JPS63104832A - Heat-shrinkable coating material having electromagnetic wave shielding capacity - Google Patents
Heat-shrinkable coating material having electromagnetic wave shielding capacityInfo
- Publication number
- JPS63104832A JPS63104832A JP61252389A JP25238986A JPS63104832A JP S63104832 A JPS63104832 A JP S63104832A JP 61252389 A JP61252389 A JP 61252389A JP 25238986 A JP25238986 A JP 25238986A JP S63104832 A JPS63104832 A JP S63104832A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- coating material
- synthetic resin
- shrinkable
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 30
- 239000011248 coating agent Substances 0.000 title claims description 24
- 238000000576 coating method Methods 0.000 title claims description 24
- 229920003002 synthetic resin Polymers 0.000 claims description 28
- 239000000057 synthetic resin Substances 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 21
- 239000004743 Polypropylene Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101000969770 Homo sapiens Myelin protein zero-like protein 2 Proteins 0.000 description 1
- 102100021272 Myelin protein zero-like protein 2 Human genes 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電磁波シールド能を有する熱収縮性被覆材料
に関し、更に詳しくは、特に電線、ケーブル等の端子部
分及びケーブル接合部分において当該部分を被覆するに
適した材料に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat-shrinkable coating material having electromagnetic wave shielding ability, and more particularly, to a heat-shrinkable coating material that is used to cover terminal portions and cable joint portions of electric wires, cables, etc. Concerning materials suitable for.
従来の技術とその問題点
例えば、ケーブルの端部にターミナルを接続する場合に
は、第3図に示すごとく、予めケーブル(11)の外皮
層(13)を除去して多芯線(15)の各線を露出させ
た後、各線の接続加工を行ない、粘着テープ等により被
覆することが行なわれている。近年、電子機器類の電磁
波シールドの重要性が指摘されており、Ia凶器類接続
されるケーブル、電線等も当然シールドを行なう必要が
ある。一般に、ケーブル等のシールドは、外皮層(13
)の内側に網目状金属(金属メツシュ)(17)を81
i層することにより、行なわれている。Conventional technology and its problems For example, when connecting a terminal to the end of a cable, as shown in Figure 3, the outer skin layer (13) of the cable (11) is removed in advance and the multi-core wire (15) is After each wire is exposed, the wires are connected and covered with adhesive tape or the like. In recent years, the importance of electromagnetic shielding for electronic devices has been pointed out, and cables, electric wires, etc. connected to Ia weapons must also be shielded. Generally, the shield of cables etc. has an outer skin layer (13
) inside the mesh metal (metal mesh) (17) 81
This is done by forming an i-layer.
しかしながら、ケーブル等の接続時には、金属メツシュ
(17)も外皮層(13)とともに除去されるので、接
続部分は、無シールド状態とならざるを得ない。However, when connecting a cable or the like, the metal mesh (17) is also removed together with the outer skin layer (13), so the connecting portion is forced to be in an unshielded state.
問題点を解決するための手段
本発明者は、ケーブル、電線等(以下においては、ケー
ブルをもって代表させる)の接続部におけるシールドを
簡易且つ確実に行いうる技術を確立すべく鋭意研究を重
ねた結果、特定の構造を有する金B箔と合成樹脂との複
合材料を被覆材として使用する場合には、その目的を容
易に達成し得ることを見出した。Means for Solving the Problems The inventor has conducted intensive research to establish a technology that can easily and reliably shield the connecting parts of cables, electric wires, etc. (hereinafter referred to as cables). It has been found that the purpose can be easily achieved when a composite material of gold B foil and synthetic resin having a specific structure is used as a covering material.
即ち、本発明は、下記の被覆材料を提供するものである
:
■金属箔の少くとも一面に間歇的な貼着部を介して熱収
縮性合成樹脂フィルム層を形成したことを特徴とする、
電磁波シールド能を有する熱収縮性被覆材料(以下本願
第1発明とする):及び■金属箔の一面に間歇的な貼着
部を介して熱収縮性合成樹脂フィルム層を形成するとと
もに、金属箔の他の一面の少くとも一部に該熱収縮性合
成樹脂フィルム層と接着可能な熱可塑性合成樹脂層を形
成したことを特徴とする、電磁波シールド能を有する熱
収縮性被覆材料(以下本願第2発明とする)。That is, the present invention provides the following coating material: (1) A heat-shrinkable synthetic resin film layer is formed on at least one surface of the metal foil through intermittent adhesion portions;
A heat-shrinkable coating material having electromagnetic wave shielding ability (hereinafter referred to as the first invention of the present application): and ■ A heat-shrinkable synthetic resin film layer is formed on one surface of the metal foil through intermittent adhesion parts, and the metal foil A heat-shrinkable coating material having electromagnetic wave shielding ability (hereinafter referred to as the present invention), characterized in that a thermoplastic synthetic resin layer bondable to the heat-shrinkable synthetic resin film layer is formed on at least a part of the other surface. 2 invention).
本願第1発明に於て使用される金H箔の材質としては、
アルミニウム、アルミニウム合金、銅、銅合金、スチー
ル、鉛、亜鉛、錫等が挙げられる。The material of the gold H foil used in the first invention of the present application is as follows:
Examples include aluminum, aluminum alloy, copper, copper alloy, steel, lead, zinc, tin, and the like.
金属箔の厚さは、通常4〜50μm程麿であり、5〜1
5μmとすることがより好ましい。The thickness of the metal foil is usually about 4 to 50 μm, and about 5 to 1 μm thick.
More preferably, the thickness is 5 μm.
本願第1発明に於て金R箔の少くとも一面に間歇的な貼
着層を介して積層される熱収縮性合成樹脂フィルムとし
ては、ポリプロピレン(PP)、ポリエチレン(PE)
、ポリ塩化ビニル(PVC)、ポリスチレン(PST)
、ポリエステル(PES)、エチレン−酢酸ビニル共
重合樹脂(EVA)等の熱可塑性合成樹脂を押出し成形
法等によりフィルム状に成形した後、更に1軸方向又は
2軸方向に延伸して得たフィルムが挙げられる。フィル
ムとしては、一方向の収縮率が他の方向の収縮率よりも
大きいことが望ましいので、−軸延伸フィルムがより好
ましい。熱収縮性合成樹脂フィルムの厚さは、通常10
〜100μmであり、より好ましくは20〜80μm程
度である。In the first invention of the present application, the heat-shrinkable synthetic resin film laminated on at least one surface of the gold R foil via an intermittent adhesive layer may be polypropylene (PP) or polyethylene (PE).
, polyvinyl chloride (PVC), polystyrene (PST)
A film obtained by forming a thermoplastic synthetic resin such as , polyester (PES), or ethylene-vinyl acetate copolymer resin (EVA) into a film by extrusion molding or the like, and then stretching the film in a uniaxial or biaxial direction. can be mentioned. As the film, it is desirable that the shrinkage rate in one direction is larger than the shrinkage rate in the other direction, so a -axis stretched film is more preferable. The thickness of the heat-shrinkable synthetic resin film is usually 10
~100 μm, more preferably about 20 to 80 μm.
金属箔と熱収縮性合成樹脂フィルムとを間歇的なに貼着
する接着剤としては、ポリエステル、ポリエーテル等の
ポリオール成分と有機ポリイソシアネートとからなる二
液硬化型ウレタン樹脂接着剤の如き二液硬化型ドライラ
ミネーション接着剤が代表的なものとして挙げられるが
、上記金属箔とフィルムとを貼着しうる限り熱融着型等
のいかなるものであっても良い。As an adhesive for intermittently bonding metal foil and a heat-shrinkable synthetic resin film, a two-component curing type urethane resin adhesive consisting of a polyol component such as polyester or polyether and an organic polyisocyanate can be used. A typical example is a curable dry lamination adhesive, but any adhesive such as a heat-sealable adhesive may be used as long as it can bond the metal foil and film together.
本願第2発明においては、上記本願第1発明の構成に加
えて、第1の面に熱収縮性合成樹脂フィルム層を設けた
金属箔の他の面の少くとも一部に該熱収縮性合成樹脂と
接着可能な熱可塑性合成樹脂層を塗布形成する。この様
な熱可塑性合成樹脂としては、塩化ビニル−酢酸ビニル
系共重合体、EVA1エチレン−(メタ)アクリル酸共
重合体、エチレン−(メタ)アクリル酸エステル共重合
体、カルボキシル化EVA、カルボキシル化PP、塩素
化PP、塩素化カルボキシル化PP等が例示され、使用
される熱収縮性合成樹脂フィルムに応じて選択使用すれ
ば良い。尚、塩化ビニル−酢酸ビニル系共重合体には、
必要に応じ、(無水)マレイン酸を更に共重合させたり
、アクリル酸エステル、線状ポリエステル、ポリブチラ
ール、エポキシ樹脂等の少なくとも一種を混合すること
も出来る。In the second invention of the present application, in addition to the structure of the first invention of the present application, at least a part of the other surface of the metal foil provided with the heat-shrinkable synthetic resin film layer on the first surface is made of the heat-shrinkable synthetic resin film layer. A thermoplastic synthetic resin layer that can be bonded to resin is applied and formed. Such thermoplastic synthetic resins include vinyl chloride-vinyl acetate copolymers, EVA1 ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylic ester copolymers, carboxylated EVA, and carboxylated EVA. Examples include PP, chlorinated PP, and chlorinated carboxylated PP, which may be selected depending on the heat-shrinkable synthetic resin film used. In addition, the vinyl chloride-vinyl acetate copolymer contains
If necessary, maleic acid (anhydride) may be further copolymerized, or at least one of acrylic ester, linear polyester, polybutyral, epoxy resin, etc. may be mixed.
以下、図面に示す本発明の実施態様を参照しつつ、本発
明をさらに詳細に説明する。Hereinafter, the present invention will be explained in more detail with reference to embodiments of the present invention shown in the drawings.
第1図は、本願第1発明に係る被覆材料(1)の−例の
概略を示す断面図であり、(3)は金属箔、(5)は間
歇的貼着部(7)を介して積層された熱収縮性合成樹脂
フィルムである。第1図において、フィルム(5)は、
左右方向の収縮率がより大きくなるように配置する。間
歇的貼着部(7)の形状パターンは、第2図(イ)、(
ロ)及び(ハ)にその若干の例を示す如く、貼着部(7
)と非貼着部(9)とが交互に配置されていて、加熱に
より非貼着部に相当する部分のフィルムが収縮しうるも
のであればよく、特に限定されない。FIG. 1 is a cross-sectional view schematically showing an example of the coating material (1) according to the first invention of the present application, in which (3) is a metal foil and (5) is an intermittent pasting part (7). It is a laminated heat-shrinkable synthetic resin film. In FIG. 1, the film (5) is
Arrange so that the shrinkage rate in the left and right direction is greater. The shape pattern of the intermittent pasting part (7) is shown in Figure 2 (a) and (
As shown in some examples in (b) and (c), the adhesive part (7)
) and non-adhering parts (9) are arranged alternately, and the film is not particularly limited as long as it can shrink the film in the portion corresponding to the non-adhering part by heating.
第1図に示す被覆材料(1)を使用して第3図に示すケ
ーブル(11)の被覆を行なう場合には、第4図に示す
如く、熱収縮性合成樹脂フィルム層(5)が内側に位置
するように筒状にまるめ、これをケーブル(11)に被
せて、いわゆる合掌貼を行なった後、熱風等により加熱
を行なってフィルム(5)を円周方向に収縮させればよ
い(第5図参照)。When the cable (11) shown in FIG. 3 is coated with the coating material (1) shown in FIG. The film (5) may be rolled into a cylindrical shape so that it is located at the center of the cable (11), and then placed over the cable (11) to perform a so-called gassho pasting, and then heated with hot air or the like to shrink the film (5) in the circumferential direction ( (See Figure 5).
第6図にその一例の概要を示す本願第2発明に係る被覆
材料(21〉は、金属箔(23)の−面に間歇的接着層
(27)を介して熱収縮性合成樹脂フィルム層(25)
を備えるとともに、他の一面の少なくとも一部に該フィ
ルム層(25)と接着可能な熱可塑性合成樹脂1m(2
9)を備えている。熱可塑性合成樹脂層(29)は、金
属箔の全面に形成する必要はなく、また、そのパターン
も第7図(イ)、(ロ)及び(ハ)に示すごとく、特に
限定はされない。The coating material (21>) according to the second invention of the present application, an example of which is shown in FIG. 25)
1 m (2 m) of thermoplastic synthetic resin that can be bonded to the film layer (25) on at least a part of the other surface.
9). The thermoplastic synthetic resin layer (29) does not need to be formed on the entire surface of the metal foil, and its pattern is not particularly limited, as shown in FIGS. 7(a), (b), and (c).
使用に際しては、第8図に示すように、熱収縮性合成樹
脂フィルム層(25)と熱可塑性合成樹脂層(29)と
が接するように被覆材料(21)を筒状にまるめ、ヒー
トシール、圧着等の手段で両者を接着させた後、ケーブ
ル(11)を覆い、熱風等により円周方向に収縮させれ
ば良い。熱可塑性合成樹脂層(29)を第7図(イ)の
ように形成する場合には、重ね合わせ部が、ケーブルの
長さ方向と一致することになる。In use, as shown in FIG. 8, the coating material (21) is rolled up into a cylindrical shape so that the heat-shrinkable synthetic resin film layer (25) and the thermoplastic synthetic resin layer (29) are in contact with each other, and heat-sealed. After adhering the two together by means such as crimping, the cable (11) may be covered and shrunk in the circumferential direction using hot air or the like. When the thermoplastic synthetic resin layer (29) is formed as shown in FIG. 7(a), the overlapping portion will coincide with the length direction of the cable.
また、第9図に示すように、金ffe(23)を内側に
して使用する場合には、収縮により金属箔(23)と金
属メツシュ(17)とを密着させ、両者間を導通させる
ことができる。Furthermore, as shown in Fig. 9, when the gold ffe (23) is used inside, the metal foil (23) and the metal mesh (17) can be brought into close contact with each other by shrinkage, and conduction can be established between the two. can.
尚、第3図に示すケーブル(11)の多芯線(15)の
各線を複数のグループにまとめ、そのそれぞれを本発明
の被覆材料により別個に被覆することが出来る。Incidentally, each wire of the multicore wire (15) of the cable (11) shown in FIG. 3 can be grouped into a plurality of groups, and each of the wires can be separately coated with the coating material of the present invention.
発明の効果
本発明被覆材料によれば、以下の如き顕署な効果が達成
される。Effects of the Invention According to the coating material of the present invention, the following significant effects can be achieved.
(a)金属箔を使用するので、電磁波シールドの効果が
充分に達成される。(a) Since metal foil is used, the effect of electromagnetic shielding is sufficiently achieved.
(b)加熱により容易に収縮するので、ケーブル端部を
確実に被覆することができる。(b) Since it easily contracts when heated, it is possible to reliably cover the cable end.
(C)金属箔を露出させることが出来るので、この露出
部分から接地に必要な接続をとることも容易である。(C) Since the metal foil can be exposed, it is easy to make connections necessary for grounding from this exposed portion.
(d)粘着テープを被覆材料とする場合に比して、作業
性が大きく改善される。(d) Workability is greatly improved compared to when adhesive tape is used as the covering material.
衷−JLJI
以下、実施例を示し、本発明の特徴とするところをより
いっそう明らかにする。衷-JLJI Hereinafter, examples will be shown to further clarify the features of the present invention.
実施例1
厚さ9μmのアルミニウム箔の一面に幅方向に一軸延伸
された厚さ50μmの熱収縮性ポリ塩化ビニルフィルム
(沸騰水に30秒間浸漬した場合の収縮率50%)を2
液硬化型ウレタン系接着剤により間歇的に貼着した。貼
着のパターンは、第2図の(イ)において、貼着部の幅
1.5mm及び非貼着部の幅1.5mmとなるようにし
た。次いで、アルミニウム箔の他の一面の端部にポリ塩
化ビニル系接着材を幅3mm、厚さ2.5μmに塗布し
た。Example 1 A 50 μm thick heat-shrinkable polyvinyl chloride film (shrinkage rate: 50% when immersed in boiling water for 30 seconds) uniaxially stretched in the width direction on one side of a 9 μm thick aluminum foil was 2
It was attached intermittently using a liquid-curing urethane adhesive. The pasting pattern was such that the pasted part had a width of 1.5 mm and the non- pasted part had a width of 1.5 mm as shown in FIG. 2(a). Next, a polyvinyl chloride adhesive was applied to the end of the other side of the aluminum foil to a width of 3 mm and a thickness of 2.5 μm.
かくして得られた被覆材料を熱収縮性ポリ塩化ビニルフ
ィルムと2液硬化型ウレタン系接着剤とが3mmの重ね
代で接触するように巻上げた後、接触部をヒートシール
して、径30mmの筒状体を得た。これを円周約59m
mのケーブル端部に被せた後、120℃の熱風で30秒
間加熱したところ、被覆材料の収縮により接続部は、良
好に固定されて°いた。The thus obtained coating material was rolled up so that the heat-shrinkable polyvinyl chloride film and the two-component curable urethane adhesive were in contact with each other with an overlap margin of 3 mm, and the contact area was heat-sealed to form a tube with a diameter of 30 mm. A body was obtained. Circumference of this is approximately 59m
After covering the end of the cable, it was heated with hot air at 120°C for 30 seconds, and the connection was well fixed due to the shrinkage of the covering material.
電界における電磁波シールド効果(単位dB)を第1表
に示す。測定は、トラッキングジェネレータ付スペクト
ラムアナライザー(タケダ理研工業(株)製、形式TR
4172)により行なった。Table 1 shows the electromagnetic shielding effect in electric field (unit: dB). Measurement was performed using a spectrum analyzer with tracking generator (manufactured by Takeda Riken Kogyo Co., Ltd., model TR).
4172).
実施例2
アルミニウム箔に代えて厚さ9μmの圧延銅箔を使用す
る以外は、実施例1におけると同様の手法により本発明
の被覆材料を得た。Example 2 A coating material of the present invention was obtained in the same manner as in Example 1, except that a rolled copper foil with a thickness of 9 μm was used in place of the aluminum foil.
この被覆材料も実施例1のそれと同様の性能を示した。This coating material also exhibited similar performance to that of Example 1.
特に、設置の為のアース線のハンダ付が容易となり、ま
た、第1表から明らかなように、電磁波シールド効果が
更に向上した。In particular, it became easier to solder the ground wire for installation, and as is clear from Table 1, the electromagnetic shielding effect was further improved.
第1表
比較例1
Niメッキを施した径0.1mmのステンレススチール
線製金属メツシュ(開口重大々40%及び50%)を実
施例1の被覆材料に代えて使用したところ、周波数10
0MHzにおけるシールド効果は、夫々33dB及び2
8dBであった。Table 1 Comparative Example 1 When Ni-plated stainless steel wire metal mesh with a diameter of 0.1 mm (opening size of 40% and 50%) was used in place of the coating material of Example 1, a frequency of 10
The shielding effectiveness at 0 MHz is 33 dB and 2 dB, respectively.
It was 8dB.
第1図は、本願第1発明による被覆材料の概要を示す断
面図、第2図は、間歇的貼着層の形成パターンの例を示
す図面、第3図は、外皮層を除いたケーブル端部の概要
を示す図面、第4図は、本願第1発明による被覆材料を
ケーブルの端部接続部の被覆に使用する場合の形態を示
す図面、第5図は、本願第1発明による被覆材料でケー
ブル端部接続部を被覆した状態を示す図面、第6図は、
本願第2発明による被覆材料の概要を示す断面図、第7
図は、本願第2発明における熱可塑性合成樹脂図の形成
パターンを示す図面、第8図及び第9図は、本願第2発
明による被覆材料をケーブルの端部接続部の被覆に使用
する場合の形態を示す図面である。
(1)・・・被覆材料
(3)・・・金属箔
(5)・・・熱収縮性合成樹脂層
(7)・・・間歇的貼着部
(9)・・・非貼着部
(11)・・・ケーブル
(13)・・・外皮層
(15)・・・多芯線
(17)・・・金属メツシュ
(21)・・・被覆材料
(23)・・・金属箔
(25)・・・熱収縮性合成樹脂層
(27)・・・間歇的貼着部
(29)・・・熱可塑性合成樹脂層
第1図
第2図
第3図
第4図
第6図
第7図
(イ)
(0)
()X)第8図
第9図Fig. 1 is a cross-sectional view showing an outline of the coating material according to the first invention of the present application, Fig. 2 is a drawing showing an example of the formation pattern of the intermittent adhesive layer, and Fig. 3 is a diagram showing the cable end excluding the outer skin layer. FIG. 4 is a drawing showing a form in which the coating material according to the first invention of the present application is used to cover the end connection portion of a cable, and FIG. 5 is a drawing showing the coating material according to the first invention of the present application. Figure 6 is a drawing showing a state in which the cable end connection part is coated with
Cross-sectional view showing an outline of the coating material according to the second invention of the present application, No. 7
The figure shows the formation pattern of the thermoplastic synthetic resin pattern according to the second invention of the present application, and Figures 8 and 9 show the case where the coating material according to the second invention of the present application is used to cover the end connection portion of a cable. It is a drawing showing a form. (1)...Coating material (3)...Metal foil (5)...Heat-shrinkable synthetic resin layer (7)...Intermittent pasting area (9)...Non-sticking area ( 11)...Cable (13)...Sheath layer (15)...Multicore wire (17)...Metal mesh (21)...Coating material (23)...Metal foil (25) ... Heat-shrinkable synthetic resin layer (27) ... Intermittent adhesion part (29) ... Thermoplastic synthetic resin layer Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 6 Fig. 7 (I) )
(0)
()X) Figure 8 Figure 9
Claims (2)
熱収縮性合成樹脂フィルム層を形成したことを特徴とす
る、電磁波シールド能を有する熱収縮性被覆材料。(1) A heat-shrinkable coating material having electromagnetic shielding ability, characterized in that a heat-shrinkable synthetic resin film layer is formed on at least one surface of metal foil via intermittent adhesion parts.
合成樹脂フィルム層を形成するとともに、金属箔の他の
一面の少くとも一部に該熱収縮性合成樹脂フィルム層と
接着可能な熱可塑性合成樹脂層を形成したことを特徴と
する、電磁波シールド能を有する熱収縮性被覆材料。(2) A heat-shrinkable synthetic resin film layer is formed on one side of the metal foil through intermittent adhesion parts, and the heat-shrinkable synthetic resin film layer is formed on at least a part of the other side of the metal foil. A heat-shrinkable covering material having electromagnetic shielding ability, characterized by forming an adhesive thermoplastic synthetic resin layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61252389A JPH0626871B2 (en) | 1986-10-22 | 1986-10-22 | Heat-shrinkable tubular coating material with electromagnetic wave shielding ability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61252389A JPH0626871B2 (en) | 1986-10-22 | 1986-10-22 | Heat-shrinkable tubular coating material with electromagnetic wave shielding ability |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63104832A true JPS63104832A (en) | 1988-05-10 |
JPH0626871B2 JPH0626871B2 (en) | 1994-04-13 |
Family
ID=17236643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61252389A Expired - Lifetime JPH0626871B2 (en) | 1986-10-22 | 1986-10-22 | Heat-shrinkable tubular coating material with electromagnetic wave shielding ability |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0626871B2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118833U (en) * | 1984-07-06 | 1986-02-03 | 凸版印刷株式会社 | Electromagnetic shielding material |
-
1986
- 1986-10-22 JP JP61252389A patent/JPH0626871B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6118833U (en) * | 1984-07-06 | 1986-02-03 | 凸版印刷株式会社 | Electromagnetic shielding material |
Also Published As
Publication number | Publication date |
---|---|
JPH0626871B2 (en) | 1994-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS63104832A (en) | Heat-shrinkable coating material having electromagnetic wave shielding capacity | |
JPS63121244A (en) | Flexible thin type battery | |
JP2001291436A (en) | Water barrier tape for cable and water barrier cable | |
JPH11288626A (en) | Rubber/plastic insulated power cable | |
JP2621470B2 (en) | Manufacturing method of electric wire with shield layer | |
JPH0412408A (en) | Water cut-off tape | |
JPS63207004A (en) | Metal tape shielded wire | |
JP2593163Y2 (en) | Waterproof structure of wire connection | |
JPH0412566B2 (en) | ||
JPH0741874U (en) | Shield flat wire | |
JPH022029Y2 (en) | ||
JPH0133635Y2 (en) | ||
JPS6114101Y2 (en) | ||
JP2589788Y2 (en) | Shielded laminated electric wire | |
JPS5829659A (en) | Waterproof type heat-shrinkable tube | |
JP2001229745A (en) | Power cable and laminating tape for cables | |
JPH0525280Y2 (en) | ||
JPH0227594Y2 (en) | ||
JPH0119555Y2 (en) | ||
JPS62147905A (en) | Formation of joint of plastic insulated power cable with moisture shielding layer | |
JPH0347413Y2 (en) | ||
JPS61289191A (en) | Water shielding type wtisted wire | |
JPH0127390Y2 (en) | ||
JPS6252533B2 (en) | ||
JPH0334845Y2 (en) |