JPS63158528A - Electrochromic element - Google Patents
Electrochromic elementInfo
- Publication number
- JPS63158528A JPS63158528A JP30552686A JP30552686A JPS63158528A JP S63158528 A JPS63158528 A JP S63158528A JP 30552686 A JP30552686 A JP 30552686A JP 30552686 A JP30552686 A JP 30552686A JP S63158528 A JPS63158528 A JP S63158528A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive layer
- groove
- resistance conductive
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000003792 electrolyte Substances 0.000 description 20
- 239000000126 substance Substances 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 239000011245 gel electrolyte Substances 0.000 description 5
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000002265 redox agent Substances 0.000 description 5
- 229910001930 tungsten oxide Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 description 3
- 239000011244 liquid electrolyte Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 239000013225 prussian blue Substances 0.000 description 3
- 229960003351 prussian blue Drugs 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005518 polymer electrolyte Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- 239000003115 supporting electrolyte Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000005322 wire mesh glass Substances 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical class OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- -1 fluororesin Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002468 redox effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はエレクトロクロミック（ＥＣ）素子に係り、特
に低抵抗導電層が透明電極に積層形成されたＥＣ素子に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electrochromic (EC) device, and particularly to an EC device in which a low resistance conductive layer is laminated on a transparent electrode.
［従来の技術］
ＥＣ素子は、液晶表示素子（ＬＣＤ）に比して、駆動に
大電流を要し、大面積のＥＣ素子では応答速度が低下し
たり、着色濃度が不十分になったりするという問題点を
有していた。[Prior Art] EC elements require a large amount of current to drive compared to liquid crystal display elements (LCDs), and large-area EC elements result in decreased response speed and insufficient coloring density. There was a problem.
これは、ＥＣ素子の場合にも、少なくとも一方の電極は
透明電極とせざるをえなく、ＳｎＯ＊−１ｎｉＯｓ−３
ｎＯ＊等の透明電極を使用しているため、抵抗が高く、
大面積のＥＣ素子に要求される電荷が短時間で供給でき
ないためである。このため、この透明電極の上又は下に
低抵抗の金属等の導電性材料による低抵抗導電層を積層
することが提案されている。This means that even in the case of EC elements, at least one electrode must be a transparent electrode, and SnO*-1niOs-3
Because it uses transparent electrodes such as nO*, it has high resistance.
This is because the charge required for a large-area EC element cannot be supplied in a short time. For this reason, it has been proposed to laminate a low-resistance conductive layer made of a conductive material such as a low-resistance metal on or below the transparent electrode.
具体的には、基板上に低抵抗導電層を線状等に形成し、
この上に透明電極を積層形成したり、逆に透明電極を形
成した上に低抵抗導電層を線状等に積層形成したりする
。Specifically, a low resistance conductive layer is formed in a linear form on a substrate,
A transparent electrode is laminated thereon, or conversely, a low-resistance conductive layer is laminated in the form of a line or the like on the transparent electrode.
［発明の解決しようとする問題点］
このような低抵抗導電層を基板上または基板上の透明電
極上に形成したＥＣ素子は、低抵抗導電層が形成されて
いないＥＣ素子に比して。[Problems to be Solved by the Invention] An EC element in which such a low-resistance conductive layer is formed on a substrate or a transparent electrode on a substrate is different from an EC element in which a low-resistance conductive layer is not formed.
抵抗が低下するため、応答速度は向上する。Since the resistance is reduced, the response speed is improved.
さらに大面積のＦ、Ｃ表示素子やＥＣ調光素子では、そ
の着消色により多くの電流が必要とされる。この要求に
対して、前述の構成のＥＣ素子では、ＥＣ素子のセル内
に低抵抗導電層が形成されるため、その厚みは上下の基
板間での短絡の防止という点からみてあまり厚くするこ
とはできなく、低抵抗導電層の抵抗を下げるためにはそ
の幅を広くする必要が生じた。しかし、低抵抗導電層の
幅を広くすることは不要な非表示部分を増加させること
となる。このため１表示素子においてはＥＣ素子特有の
白い背景に黒い線が広い幅で見えてしまい見栄えが低下
することになる。また、ＥＣ調光素子の場合には、見え
ない部分が増加し、やはり目ざわりなものとなる。Furthermore, large-area F and C display elements and EC light control elements require a large amount of current for coloring and decoloring. In response to this requirement, in the EC element with the above-mentioned configuration, a low-resistance conductive layer is formed within the cell of the EC element, so its thickness must not be made too thick in order to prevent short circuits between the upper and lower substrates. Therefore, in order to lower the resistance of the low-resistance conductive layer, it became necessary to widen its width. However, increasing the width of the low-resistance conductive layer increases unnecessary non-display portions. For this reason, in one display element, a wide black line appears on a white background, which is characteristic of an EC element, and the appearance deteriorates. Furthermore, in the case of an EC light control element, the invisible portion increases, which is also a nuisance.
なお、ＬＣＤにおいても画素数の多い高密度の表示素子
においては、その引き廻しのリードが細くなるため、一
部のものでは低抵抗導電層を形成しているが、必要とさ
れる電流がＥＣ素子に比してはるかに少なく、はとんど
このような問題点を生じない。Note that in high-density display elements with a large number of pixels in LCDs, the wiring leads become thinner, so in some cases a low-resistance conductive layer is formed, but the required current is lower than the EC. It is far less common than other devices, and rarely causes such problems.
このため、幅は従来と同等で、抵抗値が低い低抵抗導電
層が望まれていた。For this reason, a low-resistance conductive layer with a width similar to that of conventional materials and a low resistance value has been desired.
Ｅ問題点を解決するための手段］
本発明は、この様な従来のＥＣ素子の欠点を解消するた
めになされたものであり、表面に電極を形成した第１、
第２の基板の少なくとも一方の電極が透明電極とされ、
少なくとも一方の電極面上には更にＥＣ物質層が形成さ
れたＥＣ素子において、透明電極の形成される基板には
溝が形成され、該溝中に導電性材料による低抵抗導電層
が形成されていることを特徴とするＥＣ素子を提供する
ことを目的とする。Means for Solving Problem E] The present invention has been made in order to eliminate the drawbacks of such conventional EC elements, and includes a first EC element having an electrode formed on its surface.
At least one electrode of the second substrate is a transparent electrode,
In the EC element in which an EC material layer is further formed on at least one electrode surface, a groove is formed in the substrate on which the transparent electrode is formed, and a low resistance conductive layer made of a conductive material is formed in the groove. An object of the present invention is to provide an EC element characterized by:
即ち、本発明は、基板に溝を形成し、この溝の中に低抵
抗導電層を形成し、その上に透明電極を形成するもので
ある。これにより、低抵抗導電層はその厚みを厚くでき
、同一の抵抗値にするためには同一の断面積にすればよ
いことから低抵抗導電層の幅を狭くすることができ、見
栄えの低下が少なくなる。That is, in the present invention, a groove is formed in a substrate, a low resistance conductive layer is formed in the groove, and a transparent electrode is formed thereon. This allows the low-resistance conductive layer to be thicker, and because the same cross-sectional area is required to achieve the same resistance value, the width of the low-resistance conductive layer can be narrowed, and the appearance does not deteriorate. It becomes less.
図面を参照しつつ説明する。This will be explained with reference to the drawings.
第１図は１本発明のＥＣ素子の基本的構造を示す断面図
である。FIG. 1 is a sectional view showing the basic structure of an EC element according to the present invention.
第１図において、一方の基板ＩＡ上には、透明電極２Ａ
、さらにその上にＥＣ物質層３が形成されており、他方
の基板ＩＢ上には、電極２Ｂが形成されている１本発明
では、これらの電極の形成された基板１＾、 ＩＢには
、溝４Ａ、４Ｂが形成され、これらの溝の中には低抵抗
導電層５Ａ、５Ｂが形成されている。これらの２枚の基
板ＩＡ、ＩＢは、その間に電解質６を挟持するように電
極面が相対向するように配置され、周辺がシール材７で
シールされている。In FIG. 1, a transparent electrode 2A is provided on one substrate IA.
Further, an EC material layer 3 is formed thereon, and an electrode 2B is formed on the other substrate IB. In the present invention, the substrate 1^, IB on which these electrodes are formed, Grooves 4A and 4B are formed, and low resistance conductive layers 5A and 5B are formed in these grooves. These two substrates IA and IB are arranged so that their electrode surfaces face each other so that the electrolyte 6 is sandwiched therebetween, and their peripheries are sealed with a sealing material 7.
本発明で、ＥＣ素子を構成する基板は１通常のガラス、
プラスチック等の基板が使用できる。また、調光段や反
射型の表示素子のように反射型で使用する場合には、裏
側に使用される基板は金属、セラミック、着色プラスチ
ック等不透明な基板であってもよい。In the present invention, the substrate constituting the EC element is 1 ordinary glass;
A substrate made of plastic or the like can be used. Further, when used in a reflective type such as a light control stage or a reflective display element, the substrate used on the back side may be an opaque substrate such as metal, ceramic, or colored plastic.
電極としては、酸化錫（ＳｎＯｓｌ、酸化インジウム・
酸化錫＋ＩＴＯ１等の透明電極や１本発明のＥＣ素子を
調光鏡として用いる場合には１反射性の窒化チタン等の
金属化合物等を電極として用いてもよいし、反射型の表
示素子として用いる場合には、裏側の電極は５金属、Ｅ
Ｃ物質、その他年透明な材料の電極であってもよい。As an electrode, tin oxide (SnOsl, indium oxide) is used.
When using a transparent electrode such as tin oxide + ITO1 or the EC element of the present invention as a dimming mirror, a reflective metal compound such as titanium nitride may be used as the electrode, or it may be used as a reflective display element. In case, the back side electrode is 5 metal, E
The electrode may be made of C material or other transparent material.
これらの電極は、基板に形成されるが、少なくとも一方
の電極は、透明電極とされるものであり、この透明電極
には、低抵抗導電層が積層される。もちろん、第１図の
例のように両方の基板に溝が形成され、低抵抗導電層が
形成されてもよい。These electrodes are formed on the substrate, and at least one of the electrodes is a transparent electrode, and a low resistance conductive layer is laminated on this transparent electrode. Of course, grooves may be formed in both substrates and low resistance conductive layers may be formed as in the example of FIG.
この低抵抗導電層は、透明電極が形成される基板に形成
された溝に埋め込まれ形成されたものであり、表示素子
のように表示パターンがある場合には、そのパターンに
合せて形成すればよいし、調光素子のように全面ベタパ
ターンの場合には通常、線状、格子状、亀甲状等の形状
に形成されればよい。This low-resistance conductive layer is embedded in a groove formed in the substrate on which the transparent electrode is formed, and if there is a display pattern such as a display element, it can be formed to match the pattern. However, in the case of a solid pattern on the entire surface such as a light control element, it is usually sufficient to form the pattern in a linear, lattice, hexagonal, etc. shape.
この低抵抗導電層の幅と厚み（深さ）は基板の厚みと要
求される抵抗値とＥＣ素子の大きさとによって適宜定め
られればよく、幅は０．１〜１０ｎ＋ｍ程度、厚みは０
．０２〜１ｍｒｎ程度とされればよい１例えば比較的小
型のｌ Ｏｃｍ角程度のＥＣ素子では幅は １ｍｍ以下
とされるほうが好ましいが、９０ｃｏ＋角というような
大型のＥＣ調光素子の場合には数ｍｌ１１程度あっても
あまり問題とならない。The width and thickness (depth) of this low-resistance conductive layer may be appropriately determined depending on the thickness of the substrate, the required resistance value, and the size of the EC element, and the width is about 0.1 to 10n+m and the thickness is about 0.
．． For example, in the case of a relatively small EC element of about 10 cm square, it is preferable that the width is 1 mm or less, but in the case of a large EC dimming element of 90 cm square, the width should be about 0.2 to 1 mrn. Even if the amount is about 11 ml, it is not a big problem.
この低抵抗導電層を形成するための溝中に埋設される導
電性材料は、金属、導電ペースト等透明電極よりも低抵
抗で、導電性を生じさせるものであれば使用できる。The conductive material to be buried in the groove for forming the low resistance conductive layer may be a metal, a conductive paste, or any other material that has lower resistance than the transparent electrode and exhibits conductivity.
この低抵抗導電層を埋め込むための溝は、基板に形成さ
れるが、その形成方法は公知の溝形成方法が使用でき、
ガラス基板やセラミック基板であればダイヤモンド砥石
等で切削すればよいし、プラスチック基板では切削手段
で切削したり、プレスで加圧成形してもよい。A groove for embedding this low-resistance conductive layer is formed in the substrate, and a known groove forming method can be used to form the groove.
A glass substrate or a ceramic substrate may be cut with a diamond grindstone or the like, and a plastic substrate may be cut with a cutting means or pressure molded with a press.
この溝は、その断面において、深くなるに従いその幅が
減少するような形状、具体的には、断面が逆三角形、逆
台形、放物線等のようになるようにされることが好まし
い、これは、溝を形成後、導電性材料を供給して低抵抗
導電層を形成すことが容易になるためである。It is preferable that the cross section of this groove is such that its width decreases as it gets deeper, specifically, the cross section is an inverted triangle, an inverted trapezoid, a parabola, etc. This is because after forming the groove, it becomes easy to supply a conductive material and form a low resistance conductive layer.
次に、このようにして形成された溝に導電性材料を供給
して低抵抗導電層を形成する。この場合５導電性材料と
して導電性ペーストを使用することにより溝の形状が正
確でなくても溝に一致した低抵抗導電層が容易に製造で
きる。これは、ｆＭを形成する工程の制御を厳しくしな
くてもよくなるため、その生産性が極めて向上する。Next, a conductive material is supplied to the grooves thus formed to form a low resistance conductive layer. In this case, by using a conductive paste as the conductive material 5, a low resistance conductive layer matching the grooves can be easily manufactured even if the shape of the grooves is not accurate. This eliminates the need to strictly control the process of forming the fM, thereby significantly improving productivity.
また、導電性ペーストの使用は、印刷法が使用できるた
め、大面積のＥＣ素子であっても、導電性ペーストを極
めて速く供給でき、導電性ペースト供給工程自体も生産
性がよいものとなる。特に、スクリーン印刷により容易
に形成できる。Furthermore, since a printing method can be used to use the conductive paste, the conductive paste can be supplied extremely quickly even for large-area EC elements, and the conductive paste supply process itself can be highly productive. In particular, it can be easily formed by screen printing.
この導電性ペーストとしては、銀、銅、カーボン等の導
電性粒子を樹脂、ガラスフリット等の材料に混合した公
知の導電性ペーストが使用できる。As this conductive paste, a known conductive paste in which conductive particles of silver, copper, carbon, etc. are mixed with a material such as resin or glass frit can be used.
本発明のＥＣ物質としては、酸化タングステン（ＷＯ，
） 、酸化モリブデン（Ｍｏｓｓ）等の遷移金属化合物
による無機のＥＣ物質をはじめプルシアンブルー等の有
機のＥＣ物質等公知のＥＣ物質を使用すればよい。The EC material of the present invention includes tungsten oxide (WO,
), well-known EC substances such as inorganic EC substances made of transition metal compounds such as molybdenum oxide (Moss) and organic EC substances such as Prussian blue may be used.
透過型のＥＣ表示素子や、調光素子の場合には１両方の
基板とも透明基板に透明電極を使用し、一方の基板のみ
に非晶質の酸化タングステンのようなＥＣ物質層を形成
して使用したり、一方の基板には可視光域で着消色する
非晶質の酸化タングステンのようなＥＣ物質層を形成し
、他方の基板には可視光域で着消色しない結晶質の酸化
タングステンによるＥＣ物質層を形成したり、一方の基
板には非晶質の酸化タングステン、他方の基板にはプル
シアンブルーというように逆の電圧の印加により着消色
する２種類のＥＣ物質を使用することもできる。In the case of transmissive EC display elements or light control elements, transparent electrodes are used on transparent substrates for both substrates, and an EC material layer such as amorphous tungsten oxide is formed on only one substrate. Alternatively, one substrate may be formed with an EC material layer such as amorphous tungsten oxide, which changes color and fades in the visible light range, and the other substrate contains a crystalline EC material layer that does not color or fade in the visible light range. An EC material layer made of tungsten is formed, or two types of EC materials are used, such as amorphous tungsten oxide on one substrate and Prussian blue on the other substrate, which change color and fade when opposite voltages are applied. You can also do that.
なお、一方の基板が透明電極のみという場合には、後述
するように電解質中にレドックス剤を混入しておくこと
が好ましい。In addition, when one of the substrates is only a transparent electrode, it is preferable to mix a redox agent into the electrolyte as described later.
このように両方の基板に透明電極を形成した場合には、
低抵抗導電層は両方の基板に形成することが好ましい。When transparent electrodes are formed on both substrates in this way,
Preferably, the low resistance conductive layer is formed on both substrates.
反射型の表示素子の場合には、前述の透過型のＥＣ素子
と同様の構成であってもよいが、内部に反射板を挿入で
きるため、裏側の基板は不透明でよく、透明電極、金属
電極、導電性ペーストの焼成による電極等の電極に、カ
ーボンとＥＣ物質、ＥＣ物質のみ、レドックス剤等によ
る対向電極を積層して形成すればよい。In the case of a reflective display element, it may have the same configuration as the above-mentioned transmissive EC element, but since a reflective plate can be inserted inside, the back substrate may be opaque, and transparent electrodes, metal electrodes, etc. , an electrode such as an electrode formed by baking a conductive paste may be laminated with a counter electrode made of carbon and an EC substance, only an EC substance, a redox agent, or the like.
もちろん、この裏側の電極にも基板に溝を設けて、その
溝の中に低抵抗導電層を形成してもよい。Of course, it is also possible to provide a groove in the substrate for the electrode on the back side and form a low resistance conductive layer in the groove.
調光鏡の場合には、前述の透過型の調光素子の裏側に鏡
面を形成してもよいし、裏側の基板の電極を反射電極に
してもよい、この裏側の電極にも基板に溝を設け、その
溝の中に低抵抗導電層を形成してもよい。In the case of a dimming mirror, a mirror surface may be formed on the back side of the above-mentioned transmission type dimming element, or the electrode on the back side substrate may be a reflective electrode, and this back side electrode may also have a groove on the substrate. A low resistance conductive layer may be formed in the groove.
本発明で使用される電解質は、液体、ゲル。The electrolyte used in the present invention can be a liquid or a gel.
固体のいずれであってもよ＜、ＥＣ物質を着消色させる
ものであれば使用できる。Any solid substance can be used as long as it can color or erase the color of the EC substance.
液体電解質としては、γ−ブチロラクトン（γ−ＢＬ）
、スルホラン、スルホキシド、プロピレンカーボネー
ト、ブチルアルコール等の有機溶媒に、ＥＣ物質を着消
色させるイオンを供給する過塩素酸リチウム等の支持電
解質を溶解したものが使用できる。As a liquid electrolyte, γ-butyrolactone (γ-BL)
, sulfolane, sulfoxide, propylene carbonate, butyl alcohol, and the like, in which a supporting electrolyte such as lithium perchlorate, which supplies ions for coloring and decolorizing the EC substance, is dissolved.
ゲル状電解質としては、上記した液体電解質に、さらに
それらの有機溶媒に溶解してゲル化する樹脂、例えば、
ウレタン樹脂、アクリル酸樹脂、ポリエチレンオキシド
、ポリメチルメタクリート、ポリビニルピロリドン、ポ
リビニルブチラールその他の樹脂又はそれらの共重合体
等が加えられたものが使用される。The gel electrolyte includes a resin that dissolves in the above liquid electrolyte and an organic solvent thereof to form a gel, for example,
Those to which urethane resin, acrylic acid resin, polyethylene oxide, polymethyl methacrylate, polyvinylpyrrolidone, polyvinyl butyral, other resins, or copolymers thereof are added are used.
固体電解質としては、プロトン、リチウムイオン等を生
じる無機化合物、支持電解質を含有する高分子電解質等
がある。Examples of solid electrolytes include inorganic compounds that generate protons, lithium ions, etc., and polymer electrolytes containing supporting electrolytes.
ＥＣ物質を設けた一方の電極以外の電極がレドックス性
を有さない単なる透明電極や金属化合物電極であった場
合には、電解質中にレドックス剤、特にＬｉｌ 、フェ
ロセンを加えることが好ましい。これにより、他方の電
極が単なる透明電極や金属化合物電極であっっても、高
速応答が得られる。When the electrodes other than the one electrode provided with the EC substance are mere transparent electrodes or metal compound electrodes without redox properties, it is preferable to add a redox agent, particularly Lil and ferrocene, to the electrolyte. As a result, even if the other electrode is a simple transparent electrode or a metal compound electrode, a high-speed response can be obtained.
調光素子の場合には、両面の電極を透明電極としなくて
はならないため、前述のごとく電解質中にレドックス剤
を混入しておくことが好ましい。また、一方の基板には
非晶質の酸化タングステン、他方の基板にはプルシアン
ブルーというように逆の電圧の印加により着消色する２
種類のＥＣ物質を使用してもよいが、この場合において
も電解質中にレドックス剤を混入しておくことが好まし
い。In the case of a light control element, since the electrodes on both sides must be transparent electrodes, it is preferable to mix a redox agent into the electrolyte as described above. In addition, one substrate is made of amorphous tungsten oxide, and the other substrate is made of Prussian blue, which change color and fade when opposite voltages are applied.
Although various types of EC substances may be used, it is preferable to mix a redox agent into the electrolyte in this case as well.
また、調光素子の場合には、大型となることが多いため
、電解質はゲル状電解質か高分子電解質とすることが上
下基板間での短絡防止、垂直位置での使用時の下方の膨
らみ防止及び外圧による破損時の安全対策上好ましい。In addition, in the case of dimming elements, since they are often large, the electrolyte should be a gel electrolyte or a polymer electrolyte to prevent short circuits between the upper and lower substrates and to prevent downward bulge when used in a vertical position. It is also preferable for safety measures in case of damage due to external pressure.
この電解質は、液状の場合には、基板の周辺をシール材
でシールし、注入口から電解質を注入するようにしても
よいし、基板の中央部付近に電解質を供給してシールと
同時に電解質を封入するようにしてもよい。If this electrolyte is in liquid form, the periphery of the substrate may be sealed with a sealant and the electrolyte may be injected from the injection port, or the electrolyte may be supplied near the center of the substrate and the electrolyte may be sealed at the same time. It may also be enclosed.
また、固体状の場合には、液体状の電解質と同様に液体
の原料を封入した後、硬化させて固体にしてもよいし、
予めフィルム状に成形して積層し、圧着してもよい。In addition, in the case of a solid state, a liquid raw material may be encapsulated in the same way as a liquid electrolyte, and then it may be hardened to become a solid.
It may be formed into a film shape in advance, laminated, and pressure bonded.
また、これら電解質中に、基板の間隙を制御するだめの
ガラス繊維、プラスチック粒子、セラミック粒子等のス
ペーサーを混入しておくこともできる。Further, spacers such as glass fibers, plastic particles, ceramic particles, etc., for controlling the gap between the substrates can be mixed in these electrolytes.
本発明では、これらのいずれの場合においても、低抵抗
導電層は基板中に埋設され、基板」二に突出していない
ため、上下基板間での短絡を生じにくいのみならず、電
解質の封入や積層時にも同等問題を生じない。In the present invention, in any of these cases, the low-resistance conductive layer is buried in the substrate and does not protrude beyond the substrate, which not only makes short circuits between the upper and lower substrates less likely to occur, but also prevents electrolyte encapsulation and lamination. Sometimes the same problem does not arise.
シールは本発明では必須の要件ではないが、水分や酸素
による電解質やＥＣ物質の劣化の防止のためにはあった
方がよい、もちろん、電解質が液体やゲルの場合にはシ
ールを形成する。Although a seal is not an essential requirement in the present invention, it is better to have one in order to prevent deterioration of the electrolyte and EC substance due to moisture and oxygen. Of course, if the electrolyte is a liquid or gel, a seal is formed.
このシールは、その材質、ＥＣ素子の大きさやシールに
要求される強度によっても異なるが。This seal varies depending on its material, the size of the EC element, and the strength required for the seal.
通常硬化後で １〜２０ｍｍ程度とされればよく、１種
類のシール材のシールであってもよいし、２種類以上の
シール材を併用した２以上のシールとされてもよい、ま
た、その形成も、予めシール材を基板上に供給しておい
てもよいし、電解質を積層後シール材により周辺をシー
ルするようにしてもよい。Normally, the thickness after curing may be about 1 to 20 mm, and the seal may be made of one type of sealant, or may be a seal of two or more seals using two or more types of sealant. For formation, a sealing material may be supplied onto the substrate in advance, or the periphery may be sealed with a sealing material after the electrolyte is laminated.
シール材としては、エポキシ系接着剤のように５０〜２
００℃で熱圧着可能な接着性ポリマーあるいは光硬化型
接着剤等があり、硬化させられまたは未硬化で使用され
ればよい。As a sealing material, 50 to 2
There are adhesive polymers or photocurable adhesives that can be thermocompression bonded at 00°C, and they may be used in a cured or uncured state.
このような素材をペースト、フィルム状、繊維状、また
は溶融して、又はスクリーン印刷、ディスペンサー笠に
より基板に供給してシールとすればよい。Such a material may be applied to the substrate in the form of a paste, film, fiber, or melt, or by screen printing or a dispenser shade to form a seal.
更に、これらの材料にシランカップリング材や無機ある
いは有機のフィラー等を充填すれば接着力、ガス透過性
等の面でより良好な特性が得られる。Furthermore, if these materials are filled with a silane coupling agent, inorganic or organic filler, etc., better properties in terms of adhesive strength, gas permeability, etc. can be obtained.
さらに、例えばこの内側のシール材中にセル間隙を制御
するためのガラス繊維、プラスチック粒子、セラミック
粒子等のスペーサーを混入しておいてもよい。Furthermore, for example, a spacer such as glass fiber, plastic particles, ceramic particles, etc. may be mixed into the inner sealing material to control the cell gap.
このようにして製造されたＥＣ素子に必要に応じて、基
板の端部に焼成用導電性ペースト、導電性接着材金属層
または半田層を形成し、外部電源に接続するリード線を
半田付けし、端子用のリードを接続したり、さらに周辺
にブチルゴム、フッ素樹脂、エポキシ樹脂等の接着材に
よるシール材を設けたりしてもよい。If necessary, a conductive paste for firing, a conductive adhesive metal layer, or a solder layer is formed on the edge of the substrate of the EC device manufactured in this way, and a lead wire to be connected to an external power source is soldered. , leads for terminals may be connected, and a sealing material made of an adhesive such as butyl rubber, fluororesin, or epoxy resin may be provided around the periphery.
本発明のＥＣ素子は、特に透過型の調光素子に好適であ
り、両方の基板ともに溝を形成し、低抵抗導電層を形成
することにより、大きな面積であっても高速で応答する
ＥＣ素子を容易に製造することができる。この窓ガラス
等の調光用ＥＣ素子は、たとえ、線状や格子状に低抵抗
導電層が形成されていてもそれは網入ガラスや線入ガラ
スのように見えるのみであり、美観を損ねにくい。この
ため１本発明は、このような調光素子用に特に好適であ
る。The EC element of the present invention is particularly suitable for a transmission type light control element, and by forming grooves on both substrates and forming a low resistance conductive layer, the EC element can respond at high speed even in a large area. can be easily manufactured. Even if a low-resistance conductive layer is formed in the form of lines or grids, this EC element for dimming window glass, etc., will only look like wired glass or wired glass, and will not spoil the aesthetic appearance. . Therefore, the present invention is particularly suitable for such a light control element.
実施例を示し、更に詳細に説明する。Examples will be shown and explained in more detail.
［実施例］
実施例Ｉ
４００Ｘ ８００ｍｍのガラス基板に底辺が０．５ｍ
ｍ、深さ０．５ｍｎ＋の逆三角形状の溝をダイアモンド
砥石により１００ｍｍ間隔で８本形成した。この溝付き
の基板の溝に銀ペーストをスクリーン印刷により印刷し
、 ５１０℃で焼成して低抵抗導電層を形成した６次い
で、ＩＴＯ膜を面抵抗が１０Ω／口となるように蒸着し
て透明電極付きの基板を製造した。[Example] Example I 400 x 800 mm glass substrate with a base of 0.5 m
Eight inverted triangular grooves with a depth of 0.5 mm and a depth of 0.5 mm were formed using a diamond grindstone at intervals of 100 mm. Silver paste was screen-printed into the grooves of this grooved substrate and baked at 510°C to form a low-resistance conductive layer.6 Next, an ITO film was evaporated to have a sheet resistance of 10Ω/hole to make it transparent. A substrate with electrodes was manufactured.
このガラス基板のｌゴ０膜上に、ｌ？Ｌ ｖ４を４５０
ｎｍ蒸着して第１の基板を製造した。On the lgo0 film of this glass substrate, l? L v4 to 450
A first substrate was manufactured by vapor deposition.
次に、もう一方の基板として同じガラス基板のＩＴＯ膜
側の周辺にエチレン酢酸ビニル樹脂の巾約５ｍｍの枠状
のシール部を形成し、その堤の枠内に粒径的５０μｍの
ガラスピーズを徹布して第２の基板を製造した。Next, a frame-shaped seal portion of ethylene vinyl acetate resin with a width of about 5 mm is formed around the ITO film side of the same glass substrate as the other substrate, and glass beads with a particle size of 50 μm are placed within the frame of the bank. A second substrate was manufactured by thorough fabrication.
これら２つの基板の周辺には、あらかじめガラス基板を
側面に向って斜めに削って、その削り面に１′「０上に
銀ペーストを塗布し、これを焼成して外部電源と接続す
るための端子を形成しておいた。Around these two substrates, the glass substrate is shaved diagonally toward the side, a silver paste is applied to the shaved surface, and this is baked to connect it to an external power source. A terminal was formed.
ゲル状電解質溶液としては、脱気及び脱水した０、 ７
５Ｍ ／ １のＬｉｌ 、 Ｙ−ブチロラクトン５０ｍ
氾に脱水したポリビニルブチラール２５ｇとを窒素ガス
雰囲気中で溶解し、ゲル状電解質溶液を調合した。As a gel electrolyte solution, degassed and dehydrated 0,7
5M/1 Lil, Y-butyrolactone 50m
A gel electrolyte solution was prepared by dissolving 25 g of dehydrated polyvinyl butyral in a nitrogen gas atmosphere.
まず、第２の基板上に前記のようにして準備したゲル状
電解質溶液を周辺のシール部の部分にまでは完全には達
しない程度にその中央部付近に山状に供給した。First, the gel electrolyte solution prepared as described above was supplied onto the second substrate in a mountain shape near the center of the second substrate, but not completely reaching the peripheral seal portion.
次に、第１の基板をＷ０３０３Ｍ電解質溶液側を向くよ
うに第２の基板の上に離して配置し、減圧しながら第１
の基板を第２の基板側に下降させ、圧着した。この時、
シール部を１１０℃で１０分間加熱し、その後冷却して
両基板を接着した。Next, the first substrate is placed on top of the second substrate so as to face the W0303M electrolyte solution side, and while the pressure is reduced, the first substrate is
The substrate was lowered to the second substrate side and crimped. At this time,
The sealed portion was heated at 110° C. for 10 minutes, and then cooled to bond both substrates together.
次に、このＥＣ素子の周辺に形成されたＩＴＯ上の端子
に外部電源接続用にリード線をハンダ付けし、２次シー
ル材としてエポキシ、樹脂を付与して１次シール材のエ
チレン酢酸ビニル樹脂の枠状のシール部の周囲を密閉し
た。Next, lead wires are soldered to the terminals on the ITO formed around this EC element for external power connection, and epoxy and resin are applied as a secondary sealing material, and ethylene vinyl acetate resin is used as a primary sealing material. The area around the frame-shaped seal part was sealed.
このＥＣ素子は、生産性良く製造でき、信頼性も高く、
低抵抗導電層を設けなかったＥＣ素子に比して応答速度
が速いものであった。This EC element can be manufactured with high productivity and has high reliability.
The response speed was faster than that of an EC element not provided with a low-resistance conductive layer.
実施例２
第２の基板上に脱気及び脱水した０、 ７ＦＩＭ ／
ＡのＬｉｌ 、スルホラン５０ｍ Ａに脱水した２−ヒ
ドロキシエチルアクリレート２５ｇを供給し、その上に
第１の基板を端から順に重ね合せローラーにより圧着し
、紫外線を照射し電解質を硬化させるとともに２枚の基
板を接着した６次いで１周辺からはみだした電解質を除
去し、周辺をエポキシ樹脂で封止してＥＣ素子を製造し
た。Example 2 Degassed and dehydrated 0,7FIM/
25 g of dehydrated 2-hydroxyethyl acrylate is supplied to A, 50 m of sulfolane, and the first substrate is stacked on top of it from the edge and pressed with a roller. The electrolyte protruding from the periphery of the substrate was removed, and the periphery was sealed with epoxy resin to produce an EC device.
このＥＣ素子は、実施例１と同様の効果を有するととも
に、電解質が固体化されていて２枚の基板を接着してい
るため、風や人の衝突といった外圧によって破損しにく
く、たとえ破損しても基板や電解質が飛散するおそれが
少ないという特長を有していた。This EC element has the same effect as Example 1, and since the electrolyte is solidified and the two substrates are bonded together, it is difficult to be damaged by external pressure such as wind or human collision. It also had the advantage that there was little risk of the substrate or electrolyte scattering.
実施例３
溝を電極側でほぼ幅１ｏ＋＋ｍ 、反対側で０．Ｆｕｎ
ｍ 。Example 3 The width of the groove is approximately 1o++m on the electrode side and 0.0m on the opposite side. Fun
m.
深さ０．３■の逆台形に形成した外は実施例１と同様に
してＥＣ素子を製造した。このＥＣ素子は、実施例１と
同様の効果を有していた。An EC element was manufactured in the same manner as in Example 1 except that it was formed into an inverted trapezoid with a depth of 0.3 cm. This EC element had the same effect as Example 1.
実施例４
溝を電極側でほぼ幅ｌａｗ 、深さ０．５ｎ＋ｍ程度の
放物線に形成した外は実施例１と同様にし、てＥＣ素子
を製造した。このＥＣ素子は、実施例１と同様の効果を
有していた。Example 4 An EC element was manufactured in the same manner as in Example 1, except that the groove was formed on the electrode side into a parabolic shape with a width of approximately law and a depth of approximately 0.5 nm+m. This EC element had the same effect as Example 1.
実施例５
溝のパターンを１００ｎ＋ｍ角の格子状にした外は実施
例１と同様にしてＥＣ素子を製造した。このＥＣ素子は
、実施例１と同様の効果を有していた。Example 5 An EC element was manufactured in the same manner as in Example 1 except that the groove pattern was made into a lattice shape of 100n+m squares. This EC element had the same effect as Example 1.
実施例６
第１の基板の電極を幅約５０Ｘ ３００ｎｕａの１２個
のパターンに分割し、各パターン毎にコの字状の低抵抗
導電層を形成した外は実施例１と同様にしてＥＣ素子を
製造した。このＥＣ素子は、パターン毎の駆動が可能で
あり、実施例１と同様の効果を有していた。Example 6 An EC element was manufactured in the same manner as in Example 1, except that the electrodes on the first substrate were divided into 12 patterns with a width of approximately 50×300 nua, and a U-shaped low resistance conductive layer was formed for each pattern. was manufactured. This EC element could be driven pattern by pattern and had the same effect as Example 1.
実施例７
第２の基板の電極を窒化チタン、さらにその上にＩＴＯ
とした外は実施例１と同様にして調光鏡を製造した。こ
の調光鏡は、実施例１と同様の効果を有していた。Example 7 The electrode of the second substrate was made of titanium nitride, and ITO was further applied on top of it.
A photochromic mirror was manufactured in the same manner as in Example 1 except for the following. This light control mirror had the same effect as Example 1.
［発明の効果］
以上説明したように、本発明のＥＣ素子は見宋えを低下
させる低抵抗導電層の幅を狭くできるため、大面積のＥ
Ｃ素子であっても速い応答速度が得られる。[Effects of the Invention] As explained above, the EC element of the present invention can narrow the width of the low-resistance conductive layer that reduces the visibility, so
A fast response speed can be obtained even with a C element.
また、本発明では、この低抵抗導電層は基板中に埋設さ
れることとなるため、大型のＥＣ素子としても基板間で
の短絡のおそれが少なくなるという利点も有する。Further, in the present invention, since this low resistance conductive layer is buried in the substrate, there is also an advantage that there is less risk of short circuit between the substrates even in a large EC element.
また、低抵抗導電層を形成するために導電ベーストを使
用することにより、生産性がよく、溝に正確に埋設でき
るという利点も有する。Further, by using a conductive base to form a low resistance conductive layer, there is an advantage that productivity is good and it can be buried accurately in a groove.
本発明は、この外、本発明の効果を損しない範囲で種々
の応用が可能なものである。In addition to this, the present invention can be applied in various other ways as long as the effects of the present invention are not impaired.
第１図は１本発明のＥＣ素子の基本的例の断面図である
。
基板 ： ＩＡ、 ＩＢ
透明電極 ：ＺＡ
電極 ：２Ｂ
ＥＣ物質層 ＝ ３
溝 ： ４Ａ、４Ｂ低抵抗導
電層 ： ５Ａ、 ５Ｂ
電解質 ： ６
シール材 ＝ ７FIG. 1 is a sectional view of a basic example of an EC element according to the present invention. Substrate: IA, IB Transparent electrode: ZA Electrode: 2B EC material layer = 3 Groove: 4A, 4B Low resistance conductive layer: 5A, 5B Electrolyte: 6 Sealing material = 7
Claims (8)
とも一方の電極が透明電極とされ、少なくとも一方の電
極面上には更にＥＣ物質層が形成されたエレクトロクロ
ミック素子において、透明電極の形成される基板には溝
が形成され、該溝中に導電性材料による低抵抗導電層が
形成されていることを特徴とするエレクトロクロミック
素子。(1) In an electrochromic element in which at least one electrode of the first and second substrates having electrodes formed thereon is a transparent electrode, and an EC material layer is further formed on at least one electrode surface, the transparent electrode 1. An electrochromic device characterized in that a groove is formed in a substrate on which the element is formed, and a low resistance conductive layer made of a conductive material is formed in the groove.
ストを焼成することにより低抵抗導電層を形成した特許
請求の範囲第１項記載のエレクトロクロミック素子。(2) The electrochromic device according to claim 1, wherein the conductive material is a conductive paste, and the low resistance conductive layer is formed by firing the conductive paste.
特許請求の範囲第２項記載のエレクトロクロミック素子
。(3) The electrochromic device according to claim 2, wherein the conductive paste is supplied onto the substrate by printing.
供給される特許請求の範囲第３項記載のエレクトロクロ
ミック素子。(4) The electrochromic device according to claim 3, wherein the conductive paste is applied onto the substrate by screen printing.
られる特許請求の範囲第１項〜第４項のいずれか一項記
載のエレクトロクロミック素子。(5) The electrochromic device according to any one of claims 1 to 4, wherein the substrate is a glass substrate, and a groove is cut by a cutting means.
ような形状にされている特許請求の範囲第１項〜第５項
のいずれか一項記載のエレクトロクロミック素子。(6) The electrochromic device according to any one of claims 1 to 5, wherein the groove has a cross-sectional shape in which the width decreases as the groove becomes deeper.
許請求の範囲第１項〜第６項のいずれか一項記載のエレ
クトロクロミック素子。(7) The electrochromic device according to any one of claims 1 to 6, which is used for dimming and has electrodes formed on the entire surface of the substrate.
基板に溝と低抵抗導電層が形成されている特許請求の範
囲第７項記載のエレクトロクロミック素子。(8) The electrochromic device according to claim 7, wherein transparent electrodes are formed on both substrates, and grooves and low resistance conductive layers are formed on both substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30552686A JPS63158528A (en) | 1986-12-23 | 1986-12-23 | Electrochromic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30552686A JPS63158528A (en) | 1986-12-23 | 1986-12-23 | Electrochromic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63158528A true JPS63158528A (en) | 1988-07-01 |
Family
ID=17946207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30552686A Pending JPS63158528A (en) | 1986-12-23 | 1986-12-23 | Electrochromic element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63158528A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011145590A (en) * | 2010-01-18 | 2011-07-28 | Konica Minolta Holdings Inc | Electrochemical display panel and method for manufacturing electrochemical display panel |
| US8278722B2 (en) | 2003-11-27 | 2012-10-02 | Samsung Display Co., Ltd. | Flat panel display device |
| JP2016133648A (en) * | 2015-01-20 | 2016-07-25 | 株式会社リコー | Electrochromic device and manufacturing method thereof |
| US9869918B2 (en) | 2015-01-16 | 2018-01-16 | Ricoh Company, Ltd. | Electrochromic apparatus, electrochromic element, and method of manufacturing electrochromic element |
-
1986
- 1986-12-23 JP JP30552686A patent/JPS63158528A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8278722B2 (en) | 2003-11-27 | 2012-10-02 | Samsung Display Co., Ltd. | Flat panel display device |
| JP2011145590A (en) * | 2010-01-18 | 2011-07-28 | Konica Minolta Holdings Inc | Electrochemical display panel and method for manufacturing electrochemical display panel |
| US9869918B2 (en) | 2015-01-16 | 2018-01-16 | Ricoh Company, Ltd. | Electrochromic apparatus, electrochromic element, and method of manufacturing electrochromic element |
| JP2016133648A (en) * | 2015-01-20 | 2016-07-25 | 株式会社リコー | Electrochromic device and manufacturing method thereof |
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