JPS63115206U - - Google Patents
Info
- Publication number
- JPS63115206U JPS63115206U JP787487U JP787487U JPS63115206U JP S63115206 U JPS63115206 U JP S63115206U JP 787487 U JP787487 U JP 787487U JP 787487 U JP787487 U JP 787487U JP S63115206 U JPS63115206 U JP S63115206U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- semi
- substrate
- covered
- hardening resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図Ａ〜Ｄは、本考案のチツプコンデンサー
の構成及びその基板へのマウント手段を示す。第
２図は、本考案に使用する半硬化性樹脂の性質を
示す図である。第３図Ａ，Ｂは、従来のチツプコ
ンデンサーの基板へのマウント方法を示す。第４
図Ａ，Ｂは、従来のチツプコンデンサーの問題点
を示す。
１……コンデンサーチツプ、２……基板、３…
…配線電極、４……導電性ペースト、５……樹脂
、６……半硬化性樹脂、７……コンデンサー電極
、８……コンデンサー本体。
1A to 1D show the structure of the chip capacitor of the present invention and the means for mounting it on a substrate. FIG. 2 is a diagram showing the properties of the semi-curing resin used in the present invention. 3A and 3B show a conventional method for mounting a chip capacitor on a substrate. Fourth
Figures A and B show problems with conventional chip capacitors. 1... Capacitor chip, 2... Board, 3...
... Wiring electrode, 4 ... Conductive paste, 5 ... Resin, 6 ... Semi-hardening resin, 7 ... Capacitor electrode, 8 ... Capacitor body.
Claims (1)
子部品に於て、電極のコンタクト部分以外が半硬
化性樹脂により被覆されていることを特徴とする
電子部品。 1. An electronic component mounted on a substrate having electrodes on both sides, characterized in that the parts other than the contact portions of the electrodes are covered with a semi-hardening resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787487U JPS63115206U (en) | 1987-01-22 | 1987-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787487U JPS63115206U (en) | 1987-01-22 | 1987-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115206U true JPS63115206U (en) | 1988-07-25 |
Family
ID=30791735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP787487U Pending JPS63115206U (en) | 1987-01-22 | 1987-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115206U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269003A (en) * | 1999-03-17 | 2000-09-29 | Marcon Electronics Co Ltd | Ceramic varistor and its manufacture |
| JP2014116570A (en) * | 2012-12-11 | 2014-06-26 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method of the same |
| JP2015115392A (en) * | 2013-12-10 | 2015-06-22 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
| WO2016093153A1 (en) * | 2014-12-10 | 2016-06-16 | 東光株式会社 | Electronic component and method of manufacturing same |
| WO2016121575A1 (en) * | 2015-01-30 | 2016-08-04 | 株式会社村田製作所 | Method for producing electronic component, and electronic component |
| WO2017110136A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社村田製作所 | Electronic component mounting structure, electronic component, and method for forming electronic component mounting structure |
-
1987
- 1987-01-22 JP JP787487U patent/JPS63115206U/ja active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269003A (en) * | 1999-03-17 | 2000-09-29 | Marcon Electronics Co Ltd | Ceramic varistor and its manufacture |
| JP2014116570A (en) * | 2012-12-11 | 2014-06-26 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method of the same |
| US8879238B2 (en) | 2012-12-11 | 2014-11-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
| JP2015115392A (en) * | 2013-12-10 | 2015-06-22 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
| TWI658478B (en) * | 2014-12-10 | 2019-05-01 | 日商村田製作所股份有限公司 | Electric component and method for manufacturing the same |
| WO2016093153A1 (en) * | 2014-12-10 | 2016-06-16 | 東光株式会社 | Electronic component and method of manufacturing same |
| JP2016111280A (en) * | 2014-12-10 | 2016-06-20 | 東光株式会社 | Electronic component and manufacturing method thereof |
| US10879005B2 (en) | 2014-12-10 | 2020-12-29 | Murata Manufacturing Co., Ltd. | Electronic component and method of manufacturing same |
| CN107004493A (en) * | 2014-12-10 | 2017-08-01 | 株式会社村田制作所 | Electronic unit and its manufacture method |
| WO2016121575A1 (en) * | 2015-01-30 | 2016-08-04 | 株式会社村田製作所 | Method for producing electronic component, and electronic component |
| CN107210129A (en) * | 2015-01-30 | 2017-09-26 | 株式会社村田制作所 | The manufacture method and electronic unit of electronic unit |
| JPWO2016121575A1 (en) * | 2015-01-30 | 2017-10-19 | 株式会社村田製作所 | Electronic component manufacturing method and electronic component |
| KR20170102919A (en) * | 2015-01-30 | 2017-09-12 | 가부시키가이샤 무라타 세이사쿠쇼 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS |
| US11170935B2 (en) | 2015-01-30 | 2021-11-09 | Murata Manufacturing Co., Ltd. | Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light |
| WO2017110136A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社村田製作所 | Electronic component mounting structure, electronic component, and method for forming electronic component mounting structure |