JPS63153839A - Rotary holding device for substrate - Google Patents
Rotary holding device for substrateInfo
- Publication number
- JPS63153839A JPS63153839A JP61285752A JP28575286A JPS63153839A JP S63153839 A JPS63153839 A JP S63153839A JP 61285752 A JP61285752 A JP 61285752A JP 28575286 A JP28575286 A JP 28575286A JP S63153839 A JPS63153839 A JP S63153839A
- Authority
- JP
- Japan
- Prior art keywords
- movable
- claw
- substrate
- pawl
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 210000000078 claw Anatomy 0.000 claims description 133
- 239000000428 dust Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 25
- 238000004381 surface treatment Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体基板や液晶用又はフォトヤスク用ガラス
基板等の薄板状基板（以下クエハと称す）を１枚ずつ順
次水平に保持し、クエハを回転させながら、該クエハの
表面に所要の表面処理液を供給し、表面処理を行う装置
に用いられ特にフェノ１を、回転させながら水平に保持
する装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention involves sequentially holding thin plate-shaped substrates (hereinafter referred to as wafers) horizontally one by one, such as semiconductor substrates, glass substrates for liquid crystals, or photo yasks, and holding the wafers horizontally one by one. The present invention relates to a device that is used for surface treatment by supplying a required surface treatment liquid to the surface of the phenol while rotating it, and particularly relates to a device that holds the phenol horizontally while rotating it.
一般に基板の回転保持装置としては大別してクエハの片
面を真空吸着する真空チャック方式のもの、あるいは、
クエハの外縁を３本以上の挾持爪で挾持するグリップチ
ャック方式のものがある。In general, substrate rotation and holding devices can be roughly divided into vacuum chuck type devices that vacuum suck one side of a wafer, and
There is a grip chuck type in which the outer edge of the wafer is clamped with three or more clamping claws.
前者は基板の一面しか処理できないことから、クエハの
両面を処理する場合には専ら後者のグリップチャック方
式のものが用いられる。Since the former can only process one side of the substrate, the latter grip chuck type is used exclusively when processing both sides of the wafer.
このグリップチャック方式による回転保持装置としては
、従来より例えば特開昭５７−２０７５７１号公報に開
示されたものが知られている。そこには、基板処理装置
の処理室内へ回転軸を突入させて設け、その回転軸の突
入側の一端部に設けた回転台に３本の可動爪を設け、こ
れらの各可動爪に直接付勢バネを張設して各可動爪を基
板挾持側へ弾圧付勢するようＫし、かつ可動爪を基板解
放側へ解除する可動爪解除手段を可動爪に近接配置して
構成したものが開示されている。As a rotary holding device using the grip chuck method, one disclosed in, for example, Japanese Unexamined Patent Publication No. 57-207571 is known. There, a rotating shaft is installed to protrude into the processing chamber of the substrate processing equipment, three movable claws are provided on a rotating table provided at one end of the rotating shaft on the protruding side, and a device is attached directly to each of these movable claws. Disclosed is a structure in which a biasing spring is tensioned to bias each movable claw toward the substrate holding side, and movable claw release means for releasing the movable claw toward the substrate release side is disposed close to the movable claw. has been done.
（発明が解決しようとする問題点）
上記従来装置は各々の可動爪にそれぞれ付勢バネを作用
させていることから、クエハを確実に保持することがで
きる点で秀れてはいるが、なお以下の問題点を伐してい
る。(Problems to be Solved by the Invention) The above-mentioned conventional device has a biasing spring acting on each movable claw, so it is excellent in that it can securely hold the quefer. The following problems have been resolved.
即ち、付勢バネや可動爪解除手段が基板処理装置の処理
室内に臨ませた状態、あるいは処理室内の雰囲気の影響
を受は易い状態で配置構成されていることから、腐食性
の強い表面処理液を使用する場合には、付勢バネが腐食
され塵埃を発生し、それがクエハに付着して歩留りを低
下させたり、可動爪解除手段等の耐久性を低下させる等
の問題があった。In other words, since the biasing spring and the movable claw release means are arranged so as to face the processing chamber of the substrate processing apparatus, or to be easily affected by the atmosphere inside the processing chamber, highly corrosive surface treatment is required. When a liquid is used, there are problems such as corrosion of the biasing spring and generation of dust, which adheres to the wafer and reduces the yield, and reduces the durability of the movable claw release means and the like.
本発明はこのような問題点を解決することを技術的課題
とする。The technical objective of the present invention is to solve such problems.
（問題点を解決するための手段）
上記問題点を解決するために本発明に係る基板の回転保
持装置は次のように構成される。(Means for Solving the Problems) In order to solve the above problems, a substrate rotation holding device according to the present invention is configured as follows.
即ち、基板処理装置の処理室内へ突設させて回転可能に
設けた回転軸と、回転軸の突投側一端部に設けた回転板
と、回転板に配設され基板の外縁を挾持する少なくとも
３個以上の挾持爪と、これらの挾持爪のうち少なくとも
１以上のものを可動爪とし、可動爪を基板挾持側へ押圧
付勢するように設けた付勢手段と、可動爪を付勢手段に
抗して基板解放側へ解除するように設けた可動爪解除手
段とを備えて成る基板の回転保持装置において、回転軸
を筒状回転軸で形成し、筒状回転軸内に相対回転又は相
対移動可能に爪駆動軸を貫通して設け、爪駆動軸の突設
側一端部を可動爪操作リンクを介して可動爪と連結し、
それぞれ筒状回転軸と爪駆動軸の他端側同士を付勢手段
で掛止するとともに、当該付勢手段に対向して設けられ
た可動爪解除手段により爪駆動軸を介して基板を挾持・
解放するように構成したことを特徴とするものである。That is, a rotary shaft that is rotatably protruded into the processing chamber of the substrate processing apparatus, a rotary plate provided at one end of the rotary shaft on the projecting side, and at least one rotary plate that is disposed on the rotary plate and that grips the outer edge of the substrate. three or more clamping claws, at least one of these clamping claws being a movable claw, a biasing means provided to press and bias the movable claws toward the substrate clamping side, and a biasing means for the movable claws. In the substrate rotation holding device, the rotation shaft is formed of a cylindrical rotation shaft, and the rotation shaft is formed with a cylindrical rotation shaft, and a relative rotation or The pawl drive shaft is provided so as to be relatively movable through the pawl drive shaft, and one end of the protruding side of the pawl drive shaft is connected to the movable pawl via a movable pawl operation link.
The other end sides of the cylindrical rotating shaft and the claw drive shaft are respectively latched together by a biasing means, and the substrate is clamped via the claw drive shaft by a movable claw release means provided opposite to the biasing means.
It is characterized by being configured so that it can be released.
（作用）
可動爪を基板挾持側へ押圧付勢するための付勢バネはそ
れぞれ筒状の回転軸と爪駆動軸の他端側同士に掛止され
、またこの付勢バネに抗して可動爪を基板解放側へ解除
するための可動爪解除手段は、この付勢バネに・対向し
て設けてあり、可動爪解除手段で爪駆動軸を筒状回転軸
に対して相対回動又は相対移動することにより、処理室
内側の回転台に設けられた可動爪を可動爪操作リンクを
介して操作し、クエハを挾持爪で挾持・解放することが
できる。つまり、上記付勢バネと可動爪解除手段はいず
れも処理室内より隔離した状態で配置構成されており、
処理液等による悪影響を排除することができる。(Function) A biasing spring for pressing and biasing the movable claw toward the substrate holding side is hooked to the other end of the cylindrical rotating shaft and the claw drive shaft, and is movable against the biasing spring. A movable claw release means for releasing the claw toward the substrate release side is provided opposite to this biasing spring, and the movable claw release means rotates the claw drive shaft relative to the cylindrical rotating shaft. By moving, the movable claws provided on the rotating table inside the processing chamber can be operated via the movable claw operation link, and the quefer can be held and released by the holding claws. In other words, both the biasing spring and the movable claw release means are arranged and configured to be isolated from the processing chamber.
It is possible to eliminate adverse effects caused by processing liquid and the like.
（実施例）
第１図は本発明に係る回転保持装置の第１の実施例を示
す縦断面図、第２図はその平面図である。(Embodiment) FIG. 1 is a longitudinal sectional view showing a first embodiment of a rotation holding device according to the present invention, and FIG. 2 is a plan view thereof.
この回転保持装置は基板処理装置の処理室を区画形成す
るカップ２１内へ突設させて回転可能に設けた回転軸６
と、回転軸６の突設側一端部に設けた回転板２と、回転
板２上に回転軸対称に配設され、クエハＷの外縁を挾持
する４個の挾持爪１・１・・・と、これらの挾持爪のう
ち相対向するものの一方を可動爪１ａとし、可動爪１ａ
を基板挾持側へ押圧付勢するように設けた付勢バネ１５
と、付勢バネ１５に抗して可動爪１ａを基板解放側へ解
除するように設けた可動爪解除手段３０とを備えて成る
。This rotation holding device has a rotary shaft 6 rotatably protruding into a cup 21 that partitions and forms a processing chamber of a substrate processing apparatus.
, a rotary plate 2 provided on one end of the protruding side of the rotary shaft 6, and four clamping claws 1, 1, which are disposed symmetrically with the rotational axis on the rotary plate 2 and clamp the outer edge of the quefer W. One of these clamping claws that faces each other is defined as the movable claw 1a, and the movable claw 1a
A biasing spring 15 provided to press and bias the board toward the board holding side.
and a movable claw release means 30 provided to release the movable claw 1a toward the substrate release side against the biasing spring 15.
回転板２は、回転軸６の突設側一部に固定した回転ヘッ
ド２Ａにボルト２４によって着脱可能に水平に固定され
、クエハの寸法に応じて交換することができるようにな
っている。そしてこの回転板２には４つのアーム２ａ・
２ａ・・・が放射状に延出して形成され、上記４個の挾
持爪のうち、２本が固定爪としてアーム２ａの先端部に
立設され、他の２本が可動爪１ａ・１ａとしてアーム２
ａに沿って水平方向へ摺動自在に設けられたスライダ３
に立設されている。なお符号２８はスライダ３とはソ同
−形状・同一重量となるように形成され、回転軸対称の
位置でアームに沿って摺動自在に設けられたバランサで
あり、後述する可動爪操作リンク４によってスライダ３
と連結されている。The rotary plate 2 is removably fixed horizontally to a rotary head 2A fixed to a part of the protruding side of the rotary shaft 6 by means of bolts 24, and can be replaced according to the dimensions of the quefer. This rotary plate 2 has four arms 2a,
2a... are formed extending radially, and of the four clamping claws, two are erected at the tip of the arm 2a as fixed claws, and the other two are movable claws 1a and 1a on the arm. 2
A slider 3 provided so as to be slidable in the horizontal direction along a
It is erected in Reference numeral 28 is a balancer that is formed to have the same shape and weight as the slider 3, and is slidably provided along the arm at a position symmetrical to the rotational axis, and is connected to the movable claw operation link 4, which will be described later. by slider 3
is connected to.
回転軸６は、筒状の回転軸で形成され、この筒状回転軸
６内に相対回転可能に爪駆動軸５を貫通して設けである
。そしてこの筒状回転軸６は基台３１に軸受２５により
回転自在に軸支され、同様に基台３１に設けられた駆動
モータ１２によってベルト１１、プーリ７を介して回転
駆動されるようＫなっている。The rotating shaft 6 is formed as a cylindrical rotating shaft, and is provided so as to pass through the claw drive shaft 5 so as to be relatively rotatable within the cylindrical rotating shaft 6. The cylindrical rotating shaft 6 is rotatably supported by a bearing 25 on a base 31, and is driven to rotate via a belt 11 and a pulley 7 by a drive motor 12, which is also provided on the base 31. ing.
また、この筒状回転軸６は回転位置検出手段（１０，２
６）で停止位置を検出した後、クランプ装置（８・９）
でクランプするよう忙なっている。Further, this cylindrical rotating shaft 6 has rotational position detecting means (10, 2
After detecting the stop position in 6), the clamp device (8/9)
I'm busy trying to clamp it.
即ち、回転位置検出手段（１０，２６）Ｈ回転軸の下部
に固定され、回転軸６のクランプ位置を読み取るための
切り欠きを有する円板１０と、この円板１０の切り欠き
を検出する光電センサ２６とから成り、クランプ装置（
８・９）ｌ／ｉ回転軸６に固定された７ランジ８と、こ
の７ランジ８に対応させて基台５１に設けたシリング９
とから成る。こるようになっている。That is, the rotational position detection means (10, 26) H is fixed to the lower part of the rotating shaft, and includes a disc 10 having a notch for reading the clamping position of the rotating shaft 6, and a photoelectric sensor for detecting the notch in the disc 10. It consists of a sensor 26 and a clamping device (
8/9) 7 langes 8 fixed to the l/i rotation shaft 6 and a sill 9 provided on the base 51 in correspondence with the 7 langes 8
It consists of It's starting to get worse.
一方、爪駆動軸５の上端部には前記した可動爪操作リン
ク４のはソ中央部が当該爪駆動軸５の回転中心から偏心
させた状態で連結されており、筒状口＠＠６と爪駆動軸
５とを相対的に回転させることにより可動爪１ａを操作
するようになっている。On the other hand, the above-mentioned movable claw operation link 4 is connected to the upper end of the claw drive shaft 5 in a state where the central part thereof is eccentric from the rotation center of the claw drive shaft 5, and the cylindrical opening @@6 is connected to the upper end of the claw drive shaft 5. The movable claw 1a is operated by rotating the claw drive shaft 5 relative to the movable claw 1a.
また、爪駆動軸５の下端部と、筒状回転軸６とるように
付勢されている。即ち、引張バネ１！Ｍ：を筒状回転軸
６の下端に設けた７ランジ１３から下向きに突出したビ
ン１４と、爪駆動軸５の下部に突設じたビン１７とに掛
止されており、この引張バネ１５の付勢力は７ランジ１
３の取付位置を変更してビン１４とビン１７の間隔を調
整することにより調節することができる。なお爪駆動軸
５の下端には、さらにもう一本のビン１６が突設されて
おり、挾持爪でクエハＷを挾持しない場合にはこのビン
１６が７ランジ１３のビン１４に当接しの挾持を検出す
るようにしてもよい。Further, the lower end of the pawl drive shaft 5 and the cylindrical rotating shaft 6 are biased together. That is, tension spring 1! The tension spring 15 The biasing force is 7 lunge 1
The distance between the bins 14 and 17 can be adjusted by changing the mounting position of the bins 3 and 3 and adjusting the distance between the bins 14 and 17. Furthermore, another bottle 16 is protruded from the lower end of the claw drive shaft 5, and when the clamping claws are not used to clamp the quefer W, this bottle 16 comes into contact with the bin 14 of the 7-lunge 13 and is not clamped. may be detected.
可動爪解除手段３０は、基台３１に設けられたエアシリ
ング３０で構成され、このエアシリンダ３０の出力ロッ
ト３０ａが引張バネ１５の一端を係止しているビン１７
に対向するように配置されており、引張バネ１５の寸勢
力に抗してビン１７を二点鎖線で示す位置まで押し回す
こと（でよって爪駆動軸５を反時計回り方向へ回転する
ように構成されている。このエアシリンダ３０の解除動
作に連動して爪駆動軸５及び爪操作リンク４を介してス
ライダ３に立設した可動爪１ａを、第２図の二点鎖線で
示す解除位置まで移動するようになっている。The movable claw release means 30 is composed of an air cylinder 30 provided on a base 31, and the output rod 30a of this air cylinder 30 is connected to the bottle 17 which locks one end of the tension spring 15.
The pin 17 is pushed around against the force of the tension spring 15 to the position shown by the two-dot chain line (thereby rotating the pawl drive shaft 5 counterclockwise). In conjunction with the release operation of the air cylinder 30, the movable claw 1a, which is erected on the slider 3 via the claw drive shaft 5 and the claw operation link 4, is moved to the release position shown by the two-dot chain line in FIG. It is designed to move up to.
上記の回転保持装置を支持する基台３１は、ガイド１９
・１９′に洛って昇降可能に投けられ、昇降シリンダ１
日によって昇降駆動するようになっており、昇降シリン
ダ１８を伸長作動することにより、挾持爪部分が第１図
の仮想線で示すようにカップ２１より上方に上昇し、ク
エハＷの着脱交換が可能となる。The base 31 supporting the rotation holding device described above includes the guide 19
・It is placed in the position 19' so that it can be raised and lowered, and the lifting cylinder 1
It is designed to move up and down depending on the day, and by extending and operating the lifting cylinder 18, the clamping claw portion rises above the cup 21 as shown by the imaginary line in Fig. 1, making it possible to attach and detach the Kueha W. becomes.
なお符号２３１１−を基板搬送装置（図示せず）のウェ
ハ搬送用アーム、２０ＩＩｉカツプ２１の内壁に設けら
れクエハＷの下面へ処理液を供給するノズル、２２ＪＩ
ｉ回伝ヘッド２Ａの上方に水平移動可能に吊設されてい
る処理液供給ノズルであり、ノズル２０・２２には図示
しない処理液供給手段が接続されており、処理液をクエ
ハＷの表面及び裏面に供給することができるように構成
されている。又必要なら、爪駆動軸５内に処理液供給路
を貫通形成して上端にノズルを設はクエハＷの裏面に処
理液を供給するようＫしてもよい。The reference numeral 2311- is a wafer transfer arm of a substrate transfer device (not shown), a nozzle provided on the inner wall of the 20IIi cup 21 and supplying a processing liquid to the lower surface of the wafer W, and 22JI.
This is a processing liquid supply nozzle that is horizontally movably suspended above the i-transmission head 2A. A processing liquid supply means (not shown) is connected to the nozzles 20 and 22, and the processing liquid is supplied to the surface of the wafer W and It is configured so that it can be supplied to the back side. If necessary, a processing liquid supply path may be formed through the claw drive shaft 5 and a nozzle may be provided at the upper end to supply the processing liquid to the back surface of the wafer W.
次に、本実施例におけるクエハの保持動作について説明
する。Next, the holding operation of the quefer in this embodiment will be explained.
図示しない所定位置であらかじめプリアライメントされ
たクエハＷは、搬送アーム２３によって、カップ２１の
上方に移動せしめられる。The wafer W, which has been pre-aligned in advance at a predetermined position (not shown), is moved above the cup 21 by the transport arm 23.
一方、回転軸６は、位置決め用円板１０と光電センサ２
６によって粗位置決めされて停止し、次に１シリンダ９
のロッドの先端を７ランジ８の凹部に嵌入させることに
より、正確に位置決めされ、固定される。On the other hand, the rotating shaft 6 is connected to the positioning disk 10 and the photoelectric sensor 2.
Roughly positioned and stopped by 6, then 1 cylinder 9
By fitting the tip of the rod into the recess of the 7 flange 8, it is accurately positioned and fixed.
しかる後、エアシリンダ３０を作動させることにより引
張バネ１５の付勢力に抗してビン１７を押圧し、軸５を
回転軸６に対し、相対的に所定量回転すること忙よりス
ライダ３を第２図に示す実線位置から二点鎖線位置へ摺
動させ、搬送アーム２３に近い２個の挾持爪１の間隔を
開いた状態にする。Thereafter, by operating the air cylinder 30, the bottle 17 is pressed against the biasing force of the tension spring 15, and the slider 3 is rotated by a predetermined amount relative to the rotating shaft 6. It is slid from the solid line position shown in FIG. 2 to the two-dot chain line position to open the gap between the two gripping claws 1 near the transfer arm 23.
次に昇降シリング１Ｂを伸長作動させることにより、基
台３１を上昇させ、挾持爪１を第１図に示す実線位置か
ら二点鎖線位置へ上昇させ、挾持爪１の凹部２７が搬送
アーム２３に保持されたクエハＷと同じ高さになるよう
にする。Next, by extending the elevating sill 1B, the base 31 is raised, and the clamping claw 1 is raised from the solid line position shown in FIG. Make it the same height as the held Kueha W.
次にシリンダ３０を収縮作動してそのロッドを縮め、引
張バネ１５の付勢力を軸５と、回転軸６間に作用させ、
スライダ３を第２図に示す二点鎖線位置から実線位置へ
摺動させ、挾持爪１の凹部２７によってクエハＷを挾持
する。このとき、ビン１６がビン１４に当接しているか
否かを険知するセンサ（図示せず）を設けた場合には挾
持爪がクエハＷを挾持したか否かをオペレークが確認す
ることもできる。Next, the cylinder 30 is contracted to shorten its rod, and the biasing force of the tension spring 15 is applied between the shaft 5 and the rotating shaft 6,
The slider 3 is slid from the two-dot chain line position to the solid line position shown in FIG. At this time, if a sensor (not shown) is provided to detect whether or not the bottle 16 is in contact with the bottle 14, the operator can confirm whether or not the clamping claws have clamped the quefer W. .
次に挾持爪１をエアシリンダ１８によりさらに上昇させ
ることにより該搬送アームとクエハＷの裏面間にスペー
スを与えアーム２３を、クエハＷの下面より退去させた
後、昇降シリング１８を収縮作動すると基台３１ｔ／ｉ
下降し、クエハＷは第１図に示す二点鎖線位置から実線
位置へ下降してカップ２１内に収容される。Next, the clamping claw 1 is further raised by the air cylinder 18 to create a space between the transfer arm and the back surface of the wafer W, and the arm 23 is moved away from the bottom surface of the wafer W, and then the elevating cylinder 18 is retracted. 31t/i
The quefer W is lowered from the two-dot chain line position shown in FIG. 1 to the solid line position, and is housed in the cup 21.
しかる後、シリンダ９を収縮作動することにより、その
出力ロットとフランジ８の凹部との保合を解除し、回転
軸６を回転自在として、モーター１２を駆動させ、回転
軸６を回転させる。この時、軸５は、バネ１５により回
転軸６と連結されているため、回転軸６と一体に回転す
る。すなわちクエハＷは挾持爪１により水平に挾持され
た状態で回転する。Thereafter, by contracting the cylinder 9, the engagement between the output rod and the concave portion of the flange 8 is released, the rotary shaft 6 is made rotatable, the motor 12 is driven, and the rotary shaft 6 is rotated. At this time, since the shaft 5 is connected to the rotating shaft 6 by the spring 15, it rotates together with the rotating shaft 6. That is, the quefer W rotates while being held horizontally by the holding claws 1.
そこでクエハＷの表面にエツチング液、現像液、又は洗
浄液等の所要の表面処理液をクエハＷの中央部まで移動
せしめられたノズル２２より供給し、クエへ表面を処理
する。この時、必要πより、カップ２１の内壁に設けら
れたノズル２０からクエハＷの裏面にも表面処理液を供
給し、裏面も同時に表面処理を行うことも可能である。Therefore, a required surface treatment liquid such as an etching solution, a developing solution, or a cleaning solution is supplied to the surface of the wafer W from the nozzle 22 moved to the center of the wafer W to treat the surface of the wafer. At this time, depending on the necessity π, it is also possible to supply the surface treatment liquid to the back surface of the wafer W from the nozzle 20 provided on the inner wall of the cup 21 to perform surface treatment on the back surface at the same time.
この回転中、スライダ３に生じる遠心力は、対称位置に
配置されたバランサ２日により平衡状急となり、バネ１
５の負荷が変動を生じることはなく、安定してクエハＷ
を回転させることができる。During this rotation, the centrifugal force generated on the slider 3 becomes sharply balanced due to the balancer 2 placed at a symmetrical position, and the
5 load does not cause fluctuations and is stable.
can be rotated.
以上のようにして所要の表面処理が終了すると、位置決
め用円板１０の切り欠き部と、光電センサ２６とが対向
する位置にて、回転軸６を停止させ、シリンダ９を作動
させてそのロッドを７ランジ８の凹部と係合させること
により正確に位置決めされる。When the required surface treatment is completed as described above, the rotary shaft 6 is stopped at a position where the notch of the positioning disk 10 and the photoelectric sensor 26 face each other, and the cylinder 9 is activated to connect the rod. 7 and the recessed portion of the flange 8, the position is accurately determined.
次にシリンダ１８を作動させることＫよりクエハＷを上
昇させた後、搬送アーム２３をクエハ下部に挿入し、さ
らに、シリンダ３０を作動させることにより搬送アーム
に対向する挾持爪１の間隔を開き、クエハＷを搬送アー
ム２３の上に載置する。Next, by activating the cylinder 18, the wafer W is raised by K, and the transport arm 23 is inserted into the lower part of the wafer.Furthermore, by activating the cylinder 30, the gap between the clamping claws 1 facing the transport arm is opened. The quefer W is placed on the transport arm 23.
このようにして、搬送アーム２３によって１枚ずつ搬送
されてくるクエハＷを保持し、所要の表面処理を行なう
ことができる。In this way, the wafers W transported one by one by the transport arm 23 can be held and the required surface treatment can be performed.
第３図は本発明に係る回転保持装置の第２の実施例を示
す縦断面図、第４図はその平面図である。FIG. 3 is a longitudinal sectional view showing a second embodiment of the rotation holding device according to the present invention, and FIG. 4 is a plan view thereof.
これらの図において第１図及び第２図に示した同一部材
は同一符号で表わす。In these figures, the same members shown in FIGS. 1 and 2 are designated by the same reference numerals.
仮想線で示す符号３５・３５′は基板搬送用の一対の無
端ベルトであり、この搬送ベルト３５・３５′は、カッ
プ２１内に配置され図示を省略したプーリに張設されて
おり、一方力ツブ２１には搬送ベルト３５・３５′に対
応させて図示を省略したクエハ搬入・搬出口が開口され
、この出入口には扉が開閉自在に設けられている。Symbols 35 and 35' indicated by imaginary lines are a pair of endless belts for conveying the substrate, and these conveyor belts 35 and 35' are placed in the cup 21 and stretched around pulleys (not shown), and one side is The knob 21 has an opening for loading and unloading wafers (not shown) corresponding to the conveyor belts 35 and 35', and a door is provided at this entrance so that it can be opened and closed.
この第２の実施例においては、以下に述べる点が上記第
１の実施例と異なる。This second embodiment differs from the first embodiment in the following points.
４本の挾持爪３６・３６′・３８・３８′のうち１木の
挾持爪３６が可動爪としてスライダ３に立設され、他の
挾持爪３６′・３８・３８′は回転板２のアーム２ａに
立設されている。これらの挾持爪３６・３６′・３８・
３８′のうちクエハＷの搬入方向（第４図矢印Ｂ）から
見て手前側に配設された挾持爪３６・３６′は後方側に
配設された挾持爪３日・３８′よりも背丈が低くなって
おり、後方側の挾持爪３８・３８′ハ位置決めピンとし
て機能する。Among the four clamping claws 36, 36', 38, and 38', one wooden clamping claw 36 is installed upright on the slider 3 as a movable claw, and the other clamping claws 36', 38, and 38' are attached to the arm of the rotating plate 2. It is erected at 2a. These clamping claws 36, 36', 38,
Of the 38', the clamping claws 36 and 36' that are arranged on the front side when viewed from the loading direction of the Kueha W (arrow B in Figure 4) are taller than the clamping claws 3 and 38' that are arranged on the rear side. The gripping claws 38 and 38' on the rear side function as positioning pins.
また、これらの挾持爪の内径側には、挾持爪３６・３６
′よりもさらに背丈の低いフェノ１載置ビン３７・３７
・・・が配設され、そのうちの１木３７ａはスライダ３
に立設されている。In addition, on the inner diameter side of these clamping claws, clamping claws 36, 36 are provided.
'Feno 1 mounting bin 37, 37 which is even shorter than '
... are arranged, and one of them, 37a, is the slider 3.
It is erected in
したがって、一対の無端ベルト３５・３５′によって挾
持爪３６・３６′の□上方を水平搬送されてきたクエハ
Ｗけ、挾持爪３８・３８′に当接して位置決めされ、次
に回転軸６を第３図の二点鎖線位置まで上昇させること
により、クエハＷを無端ベルト３５・３５′からクエハ
載置ビン３７・３７′上に移載するとともに、下記の可
動爪解除手段４１が非作動状態となり、クエハＷを挾持
爪３６・３６′・３日・３８′で挾持することができる
。Therefore, the wafer W, which has been horizontally conveyed above the clamping claws 36, 36' by the pair of endless belts 35, 35', is positioned by coming into contact with the clamping claws 38, 38', and then the rotating shaft 6 is By raising it to the position indicated by the two-dot chain line in Fig. 3, the Kueha W is transferred from the endless belts 35, 35' onto the Kueha loading bins 37, 37', and the movable claw release means 41 described below becomes inactive. , the Kueha W can be held by the holding claws 36, 36', 3 days, and 38'.
可動爪解除手段４１は、第５図又は第６図に示すように
カム４１によって構成される。The movable claw release means 41 is constituted by a cam 41 as shown in FIG. 5 or 6.
すなわち図中、爪駆動軸５に立設したビン１７に、回転
自在なロール４２を付設するとともに、回転軸６が下降
したとき、このロール４２と係合するカム４１を軸５の
下端の下方に配設しておくと、回転軸６の下降に伴いロ
ール４２はバネ１５の付勢力に抗して軸５を回転軸６に
対して相対的に回転させ、第４図に示すスライダ３を摺
動させて挾持爪３６・３８′の間隔を開く一方、逆に回
転軸６が上昇すると、ロール４２Ｆｉカム４１と離れ、
バネ１５の付勢力が爪駆動軸５に加わり、第４図に示す
如く、リンク４を介して、スライダ３を回転中心方向へ
摺動させるため、クエハＷは、挾持爪３６・３８にて挾
持される。That is, in the figure, a freely rotatable roll 42 is attached to the bin 17 installed vertically on the claw drive shaft 5, and a cam 41 that engages with this roll 42 is moved below the lower end of the shaft 5 when the rotating shaft 6 is lowered. 4, the roll 42 rotates the shaft 5 relative to the rotation shaft 6 against the urging force of the spring 15 as the rotation shaft 6 descends, and the slider 3 shown in FIG. While sliding opens the gap between the clamping claws 36 and 38', conversely, when the rotating shaft 6 rises, the roll 42 separates from the Fi cam 41,
The biasing force of the spring 15 is applied to the pawl drive shaft 5, and as shown in FIG. be done.
なお、上記した実施例では、いずれもアーム２ａを４本
配設したものについて記述したが少なくとも３本等間隔
で配設しても良いことは勿論である。In the above-described embodiments, four arms 2a are arranged, but it goes without saying that at least three arms 2a may be arranged at equal intervals.
第７図は本発明に係る回転保持装置の第３の実施例を示
す要部縦断面図であり、こ＼では、爪駆動軸５が回転軸
６に対しその軸線方向に摺動自在に構成されており、爪
駆動軸５の上端にカム溝４３ａを有するブロック４３が
固定されており、この軸５の上方への摺動に伴いカム溝
４３ ａＫ溢ってカムフィロア４６が従動することによ
り、リンク４４がガイド５０に沿って水平移動し、挾持
爪１がクエハＷを挾持又は解除するよう構成されている
。FIG. 7 is a longitudinal cross-sectional view of a main part showing a third embodiment of the rotation holding device according to the present invention, in which the pawl drive shaft 5 is configured to be slidable in the axial direction with respect to the rotation shaft 6. A block 43 having a cam groove 43a is fixed to the upper end of the pawl drive shaft 5, and as the shaft 5 slides upward, the cam groove 43aK overflows and the cam filler 46 is driven. The link 44 moves horizontally along the guide 50, and the clamping claws 1 are configured to clamp or release the quefer W.
すなわち、爪駆動軸５の下方に突設したビン４７により
、回転軸６が下降したときのみ、軸５はバネ１５の付勢
力に抗して相対的に上昇し、挾持爪１を第７図実線に示
す如く開き、回転軸６が上昇したときはバネ１５の付勢
力により挾持爪１を第７図二点鎖線で示す如く閉じ、ク
エハＷを挾持できる機構になっている。That is, only when the rotary shaft 6 is lowered by the pin 47 protruding below the claw drive shaft 5, the shaft 5 relatively rises against the biasing force of the spring 15, and the clamping claw 1 is moved upward as shown in FIG. It opens as shown by the solid line, and when the rotating shaft 6 rises, the clamping claw 1 closes as shown by the two-dot chain line in FIG. 7 due to the biasing force of the spring 15, thereby making it possible to clamp the quefer W.
第１図および第７図の場合は、例えば回転軸を吊設して
、クエハの主面を下方に向けてフェノλを挾持し、クエ
ハを回転させながら表面処理できることは言うまでもな
い。In the case of FIGS. 1 and 7, it goes without saying that surface treatment can be performed while rotating the quefer by, for example, suspending the rotation shaft and holding the phenol λ with the main surface of the quefer facing downward.
第８図は本発明の第４の実施例を示す平面図、第９図は
その要部を示す縦断面図である。この第４の実施例は第
１の実施例と以下の点で異なる。FIG. 8 is a plan view showing a fourth embodiment of the present invention, and FIG. 9 is a longitudinal sectional view showing the main parts thereof. This fourth embodiment differs from the first embodiment in the following points.
即ち、回転板５０にはアームがなく、４本の挾持爪のう
ち、３本の固定爪５２を回転板５０に立設し、１本の可
動爪５１をスライダ５４に立設しである。この可動爪５
１は、回転板５０に切設した長穴６３を上下に遊嵌状に
貫通してスライダ５４に固定されており、スライダ５４
とともに基板挾持側へ移動可能に構成されている。そし
てスライダ５４１ｉ可動爪操作リンク５３を介して爪駆
動軸５の上端部５６と連結されている。That is, the rotating plate 50 has no arm, and among the four clamping claws, three fixed claws 52 are erected on the rotating plate 50, and one movable claw 51 is erected on the slider 54. This movable claw 5
1 is fixed to the slider 54 by passing through an elongated hole 63 cut in the rotary plate 50 in a vertically loose-fitting manner, and is fixed to the slider 54.
It is also configured to be movable toward the substrate holding side. The slider 541i is connected to the upper end portion 56 of the pawl drive shaft 5 via the movable pawl operation link 53.
なお符号５５は、スライダ５４と回転軸対称に配設され
たバランサであり、同様に回転板５０に切設された長穴
６４にビン５９を遊嵌状に貫通して設けられ、スライダ
５４とバランスするようになっている。Reference numeral 55 denotes a balancer disposed symmetrically with the slider 54 on the rotational axis. Similarly, the balancer is provided with a pin 59 loosely fitted through an elongated hole 64 cut in the rotary plate 50, and is connected to the slider 54. It's supposed to be balanced.
なお可動爪５１に対向する固定爪５２をバランサ５５に
立設して可動爪とすることもできる６第１０図は本発明
の第５の実施例を示す要部の１の実施例と以下の点で異
なる。Note that the fixed claw 52 facing the movable claw 51 can also be provided upright on the balancer 55 to form a movable claw.6 Fig. 10 shows an embodiment of the main part of the fifth embodiment of the present invention and the following. They differ in some respects.
回転板７０のアーム７０ａを６本放射状に水平方向に突
投し、６本の挾持爪７３は各アーム７０ａの先端に設け
られ、６本の挾持爪７３のうち、３本を可動爪７３ａと
して固定爪と交互に配置しである。Six arms 70a of the rotary plate 70 are radially projected horizontally, and six clamping claws 73 are provided at the tip of each arm 70a, and three of the six clamping claws 73 are used as movable claws 73a. They are arranged alternately with fixed claws.
可動爪７３ａは第１２図に示すようにその上部がクエハ
保持部として形成され、その下部には揺動腕７６が固定
され、上記アーム７０ａに回転可能に立設されている。As shown in FIG. 12, the movable claw 73a has an upper portion formed as a wafer holding portion, a swing arm 76 fixed to the lower portion thereof, and is rotatably erected on the arm 70a.
そして揺動腕７６Ｆｉ可動爪操作リンク７１に連結され
、爪駆動軸５を介して揺動される。The swinging arm 76Fi is connected to the movable claw operation link 71 and swings via the claw drive shaft 5.
クエハ保持部は段落状のクエハ載置部７８と、揺動腕７
６の揺動に連動してクエハＷを挾持する切欠状の爪部７
７とが一体だ形成してあり、クエハ載置都７８上に載置
したクエハＷを爪部７７で挾持するようになっている。The quefer holding portion includes a stepped quefer placement portion 78 and a swinging arm 7.
A notch-like claw portion 7 that clamps the Kueha W in conjunction with the swinging of the part 6.
7 are formed integrally with each other, and the wafer W placed on the wafer mounting cap 78 is held between the claws 77.
第１３図は、第１２図におけるクエハ保持部の変形例を
示す斜視図であり、爪部７７を可動爪７３ａ本体の回転
中心より偏心させた位置に設けた小円柱で形成したもの
である。FIG. 13 is a perspective view showing a modification of the quefer holding portion in FIG. 12, in which the claw portion 77 is formed of a small cylinder provided at a position eccentric from the center of rotation of the main body of the movable claw 73a.
なお第１２図及び第１３図忙示す可動爪においては、付
勢バネ１５の付勢力を第１図に示した方向と逆に作用さ
せることも可能である。第１４図は本発明に係る基板の
回転保持装置を真空式の処理室内に臨ませて設けた場合
の実施例を示す縦断面図である。In the movable claw shown in FIGS. 12 and 13, it is also possible to cause the biasing force of the biasing spring 15 to act in the opposite direction to that shown in FIG. FIG. 14 is a longitudinal sectional view showing an embodiment in which the substrate rotation and holding device according to the present invention is provided facing inside a vacuum processing chamber.
この図において第１図と同一の部材は同一の符号を用い
て表わしている。In this figure, the same members as in FIG. 1 are represented using the same symbols.
符号８４ＩＩｉ真空式表面処理装置のチャンバ、８３は
チャンバ８４内を密閉する開閉可能に設けられたカバ、
８５は真空引き用のドレン管、８０はチャンバ８４の底
壁と筒状回転軸用の軸受管８６とを密閉状に閉止するベ
ローズである。Reference numeral 84IIi is a chamber of the vacuum surface treatment apparatus, and 83 is a cover that is openable and closable to seal the inside of the chamber 84;
85 is a drain pipe for evacuation, and 80 is a bellows that hermetically closes the bottom wall of the chamber 84 and the bearing pipe 86 for the cylindrical rotating shaft.
昇降シリング１８により軸受管８６が昇降してもベロー
ズ８０が仲、縮して処理室内を密閉するようになってい
る。Even when the bearing tube 86 is raised or lowered by the raising/lowering ring 18, the bellows 80 contracts to seal the inside of the processing chamber.
又軸受管８６と回転軸６との間にもオイルシール等の軸
封止手段８１が嵌着され、回転軸６と爪駆動軸５との間
にも０リング等の封止手段８２が介在させである。Also, a shaft sealing means 81 such as an oil seal is fitted between the bearing tube 86 and the rotating shaft 6, and a sealing means 82 such as an O-ring is also interposed between the rotating shaft 6 and the pawl drive shaft 5. It's a shame.
こうすることにより、真空式表面処理装置においても本
発明に係る基板の回転保持装置を用いることが可能とな
る。By doing so, it becomes possible to use the substrate rotation and holding device according to the present invention even in a vacuum type surface treatment apparatus.
（発明の効果）
本発明によれば、耐食性の弱い付勢バネや可動爪解除手
段を処理室内から隔絶す・ることかでき、基板の回転保
持装置からの臂塵をなくし、又装置の耐食性を高めるこ
とができる。(Effects of the Invention) According to the present invention, it is possible to isolate the biasing spring and the movable claw release means, which have low corrosion resistance, from the processing chamber, eliminate arm dust from the substrate rotation holding device, and improve the corrosion resistance of the device. can be increased.
第１図は本発明に係る基板の回転保持装置の第１の実施
例を示す要部縦断面図、第２図はその平面図、第３図は
第２の実施例を示す要部縦断面図、第４図はその平面図
、第５図は第２の実施例における可動爪解除手段の要部
断面図、第６図はその斜視図、第７図は第３の実施例を
示す要部縦断面図、第８図は第４の実施例を示す平面図
、第９図は第８図の要部縦断面図、第１０図は第５の実
施例を示す要部平面図、第１１図はその要部縦断面図、
第１２図は第１１図の可動爪の斜視図、第１３図は第１
２図における可動爪の変形例を示す斜視図、第１会図は
本発明の回転保持装置を真空式表面処理装置に用いた実
施例を示す縦断面図である。
Ｗ・・・基板（クエハ）、１・・・挾持爪、１ａ・・・
可動爪、２・・・回転板、３・・・スライダ、４・・・
可動爪操作リンク、５・・・爪駆動軸、６・・・筒状回
転軸、（８・９）・・・クランプ装置、１５・・・付勢
バネ、２８・・・バランサ、３０・・・可動爪解除手段
、４３・・・カム溝用ブロック、４３ａ・・・カム溝、
４６・・・カムフォロワ。
特許出願人 大日本スクリーン製造株式会社第１Ｉ１
２１）
第２図FIG. 1 is a vertical sectional view of a main part showing a first embodiment of a substrate rotation holding device according to the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a longitudinal sectional view of a main part showing a second embodiment. 4 is a plan view thereof, FIG. 5 is a sectional view of a main part of the movable claw release means in the second embodiment, FIG. 6 is a perspective view thereof, and FIG. 7 is a main part showing the third embodiment. 8 is a plan view showing the fourth embodiment, FIG. 9 is a vertical sectional view of the main part of FIG. 8, and FIG. 10 is a plan view of the main part showing the fifth embodiment. Figure 11 is a vertical cross-sectional view of the main part.
Figure 12 is a perspective view of the movable claw in Figure 11, and Figure 13 is a perspective view of the movable claw in Figure 11.
FIG. 2 is a perspective view showing a modification of the movable claw, and the first view is a longitudinal sectional view showing an embodiment in which the rotation holding device of the present invention is used in a vacuum type surface treatment device. W...Substrate (queue), 1...Pinching claw, 1a...
Movable claw, 2... rotating plate, 3... slider, 4...
Movable claw operation link, 5... claw drive shaft, 6... cylindrical rotating shaft, (8, 9)... clamp device, 15... biasing spring, 28... balancer, 30... - Movable claw release means, 43... cam groove block, 43a... cam groove,
46... Cam follower. Patent applicant: Dainippon Screen Manufacturing Co., Ltd. No. 1I1
21) Figure 2
Claims (1)
けた回転軸と、回転軸の突設側一端部に設けた回転板と
、回転板に配設され基板の外縁を挾持する少なくとも３
個以上の挾持爪と、これらの挾持爪のうち少なくとも１
以上のものを可動爪とし、可動爪を基板挾持側へ押圧付
勢するように設けた付勢手段と、可動爪を付勢手段に抗
して基板解放側へ解除するように設けた可動爪解除手段
とを備えて成る基板の回転保持装置において、 回転軸を筒状回転軸で形成し、筒状回転軸内に相対回転
又は相対移動可能に爪駆動軸を貫通して設け、爪駆動軸
の突設側一端部を可動爪操作リンクを介して可動爪と連
結し、それぞれ筒状回転軸と爪駆動軸の他端側同士を付
勢手段で掛止するとともに、当該付勢手段に対向して設
けられた可動爪解除手段により爪駆動軸を介して基板を
挾持・解放するように構成したことを特徴とする基板の
回転保持装置 ２、可動爪操作リンクを爪駆動軸の突設側一端部に当該
爪駆動軸の回動中心から偏心させて連結し、筒状回転軸
と爪駆動軸とを相対回転させて可動爪を操作するように
構成した特許請求の範囲第１項に記載した基板の回転保
持装置 ３、爪駆動軸の突設側一端部に略八字状のカム溝を有す
るブロックを設け、可動爪操作リンクの一端に、このカ
ム溝と係合するカムフォロワを設け、筒状回転軸と爪駆
動軸とを相対移動させて挾持爪を操作するように構成し
た特許請求の範囲第１項に記載した基板の回転保持装置 ４、回転台に回転中心へ向けて移動可能なスライダを設
け、このスライダに挾持爪を立設して可動爪を構成した
特許請求の範囲第２項に記載した基板の回転保持装置 ５、回転台に回転中心へ向けて移動可能なバランサを設
け、可動爪とバランサとを軸対称に配設して可動爪操作
リンクで連結した特許請求の範囲第４項に記載した基板
の回転保持装置 ６、回転台の所要位置に偏心回転可能な挾持爪を立設し
て可動爪を構成した特許請求の範囲第１項に記載した基
板の回転保持装置[Claims] 1. A rotary shaft protruding into a processing chamber of a substrate processing apparatus so as to be rotatable, a rotary plate provided at one end of the protruding side of the rotary shaft, and a substrate disposed on the rotary plate. At least three
or more clamping claws, and at least one of these clamping claws
The above is a movable claw, and a biasing means is provided to press and bias the movable claw toward the substrate holding side, and a movable claw is provided to release the movable claw toward the substrate release side against the biasing means. In the substrate rotation holding device comprising a release means, the rotation shaft is formed as a cylindrical rotation shaft, and a claw drive shaft is provided through the cylindrical rotation shaft so as to be relatively rotatable or relatively movable, and the claw drive shaft One end of the protruding side is connected to the movable claw via a movable claw operation link, and the other end sides of the cylindrical rotating shaft and the claw drive shaft are respectively latched to each other by a biasing means, and facing the biasing means. A substrate rotation holding device 2 characterized in that the substrate is held and released via a pawl drive shaft by a movable pawl release means provided as a movable pawl release means, the movable pawl operation link is disposed on the protruding side of the pawl drive shaft. Claim 1, wherein the movable claw is connected to one end thereof eccentrically from the center of rotation of the claw drive shaft, and the movable claw is operated by relatively rotating the cylindrical rotation shaft and the claw drive shaft. A rotation holding device 3 for a board that has been rotated is provided with a block having a substantially eight-shaped cam groove at one end of the protruding side of the pawl drive shaft, a cam follower that engages with this cam groove at one end of the movable pawl operating link, and a cylinder The substrate rotation holding device 4 according to claim 1, which is configured to operate the clamping claws by relatively moving the shaped rotating shaft and the claw driving shaft, is movable toward the center of rotation on the rotating table. A substrate rotation holding device 5 according to claim 2, wherein a slider is provided and a clamping claw is erected on the slider to constitute a movable claw, and a rotating table is provided with a balancer movable toward the center of rotation. , a substrate rotation holding device 6 according to claim 4, in which a movable claw and a balancer are arranged axially symmetrically and connected by a movable claw operation link; A rotary holding device for a substrate according to claim 1, wherein a movable claw is formed by erecting a movable claw.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019870008806A KR920000673B1 (en) | 1986-08-13 | 1987-08-11 | Wafer supporting apparatus |
| US07/084,336 US4788994A (en) | 1986-08-13 | 1987-08-11 | Wafer holding mechanism |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19024686 | 1986-08-13 | ||
| JP61-190246 | 1986-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63153839A true JPS63153839A (en) | 1988-06-27 |
| JPH039607B2 JPH039607B2 (en) | 1991-02-08 |
Family
ID=16254941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61285752A Granted JPS63153839A (en) | 1986-08-13 | 1986-11-29 | Rotary holding device for substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS63153839A (en) |
| KR (1) | KR920000673B1 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245951A (en) * | 1988-08-08 | 1990-02-15 | Kyushu Electron Metal Co Ltd | Holding device for semiconductor substrate |
| US5916366A (en) * | 1996-10-08 | 1999-06-29 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin treating apparatus |
| JP2002174502A (en) * | 2000-12-07 | 2002-06-21 | Ulvac Japan Ltd | Axial aligner, film thickness measuring apparatus, film forming apparatus, method and apparatus for measuring film thickness |
| JP2003100850A (en) * | 2001-09-21 | 2003-04-04 | Assist Japan Kk | Wafer aligner |
| US6921466B2 (en) | 2000-04-27 | 2005-07-26 | Ebara Corporation | Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| US7354481B2 (en) | 2004-09-14 | 2008-04-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate holding and rotating apparatus |
| JP2009055046A (en) * | 2008-09-26 | 2009-03-12 | Hitachi Kokusai Electric Inc | Method of manufacturing semiconductor and its device |
| JP2009060063A (en) * | 2007-09-04 | 2009-03-19 | Tokyo Electron Ltd | Treatment apparatus, treatment method and storage medium |
| JP2012004310A (en) * | 2010-06-16 | 2012-01-05 | Tokyo Electron Ltd | Substrate liquid processing apparatus |
| JP2013187490A (en) * | 2012-03-09 | 2013-09-19 | Tokyo Electron Ltd | Liquid processing apparatus |
| KR20150000417A (en) * | 2013-06-24 | 2015-01-02 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holding apparatus and substrate cleaning apparatus |
| TWI611501B (en) * | 2016-09-23 | 2018-01-11 | Screen Holdings Co Ltd | Substrate processing device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6497241B1 (en) * | 1999-12-23 | 2002-12-24 | Lam Research Corporation | Hollow core spindle and spin, rinse, and dry module including the same |
| KR100367665B1 (en) * | 2000-07-24 | 2003-01-10 | (주)케이.씨.텍 | Apparatus for fixing wafer |
| KR100829923B1 (en) | 2006-08-30 | 2008-05-16 | 세메스 주식회사 | Spin head and method using the same for treating substrate |
| KR100873153B1 (en) * | 2007-10-05 | 2008-12-10 | 세메스 주식회사 | Spin head |
-
1986
- 1986-11-29 JP JP61285752A patent/JPS63153839A/en active Granted
-
1987
- 1987-08-11 KR KR1019870008806A patent/KR920000673B1/en not_active IP Right Cessation
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0245951A (en) * | 1988-08-08 | 1990-02-15 | Kyushu Electron Metal Co Ltd | Holding device for semiconductor substrate |
| US5916366A (en) * | 1996-10-08 | 1999-06-29 | Dainippon Screen Mfg. Co., Ltd. | Substrate spin treating apparatus |
| US6921466B2 (en) | 2000-04-27 | 2005-07-26 | Ebara Corporation | Revolution member supporting apparatus and semiconductor substrate processing apparatus |
| JP2002174502A (en) * | 2000-12-07 | 2002-06-21 | Ulvac Japan Ltd | Axial aligner, film thickness measuring apparatus, film forming apparatus, method and apparatus for measuring film thickness |
| JP4514942B2 (en) * | 2000-12-07 | 2010-07-28 | 株式会社アルバック | Deposition equipment |
| JP4552222B2 (en) * | 2001-09-21 | 2010-09-29 | ムラテックオートメーション株式会社 | Wafer aligner |
| JP2003100850A (en) * | 2001-09-21 | 2003-04-04 | Assist Japan Kk | Wafer aligner |
| US7354481B2 (en) | 2004-09-14 | 2008-04-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate holding and rotating apparatus |
| JP2009060063A (en) * | 2007-09-04 | 2009-03-19 | Tokyo Electron Ltd | Treatment apparatus, treatment method and storage medium |
| JP4601698B2 (en) * | 2008-09-26 | 2010-12-22 | 株式会社日立国際電気 | Semiconductor manufacturing method and apparatus |
| JP2009055046A (en) * | 2008-09-26 | 2009-03-12 | Hitachi Kokusai Electric Inc | Method of manufacturing semiconductor and its device |
| JP2012004310A (en) * | 2010-06-16 | 2012-01-05 | Tokyo Electron Ltd | Substrate liquid processing apparatus |
| JP2013187490A (en) * | 2012-03-09 | 2013-09-19 | Tokyo Electron Ltd | Liquid processing apparatus |
| KR20130103378A (en) * | 2012-03-09 | 2013-09-23 | 도쿄엘렉트론가부시키가이샤 | Liquid processing apparatus |
| US9272310B2 (en) | 2012-03-09 | 2016-03-01 | Tokyo Electron Limited | Liquid processing apparatus |
| TWI562260B (en) * | 2012-03-09 | 2016-12-11 | Tokyo Electron Ltd | Liquid processing device |
| KR20150000417A (en) * | 2013-06-24 | 2015-01-02 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holding apparatus and substrate cleaning apparatus |
| JP2015005689A (en) * | 2013-06-24 | 2015-01-08 | 株式会社荏原製作所 | Substrate holding device and substrate cleaning device |
| US9558971B2 (en) | 2013-06-24 | 2017-01-31 | Ebara Corporation | Substrate holding apparatus and substrate cleaning apparatus |
| JP2017163162A (en) * | 2013-06-24 | 2017-09-14 | 株式会社荏原製作所 | Substrate holding device |
| TWI611501B (en) * | 2016-09-23 | 2018-01-11 | Screen Holdings Co Ltd | Substrate processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR880003411A (en) | 1988-05-17 |
| KR920000673B1 (en) | 1992-01-20 |
| JPH039607B2 (en) | 1991-02-08 |
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