JPS63177049U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１〜２図は本考案の実施例を示し、第１図は
ウエハ吸着時の略縦断面図、第２図はウエハを剥
離させるときの略縦断面図、第３図は従来のチヤ
ツクを略示する縦断面図である。 １：チヤツク体、１ａ：前面、２：細孔、３：
通気管、４：通路、５：ウエハ、６：シリンダ、
７：ピストン、８：ピン、９：ばね、１０：通気
管、１１：可逆式真空ポンプ。 Figures 1 and 2 show an embodiment of the present invention. Figure 1 is a schematic vertical cross-sectional view when a wafer is attracted, Figure 2 is a schematic vertical cross-sectional view when the wafer is separated, and Figure 3 is a schematic vertical cross-sectional view when the wafer is separated. FIG. 2 is a schematic longitudinal sectional view. 1: chuck body, 1a: front surface, 2: pore, 3:
Ventilation pipe, 4: passage, 5: wafer, 6: cylinder,
7: Piston, 8: Pin, 9: Spring, 10: Ventilation pipe, 11: Reversible vacuum pump.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハを密着させる平滑なチヤツク体の前面に
複数の細孔を開口させ、各細孔を空気圧を給排す
る通気管に通じさせ、チヤツク体に取付けたシリ
ンダへの空気圧給排によりチヤツク体前面から出
入するピンを、吸着するウエハの端部に当接する
位置に設けた半導体ウエハ用チヤツク。 A plurality of pores are opened on the front surface of the smooth chuck body that holds the wafer in close contact with each other, and each pore is connected to a ventilation pipe that supplies and discharges air pressure. A chuck for semiconductor wafers with a pin that comes in and out at a position where it touches the edge of the wafer to be picked up.