JPS63172612U - - Google Patents
Info
- Publication number
- JPS63172612U JPS63172612U JP6514587U JP6514587U JPS63172612U JP S63172612 U JPS63172612 U JP S63172612U JP 6514587 U JP6514587 U JP 6514587U JP 6514587 U JP6514587 U JP 6514587U JP S63172612 U JPS63172612 U JP S63172612U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- sheet
- dividing
- element formation
- opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
第１図は本考案にかかる半導体ウエハの分割装
置の要部を示す概略断面図であり、第２図は本発
明にかかる半導体ウエハの分割装置の概略断面図
である。第３図は従来の半導体ウエハの分割方法
を示す概略断面図である。
１……半導体ウエハ、２……分割溝、４……ロ
ーラー、５……シート、７……筐体、９……フレ
ーム、１０……フレームクランプ、１１……水平
軸ガイド、１２……移動基台、１３……支柱、１
４……垂直軸ガイド、１５……垂直移動ブロツク
、１６……ローラー支持具。
FIG. 1 is a schematic cross-sectional view showing the main parts of a semiconductor wafer dividing apparatus according to the present invention, and FIG. 2 is a schematic cross-sectional view of the semiconductor wafer dividing apparatus according to the present invention. FIG. 3 is a schematic cross-sectional view showing a conventional method of dividing a semiconductor wafer. 1... Semiconductor wafer, 2... Division groove, 4... Roller, 5... Sheet, 7... Housing, 9... Frame, 10... Frame clamp, 11... Horizontal axis guide, 12... Movement Base, 13... Support, 1
4... Vertical axis guide, 15... Vertical moving block, 16... Roller support.
Claims (1)
と反対側の面にて接着するシートと、 上記シートを固定する手段と、 上記半導体ウエハの素子形成面と反対側の面か
ら上記シートを介して局部的に押圧し、上記半導
体ウエハを分割する手段とを有することを特徴と
する半導体ウエハの分割装置。[Claims for Utility Model Registration] A sheet for adhering a semiconductor wafer in which dividing grooves are formed on the surface opposite to the element formation surface, means for fixing the sheet, and a side of the semiconductor wafer opposite to the element formation surface. A device for dividing a semiconductor wafer, comprising means for dividing the semiconductor wafer by locally pressing the semiconductor wafer from the surface thereof through the sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6514587U JPS63172612U (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6514587U JPS63172612U (en) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172612U true JPS63172612U (en) | 1988-11-09 |
Family
ID=30901949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6514587U Pending JPS63172612U (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172612U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014031002A (en) * | 2012-08-02 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | Rolling break device for brittle material substrate |
-
1987
- 1987-04-28 JP JP6514587U patent/JPS63172612U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014031002A (en) * | 2012-08-02 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | Rolling break device for brittle material substrate |
| JP2018030376A (en) * | 2012-08-02 | 2018-03-01 | 三星ダイヤモンド工業株式会社 | Rolling break device for brittle material substrate |