthalate product with excimer laser light,
The adhesion of the metal plating to the irradiated surface can be made very strong.
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
〔実施例１〕
ＰＥＴフィルム（種類２分子量の範囲）表面にＫｒＦエ
キシマレーザ−（波長：２４８ｎｍ、エネルギー： ３
２０ｍＪ／ｐｕｌｓｅ 、 ピーク出カニ１４ＭＷ、
半値幅：２３ｎｓ、ビームの大きさ：２４ｍｍＸ８ｍ、
照射エネルギー密度：５０ｍＪ／ｃｄ、ＬＡＭＢＤＡ
ＰＩＩＹＳｒＫ社製、ＥＭＧ１０３ＭＳＣ）を１パルス
照射したのち、プリディッピング（アルカリ水溶液：
５ＮＮａＯＨ，６０°Ｃ，１ｍ１ｎ）、キャタライジン
グ〔塩化スズ（Ｉ［） （Ｓｕｆｚ）１．０ ｇ／ｊ
２に３７％濃塩酸１ｄｌｌを加えたもの〕、アクセラレ
ーティング〔塩化パラジウム（ＰｄＣｆｆｉ Ｚ） １
．０ｇ／ｌに３７％濃塩酸０．１ ｃｎ／ ｌを加えた
もの〕の前処理を行い、その後、無電解メッキ［ホルマ
リン０．２５Ｍ、エチレンジアミンテトラアセクト（Ｅ
ＤＴＡ）０．０６Ｍ、硫酸銅０．０５ Ｍ、 （Ｃ２
１１４Ｎ）ｚ ２０ｍｇ／ ｊ２． Ｋｍ （Ｆｅ（Ｃ
Ｎ）ｓ） ３Ｈｚ０５０ｍｇ／／！、６０’Ｃ］を行っ
た。[Example 1] KrF excimer laser (wavelength: 248 nm, energy: 3) was applied to the surface of PET film (type 2 molecular weight range).
20mJ/pulse, peak output 14MW,
Half width: 23ns, beam size: 24mm x 8m,
Irradiation energy density: 50mJ/cd, LAMBDA
After irradiating one pulse of EMG103MSC (manufactured by PIIYSrK), pre-dipping (alkaline aqueous solution:
5N NaOH, 60°C, 1m1n), catalytic tin chloride (I[) (Sufz) 1.0 g/j
2 with 1 dll of 37% concentrated hydrochloric acid], accelerating [palladium chloride (PdCffi Z) 1
．． 0g/l with 0.1 cn/l of 37% concentrated hydrochloric acid], and then electroless plating [formalin 0.25M, ethylenediaminetetraacetate (E
DTA) 0.06M, copper sulfate 0.05M, (C2
114N)z 20mg/j2. Km (Fe(C)
N)s) 3Hz050mg//! , 60'C].
〔実施例２〜７〕
照射密度を第１表のように代えた以外は、実施例１と同
様にして金属メッキを行った。[Examples 2 to 7] Metal plating was performed in the same manner as in Example 1, except that the irradiation density was changed as shown in Table 1.
ＰＥＴフィルム表面にＫｒＦエキシマレーザ−を照射し
ない外は、実施例１と同様にして金属メッキを行った。Metal plating was carried out in the same manner as in Example 1, except that the surface of the PET film was not irradiated with KrF excimer laser.
以上の実施例および比較例で得られたメッキ部分の強度
を調べるため、そのメッキ部分を、金属たわしで擦りな
がら水洗した。その結果を第２表に示す。In order to examine the strength of the plated parts obtained in the above Examples and Comparative Examples, the plated parts were washed with water while being rubbed with a metal scrubber. The results are shown in Table 2.
第２表から明らかなように、エキシマレーザ−光の照射
をしない比較例では、金属メッキが簡単に剥離したのに
対して、実施例ではその大多数において金属メッキが強
固に付着していることがわかる。As is clear from Table 2, in the comparative example where excimer laser light was not irradiated, the metal plating peeled off easily, whereas in the majority of the examples, the metal plating was firmly adhered. I understand.
Claims (2)
レフタレート製品の照射面に、無電解メッキ法を利用し
て金属をメッキすることを特徴とするレーザーメッキ法
。(1) A laser plating method characterized by plating metal using electroless plating on the irradiated surface of a polyolefin terephthalate product that has been irradiated with excimer laser light.
が、無電解メッキを施したのち、電解メッキを施すこと
によりなされている特許請求の範囲第１項記載のレーザ
ーメッキ法。(2) The laser plating method according to claim 1, wherein plating the metal using electroless plating is performed by performing electroless plating and then applying electrolytic plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1927287A JPS63186877A (en) | 1987-01-28 | 1987-01-28 | Plating method with laser light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1927287A JPS63186877A (en) | 1987-01-28 | 1987-01-28 | Plating method with laser light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63186877A true JPS63186877A (en) | 1988-08-02 |
Family
ID=11994811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1927287A Pending JPS63186877A (en) | 1987-01-28 | 1987-01-28 | Plating method with laser light |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186877A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5599592A (en) * | 1994-01-31 | 1997-02-04 | Laude; Lucien D. | Process for the metallization of plastic materials and products thereto obtained |
| WO2002070780A1 (en) * | 2001-03-02 | 2002-09-12 | Omron Corporation | Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| SG102588A1 (en) * | 2000-08-03 | 2004-03-26 | Inst Materials Research & Eng | A process for modifying chip assembly substrates |
| US7586047B2 (en) * | 2004-01-14 | 2009-09-08 | Sumitomo Electric Industries, Ltd. | Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component |
| JP2010522829A (en) * | 2007-03-30 | 2010-07-08 | ダンマルクス テクニスケ ウニベルシテット | Preparation of polymer products for selective metallization |
| WO2011004802A1 (en) * | 2009-07-10 | 2011-01-13 | 三共化成株式会社 | Method for producing formed circuit component |
-
1987
- 1987-01-28 JP JP1927287A patent/JPS63186877A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5599592A (en) * | 1994-01-31 | 1997-02-04 | Laude; Lucien D. | Process for the metallization of plastic materials and products thereto obtained |
| SG102588A1 (en) * | 2000-08-03 | 2004-03-26 | Inst Materials Research & Eng | A process for modifying chip assembly substrates |
| WO2002070780A1 (en) * | 2001-03-02 | 2002-09-12 | Omron Corporation | Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| US7288287B2 (en) | 2001-03-02 | 2007-10-30 | Omron Corporation | Circuit formation part and manufacturing method for this circuit formation part |
| US7586047B2 (en) * | 2004-01-14 | 2009-09-08 | Sumitomo Electric Industries, Ltd. | Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component |
| JP2010522829A (en) * | 2007-03-30 | 2010-07-08 | ダンマルクス テクニスケ ウニベルシテット | Preparation of polymer products for selective metallization |
| US8628831B2 (en) | 2007-03-30 | 2014-01-14 | Danmarks Tekniskie Universitet | Preparation of a polymer article for selective metallization |
| WO2011004802A1 (en) * | 2009-07-10 | 2011-01-13 | 三共化成株式会社 | Method for producing formed circuit component |
| JP2011017069A (en) * | 2009-07-10 | 2011-01-27 | Sankyo Kasei Co Ltd | Method for manufacturing formed-circuit parts |
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