JPS63111190A - Chemical cleaning solution for patinated surface - Google Patents
Chemical cleaning solution for patinated surfaceInfo
- Publication number
- JPS63111190A JPS63111190A JP25700086A JP25700086A JPS63111190A JP S63111190 A JPS63111190 A JP S63111190A JP 25700086 A JP25700086 A JP 25700086A JP 25700086 A JP25700086 A JP 25700086A JP S63111190 A JPS63111190 A JP S63111190A
- Authority
- JP
- Japan
- Prior art keywords
- patina
- copper
- chloride
- cleaning solution
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 49
- 239000000126 substance Substances 0.000 title claims abstract description 13
- 241001311547 Patina Species 0.000 claims abstract description 40
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 32
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 28
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 24
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 18
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims abstract description 12
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims abstract description 12
- 229960003280 cupric chloride Drugs 0.000 claims abstract description 12
- 229940045803 cuprous chloride Drugs 0.000 claims abstract description 12
- 239000011780 sodium chloride Substances 0.000 claims abstract description 9
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 8
- 239000000243 solution Substances 0.000 claims description 26
- 239000007864 aqueous solution Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 25
- 239000010949 copper Substances 0.000 abstract description 25
- 229910052802 copper Inorganic materials 0.000 abstract description 25
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 7
- 239000000356 contaminant Substances 0.000 abstract 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- -1 iron ions Chemical class 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101150067539 AMBP gene Proteins 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L copper(II) hydroxide Inorganic materials [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229960000443 hydrochloric acid Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229940032330 sulfuric acid Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、緑青が発生した銅または銅合金の表面に付
着した汚れの化学洗浄液、より具体的には、都市部の銅
板屋根等に付着した鉄粉や鉱物質塵埃を主体とする汚れ
を該銅板屋根等に発生している緑青および銅または銅合
金の地肌を痛めずに洗浄する化学洗浄液に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention is a chemical cleaning solution for cleaning dirt that has adhered to the surface of copper or copper alloy that has developed a patina, and more specifically, for cleaning stains that have adhered to copper plate roofs in urban areas. The present invention relates to a chemical cleaning solution that cleans dirt mainly composed of iron powder and mineral dust without damaging the verdigris and the surface of copper or copper alloys generated on copper plate roofs, etc.
（従来の技術）
銅板や銅合金等は大気中にさらされていると長年の間に
緑青が表面に生成し、独特の味わい深い外観を呈し、人
の美観や趣味感と一致するところから、建築物等の屋根
やその他の建築部材、土木部材等にしばしば使用されて
いる。ところが、大気汚染の影響を受けやすい都市部の
建築物の銅板屋根等においては、該銅板屋根等の上に生
じている緑青に鉄分や鉱物質塵埃を主体とする汚れが付
着し、緑青は本来の緑青色が損われ、黒色あるいは茶褐
色となり、該緑青の生じている銅板屋根等は本来の味わ
い深い外観が損なわれている場合が多い。(Conventional technology) When copper plates and copper alloys are exposed to the atmosphere, a patina develops on their surfaces over many years, giving them a unique and tasteful appearance that matches people's sense of beauty and taste. It is often used for roofs of objects, other building materials, civil engineering materials, etc. However, on copper plate roofs of buildings in urban areas that are susceptible to air pollution, dirt mainly composed of iron and mineral dust adheres to the patina on the copper plate roofs, causing the patina to disappear. The green and blue color of the roof is damaged, turning it black or brownish, and copper plate roofs with this patina often lose their original attractive appearance.
緑青の本来の味わい深い外観を取り戻すためには、該緑
青の上に付着した該汚れを洗浄除去しなければならない
。In order to restore the original tasteful appearance of the patina, the dirt deposited on the patina must be washed away.
従来、緑青が発生した銅または銅合金の表面に付着した
汚れを洗浄除去するため、高圧水洗、酸の使用等が行な
われていた。Conventionally, in order to wash and remove stains adhering to the surface of copper or copper alloys that have developed patina, high-pressure water washing, the use of acids, etc. have been used.
（発明が解決しようとする問題点）
しかし、緑青が発生した銅または銅合金の表面に付着し
た汚れを高圧水洗すると緑青までが剥がれるという問題
点があり、酸をそのまま使用すると汚れを落すのみなら
ずａ青までをも落し、さらには銅または銅合金の地肌を
も痛めるという問題点があった。このように従来は、緑
青が発生した銅または銅合金の表面に付着した汚れを緑
青および地肌を痛めずに洗浄する技術はなかった。(Problem to be Solved by the Invention) However, there is a problem in that when stains adhered to the surface of copper or copper alloys with patina are washed with high-pressure water, even the patina comes off. There is a problem in that it removes even the blue color and also damages the surface of copper or copper alloy. As described above, conventionally, there has been no technique for cleaning stains adhering to the surface of copper or copper alloys that have developed patina without damaging the patina and the skin.
この発明はこのような問題点に鑑みてなされたものであ
って、その目的は、緑青が発生した銅または銅合金の表
面に付着した汚れを、緑青および地肌を痛めずに洗浄す
ることが可能な化学洗浄液を提供するにある。This invention was made in view of these problems, and its purpose is to make it possible to clean dirt adhering to the surface of copper or copper alloy that has developed a patina without damaging the patina or the skin. To provide a chemical cleaning solution.
（問題点を解決するための手段）
上記の目的を達成するために、第１のこの発明に係る緑
青が発生した銅または銅合金の表面に付着した汚れの化
学洗浄液は、その成分割合において、水溶液１１当り主
成分として塩酸または硫酸を５０〜３００ｍＲ１副成分
として塩化第１銅または塩化第２銅を３０〜８０ｇ含有
するのである。(Means for Solving the Problems) In order to achieve the above object, the chemical cleaning solution for stains attached to the surface of copper or copper alloy with patina according to the first aspect of the present invention has the following composition ratios: The aqueous solution contains 50 to 300 m of hydrochloric acid or sulfuric acid as a main component and 30 to 80 g of cuprous chloride or cupric chloride as a subcomponent.
また、第２のこの発明に係る緑青が発生した銅または銅
合金の表面に付着した汚れの化学洗浄液は、その成分割
合において、水溶液１１当り主成分としてＦＡ酸または
硫酸を５０〜３００ｍＱ、副成分として塩化第１銅また
は塩化第２銅を３０〜８０ｇ含有し、さらに副成分とし
て塩化アンモニウムを５〜４０ａまたは塩化ナトリウム
を１０〜１５ｇ含有するのである。In addition, the chemical cleaning solution for stains adhering to the surface of copper or copper alloy that has developed a patina according to the second aspect of the present invention has a composition ratio of 50 to 300 mQ of FA acid or sulfuric acid as the main component and 50 to 300 mQ of FA acid or sulfuric acid as the main component per 11 parts of the aqueous solution. It contains 30 to 80 g of cuprous chloride or cupric chloride, and further contains 5 to 40 g of ammonium chloride or 10 to 15 g of sodium chloride as a subcomponent.
（作 用）
第１の発明においては、塩酸または硫酸が銅または銅合
金の表面に付着した汚れを取除き、塩化第１銅または塩
化第２銅が化学洗浄液中の銅イオン濃度を高め、緑青を
組成している銅イオンの洗浄液への電離を抑える動きを
する。(Function) In the first invention, hydrochloric acid or sulfuric acid removes stains attached to the surface of copper or copper alloy, and cuprous chloride or cupric chloride increases the concentration of copper ions in the chemical cleaning solution, causing patina. It acts to suppress the ionization of the copper ions that make up the cleaning solution.
また、第２の発明においては、上記第１の発明に係る洗
浄液に塩化アンモニウムまたは塩化ナトリウムを加えた
ので、この塩化アンモニウムまたは塩化ナトリウムが洗
浄後の緑青の発生を促進する働きをする。Furthermore, in the second invention, since ammonium chloride or sodium chloride is added to the cleaning solution according to the first invention, this ammonium chloride or sodium chloride acts to promote the generation of patina after cleaning.
（実施例）
第１表は本願用１の発明に係る緑青発生面の化学洗浄液
の組成を示す表である。(Example) Table 1 is a table showing the composition of a chemical cleaning solution for a patina-producing surface according to the invention of Application No. 1.
第１表
塩酸または硫酸は、緑青が発生した銅または銅合金の表
面に付着した汚れを取り除くための主成分である。鉄（
Ｆｅ）等の水素（Ｈ）よりイオン化傾向の大きい汚れ成
分をイオン化させて取り除く。塩酸または硫酸は、洗浄
液ＩＪ２当り５〇−以下では汚れの洗浄力を十分に得ら
れず、３００ｍＱ以上では母材の銅板を傷めるとともに
緑青も溶解させてしまうため、洗浄液１１当り５０−以
上３００−以下とする。尚、塩酸は酸化力がないため銅
または銅合金の地肌を痛めることが少なく、また洗浄後
は蒸発し洗浄面に残らないため、汚れを取り除くために
使用される酸として最適である。Table 1 Hydrochloric acid or sulfuric acid is the main component for removing stains attached to the surface of copper or copper alloys that have developed patina. iron(
It ionizes and removes dirt components such as Fe) that have a greater tendency to ionize than hydrogen (H). If hydrochloric acid or sulfuric acid is less than 50% per IJ2 of the cleaning liquid, sufficient dirt cleaning power cannot be obtained, and if it is more than 300mQ, it will damage the copper plate of the base material and dissolve the patina. The following shall apply. Since hydrochloric acid has no oxidizing power, it rarely damages the surface of copper or copper alloys, and it evaporates after cleaning and does not remain on the cleaned surface, so it is the most suitable acid for use in removing stains.
塩化第１銅または塩化第２銅は、本発明に係る洗浄液の
中の銅イオン濃度を高め、緑青を組成している銅イオン
の該洗浄液への電離を抑えるためのものである。緑青は
塩基性炭酸銅（ＣＵＣＯｘ−Ｃｕ （ＯＨ）２ ）、
塩基性硫酸鋼（ｘ Ｃｕ Ｓ。Cuprous chloride or cupric chloride is used to increase the concentration of copper ions in the cleaning solution according to the present invention and to suppress ionization of copper ions forming the patina into the cleaning solution. The patina is basic copper carbonate (CUCOx-Cu(OH)2),
Basic sulfuric acid steel (x Cu S.
４ ・Ｖ Ｃｕ （ＯＨ）２ ）、塩基性酢酸銅（Ｘ
ＣＬＩ（ＣＨｉ ＣＯ２）２ ・ｙＣＤ （ＯＨ）
２ ）等からなり、塩酸またはＩｔｉｌ！酸をそれのみ
で用いるときは銅イオンが該塩酸等に含まれていないた
め、電離度は同種のイオンの存在によって影響を受ける
ことより、緑青を組成する炭酸銅Ｃｕ ＣＯ３，水酸化
第２銅Ｃｔｌ（ＯＨ）２等の銅イオンが該洗浄液中に電
離し、その結果、緑青が分解される。従って、予め該洗
浄液中に相当量の銅イオンを含まぜておき、緑青を組成
する銅イオンの該洗浄液中への電離を抑制しもってｌ！
ｌ青の分解を防ごうとするものである。塩化第１銅また
は塩化第２銅は、洗浄ａ１ρ当り、３０ａ以下では効果
が足りず母材および緑青を傷め、８０ａ以上会有しても
効果は変らず不経済であるため、洗浄液１１当り、３０
９以上８０ｇ以下とする。4 ・V Cu (OH)2 ), basic copper acetate (X
CLI(CHi CO2)2 ・yCD (OH)
2) etc., hydrochloric acid or Itil! When an acid is used alone, copper ions are not included in the hydrochloric acid, etc., and the degree of ionization is affected by the presence of similar ions. Copper ions such as Ctl(OH)2 are ionized into the cleaning solution, resulting in decomposition of the patina. Therefore, by including a considerable amount of copper ions in the cleaning solution in advance, the ionization of the copper ions that form the patina into the cleaning solution can be suppressed!
This is an attempt to prevent the decomposition of blue. If cuprous chloride or cupric chloride is less than 30a per cleaning a1ρ, it will be insufficiently effective and damage the base material and patina, and if it is more than 80a, the effect will not change and it will be uneconomical. 30
9 or more and 80g or less.
第２表は本願の第２の発明に係る緑青発生面の化学洗浄
液の組成を示す表である。Table 2 is a table showing the composition of the chemical cleaning solution for the patina-producing surface according to the second invention of the present application.
第２表
この第２の発明における塩酸、硫酸、塩化第１銅、塩化
第２銅の作用は、第１の発明の場合と同じであるが、こ
、の′５２の発明において添加された塩化アンモニウム
または塩化ナトリウムは、洗浄液による洗浄後の緑青の
発生を促進するためのものである。そしてこの場合、塩
化アンモニウムは、洗浄液１ｊ２当り５ｇ以下または４
０ｇ以上では、他の化学成分との組合せによる緑青の再
発効果が低いため、洗浄液１ｌ当り５ｇ以上４０ｇ以下
とする６同様の理由により、塩化ナトリウムは、洗浄液
１ρ当り１０ｇ以上１５（］以下とする。Table 2 The effects of hydrochloric acid, sulfuric acid, cuprous chloride, and cupric chloride in this second invention are the same as in the first invention, but the chloride added in the invention of '52 is the same as in the first invention. Ammonium or sodium chloride is used to promote the development of patina after cleaning with a cleaning solution. In this case, the amount of ammonium chloride is 5g or less or 4g per 1j2 of the cleaning liquid.
If it is 0g or more, the effect of reproducing patina due to combination with other chemical components is low, so the amount of sodium chloride should be 5g or more and 40g or less per liter of cleaning liquid6.For the same reason, the amount of sodium chloride should be 10g or more and 15(] or less per 1ρ of cleaning liquid. .
尚、好ましくは、上記第１の発明または第２の発明の組
成物にエチレンジアミン４酢酸ナトリウム１．５〜３．
８ｇ及び／またはベンゾトリアゾール０．１〜２．０（
Ｊを添加することである。Preferably, 1.5 to 3.0% sodium ethylenediaminetetraacetate is added to the composition of the first invention or the second invention.
8g and/or benzotriazole 0.1-2.0 (
By adding J.
この場合、エチレンジアミン４酢酸ナトリウムは汚れの
中の鉄イオンと結合して汚れを取り易くするためのもの
で、洗浄液１ｐ当り１．５ｇ以下または３．８ｇ以上で
は汚れ除去効果が低いため、洗浄液１！当り１．５ｇ以
上または３．８９以下とする。In this case, sodium ethylenediaminetetraacetate binds to iron ions in the dirt to make it easier to remove the dirt, and if it is less than 1.5g or more than 3.8g per 1p of the cleaning solution, the dirt removal effect will be low. ! 1.5g or more or 3.89g or less per serving.
そしてまた、ベンゾトリアゾールは銅の腐蝕を抑制する
ためのもので、洗浄液１ｌ当り０．１ｑ以下では母材の
防蝕効果が不足し、２．０ｇ以上では洗浄後に緑青面の
色が白味がかるため、洗浄液１ｌ当り０．１ｇ以上２．
０！；Ｉ以下とする。Furthermore, benzotriazole is used to suppress corrosion of copper, and if it is less than 0.1q per liter of cleaning solution, the corrosion-preventing effect on the base material will be insufficient, and if it is more than 2.0g, the color of the patina surface will become whitish after cleaning. , 0.1g or more per liter of cleaning solution2.
0! ; less than or equal to I.
本発明に係る洗浄液により、緑青が発生した銅または銅
合金の表面に付着した汚れを洗浄除去するためには、該
洗浄液をウェスやブラシ等に含ませて、該緑青が発生し
た銅または銅合金の表面に付着した汚れを拭き取るよう
にして行なう。In order to use the cleaning solution of the present invention to clean and remove dirt adhering to the surface of the copper or copper alloy that has developed a patina, the cleaning solution can be soaked in a cloth, brush, etc. Wipe off any dirt adhering to the surface.
（発明の効果）
第１の本発明に係る洗浄液は、水溶液１！当り汚れを取
り除く主成分である塩酸または硫酸５０〜３００ｍ１２
に、塩化第１銅または塩化第２銅を３０〜８０ｇ含有さ
せたため、該洗浄液の中の銅イオン濃度が予め高められ
、緑青を組成している銅イオンの該洗浄液への電離が抑
えられ、その結果、緑青の分解が防止される。(Effect of the invention) The cleaning liquid according to the first invention is an aqueous solution 1! 50-300ml of hydrochloric acid or sulfuric acid, which is the main ingredient for removing stains
Since 30 to 80 g of cuprous chloride or cupric chloride was contained in the cleaning solution, the concentration of copper ions in the cleaning solution was increased in advance, and the ionization of copper ions constituting the patina into the cleaning solution was suppressed. As a result, decomposition of the patina is prevented.
第２の本発明に係る洗浄液は、水溶液１ｌ当り汚れを取
り除く主成分である塩酸または硫酸５０〜３００−に、
塩化第１銅または塩化第２銅を３０〜８０９、塩化アン
モニウムを５〜４０ａまたは塩化ナトリウムを１０〜１
５ｇ含有しているため、本発明に係る洗浄液による洗浄
後の緑青の発生を促進する。The cleaning liquid according to the second aspect of the present invention contains 50 to 300% of hydrochloric acid or sulfuric acid, which is the main component for removing dirt per liter of aqueous solution.
Cuprous chloride or cupric chloride 30-809, ammonium chloride 5-40a or sodium chloride 10-1
Since it contains 5g, it promotes the generation of patina after cleaning with the cleaning solution according to the present invention.
また、第１の発明あるいは第２の発明に、エチレンジア
ミン４酢駿ナトリウムを１．５〜３．８ｇ加えた場合は
、該エチレンジアミン４酢酸ナトリウムが汚れの中の鉄
イオンと結合するため、汚れが取り易くなる。Furthermore, when 1.5 to 3.8 g of sodium ethylenediaminetetraacetate is added to the first invention or the second invention, the sodium ethylenediaminetetraacetate binds to iron ions in the stain, so that the stain is removed. It becomes easier to take.
また、第１の発明あるいは第２の発明にベンゾトリアゾ
ールを０．１〜２．０ｇ加えた場合は、銅の腐蝕が抑制
される。Further, when 0.1 to 2.0 g of benzotriazole is added to the first invention or the second invention, corrosion of copper is suppressed.
尚、緑青が発生した銅または銅合金の表面に付着した汚
れをとる主成分としての塩酸は酸化力がないため、銅ま
たは銅合金の地肌を痛めることが少なく、また洗浄後は
蒸発し洗浄面に残らないため該洗浄後の酸による持続的
な緑青面Ｊ３よび地肌面の損傷の心配がない。Hydrochloric acid, which is the main ingredient used to remove dirt adhering to the surface of copper or copper alloy that has developed a patina, has no oxidizing power, so it does not damage the surface of the copper or copper alloy, and after cleaning, it evaporates and leaves the cleaned surface. Since it does not remain on the skin, there is no need to worry about continued damage to the patina surface J3 and the skin surface due to the acid after washing.
Claims (2)
塩酸または硫酸を５０〜３００ｍｌ、副成分として塩化
第１銅または塩化第２銅を３０〜８０ｇ含有することを
特徴とする緑青発生面の化学洗浄液。(1) A chemical cleaning solution for patina-producing surfaces characterized by containing 50 to 300 ml of hydrochloric acid or sulfuric acid as a main component and 30 to 80 g of cuprous chloride or cupric chloride as a subcomponent per 1 liter of aqueous solution. .
塩酸または硫酸を５０〜３００ｍｌ、副成分として塩化
第１銅または塩化第２銅を３０〜８０ｇ含有し、さらに
副成分として塩化アンモニウムを５〜４０ｇまたは塩化
ナトリウムを１０〜１５ｇ含有することを特徴とする緑
青発生面の化学洗浄液。(2) In terms of component ratio, 1 liter of aqueous solution contains 50 to 300 ml of hydrochloric acid or sulfuric acid as the main component, 30 to 80 g of cuprous chloride or cupric chloride as a subsidiary component, and 5 to 40 g of ammonium chloride as a subsidiary component. Or a chemical cleaning solution for patina-producing surfaces, characterized by containing 10 to 15 g of sodium chloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25700086A JPS63111190A (en) | 1986-10-30 | 1986-10-30 | Chemical cleaning solution for patinated surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25700086A JPS63111190A (en) | 1986-10-30 | 1986-10-30 | Chemical cleaning solution for patinated surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63111190A true JPS63111190A (en) | 1988-05-16 |
| JPH0559997B2 JPH0559997B2 (en) | 1993-09-01 |
Family
ID=17300326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25700086A Granted JPS63111190A (en) | 1986-10-30 | 1986-10-30 | Chemical cleaning solution for patinated surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63111190A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005535784A (en) * | 2002-08-19 | 2005-11-24 | 伊默克化學科技股▲ふん▼有限公司 | Cleaning liquid |
| JP2007107044A (en) * | 2005-10-13 | 2007-04-26 | Jfe Steel Kk | Method for pickling stainless hot rolled steel material and method for producing the same |
| CN109267127A (en) * | 2018-08-30 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A kind of Copper base material treatment fluid and pretreating process |
-
1986
- 1986-10-30 JP JP25700086A patent/JPS63111190A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005535784A (en) * | 2002-08-19 | 2005-11-24 | 伊默克化學科技股▲ふん▼有限公司 | Cleaning liquid |
| JP2007107044A (en) * | 2005-10-13 | 2007-04-26 | Jfe Steel Kk | Method for pickling stainless hot rolled steel material and method for producing the same |
| CN109267127A (en) * | 2018-08-30 | 2019-01-25 | 扬州虹扬科技发展有限公司 | A kind of Copper base material treatment fluid and pretreating process |
| CN109267127B (en) * | 2018-08-30 | 2023-09-05 | 扬州虹扬科技发展有限公司 | Copper substrate treatment fluid and pretreatment process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0559997B2 (en) | 1993-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |