JPS6312817Y2 - - Google Patents
Info
- Publication number
- JPS6312817Y2 JPS6312817Y2 JP17100781U JP17100781U JPS6312817Y2 JP S6312817 Y2 JPS6312817 Y2 JP S6312817Y2 JP 17100781 U JP17100781 U JP 17100781U JP 17100781 U JP17100781 U JP 17100781U JP S6312817 Y2 JPS6312817 Y2 JP S6312817Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- mounting
- temperature
- sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000009466 transformation Effects 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Cookers (AREA)
Description
【考案の詳細な説明】
1 考案の技術分野
本考案は熱機器の被感熱部分の温度を検出する
感熱体を、その被感熱部分に接触する伝熱基体に
取付ける構造を改良してなる熱機器の感熱体取付
装置に関する。[Detailed Description of the Invention] 1. Technical Field of the Invention The present invention is a thermal device that has an improved structure in which a heat-sensitive element for detecting the temperature of a heat-sensitive part of a thermal device is attached to a heat transfer base that comes into contact with the heat-sensitive part. The present invention relates to a heat sensitive body mounting device.
2 従来技術
従来、例えば圧力調理器においては、鍋の温度
を検知する感熱体を伝熱基体たる筒状の伝熱ケー
スの内底面に収納するとともにその伝熱ケース内
にプラスチツク等のモールド材を流し込んで固定
するようにしていた。2. Prior Art Conventionally, for example, in a pressure cooker, a heat sensitive element for detecting the temperature of a pot is housed in the inner bottom surface of a cylindrical heat transfer case serving as a heat transfer base, and a molded material such as plastic is placed inside the heat transfer case. I was trying to pour it in and fix it.
3 従来技術の問題点
しかしながら、従来のものはモールド材により
伝熱ケース全体の熱容量が大きくなるから、鍋の
温度に対する追従性が悪くなつて、鍋内の温度リ
ツプルが大きくなる欠点があり、製作時にモール
ド材の乾燥に時間が掛るとともに乾燥中に感熱体
が移動して伝熱ケースとの接触度合にばらつきを
生ずることもあつて、設定温度にばらつきが生じ
易い欠点があつた。3 Problems with the conventional technology However, with the conventional technology, the heat capacity of the entire heat transfer case increases due to the molding material, which has the disadvantage of poor followability to the temperature of the pan, resulting in large temperature ripples inside the pan. Sometimes, it takes time to dry the molding material, and the heat-sensitive element moves during drying, causing variations in the degree of contact with the heat transfer case, which has the disadvantage that the set temperature tends to vary.
4 考案の目的
本考案は上記事情に鑑みてなされたものであ
り、その目的は、伝熱基体全体の熱容量を減少さ
せて感熱体が熱機器の温度変化に対して良好に追
従できるようにし、以つて熱機器の温度リツプル
を極力減少させるとともに、簡単な構造で感熱体
を伝熱基体にばらつきなく接触させることができ
て製作が容易な熱機器の感熱体取付装置を提供す
るにある。4 Purpose of the invention The present invention was made in view of the above circumstances, and its purpose is to reduce the heat capacity of the entire heat transfer substrate so that the heat sensitive body can better follow the temperature changes of the thermal equipment, To provide a heat sensitive body mounting device for a thermal device which can reduce the temperature ripple of the thermal device as much as possible, and can bring the heat sensitive body into contact with a heat transfer substrate without variation with a simple structure and is easy to manufacture.
5 考案の構成
本考案は磁性体からなる感熱体を、伝熱基体の
取付凹部内に圧入により固着される取付体の舌片
部にてその取付凹部の内面に圧接させるようにし
た構成である。5. Structure of the invention The present invention has a structure in which a heat-sensitive body made of a magnetic material is brought into pressure contact with the inner surface of the mounting recess at the tongue part of the mounting body, which is fixed by press-fitting into the mounting recess of the heat transfer base. .
6 考案の実施例
以下本考案の一実施例について図面を参照しな
がら説明する。1は熱機器としての圧力調理器の
外ケースで、これの内部にはヒータ2を有する熱
盤3が配設され、熱盤3上に鍋4が着脱可能に載
置されている。5は鍋4の上面をパツキング6を
介して気密に被う蓋で、圧力調整装置7を有して
いる。8は外ケース1内に設けた仕切板で、これ
の中央部に上面に開口部9aを有する***部9が
設けられ、熱盤3の中央部には開口部9aと対応
する開口部3aが設けられている。10は***部
9内に上下動可能に配設された伝熱基体としての
伝熱ケースで、これは例えばアルミニウム板の絞
り加工により下面が開放した有底筒状に形成され
たもので、上半部を下半部より径小に形成してそ
の上半部内面を取付凹部10aとしたものであ
り、コイルばね11にて常に上方に付勢されてい
てその上端面が開口部9a及び3aを順に介して
被感熱部分としての鍋4の底面に圧接されてい
る。12は磁気変態点を有する矩形筒状の磁性体
からなる感熱体で、これには検出用のコイル13
が巻装されている。14は例えばプレス打抜加工
でで形成された取付体としての略円形な取付板
で、外周部分に3個の舌片部15が外周方向に指
向するように形成されているとともにその取付板
14の舌片部15を除く外周部分にはバーリング
部14aが形成されている。そして、この取付板
14の舌片部15に夫々感熱体12が挿入されて
該取付板14が伝熱ケース10の取付凹部10a
内に圧入により嵌合され、感熱体12が取付凹部
10aの内底面に舌片部15により圧接されてい
る。6 Embodiment of the invention An embodiment of the invention will be described below with reference to the drawings. Reference numeral 1 denotes an outer case of a pressure cooker as a thermal device, and a heating plate 3 having a heater 2 is disposed inside the case, and a pot 4 is removably placed on the heating plate 3. Reference numeral 5 denotes a lid that airtightly covers the upper surface of the pot 4 via a packing 6, and has a pressure regulating device 7. Reference numeral 8 denotes a partition plate provided inside the outer case 1. A raised part 9 having an opening 9a on the upper surface is provided at the center of the partition plate 8, and an opening 3a corresponding to the opening 9a is provided at the center of the heating plate 3. It is provided. Reference numeral 10 denotes a heat transfer case as a heat transfer base disposed in the raised portion 9 so as to be movable up and down. The half part is formed to have a smaller diameter than the lower half part, and the inner surface of the upper half part is a mounting recess 10a, which is always urged upward by a coil spring 11, and the upper end surface is formed into openings 9a and 3a. are in pressure contact with the bottom surface of the pot 4 as a heat-sensitive part through the heat-sensitive portion. Reference numeral 12 denotes a heat sensitive body made of a rectangular cylindrical magnetic material having a magnetic transformation point, which includes a detection coil 13.
is wrapped. Reference numeral 14 denotes a substantially circular mounting plate as a mounting body formed by press punching, for example, and three tongue pieces 15 are formed on the outer periphery so as to be oriented toward the outer periphery. A burring portion 14a is formed on the outer peripheral portion excluding the tongue portion 15. The heat sensitive elements 12 are inserted into the tongue portions 15 of the mounting plate 14, and the mounting plate 14 is attached to the mounting recess 10a of the heat transfer case 10.
The heat sensitive element 12 is press-fitted into the mounting recess 10a by a tongue piece 15 on the inner bottom surface of the mounting recess 10a.
次に以上のように構成した本実施例の作用につ
いて説明する。ヒータ2の通電により熱盤3が加
熱され、その熱盤3により鍋4が加熱されると、
鍋4の温度に追従して伝熱ケース10の温度も変
化し、鍋4の温度が伝熱ケース10の取付凹部1
0aに圧接された感熱体12により検出される。
而して、伝熱ケース10が温度上昇して感熱体1
2が磁気変態点を超えると、外ケース1内に設け
た図示しない制御回路によりヒータ2への通電が
断たれ、その後鍋4の温度が低下して感熱体12
の磁気変態点以下の温度になると再びヒータ2が
通電されるようになり、鍋4は一定の温度範囲に
保たれつつ加熱され鍋4内の調理物が調理され
る。 Next, the operation of this embodiment configured as above will be explained. When the heating plate 3 is heated by energizing the heater 2, and the pot 4 is heated by the heating plate 3,
The temperature of the heat transfer case 10 changes in accordance with the temperature of the pot 4, and the temperature of the pot 4 changes to the mounting recess 1 of the heat transfer case 10.
It is detected by the heat sensitive body 12 that is pressed against Oa.
As a result, the temperature of the heat transfer case 10 rises and the temperature of the heat sensitive element 1 increases.
2 exceeds the magnetic transformation point, a control circuit (not shown) provided in the outer case 1 cuts off the power to the heater 2, and then the temperature of the pot 4 decreases and the heat sensitive element 12
When the temperature reaches below the magnetic transformation point, the heater 2 is energized again, and the pot 4 is heated while being maintained within a certain temperature range, and the food in the pot 4 is cooked.
このように構成した本実施例においては、伝熱
ケース10に対する感熱体12の固定を取付板1
4の舌片部15によつて行つているから、伝熱ケ
ース10全体の熱容量をプラスチツク等のモール
ド材を流し込んだ場合に比べて充分小さなものに
でき、鍋4の温度変化に対して感熱体12が良好
に追従し、鍋4の温度リツプルが極力減少され
る。そして、感熱体12の固定が取付板14を伝
熱ケース10の取付凹部10a内に圧入するとい
う簡単な構造でできるから製作が容易であるとと
もに感熱体12を舌片部15の弾性により伝熱ケ
ース10に圧接させるから接触度合をばらつきな
く一定にでき、設定温度のばらつきも少なくする
ことができる。 In this embodiment configured in this way, the heat sensitive body 12 is fixed to the heat transfer case 10 by the mounting plate 1.
4, the heat capacity of the entire heat transfer case 10 can be made sufficiently smaller than when molding material such as plastic is poured into the heat transfer case 10. 12 follows well, and the temperature ripple in the pot 4 is reduced as much as possible. The heat sensitive element 12 can be fixed with a simple structure in which the mounting plate 14 is press-fitted into the mounting recess 10a of the heat transfer case 10, so manufacturing is easy. Since it is brought into pressure contact with the case 10, the degree of contact can be made constant without variations, and variations in the set temperature can also be reduced.
7 考案の変形例
尚、熱機器としては圧力調理器の他に炊飯器等
にも適用できる。7. Modification of the invention In addition to the pressure cooker, the present invention can also be applied to a rice cooker, etc. as a heat appliance.
8 考案の効果
本考案は以上説明した実施例から明らかなよう
に、伝熱基体全体の熱容量を減少させて感熱体が
熱機器の被感熱部分の温度変化に対して良好に追
従できるようにし、以つて熱機器の温度リツプル
を極力減少させるとともに、簡単な構造で感熱体
を伝熱基体にばらつきなく接触させることができ
て製作が容易な熱機器の感熱体取付装置を提供で
きる。8. Effects of the invention As is clear from the embodiments described above, the present invention reduces the heat capacity of the entire heat transfer base so that the heat sensitive body can better follow the temperature change of the heat sensitive part of the thermal equipment. Therefore, it is possible to provide a heat sensitive body mounting device for a thermal device that can reduce the temperature ripple of the thermal device as much as possible, has a simple structure, can bring the heat sensitive body into contact with the heat transfer substrate without variation, and is easy to manufacture.
図面は本考案の一実施例を示すものであり、第
1図は一部切欠して示す縦断面図、第2図は要部
の拡大縦断面図、第3図は取付板単体の拡大斜視
図、第4図は感熱体単体の拡大斜視図である。
図面中、1は外ケース、4は鍋(被感熱部分)、
10は伝熱ケース(伝熱基体)、10aは取付凹
部、12は感熱体、14は取付板(取付体)、1
5は舌片部である。
The drawings show one embodiment of the present invention, in which Fig. 1 is a partially cutaway longitudinal sectional view, Fig. 2 is an enlarged longitudinal sectional view of the main part, and Fig. 3 is an enlarged perspective view of the mounting plate alone. FIG. 4 is an enlarged perspective view of the heat-sensitive body alone. In the drawing, 1 is the outer case, 4 is the pot (heat sensitive part),
10 is a heat transfer case (heat transfer base), 10a is a mounting recess, 12 is a heat sensitive element, 14 is a mounting plate (mounting body), 1
5 is a tongue portion.
Claims (1)
た取付凹部を有する伝熱基体と、磁気変態点を有
する磁性体からなる感熱体と、この感熱体の開口
部に挿入される舌片部を一体に有するとともに前
記取付凹部内に圧入により固着され該舌片部にて
前記感熱体を前記取付凹部の内面に圧接させる取
付体とを具備してなる熱機器の感熱体取付装置。 A heat transfer base having a mounting recess provided so as to be in contact with a heat sensitive part of a thermal device, a heat sensitive body made of a magnetic material having a magnetic transformation point, and a tongue piece inserted into an opening of the heat sensitive body. A heat-sensitive element mounting device for a thermal device, comprising: a mounting body which is integrally fixed in the mounting recess by press-fitting, and presses the heat-sensitive member into contact with the inner surface of the mounting recess at the tongue portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17100781U JPS5874418U (en) | 1981-11-16 | 1981-11-16 | Heat sensitive body mounting device for thermal equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17100781U JPS5874418U (en) | 1981-11-16 | 1981-11-16 | Heat sensitive body mounting device for thermal equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5874418U JPS5874418U (en) | 1983-05-19 |
JPS6312817Y2 true JPS6312817Y2 (en) | 1988-04-12 |
Family
ID=29962948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17100781U Granted JPS5874418U (en) | 1981-11-16 | 1981-11-16 | Heat sensitive body mounting device for thermal equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5874418U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62298312A (en) * | 1986-06-18 | 1987-12-25 | 松下電器産業株式会社 | Heat sensor |
-
1981
- 1981-11-16 JP JP17100781U patent/JPS5874418U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5874418U (en) | 1983-05-19 |
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