JPS6313650U - - Google Patents

Info

Publication number
JPS6313650U
JPS6313650U JP10625086U JP10625086U JPS6313650U JP S6313650 U JPS6313650 U JP S6313650U JP 10625086 U JP10625086 U JP 10625086U JP 10625086 U JP10625086 U JP 10625086U JP S6313650 U JPS6313650 U JP S6313650U
Authority
JP
Japan
Prior art keywords
substrate
cutting wheel
utility
model registration
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10625086U
Other languages
Japanese (ja)
Other versions
JPH0429981Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986106250U priority Critical patent/JPH0429981Y2/ja
Publication of JPS6313650U publication Critical patent/JPS6313650U/ja
Application granted granted Critical
Publication of JPH0429981Y2 publication Critical patent/JPH0429981Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は第２図―線における本考案の基板
を有する切断砥石の断面図、第２図は同じく正面
図、第３図は第４図―線における従来のダイ
ヤモンド砥石の断面図、第４図は同じく正面図で
ある。 １：基板、２：チツプ、３ａ，３ｂ：基板材、
４：切欠部、５：補強凸部、６：空所。 1 is a cross-sectional view of a cutting wheel having a substrate of the present invention taken along the line shown in FIG. 2, FIG. 2 is a front view of the same, and FIG. The figure is also a front view. 1: substrate, 2: chip, 3a, 3b: substrate material,
4: Notch portion, 5: Reinforcement convex portion, 6: Vacant space.

Claims (1)

【実用新案登録請求の範囲】 １ 基板の周縁に硬質砥粒と結合材とからなる混
合物を焼結して形成した砥材チツプを設けた切断
砥石において、複数の基板材を積層して基板を構
成したことを特徴とする複合基板を有する切断砥
石。 ２ 基板材の切欠部周囲に補強部を設けたことを
特徴とする実用新案登録請求の範囲第１項記載の
複合基板を有する切断砥石。[Claims for Utility Model Registration] 1. In a cutting wheel that has abrasive chips formed by sintering a mixture of hard abrasive grains and a binder on the periphery of a substrate, a plurality of substrate materials are laminated to form a substrate. A cutting wheel having a composite substrate comprising: 2. A cutting wheel having a composite substrate according to claim 1 of the utility model registration, characterized in that a reinforcing portion is provided around the cutout portion of the substrate material.
JP1986106250U 1986-07-10 1986-07-10 Expired JPH0429981Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986106250U JPH0429981Y2 (en) 1986-07-10 1986-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986106250U JPH0429981Y2 (en) 1986-07-10 1986-07-10

Publications (2)

Publication Number Publication Date
JPS6313650U true JPS6313650U (en) 1988-01-29
JPH0429981Y2 JPH0429981Y2 (en) 1992-07-20

Family

ID=30981434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986106250U Expired JPH0429981Y2 (en) 1986-07-10 1986-07-10

Country Status (1)

Country Link
JP (1) JPH0429981Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113757U (en) * 1990-03-08 1991-11-21
JPH0885066A (en) * 1994-09-16 1996-04-02 Osaka Diamond Ind Co Ltd Super abrasive particle blade and menufacture thereof
JP2001212768A (en) * 2000-02-02 2001-08-07 Asahi Diamond Industrial Co Ltd Grinding wheel for cutting

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128358U (en) * 1983-02-18 1984-08-29 池内精機株式会社 Cutting wheel substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59128358U (en) * 1983-02-18 1984-08-29 池内精機株式会社 Cutting wheel substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113757U (en) * 1990-03-08 1991-11-21
JPH0885066A (en) * 1994-09-16 1996-04-02 Osaka Diamond Ind Co Ltd Super abrasive particle blade and menufacture thereof
JP2001212768A (en) * 2000-02-02 2001-08-07 Asahi Diamond Industrial Co Ltd Grinding wheel for cutting

Also Published As

Publication number Publication date
JPH0429981Y2 (en) 1992-07-20

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