JPS63119734A - Endoscope - Google Patents
EndoscopeInfo
- Publication number
- JPS63119734A JPS63119734A JP62234760A JP23476087A JPS63119734A JP S63119734 A JPS63119734 A JP S63119734A JP 62234760 A JP62234760 A JP 62234760A JP 23476087 A JP23476087 A JP 23476087A JP S63119734 A JPS63119734 A JP S63119734A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solid
- distal end
- image sensor
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 238000003384 imaging method Methods 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Landscapes
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
- Endoscopes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は挿入部の先端部内に電子部品が設けられる内
視鏡に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an endoscope in which electronic components are provided within the distal end of the insertion section.
近時、内視鏡の挿入部の先端部内に固体撮像素子を設け
、この固体撮像素子によって観察窓に対向して配置され
た対物レンズ系で結像された光学像を電気信号に変換し
、この電気信号を信号処理してモニタに画像として写し
出すことが行なわれている。このような構造によると、
光学繊維束からなるイメージガイドを用いた場合のよう
にイメージガイドの折損によって良好な観察が行なえな
くなった）、観察像を限られた人数でしか見ることがで
きないなどの欠点を除去することができる。Recently, a solid-state image sensor is installed in the tip of the insertion section of an endoscope, and the solid-state image sensor converts an optical image formed by an objective lens system placed opposite the observation window into an electrical signal. This electrical signal is processed and displayed as an image on a monitor. According to this structure,
This eliminates drawbacks such as when using an image guide made of an optical fiber bundle, in which good observation cannot be performed due to breakage of the image guide, and the observation image can only be viewed by a limited number of people. .
ところで、このような内視鏡においては、上記挿入部の
先端部内に上記固体撮像素子に接続されて回路基板が設
けられる。この回路基板には上記固体撮像素子の他に、
増重回路や周辺回路用の種種の電子部品が取付けられる
とともに、信号ケーブルも接続される。そのため、上記
回路基板は上記各部品を接続するために大きな接続面積
が必要となシ、小形化するのに限界がある。Incidentally, in such an endoscope, a circuit board is provided within the distal end portion of the insertion portion and connected to the solid-state imaging device. In addition to the solid-state image sensor mentioned above, this circuit board also includes
Various electronic components for redundant circuits and peripheral circuits are installed, and signal cables are also connected. Therefore, the circuit board requires a large connection area to connect the various components, and there is a limit to miniaturization.
このように大きな面積の回路基板を挿入部の先端部内に
配設する〈際し、固体撮像素子を挿入部の軸線とほぼ直
角に設け、この固体撮像素子と平行に上記回路基板を設
けるようにすると、この回路基板によって上記先端部が
大径化することになる。ｉた、固体撮像素子を挿入部の
軸線方向に沿って設け、回路基板もこの固体撮像素子と
同様挿入部の軸線と平行に設けるようにすると、上記回
路基板の形状によって先端部の大径化を招いたシ、先端
硬質部が長くなるという欠点が生じる。When disposing such a large-area circuit board within the distal end of the insertion tube, the solid-state imaging device is placed almost perpendicular to the axis of the insertion portion, and the circuit board is placed parallel to the solid-state imaging device. Then, this circuit board causes the tip portion to have a larger diameter. In addition, if the solid-state imaging device is installed along the axial direction of the insertion section, and the circuit board is also installed parallel to the axis of the insertion section, like the solid-state imaging device, the diameter of the distal end can be increased due to the shape of the circuit board. This results in the disadvantage that the hard tip portion becomes longer.
この発明は上記事情にもとづきなされたもので、その目
的とするところは、回路基板に対する電子部品や信号ケ
ーブルなどの接続面積を増大させても、それによって先
端部の大径化や硬質部の長尺化を招くことがないよう＜
１．た内視鏡を提供することにある。This invention was made based on the above circumstances, and its purpose is to increase the connection area of electronic components and signal cables to the circuit board, thereby increasing the diameter of the tip and the length of the hard part. So as not to lead to scaled-up <
1. The objective is to provide an endoscope with improved performance.
〔問題点を解決するための手段および作用〕上記問題点
を解決するためにこの発８ＩＩは、挿入部の先端部に固
体撮像素子を設け、この固体撮像素子に回路基板を、上
記固体撮像素子との接続部をほぼ平行にして接続すると
ともに、上記先端部内で屈曲させる。このようＫするこ
とにより、回路基板が上記先端部において占める径方向
と軸方向の寸法を小さくする。[Means and effects for solving the problem] In order to solve the above problem, this invention 8II provides a solid-state image sensor at the distal end of the insertion section, a circuit board on the solid-state image sensor, and a circuit board on the solid-state image sensor. The connecting portion is made almost parallel to the connecting portion, and the tip portion is bent within the tip portion. By making K in this way, the radial and axial dimensions that the circuit board occupies at the tip are reduced.
以下、この発明の一実施例を第１図と第２図を参照して
説明する。第１図中１は内視鏡の操作部である。こ−の
操作部１ｔ／Ｃは挿入部２と末端にコネク９３ｆ：有す
るユニバーサルコード４とが連結されている。上記挿入
部２は、可撓管部５の先端に湾曲部６と先端部７とが順
次設けられてなり、上記湾曲部６は上記操作部１に設け
られたアングルノブ８で遠隔的に湾曲操作することがで
きるようになっている。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Reference numeral 1 in FIG. 1 is an operating section of the endoscope. The operating portion 1t/C is connected to the insertion portion 2 and a universal cord 4 having a connector 93f at its end. The insertion section 2 has a bending section 6 and a distal end section 7 sequentially provided at the distal end of a flexible tube section 5, and the bending section 6 can be bent remotely using an angle knob 8 provided on the operation section 1. It is now possible to operate.
上記先端部７は第２図に示すように上記湾曲部６を形成
する可動節輪９が回動自在に連結された円筒状の固定節
輪１０を備えている。この固定節輪１０ Ｋは、先端に
本体１１が嵌入されねじ１２によりて固定されていると
ともに、内周に電気絶縁材料、たとえば合成樹脂やゴム
などから形成された筒状体１３が嵌入されねじ１４によ
って固定されている。上記本体１１にはカバーガラスか
らなる照明窓１５と観察窓１６が形成されている。また
、本体１ノには照明窓１５と観察窓１６に各々一端を対
向させた第１の取付孔１１と第２の取付孔１８とが軸方
向に穿設されている。第１の取付孔１１には保持管１９
が嵌着され、この保持管１９に′は光学繊維束からなる
ライトガイド２０の先端部が保持されている。ｔた、第
２の取付孔１８にはこの内部にｔｌＸｌのホルダ２°ｌ
に保持された対物レンズ系２２が設けられているととも
に、この対物レンズ系２２と対向して第２のホルダ２３
Ｉｃ保持された電子部品でｉる固体撮像素子２４が上記
本体１１の後端面側に突出して設けられている。As shown in FIG. 2, the distal end portion 7 includes a cylindrical fixed node ring 10 to which a movable node ring 9 forming the curved portion 6 is rotatably connected. This fixed node ring 10K has a main body 11 fitted into its tip and fixed with a screw 12, and a cylindrical body 13 made of an electrically insulating material, such as synthetic resin or rubber, fitted into the inner periphery and screwed. It is fixed by 14. The main body 11 is formed with an illumination window 15 and an observation window 16 made of a cover glass. Further, a first mounting hole 11 and a second mounting hole 18 are bored in the axial direction in the main body 1, with one end facing the illumination window 15 and the observation window 16, respectively. A holding pipe 19 is provided in the first mounting hole 11.
is fitted into the holding tube 19, and the tip of a light guide 20 made of an optical fiber bundle is held in this holding tube 19. In addition, there is a tlXl holder 2°l inside the second mounting hole 18.
A second holder 23 is provided opposite to the objective lens system 22.
A solid-state image sensor 24, which is an electronic component held by Ic, is provided to protrude from the rear end surface of the main body 11.
この固体Ｆｊ＆像素子２４は・母ツケージ２５と、この
パッケージ２５に設けられた半導体テップ２６と、この
チップ２６を覆う透明な°ガラスフィルタ２７とから構
成されている。上記第２のホルダ２３はねじ２８によつ
て本体１１に固定されている。This solid state Fj & image element 24 is composed of a mother package 25, a semiconductor chip 26 provided on this package 25, and a transparent glass filter 27 covering this chip 26. The second holder 23 is fixed to the main body 11 with screws 28.
上記固体撮像素子２４のパッケージ２５には電子部品で
あるフレキシブルな回路基板２９が一端部を上記固体撮
像素子２４とほぼ平行にして電気的に接続されて取着さ
れている。この回路基板２９は他端部が先端部７の軸線
と平行になるようほぼ直角に湾曲させられ、その他端部
に設けられた固定用チツｆ 、ｑ ｏを介してねじ３１
によシ上記筒状体１３に固定されている。つまり、回路
基板１−９は筒状体１３内に収容されている。さらに、
回路基板２９の中途部や他端部にはたとえば増幅回路な
どを形成する複数の電子部品３２が取着されているとと
もに、固定端側である他端部には信号ケーブルとしての
リード線３３が電気的絶縁性の接着剤３４によって接続
されている。したがって、上記対物レンズ系２２からの
光学像は固体撮像素子２４によって電気信号に変換され
、回路基板２９に設けられた電子部品３２で種々の処理
がなされたのち、リード線３３によって内視鏡の手元側
に伝送されるようになっている。なお、上記回路基板２
９Ｖｃは内蔵物であるライトガイド２０が挿通される通
孔３５が電子部品３２やリード線３３が接続されていな
い個所に穿設されている。A flexible circuit board 29, which is an electronic component, is attached to the package 25 of the solid-state image sensor 24 with one end thereof being electrically connected to the solid-state image sensor 24 with its end substantially parallel to the solid-state image sensor 24. This circuit board 29 is curved at a substantially right angle so that its other end is parallel to the axis of the tip 7, and screws 31 are inserted through fixing holes f and qo provided at the other end.
It is fixed to the cylindrical body 13. That is, the circuit board 1 - 9 is housed within the cylindrical body 13 . moreover,
A plurality of electronic components 32 forming, for example, an amplifier circuit are attached to the middle part and the other end of the circuit board 29, and a lead wire 33 as a signal cable is attached to the other fixed end. They are connected by an electrically insulating adhesive 34. Therefore, the optical image from the objective lens system 22 is converted into an electrical signal by the solid-state image sensor 24, and after various processing is performed by the electronic component 32 provided on the circuit board 29, the endoscope is connected to the lead wire 33. It is configured to be transmitted to the local side. Note that the circuit board 2
9Vc has a through hole 35 through which the built-in light guide 20 is inserted, at a location where the electronic components 32 and lead wires 33 are not connected.
また、上記固定節輪１０の後端部にはその周壁の一部を
径方向内方へ突出させた一対の取付部３６が周方向に１
８０度ずれて形成されている。これら取付部３６には上
記アングルノブ８によって押し引きされる操作ワイヤ３
１の先端が固着されている。したがって、操作ワイヤ３
１ｙ＆：押し引きすることにより、湾曲部６を湾曲させ
て先端部１の向きを変えることができる。Further, at the rear end portion of the fixed node ring 10, a pair of mounting portions 36 having a part of the peripheral wall protruding inward in the circumferential direction are provided.
They are formed 80 degrees apart. These mounting portions 36 have operating wires 3 that are pushed and pulled by the angle knob 8.
The tip of 1 is fixed. Therefore, the operating wire 3
1y&: By pushing and pulling, the bending portion 6 can be bent and the direction of the tip portion 1 can be changed.
なお、図中３８は挿入部２の外皮であ）、３９はブレー
ド、４０け先端部７の本体１１を被覆した弾性材である
。Note that in the figure, 38 is the outer skin of the insertion portion 2), 39 is a blade, and an elastic material that covers the main body 11 of the distal end portion 7.
このような構造の内視ｆＲＫよれば、回路基板２９をほ
ぼ直角に屈曲させたことくよってこの回路基板２９に対
する固体撮像素子２４、電子部品３２あるいはリード線
３３の接続部を先端部１の軸方向と直角な方向、斜めの
方向および平行な方向に分散させることができる。した
がって、上記回路基板２９の接続部が一方向にだけ設け
られる場合に比べ先端部１を細径化した秒、硬質部長を
短かくすることができる。According to the internal vision fRK having such a structure, the circuit board 29 is bent at an almost right angle, so that the connection portions of the solid-state image sensor 24, electronic components 32, or lead wires 33 to the circuit board 29 are aligned with the axis of the tip portion 1. It can be distributed perpendicularly, diagonally and parallel to the direction. Therefore, compared to the case where the connection portion of the circuit board 29 is provided only in one direction, the diameter of the tip portion 1 is reduced, and the hard portion can be shortened.
また、回路基板２９に内薦物であるライトガイド２０を
挿通する通孔３５を穿設し、他の内蔵物がない所に電子
部品３２やリード線３３を接続するようにした。したが
って、先端部７を細径化させるレイアウトが可能となり
、それによって細径化を計ることができる。Further, a through hole 35 is formed in the circuit board 29 through which the recommended light guide 20 is inserted, and an electronic component 32 and a lead wire 33 are connected to a place where there are no other built-in components. Therefore, it is possible to create a layout in which the tip portion 7 is made smaller in diameter, thereby making it possible to make the diameter smaller.
第３図は回路基板２９とリード線３３との接続構造を示
すこの発明の他の実施例である。つまり、この実施例は
回路基板２９の端部に端子４５が一体的に設けられた固
定用チップ４６を取着し、上記端子４５にリード線３３
を接続するようにした。FIG. 3 shows another embodiment of the present invention showing a connection structure between the circuit board 29 and the lead wires 33. In FIG. That is, in this embodiment, a fixing chip 46 having a terminal 45 integrally provided is attached to the end of the circuit board 29, and the lead wire 33 is attached to the terminal 45.
I tried to connect it.
また、固定用チツｆ４６は上記一実施例と同様ねじ４１
によって筒状体１３に固定される。Also, the fixing screw f46 is the screw 41 as in the above embodiment.
It is fixed to the cylindrical body 13 by.
このような構造によれば、湾曲部６の湾曲操作によって
リード線３３に応力が発生しても、この応力が固定用チ
ップ４６で吸収され、回路基板２９が湾曲させられると
いうことがないから、回路基板２９が損傷させられたシ
、必要以上に湾曲させられるのが防止される。According to such a structure, even if stress is generated in the lead wire 33 due to the bending operation of the bending portion 6, this stress is absorbed by the fixing chip 46, and the circuit board 29 is not bent. This prevents the circuit board 29 from being damaged or being bent more than necessary.
以上述べたようにこの発明は、挿入部の先端部に設けら
れる固体撮像素子に対して回路基板を、上記固体撮像素
子との接続部をほぼ千行くして接続するとともに、上記
先端部内で屈曲させるようにした。したがって、回路基
板に対する上記固体撮像素子や他の電子部品などの接続
部を種々の方向に分散できるから、先端部を細径化でき
るはかシか、硬質部長を短かくできるなどの利点を有す
る。As described above, the present invention connects the circuit board to the solid-state imaging device provided at the distal end of the insertion section with the connecting portion to the solid-state imaging device being approximately 1,000 lines, and bends the circuit board within the distal end. I tried to let them do it. Therefore, since the connection parts of the solid-state image sensor and other electronic components to the circuit board can be distributed in various directions, there are advantages such as the ability to make the diameter of the tip part thinner and the rigid part shorter. .
第１図はこの発明の一実施例を示す内視鏡の構成図、第
２図は同じく′挿入部の先端部の断面図、第３図はこの
発明の他の実施例を示すプリント基板とリード線との接
続構造の断面図である。
２・・・挿入部、２４・・・固体撮像素子、２９・・・
回路基板、３２・・・電子部品、３３・・・リード線。
出願人代理人 弁理士 坪 井 淳第１図Fig. 1 is a configuration diagram of an endoscope showing one embodiment of the present invention, Fig. 2 is a sectional view of the distal end of the insertion section, and Fig. 3 is a printed circuit board showing another embodiment of the invention. FIG. 3 is a cross-sectional view of a connection structure with lead wires. 2... Insertion section, 24... Solid-state image sensor, 29...
Circuit board, 32...Electronic component, 33... Lead wire. Applicant's agent Patent attorney Atsushi Tsuboi Figure 1
Claims (1)
子に回路基板を、上記固体撮像素子との接続部をほぼ平
行にして接続するとともに、上記先端部内で屈曲させて
なることを特徴とする内視鏡。A solid-state imaging device is provided at the distal end of the insertion portion, and a circuit board is connected to the solid-state imaging device with the connection portion to the solid-state imaging device being substantially parallel, and is bent within the distal end. endoscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62234760A JPS63119734A (en) | 1987-09-21 | 1987-09-21 | Endoscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62234760A JPS63119734A (en) | 1987-09-21 | 1987-09-21 | Endoscope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63119734A true JPS63119734A (en) | 1988-05-24 |
Family
ID=16975924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62234760A Pending JPS63119734A (en) | 1987-09-21 | 1987-09-21 | Endoscope |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63119734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06285018A (en) * | 1993-03-30 | 1994-10-11 | Olympus Optical Co Ltd | Electronic endoscope |
-
1987
- 1987-09-21 JP JP62234760A patent/JPS63119734A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06285018A (en) * | 1993-03-30 | 1994-10-11 | Olympus Optical Co Ltd | Electronic endoscope |
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