JPS631383U - - Google Patents

Info

Publication number
JPS631383U
JPS631383U JP9441586U JP9441586U JPS631383U JP S631383 U JPS631383 U JP S631383U JP 9441586 U JP9441586 U JP 9441586U JP 9441586 U JP9441586 U JP 9441586U JP S631383 U JPS631383 U JP S631383U
Authority
JP
Japan
Prior art keywords
holes
back surfaces
hole
diameter
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9441586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9441586U priority Critical patent/JPS631383U/ja
Publication of JPS631383U publication Critical patent/JPS631383U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の実施例、第２図ａ，ｂ
は一般の多層印刷配線板のスルホール構造の平面
図及び断面図。第３図ａ，ｂは、ランドレス構造
を有する多層印刷配線板の平面図及び断面図。 １……絶縁層、２……スルホール孔、３……ラ
ンド、４……表裏面導体、５……内層導体、６…
…（表裏のスルホール孔の径より大きい）スルホ
ール孔、１０……基板。 Figure 1 a, b is an embodiment of the present invention, Figure 2 a, b
1 is a plan view and a cross-sectional view of a through-hole structure of a general multilayer printed wiring board. FIGS. 3a and 3b are a plan view and a sectional view of a multilayer printed wiring board having a landless structure. 1... Insulating layer, 2... Through hole, 3... Land, 4... Front and back conductor, 5... Inner layer conductor, 6...
...Through-hole hole (larger than the diameter of the through-hole hole on the front and back sides), 10...Substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品挿入用スルホール孔を有する多層印刷配線
板においてスルホール孔の表裏面ランドレス構造
にし、かつ前記スルホール孔の内層部分に表裏面
のスルホール径より大きい径の孔を有することを
特徴とする多層印刷配線板。 A multilayer printed wiring board having through-holes for inserting components, wherein the front and back surfaces of the through-holes have a landless structure, and the inner layer portion of the through-holes has a hole having a diameter larger than the diameter of the through-holes on the front and back surfaces. Board.
JP9441586U 1986-06-19 1986-06-19 Pending JPS631383U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9441586U JPS631383U (en) 1986-06-19 1986-06-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9441586U JPS631383U (en) 1986-06-19 1986-06-19

Publications (1)

Publication Number Publication Date
JPS631383U true JPS631383U (en) 1988-01-07

Family

ID=30957850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9441586U Pending JPS631383U (en) 1986-06-19 1986-06-19

Country Status (1)

Country Link
JP (1) JPS631383U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137295A (en) * 1988-11-17 1990-05-25 Ibiden Co Ltd Multilayer printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137295A (en) * 1988-11-17 1990-05-25 Ibiden Co Ltd Multilayer printed wiring board

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