JPS6296564A - Electrically conductive plastic molding material and production thereof - Google Patents
Electrically conductive plastic molding material and production thereofInfo
- Publication number
- JPS6296564A JPS6296564A JP23538185A JP23538185A JPS6296564A JP S6296564 A JPS6296564 A JP S6296564A JP 23538185 A JP23538185 A JP 23538185A JP 23538185 A JP23538185 A JP 23538185A JP S6296564 A JPS6296564 A JP S6296564A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- wire
- molding material
- plastic
- plastic molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電磁波シールド効果を奏する導電化プラスチ
ック成形品の製造に用いる導電化プラスチック成形材料
とその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive plastic molding material used for manufacturing a conductive plastic molded product that exhibits an electromagnetic wave shielding effect, and a method for manufacturing the same.
各種コンピュータ機器においては、その誤動作の最大原
因となる電磁波障害を防止する電磁波シールド対策が極
めて重要な課題となっている。BACKGROUND ART Electromagnetic wave shielding measures to prevent electromagnetic wave interference, which is the biggest cause of malfunction in various types of computer equipment, have become an extremely important issue.
この電磁波シールド対策として、旧来においてはコンピ
ュータを収容するハウジング等を金属板で成形するよう
にしていたが、近時においては機器の軽量化やデザイン
上の要請からハウジング等を導電化されたプラスチック
で一体成形するのが主流となっている。As a measure to shield against electromagnetic waves, in the past, housings for housing computers were molded from metal plates, but in recent years, housings and other materials have been made of conductive plastic to reduce the weight and design requirements of devices. One-piece molding is the mainstream.
そして、プラスチックの導電化には、プラスチック成形
品の表面に無電解メッキや導電性塗料の塗布によって導
電性の被膜を形成させる方式と、熱可塑性プラスチック
の溶融液中又は熱硬化性プラスチックの粉末中に銅粉、
アルミニュウム粉。To make plastic conductive, there are two methods: forming a conductive film on the surface of the plastic molded product by electroless plating or applying conductive paint, and the other method is to form a conductive film on the surface of the plastic molded product, and to apply it in a thermoplastic melt or thermosetting plastic powder. copper powder,
aluminum powder.
銀粉等の導電性フィラーを混和もしくは充填して一体成
形する導電性プラスチック・コンポジット方式とがある
。There is a conductive plastic composite method in which a conductive filler such as silver powder is mixed or filled and integrally molded.
しかしながら、前者のようにプラスチック成形品の表面
に導電性被膜を形成させる方式は、成形品について二次
的に導電性付与の加工をしなければならない面倒がある
と共に、導電性の被膜の損傷や腐蝕によって電磁波シー
ルドの欠陥部を生ずるおそれがあった。However, the former method of forming a conductive film on the surface of a plastic molded product requires a secondary process to impart conductivity to the molded product, and it also causes damage to the conductive film. Corrosion could cause defects in the electromagnetic shield.
一方、後者のようにプラスチックの溶融液中又は粉末中
に導電性フィラーを混和もしくは充填して導電化プラス
チック成形品を製造する方式は、成形品の表面に導電性
被膜を形成する二次加工を施す必要が全くなく、導電性
フィラーの腐蝕等も生じないという長所を有しているが
、成形品中に導電性フィラーが均一に分布せず、疎の部
分からシールド漏れが生ずるという欠点を有していた。On the other hand, the latter method of manufacturing conductive plastic molded products by mixing or filling a conductive filler into a plastic melt or powder requires secondary processing to form a conductive film on the surface of the molded product. Although it has the advantage that there is no need to apply it at all and there is no corrosion of the conductive filler, it has the disadvantage that the conductive filler is not evenly distributed in the molded product and shield leakage occurs from sparse areas. Was.
特に、複雑な形状をした成形品にあっては、プラスチッ
クの溶融液中又は粉末中に混和もしくは充填された導電
性フィラーが均一に分散して混ざらず、局所的にかたま
って均一なシールド効果を得ることができなかった。ま
た、このようなシールド漏れを防止するために導電性フ
ィラーの添加量を増加させると、成形品の機械的強度、
殊に耐衝撃性が低下するという問題があった。In particular, for molded products with complex shapes, the conductive filler mixed or filled into the plastic melt or powder may not disperse uniformly and may locally clump together, resulting in a uniform shielding effect. I couldn't get it. In addition, increasing the amount of conductive filler added to prevent such shield leakage will improve the mechanical strength of the molded product.
In particular, there was a problem in that impact resistance decreased.
そこで本発明は、導電性フィラーを疎密な（極めて均一
な状態で分布させてシールド漏れのない導電化プラスチ
ック成形品を製造することができる新規な導電化プラス
チック成形材料及びその製造方法を提供することを目的
とする。SUMMARY OF THE INVENTION Therefore, the present invention provides a novel conductive plastic molding material that can produce a conductive plastic molded product with no shield leakage by distributing conductive filler in a dense (extremely uniform) state, and a method for manufacturing the same. With the goal.
この目的を達成するために、本発明による導電化プラス
チック材料は、粒状もしくは短繊維状に成形された熱可
塑性プラスチックに細線状の導電性材が一体的に配され
て成ることを特徴とする。In order to achieve this object, the electrically conductive plastic material according to the present invention is characterized in that a thin wire-shaped electrically conductive material is integrally disposed on a thermoplastic plastic molded into particles or short fibers.
また、本発明による導電化プラスチック材料の製造方法
は、伸線機で所定径に延伸された金属細線の表面に溶融
した熱可塑性プラスチ・ツクを所定厚で塗布し、当該熱
可塑性プラスチックが硬化した後に前記金属細線を所定
の長さに切断することを特徴とする。In addition, the method for manufacturing a conductive plastic material according to the present invention includes applying molten thermoplastic plastic to a predetermined thickness on the surface of a thin metal wire drawn to a predetermined diameter using a wire drawing machine, and hardening the thermoplastic plastic. The method is characterized in that the thin metal wire is then cut into a predetermined length.
本発明による導電化プラスチック成形材料は、粒状もし
くは短繊維状に成形された熱可塑性プラスチックに細線
状の導電性材が一体的に配されて成るから、これを例え
ば圧縮成形金型内に所要量充填してそのままカＯ熱及び
冷却するだけで、別途導電性フィラーを混和して攪拌す
る必要もなく、導電性材が疎密なく極めて均一に分布し
た導電化プラスチック成形品を製造することができる。The conductive plastic molding material according to the present invention is composed of a thermoplastic plastic molded into granules or short fibers and a thin wire-like conductive material is integrally placed therein. By simply filling the product and heating and cooling it, there is no need to separately mix and stir a conductive filler, and it is possible to produce a conductive plastic molded product in which the conductive material is distributed extremely uniformly without being dense or dense.
また、本発明による導電化プラスチック成形材料の製造
方法によれば、一連の工程によって導電性フィラーとな
る金属細線が個々に一体的に含有された新規な導電化プ
ラスチック成形材料を得ることができる。Furthermore, according to the method for producing a conductive plastic molding material according to the present invention, a novel conductive plastic molding material in which thin metal wires serving as conductive fillers are individually and integrally contained can be obtained through a series of steps.
以下、本発明を図面に示す具体的な実施例に基づいて説
明する。Hereinafter, the present invention will be explained based on specific embodiments shown in the drawings.
第１図及び第２図は夫々本発明による導電化プラスチッ
ク成形材料の一例を拡大して示す斜視図、第３図はその
製造方法の一例を示す工程図である。1 and 2 are enlarged perspective views of an example of the conductive plastic molding material according to the present invention, and FIG. 3 is a process diagram showing an example of the manufacturing method thereof.
導電化プラスチック成形材料１は、細線状の導電性材２
の表面に所定の厚さで被覆されたポリプロピレン、ポリ
エチレン、ナイロン又はポリ塩化ビニル等の熱可塑性プ
ラスチック３を導電性材２と共に所定の長さく例えば、
１〜１０１重）に切断して成り、導電性材２の長さが比
較的短く且つ熱可塑性プラスチック３の被覆が比較的厚
い場合には全体が粒状に形成され、導電性材２が比較的
長く且つ熱可塑性プラスチック３の被覆が比較的薄い場
合には短繊維状に形成されている。The conductive plastic molding material 1 is a thin wire-shaped conductive material 2
For example, a thermoplastic plastic 3 such as polypropylene, polyethylene, nylon, or polyvinyl chloride, whose surface is coated with a predetermined thickness, is coated with a conductive material 2 to a predetermined length.
When the length of the conductive material 2 is relatively short and the coating of the thermoplastic plastic 3 is relatively thick, the entire conductive material 2 is formed into granules, and the conductive material 2 is relatively short. If it is long and the thermoplastic plastic 3 coating is relatively thin, it is formed into short fibers.
また、導電性材２としては、例えば直径約０．０２〜０
．ＩＮ程度の伸銅裸線が使用されている。Further, as the conductive material 2, for example, the diameter is about 0.02 to 0.
．． Bare rolled copper wire of IN grade is used.
しかして、例えば圧縮成形によって導電化プラスチック
成形品を製造する場合に、本発明による導電化プラスチ
ック成形材料１．１・・・を金型のキャビティ内に所要
量充填してそのまま加熱し、各熱可塑性プラスチック３
を軟化させた状態で成形圧力をかけた後、該プラスチッ
クの硬化温度まで冷却させるだけで導電性フィラーとな
る導電性材２．２−・−が全体に均一に分布したシール
ド漏れのない導電化プラスチック成形品が製造される。For example, when manufacturing a conductive plastic molded product by compression molding, the conductive plastic molding material 1.1 according to the present invention is filled in the required amount into the cavity of a mold and heated as it is. Plastic plastic 3
After applying molding pressure in a softened state, the conductive material 2.2 becomes a conductive filler by simply cooling it to the hardening temperature of the plastic.The conductive material 2.2-.- is uniformly distributed throughout the shield, making it conductive without leakage. Plastic molded products are manufactured.
即ち、金型内に充填されて各部に位置するプラスチック
成形材料１，１−・の夫々が導電性材２を有しているか
ら、従来の如く該成形材料１． １−に銅粉等の導電性
フィラーを混入して撹拌する必要もなく、多数の導電性
材２，２・・−が必然的に金型のキャビティ内の全域に
ムラなく均一に分散して確実な電磁波シールド効果が得
られる。That is, since each of the plastic molding materials 1, 1-. filled in the mold and located in each part has the conductive material 2, the molding materials 1. There is no need to mix conductive filler such as copper powder into 1- and stir it, and a large number of conductive materials 2, 2, etc. are inevitably evenly and evenly distributed throughout the mold cavity. A reliable electromagnetic shielding effect can be obtained.
なお、導電化プラスチック成形品について、その導電性
は導電性フィラーの混和量に比例して増大せず、混和量
が一定以上に達して各導電性フィラー同士が互いに相接
触する状態になった時に急激に増大することが知られて
いる。Regarding conductive plastic molded products, the conductivity does not increase in proportion to the amount of conductive filler mixed, and when the amount of mixed conductive filler reaches a certain level and the conductive fillers come into contact with each other. It is known to increase rapidly.
しかし、このように各導電性フィラーが相接触する状態
になるまで多量の導電性フィラーを混和すると、プラス
チック成形品の機械的強度が弱くなると共に、経済性も
悪いという欠点がある。However, when a large amount of conductive filler is mixed until the conductive fillers come into contact with each other in this manner, the mechanical strength of the plastic molded product becomes weak and it is also disadvantageous in that it is not economically viable.
これに対して、本発明のように直径０．０２〜０．１龍
程度の伸銅裸線等で成る細線状の導電性材２が導電性フ
ィラーとなれば、該導電性フィラーの直径と長さの比が
大きいから、各フィラー間の接触機会が多くなり、少な
い混和量で導電性を増大させて電磁波シールド効果を高
めることができる。On the other hand, if the thin wire-shaped conductive material 2 made of a rolled copper bare wire or the like with a diameter of about 0.02 to 0.1 mm is used as a conductive filler as in the present invention, the diameter of the conductive filler and Since the length ratio is large, there are many opportunities for contact between each filler, and even with a small amount of mixture, conductivity can be increased and the electromagnetic shielding effect can be enhanced.
特に、導電性材２として直径０．０２〜０．０５ｍｎ程
度の極細伸銅裸線を使用すれば、その直径と長さとの比
が著しく大きくなり、しかも各導電性材２が上記の如く
均一に分布しているから、導電性材２及び２間の接触機
会も非常に多くなって少ない混和量で導電性を著しく増
大させることができると共に、プラスチック成形品の機
械的強度を弱めることもないという優れた利点がある。In particular, if an ultra-fine rolled copper bare wire with a diameter of about 0.02 to 0.05 mm is used as the conductive material 2, the ratio of its diameter to length will be significantly large, and each conductive material 2 will be uniform as described above. Since the conductive materials 2 and 2 are distributed in the same area, the contact opportunities between the conductive materials 2 and 2 are greatly increased, and the conductivity can be significantly increased with a small amount of mixing, and the mechanical strength of the plastic molded product will not be weakened. There are excellent advantages.
なお、本発明による導電化プラスチック成形材料１は、
上記の如く導電性材２の表面に熱可塑性プラスチック３
を被覆する場合に限らず、熱可塑性プラスチック３内に
導電性材２を含有させる場合や、第２図に示すように細
線状の導電性材２を熱可塑性プラスチック３の表面に沿
って接着もしくは融着して添設する場合であってもよい
。In addition, the conductive plastic molding material 1 according to the present invention is
As mentioned above, the thermoplastic plastic 3 is applied to the surface of the conductive material 2.
In addition to the case where the conductive material 2 is contained in the thermoplastic plastic 3, the conductive material 2 in the form of a thin wire is bonded or bonded along the surface of the thermoplastic plastic 3 as shown in FIG. It may also be attached by fusing.
また、導電性材２は、伸銅線に限らずアルミニュウム線
その他の金属細線や、カーボン繊維等であってもよい。Further, the conductive material 2 is not limited to a copper wire, but may also be an aluminum wire or other thin metal wire, carbon fiber, or the like.
次に、本発明による導電化プラスチック成形材料の製造
方法について第３図を伴って説明する。Next, a method for producing a conductive plastic molding material according to the present invention will be explained with reference to FIG.
第３図において、４は延伸によって金属細線２を製造す
るための原材料となる母線、５は母線４を巻装したボビ
ンであって、Ｊ亥ボビン５から引き出された直径約２．
６＋ｍ程度の銅線で成る母線４が所要台数の伸線機６ａ
、６ｂのダイス中に通されて直径約０．０２〜０．１鶴
程度に延伸された極細伸銅裸線で成る金属細線２を製造
するように成されている。In FIG. 3, reference numeral 4 denotes a generatrix which is a raw material for manufacturing the thin metal wire 2 by drawing, and 5 a bobbin on which the generatrix 4 is wound.
The required number of wire drawing machines 6a are used to generate busbars 4 made of approximately 6+m of copper wire.
, 6b and drawn to a diameter of approximately 0.02 to 0.1 mm.
７は伸線機６ａ、６ｂの後段側に配設された漏斗状のル
ツボであって、大径の上部開口部７ａから小径の下部開
口部７ｂ（以下、グイという）に金属細線２が挿通され
ると共に、内部には熱可塑性プラスチック３が溶融状態
で貯留されている。Reference numeral 7 denotes a funnel-shaped crucible disposed on the rear side of the wire drawing machines 6a and 6b, in which the fine metal wire 2 is inserted from a large-diameter upper opening 7a to a small-diameter lower opening 7b (hereinafter referred to as "Gui"). At the same time, thermoplastic plastic 3 is stored inside in a molten state.
しかして、まず直径約２．６龍程度の銅線で成る母線４
をボビン５から引き出して伸線機６ａ及び６ｂのダイス
中に通し、直径約０．０２〜０．１１１程度にまで延伸
して伸銅裸線で成る金属細線２を製造する。First of all, the bus bar 4 made of copper wire with a diameter of about 2.6 mm.
is pulled out from the bobbin 5, passed through the dies of wire drawing machines 6a and 6b, and drawn to a diameter of approximately 0.02 to 0.111 mm to produce a thin metal wire 2 made of a drawn bare copper wire.
次いで、この金属細線２をルツボ７内に挿通して、該金
属細線２の表面に所定厚さで熱可塑性プラスチック３の
溶融液を塗布し、更にこれを冷却機８に通して熱可塑性
プラスチック３を硬化させた後、カッター９によって所
定の長さに切断して第１図に示すような導電化プラスチ
ック成形材料１、Ｌ−−−を製造する。Next, the thin metal wire 2 is inserted into the crucible 7, and the surface of the thin metal wire 2 is coated with a melt of the thermoplastic plastic 3 to a predetermined thickness. After curing, the conductive plastic molding material 1, L--- as shown in FIG. 1 is manufactured by cutting into a predetermined length with a cutter 9.
したがって、本発明方法によれば、一連の工程によって
、粒状もしくは短繊維状の熱可塑性プラスチック３が個
々に導電性フィラーとなる金属細線２を有する従来にな
い新規な導電化プラスチック成形材料１．１−・・を製
造することができ、この導電化プラスチック成形材料１
．１−・には、その使用に際して従来の如く銅粉、アル
ミニュウム粉等の導電性フィラーを混和して攪拌する必
要が全くなくなる。Therefore, according to the method of the present invention, a novel conductive plastic molding material 1.1 in which granular or short fiber thermoplastic plastics 3 each have fine metal wires 2 which individually become conductive fillers through a series of steps. -... can be produced, this conductive plastic molding material 1
．． In 1-., there is no need to mix and stir a conductive filler such as copper powder or aluminum powder as in the conventional method.
また、金属細線２の表面に熱可塑性プラスチック３が塗
布されるから、伸銅裸線等から成る金属細線２が酸化し
て導電性の低下を来すというおそれもない。Further, since the thermoplastic plastic 3 is applied to the surface of the thin metal wire 2, there is no fear that the thin metal wire 2, which is made of a bare copper wire or the like, will be oxidized and its conductivity will decrease.
なお、金属細線２の表面に塗布して被覆する熱可塑性プ
ラスチック３の厚さは任意に選定され、例えば成形品中
における金属細線２．２−の混和量及び混和密度をより
大きくして導電性を増大させたい場合には、熱可塑性プ
ラスチック３の厚さをできるだけ薄く選定すればよい。The thickness of the thermoplastic plastic 3 applied to and covering the surface of the thin metal wire 2 may be arbitrarily selected. For example, the amount and density of the thin metal wire 2.2- mixed in the molded product may be increased to increase the conductivity. If it is desired to increase the thickness, the thickness of the thermoplastic plastic 3 should be selected to be as thin as possible.
以上述べたように、本発明による導電化プラスチック成
形材料は、粒状もしくは短繊維状の熱可塑性プラスチッ
クに細線状の導電性材が一体的に配されているから、従
来のように導電性フィラーを混和して攪拌する必要もな
く、金型内に充填するだけで細線状の導電性材が全体に
わたって極めて均一に分布したシールド漏れのない導電
化プラスチック成形品を製造することができるという優
れた効果がある。また、このように成形品中に均一に分
布する導電性材は細線状に形成されて当該導電性材が互
いに相接触しやすいから、導電性が増大されて電磁波シ
ールド効果が高められるという効果も期待できる。As described above, the conductive plastic molding material according to the present invention has a thin wire-like conductive material integrally arranged on a granular or short-fiber thermoplastic. An excellent effect is that it is possible to manufacture a conductive plastic molded product without shield leakage in which the thin conductive material is distributed extremely uniformly throughout the mold simply by filling it into the mold without the need for mixing and stirring. There is. In addition, since the conductive materials uniformly distributed in the molded product are formed into thin wires and are likely to come into contact with each other, the conductivity is increased and the electromagnetic shielding effect is enhanced. You can expect it.
また、本発明方法によれば、導電性フィラーとなる所定
長さの金属細線が個々に一体的に含有された従来にない
新規な導電化プラスチック成形材料を得ることができる
という優れた効果がある。Further, according to the method of the present invention, there is an excellent effect that it is possible to obtain a novel electrically conductive plastic molding material in which thin metal wires of a predetermined length that serve as conductive fillers are individually and integrally contained. .
第１図及び第２図は夫々本発明による導電化プラスチッ
ク成形材料の一例を拡大して示す斜視図、第３図はその
製造方法の一例を示す工程図である。
符号の説明
１−導電化ブラスチンク成形材料、２−・熱可塑性プラ
スチック、３−・−金属細線（細線状の導電性材） 、
ｔ・−母線、５ａ、５ｂ−伸線機、７−・・ルツボ、８
−・・冷却器、９−カッター。
特許出願人 日本光ファイバ株式会社冨所貴雄
円−１
第１図
上
≦1 and 2 are enlarged perspective views of an example of the conductive plastic molding material according to the present invention, and FIG. 3 is a process diagram showing an example of the manufacturing method thereof. Explanation of symbols 1-Electrically conductive brass tink molding material, 2-・Thermoplastic plastic, 3-・-Thin metal wire (thin wire-shaped conductive material),
t- Bus bar, 5a, 5b- Wire drawing machine, 7- Crucible, 8
--Cooler, 9-cutter. Patent applicant Nippon Optical Fiber Co., Ltd. Takaoen Tomidoko-1 Figure 1 top ≦
Claims (6)
成形品の製造に用いる導電化プラスチック成形材料にお
いて、粒状もしくは短繊維状に成形された熱可塑性プラ
スチックに細線状の導電性材が一体的に配されて成るこ
とを特徴とする導電化プラスチック成形材料。(1) In conductive plastic molding materials used to manufacture conductive plastic molded products that have an electromagnetic wave shielding effect, thin wire-shaped conductive material is integrally arranged on thermoplastic plastic molded into granules or short fibers. A conductive plastic molding material characterized by:
が被覆されている前記特許請求の範囲第１項記載の導電
化プラスチック成形材料。(2) The conductive plastic molding material according to claim 1, wherein the surface of the conductive material is coated with the thermoplastic plastic.
有されている前記特許請求の範囲第１項記載の導電化プ
ラスチック成形材料。(3) The conductive plastic molding material according to claim 1, wherein the conductive material is contained in the thermoplastic plastic.
面に沿って添設されている前記特許請求の範囲第１項記
載の導電化プラスチック成形材料。(4) The conductive plastic molding material according to claim 1, wherein the conductive material is attached along the surface of the thermoplastic plastic.
０２〜０．１ｍｍの伸銅裸線である前記特許請求の範囲
第１項記載の導電化プラスチック成形材料。(5) The conductive material is cut into a predetermined length with a diameter of 0.
The conductive plastic molding material according to claim 1, which is a rolled copper bare wire with a thickness of 0.02 to 0.1 mm.
成形品の製造に用いる導電化プラスチック成形材料の製
造方法において、伸線機で所定径に延伸された金属細線
の表面に溶融した熱可塑性プラスチックを所定厚で塗布
し、当該熱可塑性プラスチックが硬化した後に前記金属
細線を所定の長さに切断することを特徴とする導電化プ
ラスチック成形材料の製造方法。(6) In a method for manufacturing a conductive plastic molding material used for manufacturing a conductive plastic molded product that exhibits an electromagnetic wave shielding effect, molten thermoplastic plastic is applied to a predetermined thickness on the surface of a fine metal wire that has been drawn to a predetermined diameter using a wire drawing machine. 1. A method for producing a conductive plastic molding material, which comprises: coating the thermoplastic plastic with a thermoplastic resin, and cutting the thin metal wire into a predetermined length after the thermoplastic plastic has hardened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23538185A JPS6296564A (en) | 1985-10-23 | 1985-10-23 | Electrically conductive plastic molding material and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23538185A JPS6296564A (en) | 1985-10-23 | 1985-10-23 | Electrically conductive plastic molding material and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296564A true JPS6296564A (en) | 1987-05-06 |
Family
ID=16985235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23538185A Pending JPS6296564A (en) | 1985-10-23 | 1985-10-23 | Electrically conductive plastic molding material and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296564A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160092A (en) * | 1987-12-17 | 1989-06-22 | Kawatetsu Techno Res Corp | Electromagnetic wave shielding material |
| KR100671408B1 (en) | 2005-12-12 | 2007-01-19 | 대진정공(주) | Insulation busbar of coating manufacture system |
-
1985
- 1985-10-23 JP JP23538185A patent/JPS6296564A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160092A (en) * | 1987-12-17 | 1989-06-22 | Kawatetsu Techno Res Corp | Electromagnetic wave shielding material |
| KR100671408B1 (en) | 2005-12-12 | 2007-01-19 | 대진정공(주) | Insulation busbar of coating manufacture system |
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