JPS6313650U - - Google Patents
Info
- Publication number
- JPS6313650U JPS6313650U JP10625086U JP10625086U JPS6313650U JP S6313650 U JPS6313650 U JP S6313650U JP 10625086 U JP10625086 U JP 10625086U JP 10625086 U JP10625086 U JP 10625086U JP S6313650 U JPS6313650 U JP S6313650U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cutting wheel
- utility
- model registration
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第1図は第2図―線における本考案の基板
を有する切断砥石の断面図、第2図は同じく正面
図、第3図は第4図―線における従来のダイ
ヤモンド砥石の断面図、第4図は同じく正面図で
ある。
1:基板、2:チツプ、3a,3b:基板材、
4:切欠部、5:補強凸部、6:空所。
1 is a cross-sectional view of a cutting wheel having a substrate of the present invention taken along the line shown in FIG. 2, FIG. 2 is a front view of the same, and FIG. The figure is also a front view. 1: substrate, 2: chip, 3a, 3b: substrate material,
4: Notch portion, 5: Reinforcement convex portion, 6: Vacant space.
Claims (1)
合物を焼結して形成した砥材チツプを設けた切断
砥石において、複数の基板材を積層して基板を構
成したことを特徴とする複合基板を有する切断砥
石。 2 基板材の切欠部周囲に補強部を設けたことを
特徴とする実用新案登録請求の範囲第1項記載の
複合基板を有する切断砥石。[Claims for Utility Model Registration] 1. In a cutting wheel that has abrasive chips formed by sintering a mixture of hard abrasive grains and a binder on the periphery of a substrate, a plurality of substrate materials are laminated to form a substrate. A cutting wheel having a composite substrate comprising: 2. A cutting wheel having a composite substrate according to claim 1 of the utility model registration, characterized in that a reinforcing portion is provided around the cutout portion of the substrate material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986106250U JPH0429981Y2 (en) | 1986-07-10 | 1986-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986106250U JPH0429981Y2 (en) | 1986-07-10 | 1986-07-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6313650U true JPS6313650U (en) | 1988-01-29 |
JPH0429981Y2 JPH0429981Y2 (en) | 1992-07-20 |
Family
ID=30981434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986106250U Expired JPH0429981Y2 (en) | 1986-07-10 | 1986-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0429981Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03113757U (en) * | 1990-03-08 | 1991-11-21 | ||
JPH0885066A (en) * | 1994-09-16 | 1996-04-02 | Osaka Diamond Ind Co Ltd | Super abrasive particle blade and menufacture thereof |
JP2001212768A (en) * | 2000-02-02 | 2001-08-07 | Asahi Diamond Industrial Co Ltd | Grinding wheel for cutting |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59128358U (en) * | 1983-02-18 | 1984-08-29 | 池内精機株式会社 | Cutting wheel substrate |
-
1986
- 1986-07-10 JP JP1986106250U patent/JPH0429981Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59128358U (en) * | 1983-02-18 | 1984-08-29 | 池内精機株式会社 | Cutting wheel substrate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03113757U (en) * | 1990-03-08 | 1991-11-21 | ||
JPH0885066A (en) * | 1994-09-16 | 1996-04-02 | Osaka Diamond Ind Co Ltd | Super abrasive particle blade and menufacture thereof |
JP2001212768A (en) * | 2000-02-02 | 2001-08-07 | Asahi Diamond Industrial Co Ltd | Grinding wheel for cutting |
Also Published As
Publication number | Publication date |
---|---|
JPH0429981Y2 (en) | 1992-07-20 |
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