JPS6293870A - Conducting film composed of fine shape-memory metal wire - Google Patents
Conducting film composed of fine shape-memory metal wireInfo
- Publication number
- JPS6293870A JPS6293870A JP23256985A JP23256985A JPS6293870A JP S6293870 A JPS6293870 A JP S6293870A JP 23256985 A JP23256985 A JP 23256985A JP 23256985 A JP23256985 A JP 23256985A JP S6293870 A JPS6293870 A JP S6293870A
- Authority
- JP
- Japan
- Prior art keywords
- memory metal
- metal wire
- base material
- conducting film
- film composed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分針〕 本発明は基板間■導通？とる導通膜に関する。[Detailed description of the invention] [Industrial use minute hand] Is the present invention conductive between boards? Regarding conductive membranes.
本発明は基材Ｏ中に形状記憶金属細線を基材両面から金
属細線０頭が出るように埋め込み、これを熱圧着あるい
は加熱硬化型接着剤等により基板間の固定と導通を敗る
ようにしたも０である。In the present invention, thin shape memory metal wires are embedded in the base material O so that no thin metal wires come out from both sides of the base material, and these are bonded using thermocompression bonding or a heat curing adhesive to prevent fixation and conduction between the substrates. It is also 0.
従来○熱圧着タイプの導通膜としては、鉛粒子の入った
異方性導亀俟があった。Conventional thermocompression-bonded conductive membranes include anisotropic conductive membranes containing lead particles.
〔発明が解決しようとする間咀点及び目的〕しかし、前
述の従来技術では、導通が不充分であり、衿に導通全敗
る基板の寵臣が汚れていたり小さい異物が付いていると
導通が敗れなかった。[The problem and object to be solved by the invention] However, in the above-mentioned conventional technology, conduction is insufficient, and if the base of the board that completely loses conductivity is dirty or has small foreign matter attached to the collar, conductivity will be lost. There wasn't.
導通が取れても接触抵抗が数十〇と高いため、微小信号
や犬魁流金扱う基板Ｑコネクタには使えず、また接着強
度も弱＾ため信頼性も充分でなく高沿頼注を請求される
コネクタとしても使えなかった。Even if continuity is established, the contact resistance is high, in the tens of thousands, so it cannot be used as a board Q connector that handles minute signals or dog-eared metals.Also, the adhesive strength is weak, so the reliability is not sufficient, so a high order is required. It also could not be used as a connector.
本発明は、かかる開−を解決するためになされたも■で
おる。The present invention has been made in order to solve this problem.
本発明０導通膜は、形状記憶金員細線′ｆｒ、基材両面
から金属細線０頭が出るように埋め込み、これを熱圧着
あるいは加熱硬化型接着剤等により基板間０固定と導通
を敗ることを１時敗とする。The conductive film of the present invention is made by embedding thin metal wires with shape memory so that the thin metal wires protrude from both sides of the base material, and then fixing the metal wires between the substrates and establishing conductivity using thermocompression bonding or heat-curing adhesive. This will be considered a 1:0 loss.
本発明の構成によれば％熱８Ｅ看あるいは加熱硬化型接
着剤等により熱を加えると、形状記憶金属細線かもとの
形状にもどり、基板間の導通ｔａる。According to the structure of the present invention, when heat is applied at a temperature of 8E or with a thermosetting adhesive, the thin shape memory metal wire returns to its original shape and conduction between the substrates is established.
同時に接着剤あるいμ基材の接着により基板間を固定す
る。At the same time, the substrates are fixed by adhesive or μ base material.
姻２図μ本発明Ｏ実施例″Ｃある。第１図■基材に埋め
込まれた形状記憶金属細線が直線になる様に形状記憶さ
せておく、これをＭｉｌｌ！パターンＯ印刷された基板
４０間に入れ％熱硬化型の接着５で仮固定する。これ？
基板４０上下から圧力を加え、さらに接着剤ケ硬化させ
るために熱を加える。こＯ熱により形状記憶金属細線１
かもとの形状にもどろりとする。この復元力により上下
基板電画３０４通が取れる。こ０際に、亀陰３の接着剤
膜や汚れあるいは導通８Ｑを基板間に挿入する時に形状
記憶細線ｌＯ先端が曲っても、熱による復元力により導
通を取ることが出来る。そ■為４通が確央なもっとなり
接触抵抗も小さくなる。さらにその後■接着剤硬化によ
り基板間が固定されるため高信頼８：Ｖ）導通と錐保す
ることが出来る。実施的では接着剤を用いたが４通膜基
材を熱接有用材質とし５接着剤を用いずに単に熱圧着し
て導通を取ってもよい。Fig. 2 Embodiment Embodiment of the present invention "C" Fig. 1 ■ Shape-memory metal thin wires embedded in the base material are memorized so that they form a straight line. Temporarily fix it with thermosetting adhesive 5.Is this it?
Pressure is applied from above and below the substrate 40, and heat is further applied to harden the adhesive. Shape memory metal thin wire 1 due to heat
The shape of the base is also thick. Due to this restoring force, 304 electrical images can be taken from the upper and lower boards. At this time, even if the tip of the thin shape memory wire 10 is bent when inserting the adhesive film or dirt on the cap 3 or the conductor 8Q between the substrates, the conduction can be established by the restoring force due to heat. Therefore, the contact resistance becomes smaller because the four contacts are more accurate. Furthermore, since the substrates are fixed by curing the adhesive, highly reliable 8:V) conduction and cone can be maintained. In practice, an adhesive was used, but it is also possible to use the 4-thread membrane base material as a material for thermal bonding and simply heat-press it without using the 5-adhesive to establish electrical conductivity.
以上述べた様に、本発明によれば、上下導通が確央Ｖｃ
なり、しかも接触抵抗も小さくなるため、従来の異方性
導電膜では用いられなかった微小信号、大電流あるいは
高信頼）生がシ求される基板のコネクタとして哨いるこ
とが出来る。As described above, according to the present invention, vertical conduction is ensured at the center Vc
Moreover, since the contact resistance is also small, it can be used as a connector for substrates that require the generation of minute signals, large currents, or high reliability, which were not possible with conventional anisotropic conductive films.
こＯように従来の異方性専屯膜に比べ性能、信頼性及び
応用範囲におβて数段丁ぐれたもつとすることが出来る
。In this way, compared to conventional anisotropic specialized films, the performance, reliability, and range of application can be improved by several steps.
第１図の（α）（ｂ）ｉｊ、基材に形状記憶金属細線を
埋め込んだ状態Ｏ断面図と斜視図、１は形状記憶金属、
２μ基材。
鼾２図は基板間０導通倉取ったときの状態を示す断面図
、３は劃Ｌ４は基板、５は接着剤。
以上(α) (b) ij in Figure 1, cross-sectional view and perspective view of shape memory metal thin wires embedded in the base material, 1 is shape memory metal,
2μ base material. Figure 2 is a sectional view showing the state when there is no conduction between the boards, 3 is the board L4 is the board, and 5 is the adhesive. that's all
Claims (1)
金属細線を埋め込み、これを熱圧着あるいは加熱硬化型
接着剤等により基板間の固定と導通を取ることを特徴と
する形状記憶金属細線による導通膜。A shape memory metal characterized by embedding thin shape memory metal wires in a base material so that their heads protrude from both sides of the base material, and fixing the wires and establishing electrical continuity between the substrates by thermocompression bonding or heat curing adhesive. Conductive membrane with thin wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23256985A JPS6293870A (en) | 1985-10-18 | 1985-10-18 | Conducting film composed of fine shape-memory metal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23256985A JPS6293870A (en) | 1985-10-18 | 1985-10-18 | Conducting film composed of fine shape-memory metal wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6293870A true JPS6293870A (en) | 1987-04-30 |
Family
ID=16941395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23256985A Pending JPS6293870A (en) | 1985-10-18 | 1985-10-18 | Conducting film composed of fine shape-memory metal wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6293870A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209795A (en) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | Laminated layer circuit substrate |
| JPH097667A (en) * | 1995-06-23 | 1997-01-10 | Nec Corp | Anisotropic conductive film |
| JP2011204622A (en) * | 2010-03-26 | 2011-10-13 | Fujitsu Ltd | Connector, electronic device, and method for manufacturing the same |
| JPWO2022004179A1 (en) * | 2020-07-02 | 2022-01-06 |
-
1985
- 1985-10-18 JP JP23256985A patent/JPS6293870A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209795A (en) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | Laminated layer circuit substrate |
| JPH097667A (en) * | 1995-06-23 | 1997-01-10 | Nec Corp | Anisotropic conductive film |
| JP2011204622A (en) * | 2010-03-26 | 2011-10-13 | Fujitsu Ltd | Connector, electronic device, and method for manufacturing the same |
| JPWO2022004179A1 (en) * | 2020-07-02 | 2022-01-06 | ||
| WO2022004179A1 (en) * | 2020-07-02 | 2022-01-06 | 株式会社村田製作所 | Interposer and substrate module |
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