JPS63181401A - Manufacture of ptc compound - Google Patents
Manufacture of ptc compoundInfo
- Publication number
- JPS63181401A JPS63181401A JP1349587A JP1349587A JPS63181401A JP S63181401 A JPS63181401 A JP S63181401A JP 1349587 A JP1349587 A JP 1349587A JP 1349587 A JP1349587 A JP 1349587A JP S63181401 A JPS63181401 A JP S63181401A
- Authority
- JP
- Japan
- Prior art keywords
- kneading
- polymer
- ptc
- melting point
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 150000001875 compounds Chemical class 0.000 title description 3
- 238000004898 kneading Methods 0.000 claims description 38
- 229920000642 polymer Polymers 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 22
- 239000003431 cross linking reagent Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- -1 peroxy ester Chemical class 0.000 claims description 8
- 238000004132 cross linking Methods 0.000 claims description 7
- 150000001451 organic peroxides Chemical class 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000012933 diacyl peroxide Substances 0.000 claims description 2
- 150000002978 peroxides Chemical class 0.000 claims description 2
- 150000004979 silylperoxides Chemical class 0.000 claims description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-M hydroperoxide group Chemical group [O-]O MHAJPDPJQMAIIY-UHFFFAOYSA-M 0.000 claims 1
- 239000000654 additive Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気材料の製造法に関し、より詳細には、温
度上昇に伴って比較的狭い温度領域で電気抵抗が急増す
る性質（ＰＴＣ特性（Ｐｏｓｉｔｉｖｅｔｅａ＋ｐｃｒ
ａｔｕｒｅ ａｏｅｆｆｌａｉｅｎｔ ） ］を有する
材料組成物、すなわち、ＰＴＣ組成物の製造法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing electrical materials, and more specifically, the present invention relates to a method for producing electrical materials, and more particularly, to (Positive tea+pcr
ature aoefflaient)], that is, a method for producing a PTC composition.
ＰＴＣ組成物は、一定の温度に上昇すると発熱が止まる
ヒータ、正特性サーミスタ（ＰＴＣＴＨＥＲＭＩＳＴＥ
Ｒ） 、感熱センサ、電池などを含む回路が短絡したと
き過電流を所定の電流以下に制限し他方その短絡が取除
かれたとき回路が復帰する回路保護素子などに利用する
ことができる。ＰＴＣ組成物として、現在種々の物質が
開発され、例えば、ポリエチレン、エチレン−アクリル
酸共重合体などの少なくとも１種の重合体にカーボンブ
ラックなどの導電性粒子が均一に分散されたものがある
。PTC compositions are used in heaters that stop generating heat when the temperature rises to a certain level, and positive characteristic thermistors (PTC THERMISTE).
R) It can be used as a circuit protection element, etc., which limits the overcurrent to a predetermined current or less when a circuit including a thermal sensor, battery, etc. is short-circuited, and on the other hand, restores the circuit when the short-circuit is removed. Currently, various materials have been developed as PTC compositions, including ones in which conductive particles such as carbon black are uniformly dispersed in at least one kind of polymer such as polyethylene or ethylene-acrylic acid copolymer.
従来、ＰＴＣ組成物の製造法は、一般的に、重合体とし
て用いる１種またはそれ以上の樹脂を先ず混合して均一
に分散し、この混合物に必要量のカーボンブラックを添
加し、混練して製造されている。Conventionally, the method for producing PTC compositions generally involves first mixing and uniformly dispersing one or more resins used as polymers, adding a required amount of carbon black to this mixture, and kneading. Manufactured.
ＰＴＣ組成物として好ましい特性は、高温で抵抗値（ピ
ーク抵抗）が大きいことと共に、室温で１００ ｍΩ以
下の低い抵抗値（室温抵抗）を有すること、すなわち、
ピーク抵抗／室温抵抗の高い比を得ることである。Preferable characteristics for a PTC composition are that it has a large resistance value (peak resistance) at high temperatures and a low resistance value (room temperature resistance) of 100 mΩ or less at room temperature, that is,
The goal is to obtain a high ratio of peak resistance/room temperature resistance.
しかしながら、従来のＰＴＣ組成物の製造法では、必ず
しも高いピーク抵抗値が得られず、混練時間や混練温度
などを変更しても十分なピーク抵抗が得られず、また、
添加剤として有機過酸化物を原料に添加して重合体を架
橋し、ピーク抵抗を高くしても室温抵抗も高くなって、
例えば、回路保護素子として利用することができない。However, with conventional methods for producing PTC compositions, it is not always possible to obtain a high peak resistance value, and even if the kneading time, kneading temperature, etc. are changed, a sufficient peak resistance cannot be obtained.
Even if an organic peroxide is added to the raw material as an additive to crosslink the polymer and increase the peak resistance, the room temperature resistance also increases.
For example, it cannot be used as a circuit protection element.
本発明は、上述の背景に基づいてなされたものであり、
その目的とするところは、１００ ｍΩ以下の低い室温
抵抗を有すると共に、高いピーク抵抗を有するＰＴＣ組
成物を製造することのできる方法を提供することである
。The present invention has been made based on the above background,
The aim is to provide a method by which PTC compositions with low room temperature resistance of 100 mΩ or less and high peak resistance can be produced.
本発明者は、上述の目的達成のために種々の試験・研究
の結果、重合体と導電性粒子とを一旦混練し、この混練
物に更に架橋剤を加えて架橋と同時に混練を行えば、Ｐ
ＴＣ特性が良好な組成物が得られるとの知見を得て、本
発明を完成するに至った。As a result of various tests and studies to achieve the above-mentioned object, the present inventor has found that if a polymer and conductive particles are once kneaded, a crosslinking agent is further added to this kneaded product, and kneaded at the same time as crosslinking. P
The present invention was completed based on the finding that a composition with good TC characteristics can be obtained.
すなわち、本発明のＰＴＣ組成物の製造法は、重合体及
び導電性粒子を混練して該重合体中に該粒子を均一に分
散することを含むＰＴＣ組成物を製造する方法であって
、該混練中に架橋剤を添加し、架橋を混練と同時に行う
ことを特徴とするものである。That is, the method for producing a PTC composition of the present invention is a method for producing a PTC composition that includes kneading a polymer and conductive particles to uniformly disperse the particles in the polymer. It is characterized in that a crosslinking agent is added during kneading, and crosslinking is performed simultaneously with kneading.
この発明の好ましい態様として、混練時間を２０〜９０
分間とすることができる。また、混練温度を、重合体の
融点とその融点より７０℃高い温度範囲、より好ましく
は重合体の融点とその融点より５０℃高い温度範囲とす
ることができる。As a preferred embodiment of this invention, the kneading time is 20 to 90 minutes.
It can be for a minute. Further, the kneading temperature can be set to the melting point of the polymer and a temperature range 70° C. higher than the melting point, more preferably to the melting point of the polymer and a temperature range 50° C. higher than the melting point.
以下、この発明を、より詳細に説明する。This invention will be explained in more detail below.
ＰＴＣ組成物の成分
この発明に於いて用いる重合体として、ポリエチレン、
ポリエチレンオキシド、ｔ−４−ポリブタジェン、ポリ
エチレンアクリレート、エチレン−エチルアクリレート
共重合体、エチレン−アクリル酸共重合体、ポリエステ
ル、ポリアミド、ポリエーテル、ポリカプロラクタム、
フッ素化エチレン−プロピレン共重合体、塩素化ポリエ
チレン、クロロスルホン化エチレン、エチレン−酢酸ビ
ニル共重合体、ポリプロピレン、ポリスチレン、スチレ
ン−アクリロニトリル共重合体、ポリ塩化ビニル、ポリ
カーボネート、ポリアセタール、ポリアルキレンオキシ
ド、ポリフェニレンオキシド、ポリスルホン、フッ素樹
脂、およびこれ等のうちから選ばれた少なくとも２種の
ブレンドポリマー等がある。この発明のおいて、重合体
の種類、組成比などは、所望の性能、用途などに応じて
適宜選択することができる。Components of PTC composition The polymers used in this invention include polyethylene,
Polyethylene oxide, t-4-polybutadiene, polyethylene acrylate, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, polyester, polyamide, polyether, polycaprolactam,
Fluorinated ethylene-propylene copolymer, chlorinated polyethylene, chlorosulfonated ethylene, ethylene-vinyl acetate copolymer, polypropylene, polystyrene, styrene-acrylonitrile copolymer, polyvinyl chloride, polycarbonate, polyacetal, polyalkylene oxide, polyphenylene Examples include oxides, polysulfones, fluororesins, and blend polymers of at least two selected from these. In this invention, the type of polymer, composition ratio, etc. can be appropriately selected depending on desired performance, use, etc.
また、重合体に分散される導電性粒子としては、カーボ
ンブラック、黒鉛、スズ、銀、金、銅などの導電性物質
の粒子、および銀めっき粒子などを用いることができる
。Further, as the conductive particles dispersed in the polymer, particles of conductive substances such as carbon black, graphite, tin, silver, gold, copper, and silver-plated particles can be used.
この発明において用いられる架橋剤は、ＰＴＣ組成物中
でその成分間を架橋することのできるものであり、その
様な架橋剤として、イオウおよびイオウ化合物、セレン
、酸化マグネシウム、−酸化鉛、酸化亜鉛、オキシム類
、ニトロソ化合物、ポリアミン、有機過酸化物などがあ
る。その他、架橋促進剤を併せて用いることもできる。The crosslinking agent used in this invention is capable of crosslinking the components in the PTC composition, and examples of such crosslinking agents include sulfur and sulfur compounds, selenium, magnesium oxide, -lead oxide, and zinc oxide. , oximes, nitroso compounds, polyamines, and organic peroxides. In addition, a crosslinking accelerator can also be used in combination.
この発明の好ましい架橋剤として、ヒドロペルオキシド
、ジアルキルペルオキシド、ジアシルペルオキシド、ペ
ルオキシエステル、シリルパーオキシドなどの有機過酸
化物がある。Preferred crosslinking agents for this invention include organic peroxides such as hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxy esters, and silyl peroxides.
ＰＴＣ組成物の調製に際して、上記の重合体、導電性粒
子、架橋剤以外に、必要に応じて種々の添加剤を混合す
ることができる。そのような添加剤として、例えば、ア
ンチモン化合物、リン化合物、塩素化化合物、臭素化化
合物などの難燃剤、酸化防止剤、安定剤などがある。In preparing the PTC composition, in addition to the above-mentioned polymer, conductive particles, and crosslinking agent, various additives may be mixed as necessary. Examples of such additives include flame retardants, antioxidants, stabilizers, etc., such as antimony compounds, phosphorus compounds, chlorinated compounds, and brominated compounds.
製造法
このＰＴＣ組成物は、その原材料、重合体、導電性粒子
、その他添加剤を所定の割合いで配合・混練して調製さ
れる。Manufacturing method This PTC composition is prepared by blending and kneading the raw materials, polymer, conductive particles, and other additives in predetermined proportions.
この発明において、重合体と導電性粒子との混練は、重
合体と導電性粒子とを所定の割合いで混練して行われる
。重合体と粒子との配合割合は、目的組成物の粒子含量
、重合体の種類、ミキサー、ニーダ−の種類などに応じ
て適宜選択することができる。この発明において、混練
前に粉砕、加熱、混合などの前処理をしてもよい。混練
に際する温度は、混練する重合体の融点からその融点よ
り７０℃、好ましくは、５０℃高い温度の温度範囲であ
る。これは、その範囲で、混練する重合体がゲル化して
導電性粒子を均一に分散させることができるからである
。In this invention, the polymer and the conductive particles are kneaded by kneading the polymer and the conductive particles at a predetermined ratio. The blending ratio of the polymer and particles can be appropriately selected depending on the particle content of the target composition, the type of polymer, the type of mixer, kneader, etc. In this invention, pretreatment such as pulverization, heating, and mixing may be performed before kneading. The temperature during kneading is in the range from the melting point of the polymer to be kneaded to 70°C, preferably 50°C higher than the melting point. This is because within this range, the polymer to be kneaded gels and the conductive particles can be uniformly dispersed.
混練前に重合体の加熱の前処理をする場合、適当な温度
に予め加熱し軟化させた後、導電性粒子を添加して混練
することが好ましい。When pre-treating the polymer by heating before kneading, it is preferable to heat the polymer to an appropriate temperature in advance to soften it, then add conductive particles and knead.
この発明の特徴の一つは、重合体と導電性粒子との混練
中に架橋剤を添加し、架橋を混練と同時に行うことであ
る。この架橋剤の添加時は、混練装置性能や種類、混練
物の量や種類などにより適宜選択することができるが、
好ましくは重合体と導電性粒子との混練開始２〜３０分
後、より好ましくは混練開始５〜１０分後である。One of the features of this invention is that a crosslinking agent is added during kneading of the polymer and conductive particles, and crosslinking is performed simultaneously with the kneading. When adding this crosslinking agent, it can be selected as appropriate depending on the performance and type of kneading equipment, the amount and type of kneaded material, etc.
The time is preferably 2 to 30 minutes after the start of kneading the polymer and the conductive particles, and more preferably 5 to 10 minutes after the start of kneading.
この発明において、良好なＰＴＣ組成物を得るために混
練パラメーターを適宜選択することが望ましく、混練時
間については、好ましくは２０〜９０分間、より好まし
くは３０〜６０分間である。In this invention, it is desirable to appropriately select kneading parameters in order to obtain a good PTC composition, and the kneading time is preferably 20 to 90 minutes, more preferably 30 to 60 minutes.
この混練時間から外れると、室温抵抗が増大するからで
ある。また、混練温度については、重合体の融点とこの
融点より７０℃高い温度との温度範囲、好ましくは重合
体の融点とこの融点より５０℃高い温度との温度範囲で
混練する。This is because if the kneading time deviates from this range, the room temperature resistance increases. Regarding the kneading temperature, kneading is carried out in a temperature range between the melting point of the polymer and a temperature 70°C higher than this melting point, preferably in a temperature range between the melting point of the polymer and a temperature 50°C higher than this melting point.
その他の添加剤をＰＴＣ組成物に混入させる場合、この
添加剤を前半の混練の前後、後半の混練の前後のいずれ
かに、または、架橋剤添加と同時に添加してもよい。When other additives are mixed into the PTC composition, they may be added either before or after the first half of the kneading, before or after the second half of the kneading, or simultaneously with the addition of the crosslinking agent.
この発明によって得られたＰＴＣ組成物は、種々の用途
に用いることができる。例えば、ＰＴＣ索子に用いる場
合、このＰＴＣ組成物をフィルム状に成形し、フィルム
の上下に金属箔の電極を熱圧着してｆｌｆ層体を形成し
、この積層体を所定の寸法に切断し、電極表面にリード
線をスポット溶接、半田付けなどで接続してＰＴＣ素子
を製造することができる。The PTC composition obtained by this invention can be used for various purposes. For example, when used in a PTC cord, the PTC composition is formed into a film, metal foil electrodes are thermocompression bonded to the top and bottom of the film to form an flf layer, and this laminate is cut into predetermined dimensions. A PTC element can be manufactured by connecting a lead wire to the electrode surface by spot welding, soldering, or the like.
この発明が上記のように構成されているので、下記のよ
うに作用すると考えられる。Since this invention is configured as described above, it is thought that it operates as follows.
理論的には必ずしもメカニズムが明らかではないが、Ｐ
ＴＣ組成物の重合体を架橋することによりピーク抵抗が
増大するが室温抵抗も増大することが、また、混練によ
り室温抵抗が低下するがピーク抵抗が低下することが知
られている。この二つの相反する要因を最適時期で実施
すれば、室温抵抗を低下させ、ピーク抵抗を増大させる
ことができると考えられる。Although the mechanism is not necessarily clear theoretically, P
It is known that crosslinking the polymer of the TC composition increases the peak resistance but also increases the room temperature resistance, and that kneading reduces the room temperature resistance but also decreases the peak resistance. It is thought that if these two conflicting factors are implemented at the optimal timing, room temperature resistance can be lowered and peak resistance can be increased.
上記の説明は、この発明のより良い理解のためであり、
決してこの発明の範囲を限定するものではない。The above explanation is for better understanding of this invention,
It is not intended to limit the scope of the invention in any way.
この発明を、例示によって具体的に説明する。 This invention will be specifically explained by way of example.
実施例１ 下記組成のＰＴＣ特性を有する物質を調製した。Example 1 A material having PTC properties having the following composition was prepared.
重量％
重合体・・・高密度ポリエチレン ・・・２４
（東洋曹達型、ニボロンハード５１００）エチレン−ア
クリル酸共重合体・・・３６（ダウケミカル製、プリマ
コール３４６０）導電性粒子・・・カーボンブラック
・・・３８（キャボット製、スターリングＶ）
酸化防止剤・・・ ・・・ ２
（チバガイギー製、イルガノックス１０１０）架橋剤・
・・有機過酸化物 ・・・１（吉富製
薬製、ルバゾール１３０）
重合体、導電性粒子、酸化防止剤を上記割合で２本ロー
ルで１８０℃、５分間混練し、混練開始５分後に上記の
架橋剤を添加してさらに４０分間混練を続行してＰＴＣ
組成物を得た。 次いで、厚さ６５μのニッケル箔で得
られたＰＴＣ組成物を挟みプレスで熱圧着して積層体を
調製した。得られた積層体を所定寸法（Ｌｏ、５Ｘ ｌ
Ｏ，５Ｘ Ｏ，３ｇ＋ｕ）に切断してＰＴＣ索子を得た
。このＰＴＣ素子について室温抵抗、ピーク抵抗を測定
した。その結果を第１表に示す。Weight% Polymer...High density polyethylene...24
(Toyo Soda type, Niboron Hard 5100) Ethylene-acrylic acid copolymer...36 (Dow Chemical, Primacol 3460) Conductive particles...Carbon black
... 38 (Cabot, Sterling V) Antioxidant ... 2
(Ciba Geigy, Irganox 1010) Crosslinking agent
...Organic peroxide ...1 (manufactured by Yoshitomi Pharmaceutical, Rubazol 130) The polymer, conductive particles, and antioxidant were kneaded in the above ratio at 180°C for 5 minutes with two rolls, and 5 minutes after the start of kneading, the above Add a crosslinking agent and continue kneading for an additional 40 minutes to form a PTC
A composition was obtained. Next, the obtained PTC composition was sandwiched between nickel foils having a thickness of 65 μm and thermocompression bonded using a press to prepare a laminate. The obtained laminate is cut to a predetermined size (Lo, 5X l
PTC cords were obtained by cutting into O,5X O,3g+u). The room temperature resistance and peak resistance of this PTC element were measured. The results are shown in Table 1.
比較例２
全体の混練時間が５分であり、架橋剤を添加しなかった
こと以外、例１と同様にＰＴＣ素子を製造し、室温抵抗
、ピーク抵抗を測定した。その結果を第１表に示す。Comparative Example 2 A PTC element was manufactured in the same manner as in Example 1, except that the total kneading time was 5 minutes and no crosslinking agent was added, and the room temperature resistance and peak resistance were measured. The results are shown in Table 1.
例３〜８
第１表に示す混練時間で行ったこと以外、例１と同様に
ＰＴＣ素子を製造し、室温抵抗、ピーク抵抗を測定した
。その結果を第１表に示す。Examples 3 to 8 PTC elements were manufactured in the same manner as in Example 1, except that the kneading times shown in Table 1 were used, and the room temperature resistance and peak resistance were measured. The results are shown in Table 1.
第１表
例 混練時間 室温抵抗 ピーク抵抗
（分） （ｍΩ） （Ω）
２ ５ ８１．５ ５００３ １０
１３９．１ １００００以上４ ２０
９６．０ １００００以上５ ３０ ９
５．０ １００００以上１ ４５ ８５．
５ １００００以上６ ６０ ８８．０
１００００以上７ ９０ ９４．０
１００００以上８ １２０ １３３．５ １０
０００以上この結果から、架橋剤を添加することにより
ピーク抵抗を１００００Ω以上の高抵抗に増大させ、架
橋剤添加後も混練を一定時間続行することによって１０
０ｍΩ以下の室温抵抗に減少させることができることが
分る。Table 1 Example Kneading time Room temperature resistance Peak resistance (min) (mΩ) (Ω) 2 5 81.5 5003 10
139.1 10000 or more 4 20
96.0 10000 or more 5 30 9
5.0 10,000 or more 1 45 85.
5 10000 or more 6 60 88.0
10000 or more 7 90 94.0
10000 or more 8 120 133.5 10
From this result, adding a crosslinking agent increases the peak resistance to a high resistance of 10,000Ω or more, and continuing kneading for a certain period of time even after adding the crosslinking agent increases the resistance to 1000Ω or more.
It can be seen that the room temperature resistance can be reduced to 0 mΩ or less.
実施例で実証されるように、この発明によって次の効果
を得ることができる。As demonstrated in the examples, the following effects can be obtained by this invention.
１００ミリオーム以下の低い室温抵抗を有すると共に、
高いピーク抵抗を有するＰＴＣ素子を製造することので
きるＰＴＣ組成物を提供することができる。It has a low room temperature resistance of 100 milliohms or less, and
It is possible to provide a PTC composition with which a PTC element with high peak resistance can be manufactured.
Claims (1)
子を均一に分散することを含むＰＴＣ組成物を製造する
方法であつて、該混練中に架橋剤を添加して架橋を混練
と同時に行うことを特徴とするＰＴＣ組成物の製造法。 ２、混練時間が２０〜９０分間である、特許請求の範囲
第１項記載のＰＴＣ組成物の製造法。 ３、混練温度が、重合体の融点と該融点より７０℃高い
温度との温度範囲である、特許請求の範囲第１項または
第２項記載の製造法。 ４、混練温度が、重合体の融点と該融点より５０℃高い
温度との温度範囲である、特許請求の範囲第３項記載の
製造法。 ５、架橋剤の添加が混練開始２〜３０分後に行う、特許
請求の範囲第１項乃至第４項のいずれかに記載の製造法
。 ６、架橋剤が、ヒドロペルオキシド、ジアルキルペルオ
キシド、ジアシルペルオキシド、ペルオキシエステル、
シリルパーオキシドから選ばれた少なくとも１種の有機
過酸化物である、特許請求の範囲第１項乃至第５項のい
ずれかに記載の製造法。[Scope of Claims] 1. A method for producing a PTC composition comprising kneading a polymer and conductive particles to uniformly disperse the particles in the polymer, the method comprising: dispersing the particles uniformly in the polymer, the method comprising: A method for producing a PTC composition, characterized in that crosslinking is performed simultaneously with kneading by adding. 2. The method for producing a PTC composition according to claim 1, wherein the kneading time is 20 to 90 minutes. 3. The manufacturing method according to claim 1 or 2, wherein the kneading temperature is in a temperature range between the melting point of the polymer and a temperature 70° C. higher than the melting point. 4. The production method according to claim 3, wherein the kneading temperature is in a temperature range between the melting point of the polymer and a temperature 50° C. higher than the melting point. 5. The manufacturing method according to any one of claims 1 to 4, wherein the crosslinking agent is added 2 to 30 minutes after the start of kneading. 6. The crosslinking agent is a hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxy ester,
The manufacturing method according to any one of claims 1 to 5, which is at least one organic peroxide selected from silyl peroxides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62013495A JPH0821486B2 (en) | 1987-01-23 | 1987-01-23 | Method for producing PTC composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62013495A JPH0821486B2 (en) | 1987-01-23 | 1987-01-23 | Method for producing PTC composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63181401A true JPS63181401A (en) | 1988-07-26 |
| JPH0821486B2 JPH0821486B2 (en) | 1996-03-04 |
Family
ID=11834696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62013495A Expired - Lifetime JPH0821486B2 (en) | 1987-01-23 | 1987-01-23 | Method for producing PTC composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821486B2 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142902A (en) * | 1984-08-07 | 1986-03-01 | 出光興産株式会社 | Method of producing thermosensitive resistive conductive composition |
| JPS6142901A (en) * | 1984-08-06 | 1986-03-01 | 出光興産株式会社 | Method of producing thermosensitive resistive conductive composition |
| JPS6165402A (en) * | 1984-09-07 | 1986-04-04 | 出光興産株式会社 | Heat sensitive resistive conductive material and method of producing same |
| JPS61144001A (en) * | 1984-12-18 | 1986-07-01 | 松下電器産業株式会社 | Resistor composition |
| JPS62232903A (en) * | 1986-04-03 | 1987-10-13 | 松下電器産業株式会社 | Manufacture of positive resistance temperature coefficient heating element resin compound |
-
1987
- 1987-01-23 JP JP62013495A patent/JPH0821486B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142901A (en) * | 1984-08-06 | 1986-03-01 | 出光興産株式会社 | Method of producing thermosensitive resistive conductive composition |
| JPS6142902A (en) * | 1984-08-07 | 1986-03-01 | 出光興産株式会社 | Method of producing thermosensitive resistive conductive composition |
| JPS6165402A (en) * | 1984-09-07 | 1986-04-04 | 出光興産株式会社 | Heat sensitive resistive conductive material and method of producing same |
| JPS61144001A (en) * | 1984-12-18 | 1986-07-01 | 松下電器産業株式会社 | Resistor composition |
| JPS62232903A (en) * | 1986-04-03 | 1987-10-13 | 松下電器産業株式会社 | Manufacture of positive resistance temperature coefficient heating element resin compound |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0821486B2 (en) | 1996-03-04 |
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