JPS63115252U - - Google Patents
Info
- Publication number
- JPS63115252U JPS63115252U JP738287U JP738287U JPS63115252U JP S63115252 U JPS63115252 U JP S63115252U JP 738287 U JP738287 U JP 738287U JP 738287 U JP738287 U JP 738287U JP S63115252 U JPS63115252 U JP S63115252U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- paste
- coupling agent
- board characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 3
- 239000007822 coupling agent Substances 0.000 claims 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP738287U JPS63115252U (fr) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP738287U JPS63115252U (fr) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115252U true JPS63115252U (fr) | 1988-07-25 |
Family
ID=30790780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP738287U Pending JPS63115252U (fr) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115252U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0554714A (ja) * | 1991-08-22 | 1993-03-05 | Dai Ichi Kogyo Seiyaku Co Ltd | 導電ペースト組成物 |
-
1987
- 1987-01-21 JP JP738287U patent/JPS63115252U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0554714A (ja) * | 1991-08-22 | 1993-03-05 | Dai Ichi Kogyo Seiyaku Co Ltd | 導電ペースト組成物 |
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