JPS63124430A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS63124430A
JPS63124430A JP61268580A JP26858086A JPS63124430A JP S63124430 A JPS63124430 A JP S63124430A JP 61268580 A JP61268580 A JP 61268580A JP 26858086 A JP26858086 A JP 26858086A JP S63124430 A JPS63124430 A JP S63124430A
Authority
JP
Japan
Prior art keywords
bonding
lead
wire
tool
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61268580A
Other languages
Japanese (ja)
Other versions
JPH0455529B2 (en
Inventor
Hideaki Miyoshi
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marine Instr Co Ltd
Original Assignee
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marine Instr Co Ltd filed Critical Marine Instr Co Ltd
Priority to JP61268580A priority Critical patent/JPS63124430A/en
Publication of JPS63124430A publication Critical patent/JPS63124430A/en
Publication of JPH0455529B2 publication Critical patent/JPH0455529B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To dispense with alignment by an operator by a method wherein bonding positions are detected and the bonding is performed in accordance with the detected values and the position of the cut edge of a wire is obtained and the wire is cut. CONSTITUTION:Pattern recognition of the pictures of a terminal 14 and a lead 12 is performed to obtain the center coordinates of the terminal 14 and the lead 12. Then the crossing angle theta between a bonding wire and the X-axis is obtained from those coordinates. Then a theta table 3 is turned by the crossing angle theta and a Y-table 5 is moved to transfer a tool 6 to the position above the bonding wire. In this state, the center coordinates of the terminal 14 and the lead 12 are obtained by calculation and the tool 6 is transferred by an X-table 5 and 1st bonding is carried out. After that, the tool 6 is transferred to the position above the center point of the lead 12 and 2nd bonding is carried out. Then the coordinates of a lead edge are calculated from the coordinates of the terminal 14 and the lead 12 and the tool 6 is transferred to the position above the lead edge and, if the tool 6 is made to descent by a Z movement device 7, the bonding wire is cut by shearing.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、パワートランジスタにおける半導体装置とリ
ードとの間のワイヤボンディングの如き、太線ワイヤに
よる、ボンディング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding device using a thick wire, such as wire bonding between a semiconductor device and a lead in a power transistor.

〔従来技術〕[Prior art]

従来、例えば、Ｏ−１＝　０　、５１１程度の太線ワイ
ヤボンディングにおいては、ワイヤボンディングのため
のツール先端と第１．第２ボンディング位置の位置合わ
せ及びワイヤ切断のためのツールエツジと第２ポンディ
ング位置のエツジの位置合わせは作業者がワイヤボンデ
ィングのたびに毎回手作業で行っていた。即ち、ツール
先端と第１ボンディング位置を作業者が合わせた後、第
１ポンデイングが行われ、次に第２ポンディング位置に
ツール先端を作業者が合せて後、第２ボンディングが行
われていた。そしてボンディング終了後は第２ポンディ
ング位置のエツジとツールのエツジの位置合わせも作業
者が行い、両者のせん断動作によってワイヤ切断を行っ
ていた。Conventionally, for example, in O-1=0, about 511 thick wire bonding, the tip of the tool for wire bonding and the first . The alignment of the second bonding position and the alignment of the tool edge for wire cutting and the edge of the second bonding position have been manually performed by an operator each time wire bonding is performed. That is, the first bonding was performed after the worker aligned the tip of the tool with the first bonding position, and then the second bonding was performed after the worker aligned the tip of the tool with the second bonding position. . After the bonding is completed, the operator also aligns the edge at the second bonding position with the edge of the tool, and the wire is cut by shearing action between the two.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従って、効率的なボンディング作業が行えず、また、ボ
ンディング位置にバラツキが生じることもあった。他方
、この位置合わせ作業は作業者にとって苛酷であった。Therefore, efficient bonding work cannot be performed, and variations may occur in bonding positions. On the other hand, this alignment work was difficult for the operator.

本発明は従来の問題点を解決しようとするもので、作業
者による位置合わせが不要でボンディング作業の安定性
、生産数の向上、コストダウンを図ることのできるワイ
ヤボンディング装置を提供することを目的とするもので
ある。The present invention is an attempt to solve the conventional problems, and an object of the present invention is to provide a wire bonding device that does not require alignment by an operator and can improve the stability of bonding work, increase production volume, and reduce costs. That is.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は上述の従来の問題点を解決するための手段とし
て、基板上に固設した半導体装置とリードとをワイヤで
ボンディングし、第２ボンディングを施された半導体装
置又はリードのエツジとボンディングツールのエツジと
でワイヤをせん断により切断する、ワイヤボンディング
装置において、前記基板を保持する保持フレームと、該
保持フレームと前記ポンディングツールとを互いに直角
なｘ、　ｙ、　　Ｚ方向に相対的に移動させるＸ，Ｙ，
Ｚ移動装置と、前記保持フレームと前記ポンディングツ
ールとをＺ方向の軸のまわりに相対的に回動せしめる回
転装置と、前記半導体装置と前記リードのそれぞれのボ
ンディング位置を検出する検出装置とを備え、前記検出
値に応じて前記Ｘ、　Ｙ。As a means for solving the above-mentioned conventional problems, the present invention provides bonding between a semiconductor device fixed on a substrate and a lead using a wire, and a bonding tool between the edge of the semiconductor device or the lead subjected to second bonding. In a wire bonding apparatus that cuts a wire by shearing with an edge of the substrate, a holding frame that holds the substrate, and the holding frame and the bonding tool are moved relative to each other in x, y, and Z directions perpendicular to each other. X, Y,
A Z moving device, a rotation device that relatively rotates the holding frame and the bonding tool around an axis in the Z direction, and a detection device that detects the respective bonding positions of the semiconductor device and the lead. and the X, Y according to the detected value.

Ｚ移動装置と回転装置とを駆動する駆動装置と、前記検
出値により第２ボンディングを施された半導体装置又は
リードのワイヤ切断エツジ位置を算出する算出装置と、
該算出値に応じて前記Ｘ、　Ｙ。a driving device that drives the Z moving device and the rotating device; a calculating device that calculates a wire cutting edge position of a semiconductor device or lead subjected to second bonding based on the detected value;
The above X, Y according to the calculated value.

Ｚ移動装置を駆動し、前記第２ボンディングを施された
半導体装置又はリードとポンディングツールのエツジに
せん断動作をせしめてワイヤを切断する駆動装置とを、
備えたことを特徴とするワイヤボンディング装置を提供
しようとするものである。a driving device that drives a Z moving device and cuts the wire by causing a shearing operation to the semiconductor device or lead subjected to the second bonding and the edge of the bonding tool;
An object of the present invention is to provide a wire bonding device characterized by the following features.

〔作　用〕[For production]

本発明は、上述の構成を備えているので、第１ポンディ
ング位置及び第２ポンディング位置を自動的に検出し、
該検出値に基づいてポンディングツール及び保持フレー
ムをボンディングのために相対的に移動させ、ボンディ
ングを行うことができる。Since the present invention has the above-described configuration, the first pounding position and the second pounding position are automatically detected,
Based on the detected value, the bonding tool and the holding frame can be relatively moved for bonding to perform bonding.

また、その第１．第２ポンディング位置の検出値に基づ
いてワイヤ切断エツジ位置を算出し、該算出値に基づい
てポンディングツール及び保持フレームをワイヤ切断の
ために相対的に移動させ、ワイヤ切断を行うことができ
る。Also, the first. A wire cutting edge position is calculated based on the detected value of the second bonding position, and the bonding tool and the holding frame are relatively moved for wire cutting based on the calculated value, thereby cutting the wire. .

〔実施例〕〔Example〕

本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.

第１図において、基板としてのパッケージ１を固定して
支える保持フレームとしての固定台２は回転装置である
θテーブル３に載置されている。In FIG. 1, a fixing base 2 serving as a holding frame that fixes and supports a package 1 serving as a substrate is placed on a θ table 3 that is a rotating device.

ボンディングヘッド４は互いに直角なＸ、Ｙ方向に移動
するＸ、Ｙ移動装置であるＸ、Ｙテーブル５に載置され
、ポンディングツール（以下ツールと略）６をＸ、Ｙ方
向に直角のＺ方向に移動する移動装置７によりＺ方向移
動可能に備えている。The bonding head 4 is placed on an X, Y table 5 which is an X, Y moving device that moves in the X, Y directions perpendicular to each other, and a bonding tool (hereinafter abbreviated as the tool) 6 is moved in the Z direction perpendicular to the X, Y directions. It is provided to be movable in the Z direction by a moving device 7 that moves in the Z direction.

固定台２の上方には検出カメラ８が備えられ、該検出カ
メラ８は認、諏ユニット９に、認識ユニット９は演算・
補正コントロール部１０に連絡されている。そして該コ
ントロール部１０はボンディング位置を算出し、またそ
の算出したボンディング位置に基づいてワイヤ切断位置
を算出してＸ。A detection camera 8 is provided above the fixed base 2, the detection camera 8 is connected to a recognition unit 9, and the recognition unit 9 is connected to a calculation unit 9.
The correction control unit 10 is contacted. Then, the control section 10 calculates the bonding position, and calculates the wire cutting position based on the calculated bonding position.

Ｙテーブル５、Ｚ移動装置７、θテーブル３の各駆動装
置に所要の駆動信号を出すようになっていて、検出カメ
ラ８、認識ユニット９、コントロール部工０は検出装置
及び算出装置を形成している。Required drive signals are output to each drive device of the Y table 5, Z moving device 7, and θ table 3, and the detection camera 8, recognition unit 9, and control section 0 form a detection device and a calculation device. ing.

Ｘ、Ｙテーブル５は、その駆動装置により、ツール６先
端を第１ボンディングの位置に合わせ、第１ボンディン
グ終了後は第２ボンディングの位置まで移動させ（この
ときワイヤはフリー状態）、第２ボンディングを終了し
た後は第２ボンディング位置のエツジにツール６のエツ
ジを合わせるようにボンディングヘッド４を動かずよう
になっている。The X, Y table 5 uses its drive device to align the tip of the tool 6 to the first bonding position, and after the first bonding is completed, moves it to the second bonding position (the wire is in a free state at this time), and then moves the tool 6 to the second bonding position. After completing this process, the bonding head 4 is not moved so that the edge of the tool 6 is aligned with the edge of the second bonding position.

２移動装置７ばその駆動装置により、ボンディングに所
要の上下動及びワイヤ切断に所要の」：下動をツール６
に与えるようになっている。2. The drive device of the moving device 7 allows the vertical movement required for bonding and the downward movement required for wire cutting to be performed by the tool 6.
It is designed to be given to

θテーブル３は、その駆動装置により第１ボンディング
位置と第２ボンディング位置とを結ぶ直線がＸ軸に平行
になるように固定台２を回転させるようになっている。The θ table 3 is configured to rotate the fixed base 2 by its driving device so that the straight line connecting the first bonding position and the second bonding position becomes parallel to the X axis.

ボンディングツール６ばアルミ線などのボンディングに
用いる超音波ウェッジボンディング用のウェッジである
。The bonding tool 6 is an ultrasonic wedge used for bonding aluminum wire and the like.

次にボンディング動作の一例を経過説明する。Next, an example of the bonding operation will be explained.

パッケージ１は半導体装置としての■Ｃチップ１］及び
ポスト状のリード１２．１３を固着された後、自動供給
機構（図示せず）により固定台２上に載置される。ＩＣ
チップ１１及びリード１２゜１３のパッケージ１への取
付はパッケージ１に対して誤差があり、パッケージ１の
固定台２への固定にも誤差が生じている。The package 1 is mounted on the fixing table 2 by an automatic feeding mechanism (not shown) after the package 1 is fixed with the C chip 1 as a semiconductor device and the post-shaped leads 12 and 13. IC
There is an error in attaching the chip 11 and the leads 12 and 13 to the package 1, and there is also an error in fixing the package 1 to the fixing base 2.

ＩＣチップ１１にはリード１２との間でワイヤボンディ
ングを行うターミナル１４とリード１３との間でワイヤ
ボンディングを行うターミナル１５が設けられている。The IC chip 11 is provided with a terminal 14 that performs wire bonding with the lead 12 and a terminal 15 that performs wire bonding with the lead 13.

ターミナル１４．１５のＩＣチップ１１への取付もＩＣ
チップ１１に対して誤差がある。Attachment of terminal 14 and 15 to IC chip 11 is also IC
There is an error with respect to chip 11.

先ず、ターミナル１４及びリード１２の位置を検出する
。First, the positions of the terminal 14 and lead 12 are detected.

ターミナル］、４Ａ、１５Ａを標準位置に且つ標準方向
を向けて備えたＩＣチップＩＩＡとり一ド１２Ａ、１３
Ａが標準位置に且つ標準方向を向けてパンケージＩＡに
取付けられ、そのパッケージＩＡが固定台２に標準位置
に且つ標準方向を向けて載置されているときの状態を第
２図に２点鎖線で示す。terminal], 4A, 15A in the standard position and facing the standard direction, IC chip IIA board 12A, 13
The two-dot chain line in Figure 2 shows the state when A is attached to the pan cage IA in the standard position and facing the standard direction, and the package IA is placed on the fixing base 2 in the standard position and facing the standard direction. Indicated by

予め座標がわかっているターミナル１４Ａ、リード１２
Ａのそれぞれの付近の視野をブラウン管上に投影してそ
の画面に含まれているターミナル１４、リード１２の画
像を輝度の変化などによりパターン認識を行ってターミ
ナル】４．リード１２の中心の座標を求める。Terminal 14A, lead 12 whose coordinates are known in advance
Project the field of view near each of A onto a cathode ray tube, perform pattern recognition on the images of the terminal 14 and lead 12 included in the screen by changes in brightness, etc.]4. Find the coordinates of the center of lead 12.

得られたターミナル１４とリード１２の中心の座標から
、ターミナル１４とボスト１２を結ぶ直線（ボンディン
グ線と呼ぶ）ＢＬのＸ軸との交角θを求める。From the obtained coordinates of the centers of the terminal 14 and the lead 12, the intersection angle θ of the straight line (referred to as a bonding line) BL connecting the terminal 14 and the post 12 with the X axis is determined.

そして、θテーブル３をその交角θだけ回転させてボン
ディング線ＢＬをＸ軸に平行とする。他方、Ｙテーブル
を動かしてツール６をボンディング線ＢＬ上に移動させ
る。Then, the θ table 3 is rotated by the intersection angle θ to make the bonding line BL parallel to the X axis. On the other hand, the Y table is moved to move the tool 6 onto the bonding line BL.

その状態でのターミナルエ４とリード１２の中心の座標
を演算により求め、第３図のようにツール６をＸテーブ
ルによりターミナル１４の中心点上方に移動させ、第１
ボンディングを行う。その後ツール６をリード１２の中
心点上方に移動させ、第２ボンディングを行う。In this state, the coordinates of the center of the terminal 4 and the lead 12 are calculated, and the tool 6 is moved above the center point of the terminal 14 using the X table as shown in FIG.
Perform bonding. Thereafter, the tool 6 is moved above the center point of the lead 12 to perform second bonding.

次にワイヤ切断を行うが、リード１２の周縁線とボンデ
ィング線ＢＬの２つの交点のうち、ターミナル１４から
遠い方の交点が切断用のり一ドエッジ１６となるので、
これも自動的に行うことができる。この例ではり一ド１
２の表面が円形なので、その径さえわかればボンディン
グの際に求めたターミナル１４、リード１２の座標から
り一ドエソジ１６の座標を演算により求めることができ
る。リード１２の表面が円形でない場合はリード１２が
第２図においてリード１２Ａと同一の標準方向を向いて
いればり一ド１２の周縁線を示す数式さえわかれば円形
のものと同様に既に得られた数値によりリードエツジ１
６の座標を求めることができるが、リード１２がリード
１２Ａと同じ方向を向いていす、ズしているときはズレ
角を公知の手段により求めてリードエツジ１６の座標を
求めなければならない。Next, the wire is cut, and of the two intersections between the peripheral line of the lead 12 and the bonding line BL, the intersection farther from the terminal 14 becomes the cutting glue edge 16.
This can also be done automatically. In this example,
Since the surface of the wire 2 is circular, once the diameter is known, the coordinates of the lead 16 can be calculated from the coordinates of the terminal 14 and lead 12 determined during bonding. If the surface of the lead 12 is not circular, as long as the lead 12 is oriented in the same standard direction as the lead 12A in FIG. Lead edge 1 depending on the number
However, if the lead 12 faces in the same direction as the lead 12A but is shifted, the coordinates of the lead edge 16 must be determined by determining the angle of shift using known means.

そして第４図に示すようにリードエツジ１６上方にツー
ル６のツールエツジ１７を移動させて、所要ｆｉＺ移動
装置７によりツール６を下降させればワイヤはせん断に
より切断される。Then, as shown in FIG. 4, when the tool edge 17 of the tool 6 is moved above the lead edge 16 and the tool 6 is lowered by the required fiZ moving device 7, the wire is cut by shearing.

ターミナル１５とリード１３の間のワイヤボンディング
も上述と同様な動作で行われ、第５図に示すようにボン
ディング作業が完了する。Wire bonding between the terminal 15 and the lead 13 is performed in the same manner as described above, and the bonding work is completed as shown in FIG.

以上、固定台２を回転させ、ツール６をＸ、　Ｙ。As above, rotate the fixed base 2 and move the tool 6 to X and Y.

Ｚ方向に移動させたが、回転及びＸ，Ｙ，Ｚ方向移動は
固定台２とツール６との間で相対的に行えばよい。Although the tool was moved in the Z direction, rotation and movement in the X, Y, and Z directions may be performed relatively between the fixed base 2 and the tool 6.

〔発明の効果〕〔Effect of the invention〕

本発明は、基板上に固設した半導体装置とリードとをワ
イヤでボンディングし、第２ボンディングを施された半
導体装置又はリードのエツジとボンディングツールのエ
ツジとでワイヤをせん断により切断する、ワイヤボンデ
ィング装置において、前記基板を保持する保持フレーム
と、該保持フレームと前記ボンディングツールとを互い
に直角なＸ，Ｙ，Ｚ方向に相対的に移動させるＸ，Ｙ，
Ｚ移動装置と、前記保持フレームと前記ボンディングツ
ールとを２方向の軸のまわりに相対的に回動せしめる回
転装置と、前記半導体装置と前記リードのそれぞれのボ
ンディング位置を検出する検出装置とを備え、前記検出
値に応じて前記ｘ、　ｙ。The present invention is a wire bonding method in which a semiconductor device fixed on a substrate and a lead are bonded with a wire, and the wire is cut by shearing between the edge of the semiconductor device or lead that has been subjected to second bonding and the edge of the bonding tool. In the apparatus, a holding frame that holds the substrate, and X, Y, and
A Z-moving device, a rotation device that relatively rotates the holding frame and the bonding tool around axes in two directions, and a detection device that detects bonding positions of the semiconductor device and the lead, respectively. , the x, y according to the detected value.

２移動装置と回転装置とを駆動する駆動装置と、前記検
出値により第２ボンディングを施された半導体装置又は
リードのワイヤ切断エツジ位置を算出する算出装置と、
該算出値に応じて前記ｘ、ｙ。a driving device that drives the second moving device and the rotating device; a calculating device that calculates a wire cutting edge position of the semiconductor device or lead subjected to the second bonding based on the detected value;
x, y according to the calculated value.

Ｚ移動装置を駆動し、前記第２ボンディングを施された
半導体装置又はリードとボンディングツールのエツジに
せん断動作をせしめてワイヤを切断する駆動装置とを、
備えたことを特徴とするワイヤボンディング装置を提供
することができるので、ボンディング作業を安定化、効
率化でき、従って生産数の向上、コストダウンを図るこ
とができる。a driving device that drives a Z moving device and cuts the wire by causing a shearing operation to the semiconductor device or lead subjected to the second bonding and the edge of the bonding tool;
Since it is possible to provide a wire bonding apparatus characterized by the above-mentioned features, it is possible to stabilize and improve the efficiency of bonding work, thereby increasing production volume and reducing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例の正面図、第２図はパッケージ
の拡大図、第３図及び第４図は動作説明の縦断面正面図
、第５図はボンディング終了後のパッケージの斜面図で
ある。 １・・・パッケージ、２・・・固定台、３・・・θテー
ブル、４・・・ボンディングヘッド、５・・・Ｘ、Ｙテ
ーブル、６・・・ツール、７・・・Ｚ移動装置、８川検
出カメラ、９・・・認識ユニット、１ｏ・・・演算・補
正コントロール部、１１・・・ＩＣチップ、１２・・・
リード、１３・・・リード、１４・・・ターミナル、１
５・・・ターミナル、１６・・・リードエツジ、１７・
・・フールエツジ。Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is an enlarged view of the package, Figs. 3 and 4 are vertical cross-sectional front views for explaining the operation, and Fig. 5 is a slope view of the package after bonding is completed. It is. DESCRIPTION OF SYMBOLS 1... Package, 2... Fixing base, 3... θ table, 4... Bonding head, 5... X, Y table, 6... Tool, 7... Z moving device, 8 river detection camera, 9... recognition unit, 1o... calculation/correction control section, 11... IC chip, 12...
Lead, 13... Lead, 14... Terminal, 1
5...Terminal, 16...Lead Edge, 17.
...Fool Edge.

Claims (1)

【特許請求の範囲】[Claims] （１）基板上に固設した半導体装置とリードとをワイヤ
でボンディングし、第２ボンディングを施された半導体
装置又はリードのエッジとボンディングツールのエッジ
とでワイヤをせん断により切断する、ワイヤボンディン
グ装置において、 前記基板を保持する保持フレームと、 該保持フレームと前記ボンディングツールとを互いに直
角なＸ，Ｙ，Ｚ方向に相対的に移動させるＸ，Ｙ，Ｚ移
動装置と、 前記保持フレームと前記ボンディングツールとをＺ方向
の軸のまわりに相対的に回動せしめる回転装置と、 前記半導体装置と前記リードのそれぞれのボンディング
位置を検出する検出装置とを備え、 前記検出値に応じて前記Ｘ，Ｙ，Ｚ移動装置と回転装置
とを駆動する駆動装置と、 前記検出値により第２ボンディングを施された半導体装
置又はリードのワイヤ切断エッジ位置を算出する算出装
置と、 該算出値に応じて前記Ｘ，Ｙ，Ｚ移動装置を駆動し、前
記第２ボンディング施された半導体装置又はリードとボ
ンディングツールのエッジにせん断動作をせしめてワイ
ヤを切断する駆動装置とを、 備えたことを特徴とするワイヤボンディング装置。(1) Wire bonding equipment that bonds a semiconductor device fixed on a substrate and a lead with a wire, and cuts the wire by shearing between the edge of the second bonded semiconductor device or lead and the edge of the bonding tool. , a holding frame that holds the substrate; an X, Y, and Z moving device that relatively moves the holding frame and the bonding tool in X, Y, and Z directions perpendicular to each other; and the holding frame and the bonding tool. a rotation device that rotates the tool relatively around an axis in the Z direction; and a detection device that detects the respective bonding positions of the semiconductor device and the lead; , a driving device that drives the Z moving device and the rotating device; a calculating device that calculates the wire cutting edge position of the semiconductor device or lead that has undergone the second bonding based on the detected value; , a Y, Z moving device, and a driving device that cuts the wire by causing a shearing operation to the semiconductor device or lead subjected to the second bonding and the edge of the bonding tool. Device.
JP61268580A 1986-11-13 1986-11-13 Wire bonder Granted JPS63124430A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61268580A JPS63124430A (en) 1986-11-13 1986-11-13 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61268580A JPS63124430A (en) 1986-11-13 1986-11-13 Wire bonder

Publications (2)

Publication Number Publication Date
JPS63124430A true JPS63124430A (en) 1988-05-27
JPH0455529B2 JPH0455529B2 (en) 1992-09-03

Family

ID=17460497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61268580A Granted JPS63124430A (en) 1986-11-13 1986-11-13 Wire bonder

Country Status (1)

Country Link
JP (1) JPS63124430A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109147A (en) * 1990-05-09 1992-04-28 Applied Magnetics Corporation Soldering tip for magnetic wire hookup

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109147A (en) * 1990-05-09 1992-04-28 Applied Magnetics Corporation Soldering tip for magnetic wire hookup

Also Published As

Publication number Publication date
JPH0455529B2 (en) 1992-09-03

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