JPS63120779A - Ink composition for dry lithographic plate use - Google Patents
Ink composition for dry lithographic plate useInfo
- Publication number
- JPS63120779A JPS63120779A JP61267950A JP26795086A JPS63120779A JP S63120779 A JPS63120779 A JP S63120779A JP 61267950 A JP61267950 A JP 61267950A JP 26795086 A JP26795086 A JP 26795086A JP S63120779 A JPS63120779 A JP S63120779A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- ink
- oil
- acid
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 14
- -1 amine compound Chemical class 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 11
- 238000009835 boiling Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 5
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 239000003921 oil Substances 0.000 abstract description 15
- 235000019198 oils Nutrition 0.000 abstract description 15
- 239000002253 acid Substances 0.000 abstract description 7
- 239000003208 petroleum Substances 0.000 abstract description 7
- 239000005011 phenolic resin Substances 0.000 abstract description 7
- 229920001568 phenolic resin Polymers 0.000 abstract description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 229910052740 iodine Inorganic materials 0.000 abstract description 4
- 239000011630 iodine Substances 0.000 abstract description 4
- 229920000768 polyamine Polymers 0.000 abstract description 4
- 239000003981 vehicle Substances 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract description 3
- 239000000944 linseed oil Substances 0.000 abstract description 3
- 235000021388 linseed oil Nutrition 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- 239000004970 Chain extender Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 235000012343 cottonseed oil Nutrition 0.000 abstract description 2
- 239000002385 cottonseed oil Substances 0.000 abstract description 2
- 239000002274 desiccant Substances 0.000 abstract description 2
- 239000003349 gelling agent Substances 0.000 abstract description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000010775 animal oil Substances 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000001052 yellow pigment Substances 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は水なし平版印刷において、耐地汚れ性が良好で
、かつ印刷適性の優れた水なし平版用インキ組成物に関
するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an ink composition for waterless lithographic printing that has good ground stain resistance and excellent printability.
（従来技術）
別荘の印刷の主流をなす湿し水によるインキ反撥性を利
用した平版印刷法に対して、かかる湿し水を必要としな
い平版印刷法を使用する水なし平版印刷法が提案され、
特にシリコーンゴムを非画線部にもうけた平版印刷用刷
版を用いて印刷する方法が実用化されている。(Prior art) In contrast to the lithographic printing method that utilizes the ink repellency of dampening water, which is the mainstream of printing for vacation homes, a waterless lithographic printing method that uses a lithographic printing method that does not require dampening water has been proposed. ,
In particular, a method of printing using a lithographic printing plate having silicone rubber in the non-image area has been put into practical use.
このような水なし平版印刷において従来の油性インキを
用いて印刷すると、地汚れが発生して好ましくないとい
うことが知られている。It is known that when conventional oil-based ink is used in such waterless planographic printing, scumming occurs, which is undesirable.
水なし平版印刷における地汚れ発生という現象は印刷中
に印刷機の駆動部やローラの摩擦に起因して版面の温度
が上昇し、インキ自体の凝集力が低下してしまい、本来
インキ反撥性であるべき非画線部にインキが付着するも
のである。The phenomenon of scumming in waterless lithographic printing is caused by the friction of the printing machine's drive unit and rollers during printing, which causes the temperature of the plate surface to rise and the cohesive force of the ink itself to decrease, which is due to the fact that the ink itself is not naturally repellent. The ink adheres to the non-image area where it should be.
このような現象は湿し水を使用する従来の平版印刷にお
いては、全く考慮する必要はなく、水なし平版印刷版に
発生する特有の問題である。なぜなら従来の湿し水を用
いる平版印刷の場合はインキ反撥機構が異なり、また湿
し水の蒸発により版面温度の上昇はかなり抑制されるの
で、このような地汚れ現象は考慮する必要がないし、イ
ンキの凝集力はむしろ小さいものが好ましいとされてい
る。Such a phenomenon does not need to be considered at all in conventional lithographic printing using dampening water, and is a problem unique to waterless lithographic printing plates. This is because in the case of conventional lithographic printing that uses dampening water, the ink repulsion mechanism is different, and the increase in plate surface temperature is considerably suppressed by the evaporation of dampening water, so there is no need to take this scumming phenomenon into consideration. It is said that it is preferable for the ink to have a small cohesive force.
これを改良するためにバインダー樹脂成分を高分子量化
して凝集力を上げ耐地汚れ性を改良する方法が考えられ
る。しかしながら、例えば油性インキ中の樹脂成分を従
来の方法で高分子量化しても、耐地汚れ性が良好で、か
つ印刷適性が優れ、また良好な印刷物を与える水なし平
版インキを得ることは難しい。In order to improve this problem, it is possible to consider a method of increasing the molecular weight of the binder resin component to increase the cohesive force and improve the dirt resistance. However, even if the resin component in an oil-based ink is made to have a high molecular weight by a conventional method, it is difficult to obtain a waterless lithographic ink that has good background stain resistance, excellent printability, and provides good printed matter.
（発明が解決しようとする問題点）
本発明は、かかる従来技術の諸欠点に鑑み創案されたも
ので、その目的は耐地汚れ性に優れ、かつ印計り適性の
優れた水なし平版用インキ組成物を提供することにある
。(Problems to be Solved by the Invention) The present invention was devised in view of the various shortcomings of the prior art, and its purpose is to develop a waterless lithographic ink that is excellent in stain resistance and suitable for stamping. An object of the present invention is to provide a composition.
（問題点を解決するための手段）
かかる本発明の目的は、沸点２００℃以上の炭化水素溶
媒中、乾性油ないし半乾性油中、あるいはこれらの混合
物の中で加熱攪拌溶解下に、少なくとも１種のビヒクル
用樹脂を活性水素を含有するアミン化合物で分子鎖伸長
せしめて得られた変性樹脂を含有することを特徴とする
水なし平版用インキ組成物によって達成される。(Means for Solving the Problems) The object of the present invention is to dissolve at least one of This is achieved by a waterless lithographic ink composition characterized by containing a modified resin obtained by elongating the molecular chain of a vehicle resin with an amine compound containing active hydrogen.
本発明に使用される沸点２００°Ｃ以上の炭化水素溶媒
としては、炭素数１２以上の脂肪族、脂環族、芳香族炭
化水素が広く使用出来るが、好ましくは、通常の油性イ
ンキ溶剤として使用されている沸点２００〜３５０’Ｃ
の石油系溶剤が使用され、例えばパラフィン系、イソパ
ラフィン系、α−副レフィン系、ナフテン系、芳香族含
有パラフィン系などの高沸点石油溶剤が挙げられる。As the hydrocarbon solvent with a boiling point of 200°C or more used in the present invention, aliphatic, alicyclic, and aromatic hydrocarbons having 12 or more carbon atoms can be widely used, but it is preferably used as a normal oil-based ink solvent. Boiling point 200-350'C
Examples of petroleum solvents used include high boiling point petroleum solvents such as paraffinic, isoparaffinic, α-arylefinic, naphthenic, and aromatic-containing paraffinic solvents.
本発明において乾性油としては、ヨウ素価１３０以上の
動植物油が使用でき、例えばアマニ油、オイチシカ油、
エノ油、キリ油、脱水ヒマシ油などおよびこれらの重合
体が挙げられ、また半乾性油としてはヨウ素価１００〜
１３０の動植物油で、例えば綿実油、大豆油、ゴマ油、
ナタネ油などやこれらの重合体が挙げられる。In the present invention, as the drying oil, animal and vegetable oils having an iodine value of 130 or more can be used, such as linseed oil, oiticica oil,
Eno oil, tung oil, dehydrated castor oil, etc., and their polymers are mentioned, and semi-drying oils include iodine value of 100 to 100.
130 animal and vegetable oils, such as cottonseed oil, soybean oil, sesame oil,
Examples include rapeseed oil and polymers thereof.
本発明において使用されるビヒクル用樹脂としては、フ
ェノール樹脂、ロジン変性フェノール樹脂、エポキシ樹
脂、キシレン樹脂、石油樹脂、アミノアルキッド樹脂、
アクリル樹脂等の公知のものが挙げられ、これらは単独
または２種以上混合して使用することができる。Vehicle resins used in the present invention include phenolic resins, rosin-modified phenolic resins, epoxy resins, xylene resins, petroleum resins, aminoalkyd resins,
Known resins such as acrylic resins can be used, and these resins can be used alone or in a mixture of two or more.
本発明において分子鎖伸長剤として用いられる活性水素
を含有するアミン化合物としては、エチルアミン、ｎ−
プロピルアミン、ｎ−ブチルアミン、ヘキシルアミン、
ラウリルアミン、ステアリルアミン、エタノールアミン
、アリルアミン等のモノアミン、エチレンジアミン、ト
リメチレンジアミン、テトラメチレンジアミン、ペンタ
メチレンジアミン、ヘキサメチレンジアミン等のジアミ
ン、ジエチレントリアミン、トリエチレンテトラミン、
ビスヒドロキシジエチレントリアミン等のポリアミンや
アミンアダクト等が有効に使用できる。Examples of the active hydrogen-containing amine compound used as a molecular chain extender in the present invention include ethylamine, n-
Propylamine, n-butylamine, hexylamine,
Monoamines such as laurylamine, stearylamine, ethanolamine, allylamine, diamines such as ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine,
Polyamines such as bishydroxydiethylenetriamine and amine adducts can be effectively used.
また、アミン誘導体としてのアミド化合物としては、ギ
酸、酢酸、プロピオン酸、イタコン酸、カプリル酸、グ
リコール酸、アクリル酸、ラウリン酸、ミリスチン酸、
パルミチン酸、ステアリン酸、オレイン酸、リノール酸
、リルイン酸等のモノカルボン酸、マロン酸、コハク酸
、グルタル酸、アジピン酸、ピメリン酸、スペリン酸、
アゼライン酸、セバシン酸、マレイン酸、フマール酸、
グイマー酸などの有機ジカルボン酸、トリメリット酸等
の有機トリカルボン酸、３，９−ビス（２カルボキシア
ルキル）２，４，８．１０−テトラオキサスピロウンデ
カン等の有機カルボン酸と前記のアミン、ジアミン、ポ
リアミン等との縮合物が挙げられる。In addition, amide compounds as amine derivatives include formic acid, acetic acid, propionic acid, itaconic acid, caprylic acid, glycolic acid, acrylic acid, lauric acid, myristic acid,
Monocarboxylic acids such as palmitic acid, stearic acid, oleic acid, linoleic acid, lyluic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, superric acid,
azelaic acid, sebacic acid, maleic acid, fumaric acid,
Organic dicarboxylic acids such as guimaric acid, organic tricarboxylic acids such as trimellitic acid, organic carboxylic acids such as 3,9-bis(2carboxyalkyl)2,4,8.10-tetraoxaspiroundecane, and the above-mentioned amines and diamines. , condensates with polyamines and the like.
本発明に用いられる活性水素を含有するアミン化合物は
上述のような構造組成のものであるが、取扱い、安全性
等を考慮すると、ポリアミド樹脂が好ましく、樹脂、溶
剤との相溶性の点から炭素数６〜６０の酸とポリアミン
からなるポリアミド樹脂が特に好ましく用いられる。The amine compound containing active hydrogen used in the present invention has the above-mentioned structural composition, but from the viewpoint of handling and safety, polyamide resin is preferable, and from the viewpoint of compatibility with the resin and solvent, carbon A polyamide resin composed of a polyamine and an acid having a number of 6 to 60 is particularly preferably used.
上記ポリアミド樹脂の分子量としては５００〜２０．０
００の範囲が好ましく、より好ましくは５００〜１０，
０００の範囲である。The molecular weight of the polyamide resin is 500 to 20.0.
The range is preferably 00, more preferably 500 to 10,
The range is 000.
本発明の変性樹脂は、沸点２００℃以上の炭化水素溶媒
中、乾性油ないし半乾性油中、おるいはこれらの混合物
中で加熱攪拌溶解下に、ビヒクル用樹脂あるいはこれら
の混合物と活性水素を含有するアミン化合物を反応させ
ることにより得られるものであるが、反応条件としては
通常温度７０〜２００℃の範囲が好ましく、より好まし
くは１ＯＯ〜１７０’Ｃであり、反応体の濃度としては
通常５〜８０重攪％が望ましく、より好ましくは２０〜
７０重量％が良い。この反応は印刷インキ用ワニス組成
物の製造工程において行うことができ、まず樹脂成分、
乾性油、溶媒を加えて加熱溶解し、次いで所定温度で、
活性水素を含有するアミン化合物を添加し、反応せしめ
るものである。また、これらの反応系に、インキ用ワニ
ス組成物成分として極性溶媒などが含まれていてもよく
、必要に応じて、他の成分を含有することもできる。The modified resin of the present invention is produced by combining the vehicle resin or a mixture thereof with active hydrogen while heating and stirring the solution in a hydrocarbon solvent with a boiling point of 200°C or higher, in a drying oil or semi-drying oil, or in a mixture thereof. It is obtained by reacting the amine compound contained therein, and the reaction conditions are usually in the range of 70 to 200°C, more preferably 100 to 170'C, and the concentration of the reactant is usually in the range of 5 to 200°C. ~80 weight stirring% is desirable, more preferably 20~
70% by weight is good. This reaction can be carried out in the manufacturing process of a varnish composition for printing ink, and first the resin component,
Drying oil and solvent are added and dissolved by heating, then at a specified temperature,
An amine compound containing active hydrogen is added and reacted. Furthermore, these reaction systems may contain a polar solvent or the like as a component of the ink varnish composition, and may also contain other components as necessary.
反応時間は目的とするインキ用ワニス組成物の要求特性
に応じて任意に選ぶことができるが、通常０．１〜３時
間、好ましくは０．３〜２時間である。The reaction time can be arbitrarily selected depending on the required characteristics of the intended ink varnish composition, but is usually 0.1 to 3 hours, preferably 0.3 to 2 hours.
本発明による変性樹脂を含有する組成物は、従来から通
常平版印刷用に用いられている公知の他のインキ成分を
加えてインキ化される。The composition containing the modified resin according to the present invention is made into an ink by adding other known ink components conventionally used for lithographic printing.
このような成分としては、必要に応じて追加される樹脂
成分、例えばフェノール樹脂、ロジン変性フェノール樹
脂、アルキッド樹脂、ロジンエステル、石油樹脂、マレ
イン酸樹脂等が、また乾性油、半乾性油等が必り、これ
らを単に添加しただけでも良いし、本発明で得られた樹
脂組成物とクツキングして用いてもよい。また、ゲル化
剤として、有機アルミニウム化合物等、公知のものが使
用できる。Such components include resin components added as necessary, such as phenolic resins, rosin-modified phenolic resins, alkyd resins, rosin esters, petroleum resins, maleic acid resins, etc., and drying oils, semi-drying oils, etc. Of course, these may be simply added, or they may be combined with the resin composition obtained in the present invention. Furthermore, known gelling agents such as organoaluminum compounds can be used.
また、インキとする場合の着色剤としては、無機ないし
有機系の顔料など従来のインキ組成物に使用されている
ものが用いられる。In addition, as a coloring agent when used as an ink, those used in conventional ink compositions, such as inorganic or organic pigments, are used.
さらに、例えばワックス、乾燥剤、グリース、分散剤、
充填剤、その他公知のものを必要に応じて使用すること
ができる。Additionally, waxes, desiccants, greases, dispersants,
Fillers and other known fillers can be used as necessary.
以上のような材料を用いて三本ロールで練肉したインキ
は地汚れ発生温度が高く、印刷適性に優れ、バランスの
とれた水なし平版印刷用インキとなすことができる。The ink kneaded using three rolls using the above-mentioned materials has a high scumming temperature, has excellent printability, and can be made into a well-balanced ink for waterless lithographic printing.
（実施例）
以下実施例により具体的に説明するが、本発明はこれに
制限されるものではない。(Example) The present invention will be specifically explained below using Examples, but the present invention is not limited thereto.
なお、実施例、比較例に用いられる部数は重量部である
。Note that the numbers used in Examples and Comparative Examples are parts by weight.
実施例１
０ジン変性フエノール樹脂（ポリスチレン基準重量平均
分子量５万）３７部、“舶純亜麻”Ｎｏ。Example 1 37 parts of zero gin-modified phenolic resin (weight average molecular weight based on polystyrene: 50,000), "Ship Pure Flax" No.
４（東新油脂（株）製乾性油）２０部、５号ソルベント
（日本石油（株）製炭化水素溶媒、沸点２７０〜３１０
’Ｃ）４０部を窒素流下に混合、加熱昇温し、２００℃
で６０分加熱攪拌した後に、ダイマー酸とジエチレント
リアミンとの縮合物（モル比１：１）のポリアミド化合
物（分子量＝５゜０００＞を３部加え、３０分間反応さ
せた。4 (drying oil manufactured by Toshin Yushi Co., Ltd.) 20 parts, No. 5 solvent (hydrocarbon solvent manufactured by Nippon Oil Co., Ltd., boiling point 270-310)
'C) 40 parts were mixed under nitrogen flow and heated to 200℃.
After heating and stirring for 60 minutes, 3 parts of a polyamide compound (molecular weight = 5°000>), which is a condensate of dimer acid and diethylenetriamine (mole ratio 1:1), was added and reacted for 30 minutes.
このようにして得られたワニス８５部に“セイ力ファー
スト″イエロー２３４０ （大日精化（株）製インキ用
黄色顔料）１５部を加えて、常法により、３本ロールで
混練し、インキＡを得た。To 85 parts of the varnish thus obtained, 15 parts of "Seiroku First" Yellow 2340 (yellow pigment for ink manufactured by Dainichiseika Chemical Co., Ltd.) was added, and the mixture was kneaded with three rolls in a conventional manner to form ink A. I got it.
実施例２
シクロペンタジェン系石油樹脂（重量平均分子量２，２
万）４２部、“′舶純亜麻仁油”ＮＯ，４１６部、５号
ソルベント４０部を窒素流下に混合、加熱溶解後、１８
０℃で加熱攪拌下にジエチレントリアミン２部を添加し
、３０分間加熱陽拌した。Example 2 Cyclopentadiene petroleum resin (weight average molecular weight 2,2
10,000), 416 parts of "'marine pure linseed oil" NO, 40 parts of No. 5 solvent were mixed under nitrogen flow, and after heating and dissolving, 18
2 parts of diethylenetriamine was added to the mixture while heating and stirring at 0° C., and the mixture was heated and stirred for 30 minutes.
このようにして１ｑられたインキ用ワニスから実施例１
と同様にしてインキ化を行い、インキＢを得た。Example 1 from the ink varnish prepared in this way
Ink B was obtained in the same manner as above.
実施例３
実施例１の組成において、ダイマー酸とジエチレントリ
アミンとの縮合物の代りに、リノール酸とへキサメチレ
ンジアミンとの縮合物（分子ｄ：３．０００＞を使用し
て、同様にワニス化、インキ化を行ない、インキＣを得
た。Example 3 In the composition of Example 1, a condensate of linoleic acid and hexamethylene diamine (molecule d: 3.000>) was used in place of the condensate of dimer acid and diethylenetriamine, and a varnish was formed in the same manner. , Ink C was obtained.
比較実施例１
実施例１において、ロジン変性フェノール樹脂を４０部
としてポリアミド化合物を使用しないで、同様にワニス
化、インキ化を行ない、インキＤを得た。Comparative Example 1 Ink D was obtained in the same manner as in Example 1 except that 40 parts of the rosin-modified phenol resin was used and the polyamide compound was not used.
比較実施例２
実施例２において、石油樹脂を４４部として、ジエチレ
ントリアミンを使用しないで、同様にワニス化、インキ
化を行ない、インキＥを得た。Comparative Example 2 Ink E was obtained in the same manner as in Example 2 except that 44 parts of petroleum resin was used and diethylenetriamine was not used.
上述の実施例および比較実施例で得られたインキＡ−Ｅ
について、それぞれの方法でインキ特性および印刷特性
を評価し、結果を表１に示した。Inks A-E obtained in the above examples and comparative examples
The ink characteristics and printing characteristics were evaluated using each method, and the results are shown in Table 1.
（インキ特性および評価方法）
版胴に温水を通じて版面を昇温できるように改良した印
刷機に、シリコーンゴムよりなる非粘着性層を有する水
なし平版を取り付け、湿し水を供給することなしに、版
面を昇温しながら印刷し、一定のベタ濃度において印刷
物に地汚れが発生した際の表面温度を地汚れ発生温度と
した。地汚れ発生温度の高いインキはど実用印刷におい
ても地汚れが発生しにくい。(Ink characteristics and evaluation method) A waterless lithographic plate with a non-adhesive layer made of silicone rubber was attached to a printing machine that had been improved so that the temperature of the plate surface could be raised by passing hot water through the plate cylinder, and the printing machine was used to print a printing machine without supplying dampening water. , printing was carried out while increasing the temperature of the printing plate, and the surface temperature at which scumming occurred on the printed matter at a constant solid density was taken as the scumming generation temperature. Ink with a high scumming temperature is less likely to cause scumming even in practical printing.
次に３０’Ｃにおいてこれらのインキの流動性（フロー
値）をスプレッドメーターで測定し、インコメ−ターで
タック値を測定した。また、インキのそれぞれについて
、水なし平版を用いて印刷を行ない、マクベス反射濃度
計で印刷物のベタ濃度０．９５のところの光沢値を６０
度鏡面反射光沢計で測定した。Next, the fluidity (flow value) of these inks was measured using a spread meter at 30'C, and the tack value was measured using an incometer. In addition, for each ink, printing was performed using a waterless lithographic plate, and the gloss value at a solid density of 0.95 of the printed matter was measured with a Macbeth reflection densitometer at 60.
Measured using a specular reflection glossmeter.
この結果から、本発明に基づくインキＡ、Ｃはブランク
インキＤに比較して、また、インキＢは、ブランクイン
キＥに比較して、地汚れ発生温度が高く、タック値が低
い等の点で優れていることがわかる。From this result, inks A and C based on the present invention have a higher scumming temperature and a lower tack value than blank ink D, and ink B has a higher scumming temperature and a lower tack value than blank ink E. It turns out that it is excellent.
実用印刷テストにおいても、インキＡ、ＣをインキＤと
、またインキＢをインキＥと比較したところ、インキＡ
、Ｂ、Ｃはいずれも、紙面の汚れの発生もなく、パイリ
ング、紙むけなどの印刷ト表１
ラブルが抑制されたものとなっていた。また印刷物の光
沢を測定したところ、インキＡ、Ｂ、Ｃ１は耐地汚れ性
が高いにもかかわらず、ブランクインキと同等で光沢の
ある印刷物が得られた。In a practical printing test, ink A and C were compared with ink D, and ink B was compared with ink E.
, B, and C, there was no occurrence of stains on the paper surface, and printing problems such as piling and paper peeling were suppressed. In addition, when the gloss of the printed matter was measured, inks A, B, and C1 produced printed matter that was as glossy as the blank ink, even though they had high soil stain resistance.
（発明の効果）
本発明による分子鎖伸長樹脂をバインダー樹脂成分とし
て含有する水なし平版用インキ組成物は、耐地汚れ性が
良好で、かつ印刷適性の優れたものとなる。(Effects of the Invention) A waterless lithographic ink composition containing the molecular chain extension resin according to the present invention as a binder resin component has good background stain resistance and excellent printability.
Claims (1)
性油中、あるいはこれらの混合物中で加熱攪拌溶解下に
、少なくとも１種のビヒクル用樹脂を活性水素を含有す
るアミン化合物で分子鎖伸長せしめて得られた変性樹脂
を含有することを特徴とする水なし平版用インキ組成物
。At least one vehicle resin is subjected to molecular chain elongation with an amine compound containing active hydrogen while dissolving under heating and stirring in a hydrocarbon solvent with a boiling point of 200° C. or higher, in a drying oil or a semi-drying oil, or in a mixture thereof. An ink composition for waterless lithographic printing, characterized in that it contains a modified resin obtained by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267950A JPS63120779A (en) | 1986-11-11 | 1986-11-11 | Ink composition for dry lithographic plate use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267950A JPS63120779A (en) | 1986-11-11 | 1986-11-11 | Ink composition for dry lithographic plate use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63120779A true JPS63120779A (en) | 1988-05-25 |
| JPH04507B2 JPH04507B2 (en) | 1992-01-07 |
Family
ID=17451850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61267950A Granted JPS63120779A (en) | 1986-11-11 | 1986-11-11 | Ink composition for dry lithographic plate use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63120779A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2223771A1 (en) * | 2007-11-27 | 2010-09-01 | Harima Chemicals, Inc. | Flux for soldering and soldering paste composition |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5985136B2 (en) | 2009-03-19 | 2016-09-06 | ソニー株式会社 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
| JP5442394B2 (en) | 2009-10-29 | 2014-03-12 | ソニー株式会社 | SOLID-STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014561A (en) * | 1973-05-03 | 1975-02-15 | ||
| JPS575273A (en) * | 1980-06-13 | 1982-01-12 | Meidensha Electric Mfg Co Ltd | Metal-halogen battery |
| JPS5837069A (en) * | 1981-08-28 | 1983-03-04 | Ricoh Co Ltd | Litho printing ink which does not require dampening water |
| JPS59196374A (en) * | 1983-04-21 | 1984-11-07 | Toray Ind Inc | Dry lithographic ink composition |
| JPS6059269A (en) * | 1983-06-17 | 1985-04-05 | ブイジユ | Concrete structural member and its production method and apparatus |
-
1986
- 1986-11-11 JP JP61267950A patent/JPS63120779A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014561A (en) * | 1973-05-03 | 1975-02-15 | ||
| JPS575273A (en) * | 1980-06-13 | 1982-01-12 | Meidensha Electric Mfg Co Ltd | Metal-halogen battery |
| JPS5837069A (en) * | 1981-08-28 | 1983-03-04 | Ricoh Co Ltd | Litho printing ink which does not require dampening water |
| JPS59196374A (en) * | 1983-04-21 | 1984-11-07 | Toray Ind Inc | Dry lithographic ink composition |
| JPS6059269A (en) * | 1983-06-17 | 1985-04-05 | ブイジユ | Concrete structural member and its production method and apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2223771A1 (en) * | 2007-11-27 | 2010-09-01 | Harima Chemicals, Inc. | Flux for soldering and soldering paste composition |
| EP2223771A4 (en) * | 2007-11-27 | 2012-09-26 | Harima Chemicals Inc | Flux for soldering and soldering paste composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04507B2 (en) | 1992-01-07 |
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