JPS6293768U - - Google Patents
Info
- Publication number
- JPS6293768U JPS6293768U JP18583485U JP18583485U JPS6293768U JP S6293768 U JPS6293768 U JP S6293768U JP 18583485 U JP18583485 U JP 18583485U JP 18583485 U JP18583485 U JP 18583485U JP S6293768 U JPS6293768 U JP S6293768U
- Authority
- JP
- Japan
- Prior art keywords
- probe needle
- outer cylinder
- wedge
- spring member
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第1図は本考案の高密度実装用プローブの縦断
面図、第2図は従来のプローブの縦断面図である
。
1……プローブ針、2……ピストン、3……外
部ケーブル、4……ばね受け部材、5……外筒、
6……ばね、7……押下キー、8……横ばね、9
……外筒の先端部、10,11,12……高密度
実装集積回路の端子、14……くさび形凸部、1
5……くさび形凹溝。
FIG. 1 is a vertical cross-sectional view of a high-density mounting probe according to the present invention, and FIG. 2 is a vertical cross-sectional view of a conventional probe. DESCRIPTION OF SYMBOLS 1... Probe needle, 2... Piston, 3... External cable, 4... Spring receiving member, 5... Outer cylinder,
6...Spring, 7...Press key, 8...Horizontal spring, 9
... Tip of outer cylinder, 10, 11, 12 ... Terminal of high-density mounting integrated circuit, 14 ... Wedge-shaped protrusion, 1
5... Wedge-shaped groove.
Claims (1)
、前記プローブ針の後端に連結された中空のピス
トンと、前記ピストンの中空部を通して前記プロ
ーブ針に接続される外部ケーブルと、前記プロー
ブ針に固着されたばね受部および該プローブ針を
先方へ押圧するばね部材と、前記プローブ針をそ
の全長にわたつて常時包囲しかつ先端部が柔軟な
材質で形成され高密度実装集積回路の端子1本を
該先端部から内部に差し込み得るように構成され
た絶縁材製外筒と、前記外筒の側部にあけられた
穴から内部に挿入されかつ該外筒のくさび形凹溝
に対応したくさび形凸部を備えた押下キーと、前
記押下キーと前記外筒内壁との間に設けられた横
ばねとを有することを特徴とする高密度実装回路
用プローブ。 a probe needle having a wedge-shaped groove in the middle; a hollow piston connected to the rear end of the probe needle; an external cable connected to the probe needle through the hollow part of the piston; and the probe needle. one terminal of a high-density-packaged integrated circuit, which includes a spring receiving portion fixed to the spring member and a spring member that presses the probe needle forward, and a spring member that constantly surrounds the probe needle over its entire length and whose tip is made of a flexible material an outer cylinder made of an insulating material configured to be inserted into the inside from the tip thereof, and a wedge that is inserted into the inside through a hole drilled in a side of the outer cylinder and corresponds to a wedge-shaped groove of the outer cylinder. 1. A probe for a high-density mounted circuit, comprising a press key having a shaped convex portion, and a horizontal spring provided between the press key and the inner wall of the outer cylinder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18583485U JPS6293768U (en) | 1985-12-02 | 1985-12-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18583485U JPS6293768U (en) | 1985-12-02 | 1985-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6293768U true JPS6293768U (en) | 1987-06-15 |
Family
ID=31134832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18583485U Pending JPS6293768U (en) | 1985-12-02 | 1985-12-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6293768U (en) |
-
1985
- 1985-12-02 JP JP18583485U patent/JPS6293768U/ja active Pending
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