JPS63177929A - Press working method for lead frame - Google Patents
Press working method for lead frameInfo
- Publication number
- JPS63177929A JPS63177929A JP745987A JP745987A JPS63177929A JP S63177929 A JPS63177929 A JP S63177929A JP 745987 A JP745987 A JP 745987A JP 745987 A JP745987 A JP 745987A JP S63177929 A JPS63177929 A JP S63177929A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- blanking
- tip
- pressing
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 5
- 238000004080 punching Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract 3
- 239000000463 material Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000750 progressive effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は半導体装置用のリードフレームをプレスで打
ち抜き、寸法精度の高い所定のパターンに加工する方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method of punching out a lead frame for a semiconductor device using a press and processing it into a predetermined pattern with high dimensional accuracy.
〈従来技術とその問題点〉
従来一般に半導体装置用のリードフレームをプレスで所
定のパターンに打ち抜き加工する場合は、銅合金や、鉄
−ニッケル合金等の金属条材を順送り金型に供給し、連
続的に多数の工程を経ながら順次打ち抜き加工している
。例えば第１図のようなパターンのリードフレーム１の
り一ド２を打ち抜く場合には先ずリード２のサポートリ
ード１０とパッド３側の外周部５を図示してない順送り
金型で打抜部と同じ寸法のパンチとダイで抜きとり、次
に他のダムバー４側の外周部６を同様に抜き取ることに
よりリード２を形成する。この外周部５゜６を抜きとる
ときに、抜き取り部の外周は素材の全面を金型のストリ
ッパーを兼ねる押し板で押圧して、素材がずれないよう
に固定している。しかし、素材にはパンチで打ち抜く際
に圧縮や引張り力が加わり特に屈曲部２Ｃがある場合は
外方に開く応力が残るため打ち抜かれたリード２は第２
図の点！２ａで示す位置まで矢印Ａで示す水平方向にず
れが発生すると共に、パッド３に近い先端部２ｂにはね
じれも生ずることになる。このリード２のずれの寸法は
り一ド２の長さや巾、材質等により異るが、長くて巾が
小さいとずれが大きくなる。リードフレーム１のリード
数が少い場合はリード巾やリード間隔を太き（とれるの
で問題も小さいが、近年半導体装置の集積度が高度化さ
れるに伴い、リードの数は増加し、その巾が狭（、長さ
は長くなる一方、リード間隔の寸法精度や形状に対する
要求が厳しくなるため製品の歩留りが低下する問題があ
った。<Prior art and its problems> Conventionally, when punching a lead frame for a semiconductor device into a predetermined pattern using a press, a metal strip such as copper alloy or iron-nickel alloy is fed to a progressive die. The punching process is performed sequentially through a number of continuous processes. For example, when punching out a lead frame 1 and a lead 2 having a pattern as shown in Fig. 1, first the support lead 10 of the lead 2 and the outer periphery 5 on the pad 3 side are molded using a progressive die (not shown) in the same manner as the punching part. The lead 2 is formed by punching out the lead 2 using a punch and die of the same size, and then punching out the outer peripheral part 6 on the other dam bar 4 side in the same manner. When extracting this outer peripheral part 5.6, the outer periphery of the extracted part is pressed against the entire surface of the material by a pressing plate that also serves as a mold stripper, thereby fixing the material so that it does not shift. However, when punching the material, compression and tensile forces are applied to the material, and stress that opens outwards remains, especially when there is a bent part 2C, so the punched lead 2
Points on the diagram! A shift occurs in the horizontal direction indicated by arrow A up to the position indicated by 2a, and a twist also occurs at the tip end 2b near the pad 3. The size of this deviation of the lead 2 varies depending on the length, width, material, etc. of the lead 2, but the longer the lead 2 is and the smaller the width, the larger the deviation. If the lead frame 1 has a small number of leads, the problem is small because the lead width and lead spacing can be increased, but as the degree of integration of semiconductor devices has become more sophisticated in recent years, the number of leads has increased and the width has increased. As the lead length became narrower (and the lead length became longer), the requirements for the dimensional accuracy of the lead spacing and the shape became stricter, which caused the problem of lower product yields.
この対策として押し板に突起を設け、ダイの外周部の素
材を強く押圧して打ち抜けばリード先端部のねじれの発
生は防止できる。しかしずれは若干少くなるがリード長
さが３０ｍｍ以上では、ずれが６０〜７０μｍ生じ、寸
法精度がまだ不充分でその対策が望まれていた。As a countermeasure to this problem, if a protrusion is provided on the push plate and the material on the outer periphery of the die is strongly pressed and punched, twisting of the lead tip can be prevented. However, although the deviation is slightly smaller, when the lead length is 30 mm or more, the deviation occurs by 60 to 70 μm, and the dimensional accuracy is still insufficient, and countermeasures are desired.
〈問題点を解決するための手段〉
この発明は前記の問題点を解決するために種々試験研究
を重ねた結果、リードを打ち抜くときリードの先端近辺
の打抜き部外周を強く押圧し、一方リードの基部に近い
屈曲部の打抜き部外周は弱く押圧するか、全く押圧しな
いで打抜けば、打抜後のリードのずれが小さくなること
を見出したものである。<Means for Solving the Problems> As a result of various tests and studies conducted in order to solve the above-mentioned problems, the present invention was developed by strongly pressing the outer periphery of the punched part near the tip of the lead when punching out the lead. It has been found that if the outer periphery of the punched part at the bent part near the base is punched with weak pressure or no pressure at all, the deviation of the lead after punching can be reduced.
上述の打抜き部位の押圧力を変える手段としては例えば
順送り金型のストリッパーを兼ねる押し板の表面に設け
る突起の寸法を変えたり、又は押し板に窪みを設けても
よい。As a means for changing the pressing force of the punching portion described above, for example, the size of the protrusion provided on the surface of the push plate which also serves as a stripper of the progressive die may be changed, or a depression may be provided in the push plate.
く作 用〉
このように、リード先端部を強く押圧してねじれと打抜
時のずれを防止すると共に、基部の屈曲部の押圧力を小
さくするか、押圧しない状態にして打抜き時にリードに
加わる水平分力を吸収して屈曲部の残留応力をなくすこ
とによりプレス後のずれの発生を防止することができる
。In this way, the tip of the lead is strongly pressed to prevent twisting and misalignment during punching, and at the same time, the pressing force on the bent portion of the base is reduced or not pressed to reduce the amount of pressure applied to the lead during punching. By absorbing the horizontal component force and eliminating residual stress in the bent portion, it is possible to prevent the occurrence of displacement after pressing.
〈実施例〉
厚さ０．２５ｔｍの４２７０イ合金の素材を使用し第１
図のようなパターンのリード２を打抜くため、金型の押
し板の先端部２ｂを押圧する部分には厚さ３０μｍの突
起７を設け、屈曲部２Ｃから基部の部分には深さ２０μ
の窪み９を設け、この間には平坦部８を設けた。またリ
ード２の基部と先端の巾は夫々１．３ｆｌと０．３５ｎ
＋であり、長さは３０頭である。そして先ずリード２の
外側（サポートリード１０及びバッド３側）外周部５を
打ち抜き、次に内側ダムバー４側の外周部６を打ち抜い
てリード２を形成した。パッド３の右側についても同様
である。そしてプレス加工後のリードフレーム１００個
のり一ド２の水平方向のずれを測定した結果０〜２０μ
ｍであり、また先端のねじれは全くなく、充分寸法規格
を満足するリードフレームが得られた。<Example> Using the material of 4270I alloy with a thickness of 0.25 tm, the first
In order to punch out the lead 2 in the pattern shown in the figure, a protrusion 7 with a thickness of 30 μm is provided at the part that presses the tip 2b of the pushing plate of the mold, and a protrusion 7 with a thickness of 20 μm is provided from the bent part 2C to the base.
A depression 9 was provided, and a flat portion 8 was provided between the depressions 9. Also, the width of the base and tip of lead 2 is 1.3fl and 0.35n, respectively.
+, and the length is 30 heads. First, the outer peripheral part 5 of the lead 2 (on the side of the support lead 10 and the pad 3) was punched out, and then the outer peripheral part 6 on the inner dam bar 4 side was punched out to form the lead 2. The same applies to the right side of the pad 3. The results of measuring the horizontal deviation of glue 2 on 100 lead frames after press working were 0 to 20μ.
m, and there was no twisting at the tip at all, and a lead frame that satisfactorily met the dimensional standards was obtained.
〈発明の効果〉
以上説明したようにこの発明はリードを打ち抜（とき、
リードの先端近辺の打抜き部外周を強（押圧して固定し
、リードの基部に近い屈曲部の打抜き部外周は弱く押圧
するか、全く押圧しないで打抜（ようにしたことにより
、リード先端部のねじれは発生せず、水平方向のずれも
従来の１７３以下となり、製品品質と歩留り向上に顕著
な効果がある。<Effects of the Invention> As explained above, this invention has the advantage of punching out leads.
The outer periphery of the punched part near the tip of the lead is fixed by pressing hard, and the outer periphery of the punched part near the bent part near the base of the lead is punched with weak pressure or no pressure at all. Twisting does not occur, and the horizontal deviation is less than 173 compared to the conventional method, which has a remarkable effect on improving product quality and yield.
第１図は本発明の方法によりリードを打抜くときのリー
ド外周部の押し方を説明する図であり、第２図はリード
のずれを説明する図である。
１：リードフレーム、２：リード、３：パッド、４：ダ
ムバー、５，６：抜き取り部、７：突起、８：平坦部、
９：窪み、１０：サポートリード。
特許出願人 住友金属鉱山株式会社
第１図
第２図FIG. 1 is a diagram illustrating how to press the outer peripheral portion of the lead when punching the lead by the method of the present invention, and FIG. 2 is a diagram illustrating displacement of the lead. 1: Lead frame, 2: Lead, 3: Pad, 4: Dam bar, 5, 6: Removal part, 7: Protrusion, 8: Flat part,
9: Recess, 10: Support lead. Patent applicant Sumitomo Metal Mining Co., Ltd. Figure 1 Figure 2
Claims (1)
るリードフレームの製造方法において、屈曲部を有する
インナーリードを打ち抜くとき、打ち抜き部のパッドに
近い先端近辺の周囲は押し板で強く押圧して固定し、ダ
ムバーに近い屈曲部の周囲は押圧しないか又は弱く押圧
した状態で打ち抜くことを特徴とするリードフレームの
プレス加工方法。In a lead frame manufacturing method in which a metal plate is punched into a predetermined pattern using a press, when punching out an inner lead having a bent part, the area around the tip of the punched part near the pad is firmly pressed and fixed with a push plate; A method for press working a lead frame, characterized in that punching is performed while the periphery of the bent part near the dam bar is not pressed or is pressed weakly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62007459A JPH084845B2 (en) | 1987-01-17 | 1987-01-17 | Lead frame pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62007459A JPH084845B2 (en) | 1987-01-17 | 1987-01-17 | Lead frame pressing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177929A true JPS63177929A (en) | 1988-07-22 |
| JPH084845B2 JPH084845B2 (en) | 1996-01-24 |
Family
ID=11666402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62007459A Expired - Lifetime JPH084845B2 (en) | 1987-01-17 | 1987-01-17 | Lead frame pressing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084845B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163328U (en) * | 1984-09-28 | 1986-04-30 |
-
1987
- 1987-01-17 JP JP62007459A patent/JPH084845B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163328U (en) * | 1984-09-28 | 1986-04-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH084845B2 (en) | 1996-01-24 |
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