JPS6286136A - Copper alloy for electronic machine - Google Patents

Abstract

PURPOSE:To obtain a Cu alloy for an electronic machine having improved strength by adding a specified amount of Fe or Ni to a Cu;0.15wt% Cr;0.1wt% Sn; alloy. CONSTITUTION:This Cu alloy consists of, by weight, 0.03-0.2% Cr, 0.03-0.2% Sn, 0.05-0.8% in total of 0.03-0.5% each of Ni and/or Fe and the balance Cu. The alloy gives a high quality ingot, has superior strength, heat resistance, electric conductivity and satisfactory workability and is effectively used as a material for electronic machine parts such as a lead frame for a semiconductor integrated circuit to be thinned and miniaturized.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、強度、導ＴｒＬ率、Ｉ６＃熱性に優れ、かつ
加工性及び半田付性が良好な銅合金に関し、より詳しく
いえば電子機器用材として好適であり、特に半導体用リ
ードフレームとして最適な銅合金に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a copper alloy that has excellent strength, TrL conductivity, and I6# thermal properties, and has good workability and solderability. The present invention relates to a copper alloy that is suitable as a material for use in semiconductors, particularly as a lead frame for semiconductors.

（従来の技術） 一般に半導体用リードフレームに要求される諸特性とし
て、１）電気及び熱の伝導性が良いこと２）強度が高い
こと、３）加工性が良いこと、４）耐熱性が良いこと、
５）半田、めっき性が良好なことなどが挙げられる。(Prior art) In general, various properties required for semiconductor lead frames include 1) good electrical and thermal conductivity, 2) high strength, 3) good workability, and 4) good heat resistance. thing,
5) Good solder and plating properties.

このような半導体リードフレーム用素材に要求される特
性に関して比較的高い導電性と良好な耐熱性を有してい
るものとしてＣｕ−０，’１５ｗｔ％Ｃｒ−０，１ｗｔ
％Ｓｎ合金（以下１組成を表わすｗｔ％を単に％と記す
）がある。Cu-0,'15wt%Cr-0,1wt has relatively high conductivity and good heat resistance with respect to the characteristics required for materials for semiconductor lead frames.
%Sn alloy (hereinafter, wt% representing one composition is simply written as %).

（発明が解決しようとする問題点） しかし、近年半導体集積回路の集積度の増大及び小型化
により、リードフレームにも薄肉、小型化が要求されて
きている。(Problems to be Solved by the Invention) However, in recent years, as the degree of integration and miniaturization of semiconductor integrated circuits has increased, lead frames have also been required to be thinner and smaller.

そのため、＠肉化による構成部品の強度低下を防ぐため
１強度の向上した銅合金が要求されているが、上記のｃ
ｕ−０，１５％Ｃｒ−０，１％Ｓｎ合金はこの点でまだ
満足すべきものとはいえなかった。またこの銅合金は、
銅及び銅合金へのメ、！なしで直接ワイヤーポンディン
グする、いわゆるペアポンディング技術を適用するには
耐熱性が不十分であった。Therefore, in order to prevent the strength of component parts from decreasing due to thickening, a copper alloy with improved strength is required.
The u-0,15%Cr-0,1%Sn alloy was not yet satisfactory in this respect. In addition, this copper alloy
Me to copper and copper alloys! The heat resistance was insufficient to apply the so-called pair bonding technique, which involves direct wire bonding without wire bonding.

（問題点を解決するための１段） 本発明者らは、このような従来の電子機器用銅合金の問
題点を克服するため鋭意研究を重ねた結果、銅にＣｒ及
びＳｎとともに、所定量のＮｉ及びＦｅから選ばれた少
なくとも１種を含有させることにより導電性を低下させ
ることなく、強度と耐熱性の向−ヒを達成しうることを
見出し本発明を完成するに至った。(First Step to Solve the Problems) As a result of extensive research in order to overcome the problems of conventional copper alloys for electronic devices, the present inventors have found that copper, along with Cr and Sn, can be added in predetermined amounts. The present inventors have discovered that improvements in strength and heat resistance can be achieved without reducing conductivity by containing at least one selected from Ni and Fe, and have completed the present invention.

すなわち本発明は、Ｃｒ　　０．０３〜０．２％、Ｓｎ
　　Ｏ，０３〜０．２％を含有し、さらにＮｉ及び／又
はＦｅを単独の場合０．０３〜０．５％、複合の場合０
．０５〜０．８％含み、残部Ｃｕと不可避不純物とから
なることを特徴とする電子機器用銅合金を提供するもの
である。That is, in the present invention, Cr 0.03 to 0.2%, Sn
Contains 0.03 to 0.2% of O, and 0.03 to 0.5% of Ni and/or Fe alone, and 0 in the case of a composite.
．． The present invention provides a copper alloy for electronic devices characterized by containing 0.05 to 0.8% of Cu, and the remainder consisting of Cu and unavoidable impurities.

本発明の銅合金において各成分範囲を限定した理由は以
下の通りである。The reason for limiting the range of each component in the copper alloy of the present invention is as follows.

Ｃｒ含有量を０．０３〜０．２％、Ｓｎ含有量を０．０
３〜０．２％としたのは、これらの添加元素のいずれか
が下限未満ではＮｉ、Ｆｅより選ばれた元素を添加して
も所望の強度、耐熱性が得られず、また上限を越えると
導電性の低下が著しいためである。またＮｉ、Ｆｅの成
分範囲を、単独では０．０３〜０．５％、複合では０．
０５〜０．８％としたのは、Ｎｉ、Ｆｅ　　単独、複合
共に範囲下限未満では添加する効果がなく、単独で０．
５％、複合で０．８％を越えると導電性が低下するため
である。さらに、鋳造時の脱酸剤として０．００５〜０
．０８％のＰを添加する事は特性に何ら差支えない。Cr content 0.03-0.2%, Sn content 0.0
The reason why it is set at 3 to 0.2% is that if any of these additive elements is below the lower limit, the desired strength and heat resistance will not be obtained even if an element selected from Ni or Fe is added, and if the upper limit is exceeded. This is because the conductivity decreases significantly. In addition, the component range of Ni and Fe is 0.03 to 0.5% when used alone, and 0.0% when combined.
The reason why Ni and Fe are set at 0.05 to 0.8% is that there is no effect when adding Ni, Fe alone or in combination below the lower limit of the range, so when Ni and Fe are added alone, it is 0.05 to 0.8%.
This is because if the content exceeds 5% or 0.8% in the composite, the conductivity will decrease. Furthermore, 0.005 to 0 as a deoxidizing agent during casting.
．． Adding 0.8% P does not affect the properties at all.

（実施例） 次に本発明を実施例に基づきさらに詳細に説明する。(Example) Next, the present invention will be explained in more detail based on examples.

黒鉛ルツボを用いてＣｕを溶解しその湯面を木炭粉末で
被覆した後、Ｓｎ、ＣｒとＮｉ及びＦｅより選ばれた添
加元素を添加し、これを鋳造し表１に示す組成の幅１２
０ｍｍ、厚さ２５ｍｍ、長さ１５０ｍｍの鋳塊を得た。After melting Cu using a graphite crucible and coating the melt surface with charcoal powder, additive elements selected from Sn, Cr, Ni, and Fe were added, and this was cast to form a composition with a width of 12 as shown in Table 1.
An ingot with a diameter of 0 mm, a thickness of 25 mm, and a length of 150 mm was obtained.

これらの鋳塊について、その表面を一面あたり２．５ｍ
ｍ面削した後カラーチェック法により表面状況を調べ、
鋳塊の健全性をチェックし表１に示した。Regarding these ingots, the surface is 2.5m per side.
After milling the m surface, examine the surface condition using the color check method,
The soundness of the ingots was checked and shown in Table 1.

次にこの鋳塊を加熱して熱間圧延を行い、厚さ８ｍｍ、
輻１２０ｍｍとした後、冷間圧延と焼鈍を繰返し、最終
加工率３０％、厚さ０．２５ｍｍの板に仕上げた。これ
らの板について引張強さ。Next, this ingot was heated and hot rolled to a thickness of 8 mm.
After setting the radius to 120 mm, cold rolling and annealing were repeated to produce a plate with a final processing rate of 30% and a thickness of 0.25 mm. Tensile strength for these plates.

導電率、硬度、耐熱性曲げ加工性を測定した。Electrical conductivity, hardness, heat resistance and bending workability were measured.

導電率、引張強さの測定はＪＩＳ−ＨＯ５０５Ｊ　Ｉ　
Ｓ−２２２４１に基づいて行った。また硬度、耐熱性は
圧延材と５００℃×５分間焼鈍材を荷１５００ｇのビッ
カース硬さを測定し比較した。さらに曲げ加工性は重犯
圧延板より、巾１０ｍ　ｍ　、　長さ５０ｍｍの短冊型
試験片を切り出し。Measurement of electrical conductivity and tensile strength is based on JIS-HO505J I
It was conducted based on S-22241. Hardness and heat resistance were compared by measuring the Vickers hardness of rolled material and material annealed at 500° C. for 5 minutes using a load of 1500 g. Furthermore, bending workability was determined by cutting out a rectangular test piece with a width of 10 mm and a length of 50 mm from a heavy-duty rolled plate.

その中央部で１８０°密着曲げを行い１曲げ部の状態を
観察し、割れのない平滑なものを曲げ性が良好とし「○
」印で割れ等の欠陥が認められたものを曲げ性不良で「
×」印その中間のものを「Δ」印で表わした。A 180° close bend is performed at the center, and the condition of each bent part is observed. If the bending part is smooth and has no cracks, it is considered to have good bendability.
'' marked with cracks or other defects are considered to be poor bendability.
The mark in between the × mark and the mark is represented by a Δ mark.

さらに、鋳塊の健全性については前記カラーチェック法
により表面欠陥の認められなかったものを「Ｏ」印、そ
れ以外のものを「×」印で表わした。Furthermore, regarding the soundness of the ingots, ingots for which no surface defects were found according to the color check method were marked with an "O" mark, and other ingots were marked with an "x" mark.

表１から明らかなように、本発明合金は、従来合金であ
る比較合金Ｎｏ、９　ｒＣｕ−０，１５％Ｃｒ−０，１
％ＳｎＪ合金と比較して導電性と損わずに、高い強度、
耐熱性を有しており優れていることがわかる。As is clear from Table 1, the alloy of the present invention is a conventional alloy, comparative alloy No. 9 rCu-0,15%Cr-0,1
%SnJ alloy with high strength without loss of conductivity,
It can be seen that it has excellent heat resistance.

これに対して、Ｎｉ、Ｆｅの添加量の少ない合金Ｎｏ、
１１．１２では強度の向上が見られず、添加量の多すぎ
る合金Ｎｏ、１３．１４．１５では導電性が低下すると
ともに、加工性が劣化する。On the other hand, alloy No. with small amounts of Ni and Fe added,
In alloy No. 11.12, no improvement in strength was observed, and in alloy No. 13, 14, and 15, in which the addition amount was too large, conductivity decreased and workability deteriorated.

さらに、Ｃｒ、Ｓｎ含有量が共に少ない合金Ｎｏ。Furthermore, alloy No. has a low content of both Cr and Sn.

１０では、耐熱性が低下している。In No. 10, the heat resistance is decreased.

（発明の効果） このように、本発明合金は、鋳塊品質が良好で優れた強
度及び耐熱性と導電性を併せ有し、加工性が良好である
電子機器用材として、顕著な効果を奏するものである。(Effects of the Invention) As described above, the alloy of the present invention has good ingot quality, excellent strength, heat resistance, and conductivity, and exhibits remarkable effects as a material for electronic devices with good workability. It is something.

Claims (1)

【特許請求の範囲】[Claims] （１）Ｃｒ０．０３〜０．２ｗｔ％、Ｓｎ ０．０３〜０．２ｗｔ％を含有しさらに、Ｎｉ及び／又
はＦｅを単独では、０．０３〜０．５ｗｔ％、複合では
０．０５〜０．８ｗｔ％含み、残部がＣｕと不可避不純
物とからなることを特徴とする電子機器用銅合金。(1) Contains 0.03 to 0.2 wt% of Cr and 0.03 to 0.2 wt% of Sn, and further contains Ni and/or Fe of 0.03 to 0.5 wt% when used alone, and from 0.05 to 0.05 when combined. A copper alloy for electronic devices, characterized in that it contains 0.8 wt% of Cu, and the remainder consists of Cu and unavoidable impurities.