JPS6316482U - - Google Patents

Info

Publication number
JPS6316482U
JPS6316482U JP11112486U JP11112486U JPS6316482U JP S6316482 U JPS6316482 U JP S6316482U JP 11112486 U JP11112486 U JP 11112486U JP 11112486 U JP11112486 U JP 11112486U JP S6316482 U JPS6316482 U JP S6316482U
Authority
JP
Japan
Prior art keywords
via hole
conductor circuit
layer
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11112486U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11112486U priority Critical patent/JPS6316482U/ja
Publication of JPS6316482U publication Critical patent/JPS6316482U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る多層プリント配線板の部
分拡大縦断面図、第２図は従来の多層プリント配
線板を示す部分拡大縦断面図である。 符号の説明、１０…多層プリント配線板、１１
…基板、１２…導体回路層、１３…絶縁体層、１
４…バイアホール、１５…導体ペースト。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少なくとも２層の導体回路層と、この導体
    回路層を隔離する絶縁体層と、この絶縁体層に設
    けられたバイアホールとを有するプリント配線板
    において、 前記バイアホールの表面は、当該バイアホール
    内に充填された導体ペーストによつて前記絶縁体
    層と同一平面となるように形成されてなり、 前記絶縁体層によつて絶縁されている各導体回
    路層は、前記バイアホールの中に充填された前記
    導体ペーストによつて他の導体回路層と電気的に
    接続されてなることを特徴とする多層プリント配
    線板。 (2) 前記導体ペーストは、ポリマー系の樹脂に
    よつて構成されてなるものであることを特徴とす
    る実用新案登録請求の範囲第１項に記載の多層プ
    リント配線板。
JP11112486U 1986-07-18 1986-07-18 Pending JPS6316482U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11112486U JPS6316482U (ja) 1986-07-18 1986-07-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11112486U JPS6316482U (ja) 1986-07-18 1986-07-18

Publications (1)

Publication Number Publication Date
JPS6316482U true JPS6316482U (ja) 1988-02-03

Family

ID=30990758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11112486U Pending JPS6316482U (ja) 1986-07-18 1986-07-18

Country Status (1)

Country Link
JP (1) JPS6316482U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281692A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板
JPH02281693A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5183162A (ja) * 1975-01-18 1976-07-21 Nippon Electric Co Tasopurintohaisenban
JPS53123868A (en) * 1977-04-04 1978-10-28 Hitachi Ltd Method of producing multilayer printed circuit board provided with multiple through holes
JPS6151779B2 (ja) * 1979-01-31 1986-11-10 Canon Kk

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5183162A (ja) * 1975-01-18 1976-07-21 Nippon Electric Co Tasopurintohaisenban
JPS53123868A (en) * 1977-04-04 1978-10-28 Hitachi Ltd Method of producing multilayer printed circuit board provided with multiple through holes
JPS6151779B2 (ja) * 1979-01-31 1986-11-10 Canon Kk

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281692A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板
JPH02281693A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板の製造方法

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