JPS63137925U - - Google Patents
Info
- Publication number
- JPS63137925U JPS63137925U JP2942687U JP2942687U JPS63137925U JP S63137925 U JPS63137925 U JP S63137925U JP 2942687 U JP2942687 U JP 2942687U JP 2942687 U JP2942687 U JP 2942687U JP S63137925 U JPS63137925 U JP S63137925U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- melting point
- low melting
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図はこの考案の一実施例である電子部品を
示す正面図、第２図は上記電子部品のはんだ付け
工程を示す一部断面図である。
図において、１…電子部品本体、２…リード線
、２ａ…先端部分、２ｂ…屈曲部、３…プリント
基板、４…導体部、５…はんだである。
FIG. 1 is a front view showing an electronic component which is an embodiment of this invention, and FIG. 2 is a partial sectional view showing the soldering process of the electronic component. In the figure, 1... electronic component main body, 2... lead wire, 2a... tip portion, 2b... bent portion, 3... printed circuit board, 4... conductor portion, 5... solder.
Claims (1)
リード線の先端部分を低融点金属によつて形成し
たことを特徴とする電子部品。 (2) 上記低融点金属は、はんだであることを特
徴とする実用新案登録請求の範囲第１項記載の電
子部品。[Scope of Claim for Utility Model Registration] (1) An electronic component having a lead wire, characterized in that the tip of the lead wire is made of a low melting point metal. (2) The electronic component according to claim 1, wherein the low melting point metal is solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2942687U JPS63137925U (en) | 1987-02-28 | 1987-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2942687U JPS63137925U (en) | 1987-02-28 | 1987-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63137925U true JPS63137925U (en) | 1988-09-12 |
Family
ID=30833294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2942687U Pending JPS63137925U (en) | 1987-02-28 | 1987-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137925U (en) |
-
1987
- 1987-02-28 JP JP2942687U patent/JPS63137925U/ja active Pending
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