JPS63131556A - Cooling device for circuit substrate - Google Patents
Cooling device for circuit substrateInfo
- Publication number
- JPS63131556A JPS63131556A JP27674686A JP27674686A JPS63131556A JP S63131556 A JPS63131556 A JP S63131556A JP 27674686 A JP27674686 A JP 27674686A JP 27674686 A JP27674686 A JP 27674686A JP S63131556 A JPS63131556 A JP S63131556A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- refrigerant
- circuit board
- flow path
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title abstract description 6
- 239000003507 refrigerant Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、例えば半導体装置等の電子部品が取り付けら
れた回路基板の冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling device for a circuit board to which electronic components such as semiconductor devices are attached, for example.
近年、例えば情報処理装置等の電子機器に対する高集積
化および高電力化に伴いその発熱密度が増大してきた。In recent years, the density of heat generation has increased as electronic devices such as information processing devices have become more highly integrated and powered.
従来、この種の電子機器においては、回路基板上の電子
部品に冷風を吹きつけるファンを備えた回路基板の冷却
装置が採用されている。BACKGROUND ART Conventionally, in this type of electronic equipment, a circuit board cooling device has been employed which is equipped with a fan that blows cold air onto electronic components on a circuit board.
また、第４図に示す回路基板の冷却装置も採用されてい
る。これを同図に基づいて概略説明すると、同図におい
て、符号１および２で示すものは多数の凹溝３．４を有
する熱的シンク部材で、各々が互いに所定の間隔を隔て
て設けられており、その内部には冷媒用流路としての管
体５．６が設けられている。７はその面上にプリント配
線板８が密着する熱伝導板で、前記両凹溝３，４内に熱
伝導コネクタ９．１０によって着脱自在に設けられてい
る。なお、前記プリント配線板８の表面上には例えば半
導体装置等の電子部品１１が実装されている。A circuit board cooling device shown in FIG. 4 is also employed. This will be briefly explained based on the figure. In the figure, what is indicated by reference numerals 1 and 2 are thermal sink members having a large number of grooves 3.4, each of which is provided at a predetermined distance from each other. A pipe body 5.6 serving as a refrigerant flow path is provided inside the pipe body. Reference numeral 7 denotes a heat conductive plate on which a printed wiring board 8 is closely attached, and is detachably provided in the grooves 3 and 4 by heat conductive connectors 9 and 10. Incidentally, on the surface of the printed wiring board 8, an electronic component 11 such as a semiconductor device is mounted, for example.
ところが、前者にあっては空冷方式であるため、その冷
却効率が低下し、後者にあっては、プリント配線板８の
両側縁のみが熱的シンク部材１，２に接触する構造であ
るため、熱的シンク部材１゜２から電子部品１１までの
熱伝導率が低下していた。この結果、冷却装置としての
冷却能力を保証することができないという問題があった
。However, since the former is an air cooling system, its cooling efficiency is reduced, and the latter has a structure in which only both side edges of the printed wiring board 8 are in contact with the thermal sink members 1 and 2. The thermal conductivity from the thermal sink member 1°2 to the electronic component 11 was reduced. As a result, there was a problem in that the cooling capacity of the cooling device could not be guaranteed.
本発明はこのような事情に鑑みなされたもので、装置の
冷却効率のみならず熱伝導率を向上させることができ、
もって回路基板に対する冷却能力を十分に保証すること
ができる回路基板の冷却装置を提供するものである。The present invention was made in view of these circumstances, and it is possible to improve not only the cooling efficiency of the device but also the thermal conductivity.
The present invention provides a circuit board cooling device that can sufficiently guarantee cooling capacity for the circuit board.
本発明に係る回路基板の冷却装置は、回路基板の裏面に
密着する偏平面を有しその内部に冷媒用の流路を有する
冷却プレートと、この冷却プレートの両側に設けられ流
路の出入口に各々接続する冷媒配管とを備えたものであ
る。 （〔作 用〕
本発明においては、冷却プレートの流路に流す冷媒によ
って回路基板の裏面全体を冷却することができる
〔実施例〕
第１図および第２図は本発明に係る回路基板の冷却装置
を示す斜視図と正面図、第３図は同じく回路基板の冷却
装置における冷却プレートを示す斜視図である。同図に
おいて、符号１１で示す筺体はバックボード１２および
サイドボード１３からなり、その内部には多数の凹溝１
４，１５を有する２つのガイド部材１６．１７が上下方
向に所定の間隔を隔てて設けられている。１８は偏平な
表裏面を有する多数の冷却プレートで、上下端部が前記
両凹溝１４．１５内に挿脱自在に設けられている。これ
ら冷却プレート１８は高熱伝導率をもつ例えば銅、アル
ミニウム等の材料によって形成されており、その上下端
部には冷媒を流す銅管１９．２０が埋設され、またこれ
ら両銅管１９゜２０間には上下方向に延在する複数の冷
媒用流路２１が形成されている。そして、これら冷却プ
レート１８の表裏面には、例えば半導体装置等の電子部
品２２が搭載するプリント基板２３がコンパウンド等の
低熱抵抗剤（図示せず）によって密着されている。２４
および２５は冷媒用の配管で、前記冷却プレート１８の
上下方に設けられ、かつホース２６によって前記両銅管
１９．２０に各々接続されており、前記冷媒用流路２１
の出入口に各々接続するように構成されている。なお、
２７は前記ホース２６を前記両配管２４．２５に接続す
るユニオンである。また、２８はプリント基板２３を電
気的に接続するコネクタである。A cooling device for a circuit board according to the present invention includes a cooling plate having a flat surface in close contact with the back surface of the circuit board and having a coolant flow path therein, and a cooling plate provided on both sides of the cooling plate at the entrance and exit of the flow path. The refrigerant pipes are connected to each other. ([Function] In the present invention, the entire back surface of the circuit board can be cooled by the refrigerant flowing through the flow path of the cooling plate. [Example] Figures 1 and 2 show the cooling of the circuit board according to the present invention. A perspective view and a front view of the device, and FIG. 3 is a perspective view of a cooling plate in a circuit board cooling device.In the same figure, a housing designated by reference numeral 11 is composed of a backboard 12 and a sideboard 13. There are many grooves inside
Two guide members 16 and 17 having numbers 4 and 15 are provided at a predetermined interval in the vertical direction. Reference numeral 18 designates a number of cooling plates having flat front and back surfaces, the upper and lower ends of which are provided in the grooves 14 and 15 such that they can be inserted into and removed from the grooves 14 and 15. These cooling plates 18 are made of a material with high thermal conductivity, such as copper or aluminum. Copper pipes 19 and 20 through which a refrigerant flows are buried in the upper and lower ends of the cooling plates 18, and between these copper pipes 19 and 20, A plurality of refrigerant channels 21 are formed extending in the vertical direction. A printed circuit board 23 on which an electronic component 22 such as a semiconductor device is mounted is closely adhered to the front and back surfaces of these cooling plates 18 with a low heat resistance agent (not shown) such as a compound. 24
and 25 are refrigerant pipes, which are provided above and below the cooling plate 18 and connected to both the copper pipes 19 and 20 by hoses 26, respectively, and are connected to the refrigerant flow path 21.
are configured to be connected to the entrances and exits of each. In addition,
A union 27 connects the hose 26 to both pipes 24 and 25. Further, 28 is a connector for electrically connecting the printed circuit board 23.
このように構成された回路基板の冷却装置においては、
冷却プレート１８の冷媒用流路２１に流す冷媒によって
プリント基板２３の裏面全体を冷却することができる。In the circuit board cooling device configured in this way,
The entire back surface of the printed circuit board 23 can be cooled by the refrigerant flowing through the refrigerant flow path 21 of the cooling plate 18 .
この場合、本発明における冷却装置は、冷却プレート１
８の表裏面がプリント基板２３の裏面に密着するから、
冷却効率のみならず熱伝導率を向上させることができる
。In this case, the cooling device in the present invention includes a cooling plate 1
Since the front and back surfaces of 8 are in close contact with the back surface of the printed circuit board 23,
Not only cooling efficiency but also thermal conductivity can be improved.
なお、本発明においては、電子部品２２の発熱量に応じ
て冷却プレート１８内の冷媒用流路２１の数を増加する
ことができる。また、冷媒用流路２１としてパイプを使
用してもよいが、この他、均一な冷却能力を確保するた
めに幅狭なスリット（図示せず）を冷却プレート１８に
形成してもよい。Note that in the present invention, the number of refrigerant channels 21 in the cooling plate 18 can be increased depending on the amount of heat generated by the electronic component 22. Furthermore, although a pipe may be used as the refrigerant flow path 21, narrow slits (not shown) may be formed in the cooling plate 18 in order to ensure uniform cooling capacity.
以上説明したように本発明によれば、回路基板の裏面に
密着する偏平面を有しその内部に冷媒用の流路を有する
冷却プレートと、この冷却プレートの両側に設けられ流
路の出入口に各々接続する冷媒配管とを備えたので、冷
却プレートの流路に流す冷媒によって回路基板の裏面全
体を冷却することができる。したがって、装置の冷却効
率のみならず熱伝導率を確実に向上させることができる
から、回路基板に対する冷却能力を十分に保証すること
ができる。As explained above, according to the present invention, there is provided a cooling plate having an oblique surface that is in close contact with the back surface of a circuit board and having a refrigerant flow path therein, and a cooling plate provided on both sides of the cooling plate at the entrance and exit of the flow path. Since the refrigerant pipes are provided to connect the respective refrigerant pipes, the entire back surface of the circuit board can be cooled by the refrigerant flowing through the channels of the cooling plate. Therefore, not only the cooling efficiency of the device but also the thermal conductivity can be reliably improved, so that the cooling capacity for the circuit board can be sufficiently guaranteed.
第１図および第２図は本発明に係る回路基板の冷却装置
を示す斜視図と正面図、第３図は同じく回路基板の冷却
装置における冷却プレートを示す斜視図、第４図は従来
の回路基板の冷却装置を示す正面図である。
１８・・・・冷却プレート、２１・・・・冷媒用流路、
２２・・・・電子部品、２３・・・・プリント基板、２
４．２５・・・・配管。1 and 2 are a perspective view and a front view showing a circuit board cooling device according to the present invention, FIG. 3 is a perspective view showing a cooling plate in the same circuit board cooling device, and FIG. 4 is a conventional circuit board cooling device. FIG. 2 is a front view showing a cooling device for a substrate. 18...Cooling plate, 21...Refrigerant channel,
22...Electronic component, 23...Printed circuit board, 2
4.25...Piping.
Claims (1)
用の流路を有する冷却プレートと、この冷却プレートの
両側に設けられ前記流路の出入口に各々接続する冷媒配
管とを備えたことを特徴とする回路基板の冷却装置。A cooling plate having an oblique surface that is in close contact with the back surface of a circuit board and having a refrigerant flow path therein, and refrigerant pipes provided on both sides of the cooling plate and connected to the inlet and outlet of the flow path, respectively. A circuit board cooling device featuring:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27674686A JPS63131556A (en) | 1986-11-21 | 1986-11-21 | Cooling device for circuit substrate |
| FR8716094A FR2607349B1 (en) | 1986-11-21 | 1987-11-20 | COOLING STRUCTURE FOR SUBSTRATES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27674686A JPS63131556A (en) | 1986-11-21 | 1986-11-21 | Cooling device for circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63131556A true JPS63131556A (en) | 1988-06-03 |
| JPH0573267B2 JPH0573267B2 (en) | 1993-10-14 |
Family
ID=17573762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27674686A Granted JPS63131556A (en) | 1986-11-21 | 1986-11-21 | Cooling device for circuit substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS63131556A (en) |
| FR (1) | FR2607349B1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5482109A (en) * | 1994-03-15 | 1996-01-09 | E-Systems, Inc. | Modular heat exchanger |
| FR2860947B1 (en) * | 2003-10-10 | 2005-12-23 | Thales Sa | ELECTRONIC PRINTED CIRCUIT COOLING DEVICE AND EMBODIMENT. |
| DE102004008461A1 (en) * | 2004-02-17 | 2005-10-06 | Rittal Gmbh & Co. Kg | housing arrangement |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD104895A1 (en) * | 1973-02-19 | 1974-03-20 | ||
| US4493010A (en) * | 1982-11-05 | 1985-01-08 | Lockheed Corporation | Electronic packaging module utilizing phase-change conductive cooling |
| US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
-
1986
- 1986-11-21 JP JP27674686A patent/JPS63131556A/en active Granted
-
1987
- 1987-11-20 FR FR8716094A patent/FR2607349B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2607349A1 (en) | 1988-05-27 |
| JPH0573267B2 (en) | 1993-10-14 |
| FR2607349B1 (en) | 1995-07-07 |
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