JPS63180962U - - Google Patents
Info
- Publication number
- JPS63180962U JPS63180962U JP7217787U JP7217787U JPS63180962U JP S63180962 U JPS63180962 U JP S63180962U JP 7217787 U JP7217787 U JP 7217787U JP 7217787 U JP7217787 U JP 7217787U JP S63180962 U JPS63180962 U JP S63180962U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting device
- leads
- header
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図乃至第４図は本考案発光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図は分解斜視図、第３図はリードフレームの
斜視図、第４図はヒートシンクフレームの平面図
、第５図及び第６図は本考案発光装置の第２の実
施例を示すもので、第５図は分解斜視図、第６図
は断面図、第７図及び第８図は本考案発光装置の
第３の実施例を示すもので、第７図は断面図、第
８図は分解斜視図、第９図は従来例を示す分解斜
視である。
符号の説明、１……ヘツダー、２……補強用樹
脂充填体、３……リード、４……発光素子保持リ
ード、６……発光素子。
1 to 4 are for explaining one embodiment of the light emitting device of the present invention, and FIG. 1 is a sectional view;
Fig. 2 is an exploded perspective view, Fig. 3 is a perspective view of a lead frame, Fig. 4 is a plan view of a heat sink frame, and Figs. 5 and 6 show a second embodiment of the light emitting device of the present invention. , FIG. 5 is an exploded perspective view, FIG. 6 is a cross-sectional view, and FIGS. 7 and 8 show a third embodiment of the light emitting device of the present invention. FIG. 7 is a cross-sectional view, and FIG. 8 is a cross-sectional view. FIG. 9 is an exploded perspective view showing a conventional example. Explanation of symbols: 1...Header, 2...Reinforcing resin filling body, 3...Lead, 4...Light emitting element holding lead, 6...Light emitting element.
Claims (1)
に併設され、そのうちの一本のリードの表面に発
光素子が固定された発光装置であつて、 上記ヘツダーの表面に、上記リード併設部をそ
の裏面側から保持する補強用樹脂充填体が形成さ
れてなる、 ことを特徴とする発光装置。[Claims for Utility Model Registration] A light-emitting device in which a header made of resin is provided with a plurality of leads in a penetrating manner, and a light-emitting element is fixed to the surface of one of the leads, the header having: A light-emitting device characterized in that a reinforcing resin filling body is formed to hold the lead-attached portion from the back side thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7217787U JPS63180962U (en) | 1987-05-14 | 1987-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7217787U JPS63180962U (en) | 1987-05-14 | 1987-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180962U true JPS63180962U (en) | 1988-11-22 |
Family
ID=30915400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7217787U Pending JPS63180962U (en) | 1987-05-14 | 1987-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180962U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194437A (en) * | 2006-01-19 | 2007-08-02 | Sharp Corp | Semiconductor laser device, its manufacturing method, and optical pickup device |
-
1987
- 1987-05-14 JP JP7217787U patent/JPS63180962U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194437A (en) * | 2006-01-19 | 2007-08-02 | Sharp Corp | Semiconductor laser device, its manufacturing method, and optical pickup device |