JPS6275826U - - Google Patents
Info
- Publication number
- JPS6275826U JPS6275826U JP16893185U JP16893185U JPS6275826U JP S6275826 U JPS6275826 U JP S6275826U JP 16893185 U JP16893185 U JP 16893185U JP 16893185 U JP16893185 U JP 16893185U JP S6275826 U JPS6275826 U JP S6275826U
- Authority
- JP
- Japan
- Prior art keywords
- board body
- board
- synthetic resin
- resin adhesive
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 240000008620 Fagopyrum esculentum Species 0.000 claims 1
- 235000009419 Fagopyrum esculentum Nutrition 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000010903 husk Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
Landscapes
- Building Environments (AREA)
- Air-Conditioning Room Units, And Self-Contained Units In General (AREA)
- Drying Of Gases (AREA)
Description
第1図は本考案の吸湿板の一部拡大して示す使
用状態図、第2図は第1図の―断面図である
。
尚、図中A……吸湿板、a……板本体、b……
基台、1……基材、5……エポキシ系合成樹脂接
着剤。
FIG. 1 is an enlarged view of a portion of the moisture absorbing plate of the present invention in use, and FIG. 2 is a cross-sectional view of FIG. 1. In addition, in the figure A... Moisture absorbing plate, a... Board body, b...
Base, 1...Base material, 5...Epoxy synthetic resin adhesive.
Claims (1)
板本体がもみがら、そばがら等の基材にバインダ
ーとして3〜30wt%のエポキシ系合成樹脂接
着剤を混合し型成形してなる吸湿板。 The board body is set up on a portable base, and the board body is formed by molding a base material such as rice husk or buckwheat hulls with 3 to 30 wt% epoxy synthetic resin adhesive as a binder. Board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16893185U JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16893185U JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6275826U true JPS6275826U (en) | 1987-05-15 |
Family
ID=31102272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16893185U Pending JPS6275826U (en) | 1985-10-31 | 1985-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6275826U (en) |
-
1985
- 1985-10-31 JP JP16893185U patent/JPS6275826U/ja active Pending
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