JPS63106647U - - Google Patents
Info
- Publication number
- JPS63106647U JPS63106647U JP1986201631U JP20163186U JPS63106647U JP S63106647 U JPS63106647 U JP S63106647U JP 1986201631 U JP1986201631 U JP 1986201631U JP 20163186 U JP20163186 U JP 20163186U JP S63106647 U JPS63106647 U JP S63106647U
- Authority
- JP
- Japan
- Prior art keywords
- printer head
- window
- light emitting
- optical printer
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Facsimile Heads (AREA)
- Fax Reproducing Arrangements (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Description
第1図は本考案の光プリンタヘツドの一実施例
を示す断面図、第2図は第1図の光プリンタヘツ
ドに使用される絶縁基板の一部を示す平面図、第
3図は従来の光プリンタヘツドの断面図である。 1:金属基体、2:蓋体、2a:窓部、3:絶
縁基板、4:発光ダイオード、5:駆動用IC素
子、8:調節部材。
を示す断面図、第2図は第1図の光プリンタヘツ
ドに使用される絶縁基板の一部を示す平面図、第
3図は従来の光プリンタヘツドの断面図である。 1:金属基体、2:蓋体、2a:窓部、3:絶
縁基板、4:発光ダイオード、5:駆動用IC素
子、8:調節部材。
Claims (1)
- 窓部を有する蓋体と金属基体とから成る容器内
部に、上面に複数個の発光ダイオードが直線状に
配列搭載されている絶縁基板を収容して成る光プ
リンタヘツドにおいて、前記容器に蓋体の窓部と
発光ダイオードとの距離を調節するための調節部
材を設けたことを特徴とする光プリンタヘツド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986201631U JPS63106647U (ja) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986201631U JPS63106647U (ja) | 1986-12-26 | 1986-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63106647U true JPS63106647U (ja) | 1988-07-09 |
Family
ID=31165267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986201631U Pending JPS63106647U (ja) | 1986-12-26 | 1986-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63106647U (ja) |
-
1986
- 1986-12-26 JP JP1986201631U patent/JPS63106647U/ja active Pending