JPS63186181A - High heat loss structure - Google Patents
High heat loss structureInfo
- Publication number
- JPS63186181A JPS63186181A JP62015958A JP1595887A JPS63186181A JP S63186181 A JPS63186181 A JP S63186181A JP 62015958 A JP62015958 A JP 62015958A JP 1595887 A JP1595887 A JP 1595887A JP S63186181 A JPS63186181 A JP S63186181A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding
- high heat
- protection plate
- heat load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 238000005219 brazing Methods 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 8
- 230000008646 thermal stress Effects 0.000 description 8
- 230000004927 fusion Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業□゛上の利用分野〕
本発明は、核融合炉、核融合実験装置の第一壁、リミッ
タ、ダイバータ、又はMHD発電チャンネル壁やスペー
スシャトルの高速飛翔体の表面材料等に適用される高熱
負荷構造物に関する。[Detailed Description of the Invention] [Field of Application in Industry] The present invention is applicable to a nuclear fusion reactor, a first wall of a nuclear fusion experimental device, a limiter, a diverter, or a wall of an MHD power generation channel or a high-speed flying vehicle of a space shuttle. It relates to high heat load structures applied to surface materials, etc.
[従来の技術]
例えば、核融合炉の第−壁やリミッタ゛、ダイバータ等
の高熱負荷構造物はプラズマ側表面に耐熱性に優れ、プ
ラズマによる損耗が少なく、かつプラズマに与える影響
の少ない材料を保護板として用いる場合がある。[Prior art] For example, high heat load structures such as the fourth wall, limiter, and diverter of a fusion reactor have materials on the plasma side surface that have excellent heat resistance, are less likely to be worn out by the plasma, and have less impact on the plasma. Sometimes used as a board.
ところで、従来の高熱負荷構造物としては第3図に示す
、ように基板1に対して保護板2をφう材3によりろう
付して面接合した構造になっている。By the way, as shown in FIG. 3, a conventional high heat load structure has a structure in which a protective plate 2 is brazed to a substrate 1 using a φ filler 3 for surface bonding.
なお、前記基板1には冷却孔4がその接合面に対して平
行となるように複数設けられている。また、基板1と保
護板2との面接合は、ろう付の他にインサート材を用い
て拡散接合する方法もある。Note that a plurality of cooling holes 4 are provided in the substrate 1 so as to be parallel to the bonding surface thereof. In addition to brazing, the surface bonding between the substrate 1 and the protection plate 2 can be performed by diffusion bonding using an insert material.
[発明が解決しようとする問題点]
一般に、保護板2として用いる耐熱材料(例えばセラミ
ックス)の熱膨張率と基板1に用いられる材料(例えば
ステンレス)の熱膨張率との間には大きな差があるため
、前述した第3図図示のように基板1と保護板2を面同
志で接合した高熱負荷−構造物では接合時又は使用時の
温度変化相伴って基板1と保護板2の熱膨張差による熱
応力が発生する。その結果、保護板2に割れや剥がれ等
が生じる問題があった。[Problems to be Solved by the Invention] Generally, there is a large difference between the coefficient of thermal expansion of the heat-resistant material (e.g., ceramics) used for the protection plate 2 and the coefficient of thermal expansion of the material (e.g., stainless steel) used for the substrate 1. Therefore, as shown in FIG. 3, in a structure with a high heat load where the substrate 1 and the protection plate 2 are bonded face-to-face, the substrate 1 and the protection plate 2 undergo thermal expansion due to temperature changes during bonding or use. Thermal stress occurs due to the difference. As a result, there was a problem that the protection plate 2 would be cracked or peeled off.
本発明は、上記従来の問題点を解決するためになされた
もので、基板と保護板の熱膨張差に起因する熱応力を軽
減し、保護板の割れや剥がれの発生を抑制した高熱負荷
構造物を提供しようとするものである。The present invention was made in order to solve the above-mentioned conventional problems, and has a high heat load structure that reduces thermal stress caused by the difference in thermal expansion between the substrate and the protection plate, and suppresses the occurrence of cracking and peeling of the protection plate. It tries to provide something.
[問題点を解決するための手段]
本発明は、保護板と基板とをろう付又は拡散接合により
面接合した高熱負荷構造物において、前記基板の接合面
に溝を設けたことを特徴とするものである。[Means for Solving the Problems] The present invention is a high heat load structure in which a protection plate and a substrate are surface bonded by brazing or diffusion bonding, characterized in that a groove is provided in the bonding surface of the substrate. It is something.
[作用コ
本発明の高熱負荷構造物は、基板の接合面に溝を設ける
ことによって、保護板と基板との実質接合面積を細かく
区分できる。接合部に生じる熱応力は、接合面積に比例
して大きくなるので、接合面積を細かく区分することに
より熱応力を軽減できる。また、基板の接合面に溝を設
けることによって一接合面近傍の基板の剛性を下げるこ
とができるので、保護板と基板との熱膨張差を基板の変
形により吸収できる。従って、接合時や使用時の温度変
化に伴う保護板と基板の接合部に生じる熱応力を軽減で
きるため、保護板の割れや剥がれを抑制できる。[Function] In the high heat load structure of the present invention, by providing grooves on the bonding surface of the substrate, the substantial bonding area between the protection plate and the substrate can be divided into fine sections. Since the thermal stress generated in the joint increases in proportion to the joint area, the thermal stress can be reduced by dividing the joint area into smaller sections. Further, by providing a groove in the bonding surface of the substrate, the rigidity of the substrate near one bonding surface can be lowered, so that the difference in thermal expansion between the protection plate and the substrate can be absorbed by deformation of the substrate. Therefore, it is possible to reduce the thermal stress that occurs at the joint between the protective plate and the substrate due to temperature changes during bonding or use, thereby suppressing cracking and peeling of the protective plate.
[発明の実施例コ
以下、本発明の実施例を第1図及び第2図を参照して詳
細に説明する。[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2.
第1図は、本発明に一実施例を示す高熱負荷構造物の断
面図、第2図は同構造物の分解斜視図である。図中の1
1は、接合面に対して平行に複数の冷却孔12を有する
基板である。この基板11の接合面には、例えば格子状
の溝13が設けられている。FIG. 1 is a sectional view of a high heat load structure showing one embodiment of the present invention, and FIG. 2 is an exploded perspective view of the same structure. 1 in the diagram
1 is a substrate having a plurality of cooling holes 12 parallel to the bonding surface. For example, grid-shaped grooves 13 are provided on the bonding surface of the substrate 11.
そして前記基板11の格子状の溝13が形成された接合
〒には、保護板14がろう材15を介してろう付接合さ
れている。A protection plate 14 is brazed to the bonding area of the substrate 11 in which the lattice-shaped grooves 13 are formed through a brazing material 15.
このような構成によれば、基板11の接合面に格子状の
溝13が設けられ、保護板14と基板11との実質接合
面積が細かく区分されているため、接合面。According to such a configuration, the grid-like grooves 13 are provided on the bonding surface of the substrate 11, and the substantial bonding area between the protection plate 14 and the substrate 11 is divided into fine sections.
積に比例して大きくなる接合部での熱応力を軽減できる
。また、11113を基板の接合面に設けることによっ
て、接合面近傍の剛性を下げることができ、保護板14
と基板11との熱膨張差を該基板11の満13付近での
変形により吸収できる。従って、接合時や使用時の温度
変化に伴う保護板と基板の接合部に生じる熱応力を軽減
でき、保護板の割れや剥がれを抑制した耐久性の高い高
熱負荷構造物を得ることができる。Thermal stress at the joint, which increases in proportion to the product, can be reduced. In addition, by providing 11113 on the bonding surface of the substrate, the rigidity near the bonding surface can be lowered, and the protection plate 14
The difference in thermal expansion between the substrate 11 and the substrate 11 can be absorbed by deformation of the substrate 11 at around 13 degrees. Therefore, it is possible to reduce the thermal stress generated at the joint between the protective plate and the substrate due to temperature changes during bonding or use, and to obtain a highly durable high heat load structure in which cracking and peeling of the protective plate are suppressed.
なお、上記実施例では基板の接合面に・設ける溝の形状
を格子状としたが、これに限定されず、材料の組合わせ
(特に基板11、保護板1・4の熱膨張率)、ろう材(
特に接合温度)、使用゛温度等により溝形状を決定すれ
ばよい。 °・上記実−施例では基板と保護板と
をろう材を介してろう付接合したが、インサート材等を
用いて拡散接合してもよい。In the above embodiment, the shape of the grooves provided on the bonding surfaces of the substrates is in the form of a lattice, but the shape is not limited to this. Material (
In particular, the groove shape may be determined depending on the bonding temperature), the operating temperature, etc. - In the above embodiments, the substrate and the protective plate were joined by brazing through a brazing material, but they may be joined by diffusion using an insert material or the like.
[発明の効果]
以上詳述した如く、本発明によれば保護板と基板とをろ
う付又は拡散接合により面接合した高熱負荷構造物にお
いて、前記基板の接合面に溝を設けることによって、接
合面が細分化され、更に基板の接合面近傍の剛性を下げ
られ、接合時や使用時の温度変化に伴う保護板と基板間
の熱膨張差を吸収して接合部に発生する熱応力を軽減で
き、ひいては保護板の割れや剥がれを抑制でき、核融合
炉、核融合実験装置の第−壁、リミッタ、ダイバータ、
又は〜1HD1電子ャンネル壁やスペースシャトルの高
速飛翔体の表面材料等に好適な耐久性の高い高熱負荷構
造物を提供できる。[Effects of the Invention] As described in detail above, according to the present invention, in a high heat load structure in which a protection plate and a substrate are surface-bonded by brazing or diffusion bonding, bonding can be achieved by providing a groove in the bonding surface of the substrate. The surface is subdivided and the rigidity near the bonding surface of the board is reduced, absorbing the difference in thermal expansion between the protective plate and the board due to temperature changes during bonding and use, reducing thermal stress generated at the bonding part. This also suppresses cracking and peeling of the protective plate, making it ideal for use in fusion reactors, fusion experimental equipment, limiters, diverters,
Alternatively, it is possible to provide a highly durable and high heat load structure suitable for ~1HD1 electron channel walls, surface materials of high-speed flying vehicles of the space shuttle, and the like.
第1図は本発明の一実施例を示す高熱負荷構造物の断面
口、第2図は第1図の同構造物の分解斜視図、第3図は
従来の高熱負荷構造物を示す断面図である。
11・・・基板、12・・・冷却孔、13・・・格子状
の溝、14・・・保量板、15・・・ろう材。
出願人代理人 弁理士 鈴江武彦
第1図
1z
第2図
箪 3図Fig. 1 is a cross-sectional view of a high heat load structure showing an embodiment of the present invention, Fig. 2 is an exploded perspective view of the same structure shown in Fig. 1, and Fig. 3 is a sectional view showing a conventional high heat load structure. It is. DESCRIPTION OF SYMBOLS 11... Substrate, 12... Cooling hole, 13... Grid-shaped groove, 14... Capacity plate, 15... Brazing material. Applicant's agent Patent attorney Takehiko Suzue Figure 1 1z Figure 2 3 Figure 3
Claims (1)
高熱負荷構造物において、前記基板の接合面に溝を設け
たことを特徴とする高熱負荷構造物。A high heat load structure in which a protection plate and a substrate are surface-joined by brazing or diffusion bonding, characterized in that a groove is provided in the bonding surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62015958A JPS63186181A (en) | 1987-01-28 | 1987-01-28 | High heat loss structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62015958A JPS63186181A (en) | 1987-01-28 | 1987-01-28 | High heat loss structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63186181A true JPS63186181A (en) | 1988-08-01 |
Family
ID=11903240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62015958A Pending JPS63186181A (en) | 1987-01-28 | 1987-01-28 | High heat loss structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63186181A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1749615A1 (en) * | 2005-08-02 | 2007-02-07 | Michael Curtat | Brazing process of two elements with recesses on each brazing contact surface |
JP2011063274A (en) * | 2009-09-15 | 2011-03-31 | Asahi Glass Co Ltd | Glass plate packing body |
-
1987
- 1987-01-28 JP JP62015958A patent/JPS63186181A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1749615A1 (en) * | 2005-08-02 | 2007-02-07 | Michael Curtat | Brazing process of two elements with recesses on each brazing contact surface |
FR2889470A1 (en) * | 2005-08-02 | 2007-02-09 | Michel Curtat | METHOD FOR BRATING TWO ELEMENTS |
JP2011063274A (en) * | 2009-09-15 | 2011-03-31 | Asahi Glass Co Ltd | Glass plate packing body |
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