JPS63172174U - - Google Patents
Info
- Publication number
- JPS63172174U JPS63172174U JP6565287U JP6565287U JPS63172174U JP S63172174 U JPS63172174 U JP S63172174U JP 6565287 U JP6565287 U JP 6565287U JP 6565287 U JP6565287 U JP 6565287U JP S63172174 U JPS63172174 U JP S63172174U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- damping function
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000013016 damping Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
Landscapes
- Vibration Prevention Devices (AREA)
Description
第１図は、本考案の制振機能を持つ多層印刷配
線基板の層構成断面図、第２図は従来の多層印刷
配線基板の層構成断面図である。
図において、１……第１層印刷配線基板、２…
…第１層間接着剤、３……第２層印刷配線基板、
４……第２層間接着剤、５……制振材、６……第
３層間接着剤、７……第３層印刷配線基板である
。
FIG. 1 is a sectional view of the layer structure of a multilayer printed wiring board with a vibration damping function according to the present invention, and FIG. 2 is a sectional view of the layer structure of a conventional multilayer printed wiring board. In the figure, 1...first layer printed wiring board, 2...
...first interlayer adhesive, 3...second layer printed wiring board,
4... Second interlayer adhesive, 5... Damping material, 6... Third interlayer adhesive, 7... Third layer printed wiring board.
Claims (1)
減衰機能を持つた制振材を組入れた事を特徴とす
る制振機能を持つ多層印刷配線基板。 A multilayer printed wiring board having a vibration damping function, characterized in that a damping material having a structural damping function is incorporated as one layer of the multilayer structure of the multilayer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565287U JPS63172174U (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6565287U JPS63172174U (en) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172174U true JPS63172174U (en) | 1988-11-09 |
Family
ID=30902925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6565287U Pending JPS63172174U (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172174U (en) |
-
1987
- 1987-04-28 JP JP6565287U patent/JPS63172174U/ja active Pending
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