JPS6276541A

JPS6276541A - Soldering

Info

Publication number: JPS6276541A
Application number: JP60215652A
Authority: JP
Inventors: Hironori Terasaki; 浩則寺崎; Hiroshi Miidokoro; 三井所　博史; Nobuharu Nakayama; 中山　信春
Original assignee: New Japan Radio Co Ltd
Current assignee: New Japan Radio Co Ltd
Priority date: 1985-09-28
Filing date: 1985-09-28
Publication date: 1987-04-08

Abstract

PURPOSE:To reduce a dangerousness and a necessary time by quickly lowering a part until the portion to be soldered of the part is brought into contact with the surface of molten solder, once stopping the lowering of the part when said portion is brought into contact with the surface, keeping stationary for a predetermined time and then again lowering the part at a low speed to allow the portion to be soldered of the part to be completely dipped in the molten solder. CONSTITUTION:A part (p) is quickly lowered from a position above a molten solder (s) until the tips of the leads l of the part (p) are brought into contact with the surface of the molten solder (s) by the length of degree of 0.1-3mm and stopped to be lowered when in contact, being then kept stationary for 1-10sec. The part (p) is lowered again at a low speed and the leads l are dipped in the molten solder to the roots of the leads l. The leads l are kept to be dipped in the solder (s) for a predetermined time to build up a thermal balance between the solder and the leads l and the solder (s) is sufficiently attached to the leads l. Then, the part (p) is lifted at a low speed from a dipping state to a position where the tips of the leads l leave the surface of the molten solder (s) and thereafter, changing a lifting speed from last-said position, at a high speed.

Description

【発明の詳細な説明】〔産業上の利用分野〕本発明は半導体装置等の部品のリード等に対する半田付
は方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for soldering leads, etc. of components of semiconductor devices and the like.

〔従来技術〕[Prior art]

従来、半田付装置において、半導体装置等の部品のリー
ドに半田付けする場合には、部品を一定速度で半田槽の
熔融半田内に一挙に浸漬し、一定時間経過した後に部品
の引上げも一定速度で一挙に行っていた。Conventionally, when using soldering equipment to solder the leads of components such as semiconductor devices, the components are dipped all at once into molten solder in a solder bath at a constant speed, and after a certain period of time, the components are pulled up at a constant speed. I went all at once.

第２図はその工程のダイヤグラムを示すものである。こ
の第２図において、Ｓは半田付は槽内の熔融半田、矢印
ｔは工程経過時間を示し、丸数字は各工程時間における
部品（正確には部品の被半田付部分）の高さ位置を示し
ている。この丸数字は溶融半田に対する位置を示す第１
図の丸数字と対応している。ｐは部品（本例の場合は半
導体装置）であり、βはそのリードを示している。この
リードｌが半田付けされる部分である。FIG. 2 shows a diagram of the process. In this figure 2, S indicates the molten solder in the tank, the arrow t indicates the elapsed process time, and the circled numbers indicate the height position of the component (more precisely, the part to be soldered) at each process time. It shows. This circle number indicates the position relative to the molten solder.
They correspond to the circled numbers in the diagram. p is a component (in this example, a semiconductor device), and β is a lead thereof. This lead 1 is the part to be soldered.

第２図において明らかなように、従来の半田付けは３工
程よりなっている。即ち、（１）、■から■への工程（２）、■−■の工程（３）、■から■への工程である。As is clear from FIG. 2, conventional soldering consists of three steps. That is, (1), the process from ■ to ■ (2), the process from ■ to ■ (3), and the process from ■ to ■.

（１）の■から■への工程、即ち、半田付けされる部品
ｐが熔融半田Ｓの上方の位置から熔融半田Ｓ内に移行さ
れる工程は、下向きの直線で表されていて、部品ｐは一
定速度で降下し７て、そのリードβ部分が半田必要部分
まで一挙に熔融半田Ｓ内に浸漬される状態を示している
。The process from ■ to ■ in (1), that is, the process in which the component p to be soldered is transferred from a position above the molten solder S to inside the molten solder S is represented by a downward straight line, and the component p is lowered at a constant speed 7, and the lead β portion is immersed in the molten solder S all at once to the area where soldering is required.

（２）の■−■の水平部は部品ｐのリード２部分が熔融
半田Ｓ内に浸漬された状態で一定時間静止されているこ
とを示している。In (2), the horizontal portion (■-■) indicates that the lead 2 portion of the component p is immersed in the molten solder S and remains stationary for a certain period of time.

（３）の■から■への移行は上向きの直線で表されてい
て、部品ｐが熔融半田Ｓ内からその上方の位置へ一定速
度で引き上げられて元の位置に戻されることを示してい
る。The transition from ■ to ■ in (3) is represented by an upward straight line, indicating that component p is pulled up from within the molten solder S to a position above it at a constant speed and returned to its original position. .

このように従来の方法は、部品ｐを熔融半田Ｓ内に一挙
に浸漬し、その後そこより一挙に引上げる工程があるた
め、半田飛散、半田面の揺れ、フラックスヒユームの多
発等が起り、また引き上げ時Ｇごはリード相互間のブリ
ッジやツララの発生等の問題があった。In this way, the conventional method involves the step of immersing the component P into the molten solder S all at once and then pulling it out from there all at once, which causes solder scattering, shaking of the solder surface, frequent occurrence of flux fumes, etc. Further, when pulling up the G, there were problems such as bridging between the leads and generation of icicles.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、熔融半田を極力静止状態に安定させる
ようにし、また部品に予熱処理を行なうことができるよ
うにして、上記した問題を解消した半田付は方法を提供
するものである。It is an object of the present invention to provide a soldering method that eliminates the above-mentioned problems by stabilizing molten solder in a stationary state as much as possible and by making it possible to preheat parts.

〔発明の構成〕[Structure of the invention]

このために、本発明の半田付は方法は、部品をその被半
田付は部分の先端が熔融半田の表面に接触するまで急速
に降下させ、接触した時点で降下を一旦停止させて一定
時間静止させ、その後低速度で再び降下させて上記被半
田付は部分を熔融半田内に完全に浸漬させ、その浸漬を
一定時間維持させた後、部品を被半田付は部分の先端が
熔融半田の表面から離れるまでは低速度で引上げるよう
にしている。To this end, the soldering method of the present invention involves rapidly lowering the part to be soldered until the tip of the part contacts the surface of the molten solder, and at the point of contact, stopping the lowering once and allowing it to stand still for a certain period of time. The part to be soldered is then lowered again at a low speed so that the part to be soldered is completely immersed in the molten solder, and after maintaining the immersion for a certain period of time, the part to be soldered is lowered until the tip of the part to be soldered is on the surface of the molten solder. I try to pull it up at a low speed until it leaves.

〔実施例〕〔Example〕

以下、本発明の半田付は方法の実施例について説明する
。Hereinafter, embodiments of the soldering method of the present invention will be described.

第３図はその工程をダイヤグラムで示す説明図であり、
６エ程よりなる。即ち、（１）、■から■への工程（２）、■の静止工程（３）、■から■を経て■への工程（４）、■の静止工程（５）、■から■への工程（６）、■から■への工程である。FIG. 3 is an explanatory diagram showing the process in a diagram.
Consists of 6 steps. That is, (1), the process from ■ to ■ (2), the static process of ■ (3), the process from ■ to ■ through ■ (4), the static process of ■ (5), the process from ■ to ■ Step (6) is a step from ■ to ■.

（１）の工程は、垂直に近い直線で示されていることか
ら明らかなように、部品ｐを熔融半田Ｓの上方の位置（
■の状態）から急速に降下させ、そのリードｌの先端を
熔融半田Ｓの表面に０．１〜３１寓程変接触（■の状態
）させる。その接触した時点で、降下を停止させろ。As is clear from the nearly vertical straight line, the process (1) moves the component p to a position above the molten solder S (
The tip of the lead L is brought into contact with the surface of the molten solder S by 0.1 to 31 degrees (state of ■). Once you make contact, stop your descent.

（２）の工程において、この停止状態を１〜１０秒間維
持させる。これ番こより、リードｌを熔融半田Ｓの熱に
より予熱して、半田との温度差を少なくする。In step (2), this stopped state is maintained for 1 to 10 seconds. From now on, the lead 1 is preheated by the heat of the molten solder S to reduce the temperature difference between it and the solder.

次の（３）の工程において、部品ｐを低速度で再び降下
させ、リードβをその根元まで熔１散半田Ｓ内に浸／−
１させる（■の状態）。In the next step (3), the component p is lowered again at a low speed, and the lead β is immersed in the molten solder S up to its root.
1 (state of ■).

（４）の工程において、この浸漬状態を一定時間維持さ
せ、半田とリードとの熱的平衡状態をつくり、リードＰ
に熔融半田Ｓを充分に付着させる。In step (4), this immersion state is maintained for a certain period of time to create a thermal equilibrium state between the solder and the lead, and the lead P
Apply molten solder S to the surface.

そして（５）の工程において、部品ｐをこの浸漬状態か
らリードｌの先端が熔融半田Ｓの表面と接触しない位置
（■の状態）まで低速度で引上げる。Then, in step (5), the component p is pulled up from this immersed state at a low speed to a position where the tip of the lead l does not come into contact with the surface of the molten solder S (state of ■).

最後の（６）の工程において、■の状態の後の引上げは
その速度を変えて急速で行なう。なお、この引上げの速
度を変えないで（５）の工程の引上げに引続いて低速度
で行っても差支えない。そして、最終的に部品ｐを初期
の位置（■の状Ｂ）に戻す。In the final step (6), the pulling speed after the state (2) is changed to be rapid. Note that there is no problem in performing the pulling at a low speed following the pulling in step (5) without changing the speed of this pulling. Finally, the part p is returned to its initial position (the shape B).

以上結果、被半田付は部分が半田付けされる前に予熱さ
れるのでフラックスの活性化が向上し、被半田付は部分
を熔融半田内に浸漬させる時にフラックスヒユームが一
度に発生することが防止できる。また熔融半田が飛散し
たり、揺れたりすることが極力抑制されるので、危険性
が減少する。As a result, since the parts to be soldered are preheated before the parts are soldered, the activation of the flux is improved, and flux fumes are not generated all at once when the parts to be soldered are immersed in molten solder. It can be prevented. Furthermore, scattering or shaking of the molten solder is suppressed to the utmost, so the danger is reduced.

更に引き上げがゆっくり行なわれるので、被半田付部分
に半田ブリッジ及びつらら状の半田の発生を防止するこ
とができ半田付けの仕上がりのむらの発生が減少する。Furthermore, since the pulling is performed slowly, it is possible to prevent the formation of solder bridges and icicle-like solder on the soldered portion, thereby reducing the occurrence of unevenness in the soldering finish.

〔発明の効果〕〔Effect of the invention〕

以上から本発明によれば、従来問題となった半田飛散、
半田面の揺れ、フランクスヒュームの多発、半田ブリッ
ジやツララの発生を効果的に防止することができ、また
最初と最後の工程における部品の上下動は速い速度で行
うことが可能であるため、全体の工程に要する時間を短
縮することができる。From the above, according to the present invention, solder scattering, which has been a problem in the past, can be avoided.
It can effectively prevent shaking of the solder surface, frequent occurrence of Franks fumes, solder bridges and icicles, and the vertical movement of parts in the first and last processes can be performed at a high speed, so the overall The time required for the process can be shortened.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は半導体装置の半田付けの各工程を状態を示す説
明図、第２図は従来の半田付は方法の工程をダイヤグラ
ムで示す説明図、第３図は本発明の半田付は方法の工程
をダイヤグラムで示す説明図である。Ｓ・・・熔融半田、ｐ・・・部品（半導体装置）、！・
・・部品の被半田付部分（リード）。Fig. 1 is an explanatory diagram showing each process of soldering a semiconductor device, Fig. 2 is an explanatory diagram showing the steps of a conventional soldering method in a diagram, and Fig. 3 is an explanatory diagram showing the steps of a conventional soldering method. It is an explanatory view showing a process in a diagram. S...molten solder, p...parts (semiconductor device),!・
...The part to be soldered (lead) of the component.

Claims

【特許請求の範囲】[Claims]

（１）．部品の被半田付け部分を熔融半田内に一定時間
浸漬させてから引上げることにより半田付けする方法に
おいて、上記部品をその被半田付け部分の先端が熔融半田の表面
に接触するまで急速に降下させ、接触した時点で降下を
一旦停止させて一定時間静止させ、その後低速度で再び
降下させて上記被半田付け部分を熔融半田内に完全に浸
漬させ、その浸漬を一定時間継続させた後、部品を被半
田付け部分の先端が熔融半田の表面から離れるまでは低
速度で引上げるようにした半田付け方法。(1). In a method of soldering by dipping the part of the part to be soldered into molten solder for a certain period of time and then pulling it up, the part is rapidly lowered until the tip of the part to be soldered contacts the surface of the molten solder. At the point of contact, the descent is stopped once and kept at rest for a certain period of time, and then the part is lowered again at a low speed to completely immerse the part to be soldered into the molten solder, and after continuing the immersion for a certain period of time, the part A soldering method in which the tip of the part to be soldered is pulled up at a low speed until it separates from the surface of the molten solder.