JPS63104793A - Laser cutting method - Google Patents

Laser cutting method

Info

Publication number
JPS63104793A
JPS63104793A JP61247447A JP24744786A JPS63104793A JP S63104793 A JPS63104793 A JP S63104793A JP 61247447 A JP61247447 A JP 61247447A JP 24744786 A JP24744786 A JP 24744786A JP S63104793 A JPS63104793 A JP S63104793A
Authority
JP
Japan
Prior art keywords
point
line
scanning locus
hole
hole shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61247447A
Other languages
Japanese (ja)
Other versions
JPH0257477B2 (en
Inventor
Hiroshi Chiba
博司 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP61247447A priority Critical patent/JPS63104793A/en
Publication of JPS63104793A publication Critical patent/JPS63104793A/en
Publication of JPH0257477B2 publication Critical patent/JPH0257477B2/ja
Granted legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve efficiency of cutting by projecting a laser scanning locus to the outside of a hole shape line near the point where the cutting start point and cutting end point coincide with each other on the laser scanning locus, then executing cutting. CONSTITUTION:The scanning locus L1 inner by the radius (r) of the processing spot than the line L of the hole shape to be processed is preset. The laser scanning locus starting from the processing start point O arrives linearly at one point A on the line L of the hole shape and progresses on the scanning locus L1 set in the curved direction from the substantial processing point A1, thereby executing boring. The scanning locus projects to the outside of the line L of the hole shape in a virtual circle N from the point B and the scanning is executed when the scanning locus L1 returns to the point B near the first point A, then the scanning is executed. A projecting part C1 reaching the point B1 is generated at this time, but the scanning locus is so set that said part does not enter the inside of the line L of the hole shape. The need for processing the inside of the line after the dislodgment of a dislodging member M1 is eliminated and, therefore, the efficiency of the working is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ切断方法、特に嵌合穴等を穿孔する場合
のレーザ走査軌跡に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser cutting method, and particularly to a laser scanning trajectory when drilling a fitting hole or the like.

(従来の技術〕 レーザビームにより被加工物に嵌合孔を穿孔する従来の
方法の一例を第5図、第6図に示す。
(Prior Art) An example of a conventional method of drilling a fitting hole in a workpiece using a laser beam is shown in FIGS. 5 and 6.

穿孔される穴の内側に設定された加工開始点0をスター
トしたレーザ走査軌跡は、穿孔される穴形状の線上の実
質上の加工開始点Aに向って直線的に移動する。この場
合、点Aに達するのはレーザビームの加ニスポットの外
径であり、したがって加ニスポットの外径が点Aに達し
た後のレーザ走査軌跡L1は、穴形状の16ALよりも
加ニスポットの゛h径rだけ内側を穴形状の線りに沿っ
て矢印方向に走査して被加工物を切断し、点Aに再び接
近すると穿孔される穴の内側の廃材となる部分Mの重量
により、点Aに達する手前の点りにおいて自重を支え切
れずに落下し、穴形状の線りより内側に突出した突起部
Cが生じる。突起部Cは廃材部分Mの脱落後のレーザ照
射により成る程度溶融されるが完全には除去されずに残
る。尚、加ニスポットが1点に集中され、r=oとなっ
た場合には走査軌跡り、は穴形状の線りと一致する。
The laser scanning trajectory starts from a machining start point 0 set inside the hole to be drilled, and moves linearly toward a substantial machining start point A on the line of the shape of the hole to be drilled. In this case, it is the outer diameter of the laser beam spot that reaches point A, and therefore the laser scanning locus L1 after the outer diameter of the knife spot reaches point A is smaller than the hole-shaped 16AL. Cut the workpiece by scanning the inside of the spot by the diameter r of the hole in the direction of the arrow along the line of the hole shape, and when approaching point A again, the weight of the part M that will become waste material inside the hole to be drilled. As a result, the point before reaching point A is unable to support its own weight and falls, creating a protrusion C that protrudes inward from the hole-shaped line. The protrusion C is melted to some extent by the laser irradiation after the waste material portion M falls off, but remains without being completely removed. Note that when the crab spots are concentrated at one point and r=o, the scanning locus coincides with the hole-shaped line.

〔発明を解決しようとする問題点〕[Problems that the invention attempts to solve]

■−述した従来の被加工物に穿孔1−るレーザ切断方法
のレーザ走査軌跡は、廃材の自重によりレーザ走査軌跡
が実質りの加工開始点に戻る前に廃材が脱落し、その際
六価に突起部が残るので、穴に軸、スイッチ、電気素子
等の部品を精度よく挿入する際、突起部が邪魔をして挿
入不能となるため、やすりやその他の手段により突起部
を除去する必要があり、折角レーザ加Tにより精度よく
加工しても再加工を要するなど作業工程が増加し、かつ
、加工面の精度も低下するという欠点がある。
■-The laser scanning trajectory of the conventional laser cutting method for drilling holes in the workpiece described above is such that the waste material falls off before the laser scanning trajectory returns to the actual processing start point due to the weight of the waste material, and at that time, the hexavalent Since a protrusion remains in the hole, the protrusion gets in the way of inserting parts such as shafts, switches, electrical elements, etc. into the hole with precision, making it impossible to insert them, so it is necessary to remove the protrusion with a file or other means. However, even if the laser machining process is carried out with high accuracy, the number of work steps increases, such as re-machining, and the accuracy of the machined surface decreases.

本発明は、レーザ切断方法により被加工物に正確に嵌合
孔を穿孔する場合、穴の周囲に生じる突起部の発生を防
止することを目的とする。
An object of the present invention is to prevent the formation of protrusions around the hole when accurately drilling a fitting hole in a workpiece using a laser cutting method.

〔問題点を解決するためのf段〕[F-stage to solve problems]

本発明のレーザ切断方法は、穿孔される穴の周囲のレー
ザ走査軌跡」−の切断開始点と切断終了点が一致する点
の近傍で、レーザ走査軌跡を穴形状の線から外して突出
させるようにしたことを特徴とする。
The laser cutting method of the present invention is such that the laser scanning trajectory around the hole to be drilled is caused to deviate from the line of the hole shape and protrude near the point where the cutting start point and the cutting end point coincide. It is characterized by the following.

〔作 用〕[For production]

したがって、レーザ走査軌跡は加工孔の周囲の切断開始
点と切断終了点の一致する点の僅か手前で、廃材となる
べき穴の内側部分の自重により廃材が脱落する前に穴形
状の線よりも更に外側もしくは内側へ突出するように走
査するのて、廃材の自重により破断される部分は、穴形
状の線よりも内側もしくは外側に突出することがなく、
レーザ加1により穿孔し終った後、更に追加工により突
出部を除去する必要がない。
Therefore, the laser scanning trajectory is slightly before the point where the cutting start point and the cutting end point around the machined hole coincide, and before the waste material falls off due to the weight of the inner part of the hole that should become waste material, it is further than the line of the hole shape. Furthermore, by scanning so as to protrude outward or inward, the part that breaks due to the weight of the waste material does not protrude inward or outward beyond the line of the hole shape.
After completing the drilling by laser machining 1, there is no need to remove the protruding portion by additional machining.

〔実施例] 次に、本発明の実施例について図面を参照して説明する
[Example] Next, an example of the present invention will be described with reference to the drawings.

第1図は本発明のレーザ加り法の一実施例のレーザ走査
軌跡の図、第2図は第1図のレーザ走査軌跡により加工
された穴形状の図である。穿孔される穴形状の線りの内
側に設けられ加工開始点0から出発したレーザ走査軌跡
は、加工開始点0から直線的に穴形状の線り上の1点A
に達し、点Aを通過して仮想円Nで囲った範囲の中の実
質的な加工開始点A、に達した後、矢印の曲線方向に走
査を開始し、穴形状の線りより加ニスボッドr径rだけ
内側に沿った走査軌跡り、上を矢印に沿って進み、所定
の形状の穴を穿孔しつつ/最初の点Aに近い点Bに戻っ
て来る。次に、点Bから仮想円Nの中を穴形状の線りの
外側に突出して走査するが、点A1に達する前に第2図
の点B、に達した地点で穴となるべき部材M1の自重を
支え切れず脱落する。その隔意B1と点Aとの間には突
起部CIが生じるが、この突起部C,が穴形状の線りよ
り内側に入ることがないよう点BからA1に至る間の走
査軌跡が設定される。
FIG. 1 is a diagram of a laser scanning locus of an embodiment of the laser addition method of the present invention, and FIG. 2 is a diagram of a hole shape processed by the laser scanning locus of FIG. 1. The laser scanning trajectory starting from the machining start point 0, which is provided inside the line of the hole shape to be drilled, is a point A on the line of the hole shape in a straight line from the machining start point 0.
After passing through point A and reaching the actual machining start point A within the range surrounded by the virtual circle N, scanning is started in the curved direction of the arrow, and the varnished bod is The scanning trajectory follows the arrow along the inside by the radius r, and returns to point B, which is close to the initial point A, while drilling a hole of a predetermined shape. Next, the virtual circle N is scanned from point B by protruding outside the hole-shaped line, but before reaching point A1, point B in FIG. 2 is reached, and member M1, which should become a hole, It cannot support its own weight and falls off. A protrusion CI occurs between the distance B1 and point A, but the scanning trajectory from point B to A1 is set so that this protrusion C does not enter inside the line of the hole shape. be done.

第3図(a) 、 (b) 、 (b)は仮想円Nの中
の走査軌跡の種々の形を示した図で、第3図(a)は第
1図と同様実質的な加工開始地点A、から円弧状の曲線
L2沿って矢印方向に進み、孔形状の線りより加ニスポ
ットの!h径rだけ内側に沿った走査軌跡L1を走査し
、所定の形状の穴を穿孔して点A1に接近した点Bから
円弧上の曲線L3に沿って穴形状の線りより更に外側に
突出するように設定された走査軌跡の実施例である。第
3図(b)は加工孔の穴形状の線りより更に外側に突出
するように設定された走査軌跡L2L3が直線で、かつ
、点Aを頂点とする三角形の2辺をなすように設定され
た実施例、又、第3図(C)は実質上の加工開始点A、
から元の走査軌跡L2を戻って走査軌跡L1に達した後
穿孔に移り、B点がら円弧状の曲線L3を走査するよう
に設定された実施例である。
Figures 3(a), (b), and (b) are diagrams showing various shapes of scanning trajectories in the virtual circle N, and Figure 3(a) shows the actual start of machining as in Figure 1. From point A, proceed in the direction of the arrow along the arc-shaped curve L2, and reach the crab spot from the hole-shaped line! Scan the scanning locus L1 along the inside by the h diameter r, drill a hole of a predetermined shape, and from point B approaching point A1 protrude further outward from the line of the hole shape along the curve L3 on the circular arc. This is an example of a scanning trajectory set to In Fig. 3(b), the scanning locus L2L3, which is set to protrude further outward than the line of the hole shape of the machined hole, is a straight line and is set so that it forms two sides of a triangle with point A as the apex. In the example shown in FIG. 3(C), the actual processing starting point A,
In this embodiment, after returning from the original scanning locus L2 and reaching the scanning locus L1, drilling is started, and the arcuate curve L3 is scanned from point B.

第4図は脱落する部材M、を加工物として使用するため
の実施例で、この場合には加工開始点0が穴形状の線り
の外側に設定され、一旦、穴形状の線りの内側の実質上
の加工開始点A1迄進んだ後、円弧状の走査軌跡L2を
進んだ後、脱落部材M区の穴形状の線りより加ニスポッ
ト半径rだけ外側の走査軌跡Ll上を走査して走査軌跡
L3より再び元の実質上の加[開始点A、に戻るという
実施例で脱落部材M、の穴形状の線りが正確に加工され
る。
Fig. 4 shows an example of using the falling member M as a workpiece. In this case, the machining start point 0 is set outside the hole-shaped line, and once inside the hole-shaped line, After proceeding to the actual machining start point A1, proceeding along an arcuate scanning locus L2, and then scanning on a scanning locus Ll that is outside the line of the hole shape in section M of the fallen member by a radius r of the varnishing spot. In this embodiment, the line of the hole shape of the falling member M is precisely machined in the embodiment in which the scanning path L3 returns to the original starting point A.

本発明の実験データとしては、要求される穴形状が直径
6mmの円形の場合、板厚2mmの場合には仮想円Nの
中の走査軌跡の形状をt径0.12mm以上の円弧とし
最大突出量0.08mm以上であれば突起部CIは穴形
状の線りより内側に突出ないことが確認された。
The experimental data of the present invention is that when the required hole shape is circular with a diameter of 6 mm, and when the plate thickness is 2 mm, the shape of the scanning locus in the virtual circle N is an arc with a diameter of t of 0.12 mm or more, and the maximum protrusion is achieved. It was confirmed that if the amount was 0.08 mm or more, the protrusion CI would not protrude inward from the line of the hole shape.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、レーザ切断方法により被
加工物に各種の形状の穴を穿孔する場合、加工穴の周囲
の切断開始点と切断終了点の一致する地点の近傍で、レ
ーザ走査軌跡を加工される穴形状の線から外して突出さ
せるようにしたことにより、加1大の内側の部材が自重
により落下する際、際加−[を必要とする突出部を残さ
ずに脱落するので、作業工程の増加、加工形状の粒度の
低下等を防止できる効果がある。
As explained above, when drilling holes of various shapes in a workpiece by a laser cutting method, the present invention provides a laser scanning trajectory in the vicinity of a point around the machined hole where the cutting start point and the cutting end point coincide. By making it protrude away from the line of the hole shape to be machined, when the inner member with a larger diameter falls due to its own weight, it will fall off without leaving any protruding parts that require additional stress. This has the effect of preventing an increase in work steps, a decrease in grain size of processed shapes, etc.

レーザ走査軌跡の図、第2図は第1図のレーザ走査軌跡
により加工された穴形状の図、第3図(a)。
FIG. 2 is a diagram of the laser scanning trajectory, and FIG. 3(a) is a diagram of the hole shape processed by the laser scanning trajectory of FIG. 1.

(b) 、 (C)は本発明のレーザ加工法の走査軌跡
の各実施例の図、第4図は本発明の変形例で穴の中の部
材を正確に加工する場合の実施例のレーザ走査軌跡の図
、第5図、第6図はそれぞれ従来のレーザ加工法のレー
ザ走査軌跡の図、および穴の形状を示した図である。
(b) and (C) are diagrams of each embodiment of the scanning locus of the laser processing method of the present invention, and FIG. The scanning locus diagram, FIGS. 5 and 6 are diagrams showing the laser scanning locus and the shape of the hole in the conventional laser processing method, respectively.

L−・・・・・・・・穴形状の線、 t、、L2 L3・・・・・・・・・レーザ走査軌跡、
0−−−−−−・・・加工開始点、 A −−−−−・・・・レーザ走査軌跡とLどの交点、
A、−−−−−・実質Fの加工開始点、B−・・・・・
・・・走査軌跡が外側に突出する点、B1・・・・・・
突出部C,の起点、 C,C,−・・・・・・・・突出部、 N−・・・・・・・・仮想円、 r”・・・・・・・レーザ加ニスポットの半径、M、M
、−・・・・・・・・脱落部材。
L-・・・・・・Line of hole shape, t,, L2 L3・・・・・・Laser scanning trajectory,
0 ---------- Processing start point, A -------... Intersection of laser scanning trajectory and L,
A, ------Machining start point of F, B--...
...The point where the scanning locus protrudes outward, B1...
Starting point of protrusion C, C, C, -...Protrusion, N-......Virtual circle, r"...... Laser carving spot Radius, M, M
, -... Fallen member.

Claims (1)

【特許請求の範囲】 レーザビームにより被加工物に各種形状の穴を穿孔する
レーザ切断方法において、 前記穴の周囲のレーザ走査軌跡上の切断開始点と切断終
了点が一致する点の近傍で、レーザ走査軌跡を穴形状の
線から外して突出させるようにしたことを特徴とするレ
ーザ切断方法。
[Claims] In a laser cutting method for drilling holes of various shapes in a workpiece with a laser beam, in the vicinity of a point where a cutting start point and a cutting end point coincide on a laser scanning trajectory around the hole, A laser cutting method characterized in that the laser scanning locus is made to protrude out of the line of the hole shape.
JP61247447A 1986-10-20 1986-10-20 Laser cutting method Granted JPS63104793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61247447A JPS63104793A (en) 1986-10-20 1986-10-20 Laser cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61247447A JPS63104793A (en) 1986-10-20 1986-10-20 Laser cutting method

Publications (2)

Publication Number Publication Date
JPS63104793A true JPS63104793A (en) 1988-05-10
JPH0257477B2 JPH0257477B2 (en) 1990-12-05

Family

ID=17163577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61247447A Granted JPS63104793A (en) 1986-10-20 1986-10-20 Laser cutting method

Country Status (1)

Country Link
JP (1) JPS63104793A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994013425A1 (en) * 1992-12-14 1994-06-23 Fanuc Ltd Laser machining method and laser robot for executing this method
WO1994021417A1 (en) * 1993-03-25 1994-09-29 Fanuc Ltd Laser beam machining method and apparatus therefor
WO2023124288A1 (en) * 2021-12-30 2023-07-06 深圳市创客工场科技有限公司 Motion control method and apparatus in desktop smart laser device, and device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105142855B (en) * 2013-04-19 2017-09-29 村田机械株式会社 Laser machine and perforate processing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921286A (en) * 1982-05-27 1984-02-03 エヌ・ベ−・フィリップス・フル−イランペンファブリケン High frequency oscillator/inverter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921286A (en) * 1982-05-27 1984-02-03 エヌ・ベ−・フィリップス・フル−イランペンファブリケン High frequency oscillator/inverter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994013425A1 (en) * 1992-12-14 1994-06-23 Fanuc Ltd Laser machining method and laser robot for executing this method
US5466909A (en) * 1992-12-14 1995-11-14 Fanuc Ltd Laser robot with approach time from origin to a starting position minimized
WO1994021417A1 (en) * 1993-03-25 1994-09-29 Fanuc Ltd Laser beam machining method and apparatus therefor
WO2023124288A1 (en) * 2021-12-30 2023-07-06 深圳市创客工场科技有限公司 Motion control method and apparatus in desktop smart laser device, and device

Also Published As

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JPH0257477B2 (en) 1990-12-05

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