JPS6272051U - - Google Patents
Info
- Publication number
- JPS6272051U JPS6272051U JP1985163857U JP16385785U JPS6272051U JP S6272051 U JPS6272051 U JP S6272051U JP 1985163857 U JP1985163857 U JP 1985163857U JP 16385785 U JP16385785 U JP 16385785U JP S6272051 U JPS6272051 U JP S6272051U
- Authority
- JP
- Japan
- Prior art keywords
- ultra
- molecular weight
- high molecular
- weight polyethylene
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 10
- 238000005498 polishing Methods 0.000 claims description 5
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims 2
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims 2
Description
第１図および第６図は本考案の研磨固定用材に
被研磨材を取りつけた実例を示す断面図、第３〜
５図は本考案の研磨固定用材の他の実例を示す断
面図、第２図は従来の研磨固定用材に被研磨材を
取りつけた状態を示す断面図である。
１…被研磨材、２…固定板、３…起毛固定材、
２１…ＵＨＰＥ。
1 and 6 are cross-sectional views showing an example in which a material to be polished is attached to the polishing fixing material of the present invention;
FIG. 5 is a sectional view showing another example of the polishing fixing material of the present invention, and FIG. 2 is a sectional view showing a conventional polishing fixing material with a material to be polished attached. 1... Material to be polished, 2... Fixing plate, 3... Raised fixing material,
21...UHPE.
Claims (1)
超高文子量ポリエチレンである研磨固定用材。 (2) 超高分子量ポリエチレンが多孔質である実
用新案登録請求の範囲第１項記載の研磨固定用材
。[Scope of Claim for Utility Model Registration] (1) A polishing fixing material in which at least the contact area between the material to be polished and the fixing plate is made of ultra-high molecular weight polyethylene. (2) The polishing fixing material according to claim 1, wherein the ultra-high molecular weight polyethylene is porous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985163857U JPS6272051U (en) | 1985-10-24 | 1985-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985163857U JPS6272051U (en) | 1985-10-24 | 1985-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6272051U true JPS6272051U (en) | 1987-05-08 |
Family
ID=31092443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985163857U Pending JPS6272051U (en) | 1985-10-24 | 1985-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6272051U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111001A (en) * | 2010-11-25 | 2012-06-14 | Nikon Corp | Work carrier and polishing device having work carrier |
| JP2017037993A (en) * | 2015-08-11 | 2017-02-16 | 有限会社サクセス | Semiconductor wafer holder, semiconductor wafer grinding device, and semiconductor wafer grinding method |
-
1985
- 1985-10-24 JP JP1985163857U patent/JPS6272051U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111001A (en) * | 2010-11-25 | 2012-06-14 | Nikon Corp | Work carrier and polishing device having work carrier |
| JP2017037993A (en) * | 2015-08-11 | 2017-02-16 | 有限会社サクセス | Semiconductor wafer holder, semiconductor wafer grinding device, and semiconductor wafer grinding method |