JPS63157951U - - Google Patents

Info

Publication number
JPS63157951U
JPS63157951U JP5003487U JP5003487U JPS63157951U JP S63157951 U JPS63157951 U JP S63157951U JP 5003487 U JP5003487 U JP 5003487U JP 5003487 U JP5003487 U JP 5003487U JP S63157951 U JPS63157951 U JP S63157951U
Authority
JP
Japan
Prior art keywords
lead wire
electronic component
welding
electronic components
solder portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5003487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5003487U priority Critical patent/JPS63157951U/ja
Publication of JPS63157951U publication Critical patent/JPS63157951U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を説明するための図
であつて、そのＡは電子部品の一部分を示し、Ｂ
及びＣはその接続構造を示す。また第２図は本考
案の他の一実施例を示し、第３図は従来例を示す
図である。 １，１′，２，２′……電子部品、１ａ，２ａ
，４，４′，４″……リード線、５，５′，５″
……半田付部。 FIG. 1 is a diagram for explaining one embodiment of the present invention, in which A shows a part of the electronic component and B
and C indicate its connection structure. Further, FIG. 2 shows another embodiment of the present invention, and FIG. 3 shows a conventional example. 1, 1', 2, 2'...electronic parts, 1a, 2a
, 4, 4', 4''...Lead wire, 5, 5', 5''
...Soldering part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の電子部品のリード線同士を接続し、更に
別のリード線を前記リード線に接続してなる電子
部品において、前記電子部品の内の所定のリード
線同士を交差させて溶接してなる溶接部と、該溶
接部に別のリード線をからめて半田付けしてなる
半田部とを重畳してなる接続構造を備えたことを
特徴とする電子部品。 In an electronic component in which lead wires of a plurality of electronic components are connected to each other and another lead wire is connected to the lead wire, welding is performed by crossing and welding predetermined lead wires of the electronic components. What is claimed is: 1. An electronic component comprising a connection structure formed by overlapping a solder portion formed by intertwining another lead wire with the weld portion and soldering the solder portion.
JP5003487U 1987-04-02 1987-04-02 Pending JPS63157951U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5003487U JPS63157951U (en) 1987-04-02 1987-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5003487U JPS63157951U (en) 1987-04-02 1987-04-02

Publications (1)

Publication Number Publication Date
JPS63157951U true JPS63157951U (en) 1988-10-17

Family

ID=30873018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5003487U Pending JPS63157951U (en) 1987-04-02 1987-04-02

Country Status (1)

Country Link
JP (1) JPS63157951U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51144984A (en) * 1975-06-06 1976-12-13 Matsushita Electric Ind Co Ltd Connecting method of terminal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51144984A (en) * 1975-06-06 1976-12-13 Matsushita Electric Ind Co Ltd Connecting method of terminal

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