JPS627198A - Junction state detector - Google Patents
Junction state detectorInfo
- Publication number
- JPS627198A JPS627198A JP60144668A JP14466885A JPS627198A JP S627198 A JPS627198 A JP S627198A JP 60144668 A JP60144668 A JP 60144668A JP 14466885 A JP14466885 A JP 14466885A JP S627198 A JPS627198 A JP S627198A
- Authority
- JP
- Japan
- Prior art keywords
- inspected
- laser
- lead
- pass filter
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は複数の部品の接合状態を検出する複合接合状態
検出装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a composite joint state detection device that detects the joint state of a plurality of parts.
検査すべき接合部にはフラットパッケージ形部品１のは
んだ封部１ａ（第２図−１）、ＬＳＩなどのワイヤ・ボ
ンディング箇所２（第２図う））などの例がある。これ
らの対象物の欠陥としては接合部が完全に離れているも
の、接触をしているのみで完全には結合してい表いもの
、接合部がずれているものなどがある。これらの欠陥の
うち接合部が完全に離れているもの、接触しているのみ
であるものは自動検査が困難であるばか〕でなく、目視
による検査も困難であるため、特に検査自動化の必要性
が高い。これらの検査対象はすべて第２図（ｏｌに示す
如く、第１の物体３と第２の物体４とそれらの接合部５
とから構成される同一の構造を持っている。そこで、以
下はこれらの検査対象のうちフラットパッケージ形部品
のリード非接続欠陥（完全に浮いているものと接触はし
ているがはんだ付けがなされていないものを含む）の検
査に限って説明する。同様のことが、その他の第２図ｂ
）Ｋ示される構造を持つ対象物の検査について言え、本
発明を用いれば検：ｉを行うことがてきることは勿論で
ある。Examples of joints to be inspected include the solder sealing part 1a of the flat package type component 1 (FIG. 2-1) and the wire bonding location 2 of LSI etc. (FIG. 2-B). Defects in these objects include cases where the joints are completely separated, cases where the joints are only in contact but not completely joined, and cases where the joints are misaligned. Among these defects, it is difficult to automatically inspect those where the joints are completely separated or those where there is only contact, and it is also difficult to inspect visually, so there is a particular need for inspection automation. is high. All of these inspection objects are the first object 3, the second object 4, and their joints 5, as shown in Figure 2 (ol).
It has the same structure consisting of. Therefore, the following will explain only the inspection of lead non-connection defects of flat package type components (including those that are completely floating and those that are in contact but are not soldered). . The same thing applies to other figures 2b
)K Regarding the inspection of an object having the structure shown, it goes without saying that inspection:i can be performed using the present invention.
従来技術としてフラットパッケージ形部品のはんだ何部
の外観検査をおこなうものとして以下に述べるＶａｔｔ
ｅｌｌｅ研の２つの技術がある。The Vatt method described below is a conventional technique for visually inspecting the solder parts of flat package components.
There are two techniques used by Elle Lab.
その第」の技術では、振動子をはんだ何部に接触させる
ととＫよル、＋５ＯＨＥ〜２００ＫＨｚの周波数で加振
をおこない、そのときの振動の状態を振動検出器で検出
し、このときの振動の状態をもとに欠陥判定をおこなう
。（Ｕ、Ｓ、Ｐａｔａｎｔ ４，２１８゜第２の技術
では、振動子をはんだ何部に接触させることによＪ）、
２０Ｈｚ 〜ＩＭＨｚ’！たけ１５０ＫＨｚ〜６ｓｏｘ
ａｚｔで変化させてはんだ何部の加振をおこない、この
ときの振動の大きさを振動検出器で検出することＫよ〕
けんギ封部の周波数応答を測定し、この周波数応答をも
とに欠陥判定をおζなう。（Ｕ、Ｓ、Ｐａｔｅｎｔ ４
，２８７，７６６） ゛これらの方式は、接触式で加
振、振動検出を行っているため１次に述べる技術的課題
が残る。In the first technique, whenever a vibrator is brought into contact with solder, it is vibrated at a frequency of +5OHE to 200 KHz, and the vibration state at that time is detected by a vibration detector. Defects are determined based on the state of vibration. (U, S, Patant 4,218° In the second technique, by bringing the vibrator into contact with some part of the solder J),
20Hz ~IMHz'! Take 150KHz ~ 6sox
Excite several parts of the solder by changing azt, and detect the magnitude of the vibration with a vibration detector.]
The frequency response of the sealing part is measured, and defects are determined based on this frequency response. (U, S, Patent 4
, 287, 766) ``Since these methods perform vibration excitation and vibration detection using a contact method, the technical problems described in the first section remain.
１）検査速度が遅い。1) Inspection speed is slow.
２）はんだ何部と振動子および検出器の接触状態を一定
に保つことが困難であシ、検査信頼性の確保がむずかし
い。2) It is difficult to maintain a constant state of contact between the solder parts and the vibrator and detector, making it difficult to ensure test reliability.
本発明の目的は上記従来技術の課題を解決し部品の接合
状態の検査において、高速で信頼性良く接合状態の検出
を可能とする接合状態検出装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding state detection device that solves the above-mentioned problems of the prior art and enables high-speed and reliable detection of bonded states in inspecting the bonded state of parts.
本発明は前記の目的を達成するため、対象物に対して非
接触で外力を加える加振手段と、上記対象物を照明する
レーザ発信器と、とのレーザ発信器からの照明光の光軸
に対して所定の角度傾斜した方向から上記対象物を光学
的に検出する光学的結像手段と、この光学的結像手段か
らのスペックル像のうち、予じめ設定された範囲のみの
スペックル像を選択的に検出してこれを電気的信号に変
換する検出手段と、上記加振手段によって加振された上
記対象物のスペックル像の電気信号の時間的変化を解析
する解析手段とを設け、上記対象物の接合状態を非接触
で検出しうるように構成したもので、と〈Ｋレーザ発信
器からの照明光の光軸に対してスペックル像を検出する
検出手段の光軸を平行にし次いで、上記対象物に照射さ
れたレーザ照射位置を斜め方向よシ検出するようＫした
ことを特徴とするものである。すなわち、上記レーザス
ペックルとは、対象物にレーザ光を照射し、光学的結像
手段によ勺上記対象物の光学儂を検出したとき、コント
ラストの強い斑点が検出される゛。In order to achieve the above-mentioned object, the present invention includes: an excitation means that applies an external force to a target object without contact; a laser oscillator that illuminates the target object; and an optical axis of illumination light from the laser oscillator. an optical imaging means for optically detecting the object from a direction inclined at a predetermined angle with respect to the target object; and speckles of only a preset range of the speckle image from the optical imaging means. a detection means for selectively detecting a speckle image of the object and converting it into an electrical signal; and an analysis means for analyzing temporal changes in the electrical signal of the speckle image of the object excited by the vibration excitation means. The optical axis of the detection means for detecting the speckle image with respect to the optical axis of the illumination light from the K laser transmitter is The object is parallel to each other, and then the position of laser irradiation on the object is detected in an oblique direction. That is, the laser speckles are speckles with high contrast that are detected when an object is irradiated with a laser beam and the optical field of the object is detected by an optical imaging means.
これはレーザスペックルと呼ばれ、竜小な凹凸を有する
対象物表面で散乱したレーザ光が互いに不規則な位相関
係で干渉することによって発生するものである。このス
ペックルは、対象物の表面の移動に伴なって移動するの
で、これＫよって対象物の移動およびこの時間変化によ
って対象物に発生する振動を検出することができる。ま
た、上記スペックル像を検出する際Ｋ、光学的結像手段
の合焦位置からけずれたとき、この対象物の移動量を拡
大して検出することが知られている。本発明は上記の原
理に基いて欠陥の検出を行なうものであるが、上記欠陥
の見逃しを防止するため、レーザ発信器からの照明光の
光軸に対して光学的結像手段の光軸を平行忙しないで対
象物に照射されたレーザ照射位置を斜めの方向から検出
するように構成し、これＫよ）正しく被検査リードにレ
ーザ光が照射して検査している場合（第３図−）参照）
に対してそうでない場合（第３図ら）参照）には異なっ
た位置にスペックル像が検出されるので、これを識別検
出することによシ、たとえリードの浮きおよびリードの
位置ずれが同時に発生しているようなときでも、これを
見逃すことなく検出することが可能である。This is called laser speckle, and is generated when laser beams scattered on the surface of an object having small irregularities interfere with each other in an irregular phase relationship. Since the speckles move as the surface of the object moves, it is possible to detect the movement of the object and vibrations generated in the object due to changes over time. Furthermore, when detecting the speckle image, it is known that when the object deviates from the in-focus position of the optical imaging means, the amount of movement of the object is magnified and detected. The present invention detects defects based on the above principle, but in order to prevent the defects from being overlooked, the optical axis of the optical imaging means is aligned with the optical axis of the illumination light from the laser transmitter. It is configured to detect the laser irradiation position irradiated on the target object from an oblique direction, and the lead to be inspected is correctly irradiated with laser light and inspected (Figure 3-). reference)
If this is not the case (see Figure 3, etc.), speckle images will be detected at different positions, so by identifying and detecting these speckle images, even if lead floating and lead misalignment occur simultaneously, speckle images will be detected at different positions. It is possible to detect this without overlooking it, even when the
以下本発明の実施例を示す図面について説明する・第１
図は本発明の実施例を示す複合状態検出装置の説明図で
ある。同図において、１はＬＳＩ（またはｘｃ）ＫＬ、
て、被検査はんだ何部１ａを介してその下方位置に配置
されたプリント基板６に接続している。このプリント基
板６はテーブル７上に位置決め固定されている。８はレ
ーザ発信器にして、レーザ光をその先軸８ａが上記被検
査はんだ封部１ａのリード上面中央部に向って垂直に照
射する如く配置されている。９はビームエキスパンダに
して、上記レーザ発信器８の下方のレーザ光の光軸８ａ
上に配置され、上記レーザ発信器８からのレーザ光を平
行光とする。１０ｍはレンズにして。The drawings showing the embodiments of the present invention will be explained below.
The figure is an explanatory diagram of a composite state detection device showing an embodiment of the present invention. In the same figure, 1 is an LSI (or xc) KL,
The solder to be inspected is connected to a printed circuit board 6 located below it via the solder portion 1a. This printed circuit board 6 is positioned and fixed on a table 7. Reference numeral 8 designates a laser oscillator, which is arranged so that its tip axis 8a irradiates the laser beam vertically toward the center of the upper surface of the lead of the solder sealed portion 1a to be inspected. 9 is a beam expander, and the optical axis 8a of the laser beam below the laser transmitter 8
The laser beam from the laser oscillator 8 is parallelized. Use a lens for 10m.
上記ビームエキスパンダ９の下方のレーザ光の光軸８ａ
上に配置され、レーザ光を上記被検査はんだ封部１ａの
リード面に集光させる如く配置されている。１１は光電
子増幅管であって、受光軸８ｂ上にあってレンズ１０ｂ
Ｋよる結像位置１０ｏからはずれた位置にあるピンホ
ール１２の***１２ｍを通じて上記はんだ封部１ａのリ
ード上面から反射したレーザ受光を電気的信号に変換す
る。１３はノズルにして先端を上記被検査はんだ封部１
ａのリード上面に対向し、後述のマイク四コンビエータ
１７の指令によ）気体供給源（図示せず）からの高圧気
禄（空気）を被検査はんだ封部１ａに吹き付ける如く配
置されている。１４は低周波通過フィルタ（ＬＰＦ）に
して、第５図−１に示す如く、低周波遮断周波数″’ｔ
ｆＴ、ｃとしたとき、仁の低周波連断周波数ｆｆ、Ｃ
以下の信号成分（通過周波数領域）は主として、上記光
電子増幅管１１にピンホール１２を通じてスペックル光
が轟ってｈるか否か、すな、わち。Optical axis 8a of the laser beam below the beam expander 9
It is disposed on the top and is arranged so as to focus the laser beam on the lead surface of the solder sealing part 1a to be inspected. Reference numeral 11 denotes a photoelectron amplifier tube, which is located on the light receiving axis 8b and connected to the lens 10b.
The received laser light reflected from the top surface of the lead of the solder sealing part 1a is converted into an electrical signal through the small hole 12m of the pinhole 12 located at a position deviated from the imaging position 10o by K. 13 is a nozzle whose tip is connected to the solder sealed part 1 to be inspected.
It is arranged so as to face the upper surface of the lead 1a and to blow high-pressure air from a gas supply source (not shown) onto the solder sealed portion 1a to be inspected in response to a command from a four-microphone combiator 17 (to be described later). 14 is a low frequency pass filter (LPF), and as shown in Figure 5-1, the low frequency cutoff frequency ''t
When fT, c, the low frequency continuous frequency ff, C
The following signal components (passing frequency range) mainly determine whether speckle light is emitted through the pinhole 12 into the photoelectron amplifier tube 11, that is, whether or not the speckle light is emitted.
レーザ光が正しく嶋りているか否かを示し、連続的に検
査を行なっているときの上記ノズル１３からリードに向
って吹き付けている高圧気体の吹き付は周期をＴとした
とき、上記低周波遮断周波数ム直とは
くｆムＣ
の関係になる苓うＫする。１５は高岡、波透過フィルタ
（ＩＩＬＦ）Ｋｌ、て、第５図ら）に示す如く、高周波
遮断周波数をｔｔｉａとし、上記ノズル１３から高圧気
体が吹き付けられることＫよ）正しくはんだ付けされて
いない浮きリードに発生する固有振動数の最小値をｆ８
Ｌとしたとき、
ｆｓｔｃ＜ ｆｅｚ
’ＬＯ＜＜ ｆｉｃ
とする。すなわち、高周波通過フィルタ１５の高周波遮
断周波数ｆｌｏ以上の信号成分（高周波通過領域）は上
記ノズル１３から吹き付けられた高圧気体によ〕浮きリ
ードが振動したとき、これに伴なって光電子増幅管１１
に当ったスペックル光が高速で振動している場合である
。１６ｍ、１，６ｂけ２個のＡ／Ｄ変換器であって夫々
上記低周波通過フィルタ１４および高岡液通過フィルタ
１５からの信号をディジタル信号に変換する。１７けマ
イクｃ１コンビ晶−タ（また＃ｉオニコンビ為−タ）で
ｆ５カ、上記レーザ発信器８からのレーザ光の光軸軸が
被検査はんだ封部１ａのリード上面中央部に照射する如
（ＮＧデータ（図示せず）を参照して後述のテーブル制
御装置１８に指令を与える。かつ第４図に示す如く、上
記２個のＡ／Ｄ変換器１６ｍ、１６ｂからのディジタル
信号が入力してからｔ１秒後止記ノズル１３からリード
面に高圧気体を吹き付け、これからｔ２秒後止記ノズル
１３からの高圧気体の吹き付けを停止させる。さらに上
記２個のＶＤ変換器ＩＳａ、１６ｂからのディジタル信
号を検出して被検査はんだ封部１ａのリードの欠陥を判
定し、かつ１個のリードＯ欠陥判定後、後述のテーブル
制御装置１８に指令を与えてテーブル４をつぎのリード
位置まで移動させる。１Ｂはテーブル制御装置であ〕、
上記マイク四コンビーータ１７の指令に基づいてモータ
１９を駆動したとき、ネジ軸２０およびナツト２１を介
してテーブル４を移動させる。 ゛
つぎに欠陥判定動作について第４図によ）説明する。マ
イクロ、コンビ１−夕１７＃ｉ、 ２個のＡ／Ｄ変換器
１６ａ、１６ｂからの信号を入力してからｔ１秒経過す
ると、 ｔｚ秒だけノズル１３からリードに向りて高圧
気体を吹き付ける。このとき正しくはんだ付けされたリ
ードの場合には第４図−）Ｋ示す如く、低周波通過フィ
ルタ１Ｌおよび高周波通過フィルタ１５を通過した信号
は共にノズル１３からリードに向って高圧気体を吹き付
けた前後およびノズル１３から高圧気体の吹き付けを停
止した前後に大きな変化を発生しないが、リードが正し
くはんだ付けされていない場合には、第４１図らＩＫ示
す如く、高周波通過フィルタ１５を通過し良信号のみが
、ノズル１３からリードに向って高周気体を吹き付けた
直後から、ノズル１３からの高圧気体の吹き付けを停止
するまでの間、大きく振動を発生する。またリードの位
置ずれなどによシレーザ光の光軸８ａ２＞！−ドの上面
中央部を正しく照射していない場合たとえば第１図に破
線にて示す如くスペックル像を形成している場合には、
光電子増幅管１１にレーザ光が入射されないで、第４図
（ｃｌに示す如く、低周波通過フィルタ１４の出力信号
は一定値ＶｔＨ以下になる。ただし、ノズル１３からの
高圧気体の吹き付けによってリードが位置ずれを生じた
場合には、第４図１ｄ）Ｋ示す如くノズル１ｓから高圧
気体を吹き付けてリードが位置ズレを発生したときから
、低周波通過フィルタ１４、の出力信号は一定値Ｖ？Ｉ
以下になる。そこで。It indicates whether the laser beam is deflecting correctly or not, and when the period of the high-pressure gas sprayed from the nozzle 13 toward the lead during continuous inspection is T, the low frequency There is a relationship between the cutoff frequency and the frequency. 15 is Takaoka's wave transmission filter (IILF) Kl, as shown in Figure 5, etc., the high-frequency cut-off frequency is ttia, and high-pressure gas is blown from the nozzle 13. f8 is the minimum value of the natural frequency that occurs in
When L, fstc<fez'LO<<fic. That is, when the floating reed vibrates due to the high-pressure gas blown from the nozzle 13, the signal component (high-frequency pass region) of the high-frequency cutoff frequency flo or higher of the high-frequency pass filter 15 is transmitted to the photoelectron amplifier tube 11.
This is the case when the speckle light that hits the oscillates at high speed. Two A/D converters of 16m and 1.6b each convert the signals from the low frequency pass filter 14 and the Takaoka liquid pass filter 15 into digital signals. 17 Microphone C1 Combi crystal (also #i Oni Combi crystal) with F5, so that the optical axis of the laser beam from the laser oscillator 8 irradiates the center part of the top surface of the lead of the solder sealing part 1a to be inspected. (Gives a command to the table control device 18, which will be described later, with reference to NG data (not shown). Also, as shown in FIG. 4, digital signals from the two A/D converters 16m and 16b are input. Then, after t1 seconds, high-pressure gas is sprayed onto the lead surface from the stop mark nozzle 13, and after t2 seconds, the high-pressure gas is stopped from being sprayed from the stop mark nozzle 13.Furthermore, the digital signal from the two VD converters ISa and 16b is The signal is detected to determine the lead defect of the solder sealed portion 1a to be inspected, and after one lead O defect is determined, a command is given to the table control device 18, which will be described later, to move the table 4 to the next lead position. .1B is a table control device],
When the motor 19 is driven based on the command from the microphone four-con beater 17, the table 4 is moved via the screw shaft 20 and nut 21. Next, the defect determination operation will be explained (see FIG. 4). When t1 seconds have elapsed since the input of the signals from the two A/D converters 16a and 16b, high-pressure gas is sprayed from the nozzle 13 toward the lead for tz seconds. At this time, in the case of correctly soldered leads, as shown in FIG. There is no significant change before and after the high-pressure gas blowing from the nozzle 13 is stopped. However, if the leads are not properly soldered, the high-frequency pass filter 15 is passed through, as shown in FIG. , large vibrations occur from immediately after the high-frequency gas is sprayed from the nozzle 13 toward the reed until the spraying of the high-pressure gas from the nozzle 13 is stopped. Also, the optical axis 8a2 of the laser beam may be caused by misalignment of the leads, etc. - If the central part of the top surface of the board is not irradiated correctly, for example, if a speckle image is formed as shown by the broken line in Figure 1,
As the laser beam is not incident on the photoelectron amplifier tube 11, the output signal of the low frequency pass filter 14 becomes below a certain value VtH, as shown in FIG. If a positional deviation occurs, the output signal of the low frequency pass filter 14 will be at a constant value V? from the time when the reed is blown with high pressure gas from the nozzle 1s and the positional deviation occurs, as shown in FIG. 4 1d)K. I
It becomes below. Therefore.
上記マイクロプンピ為−夕１７はつぎのどとく欠陥判定
を行なう。The micro pump tester 17 performs the next defect determination.
（１）すなわち高圧気体の吹き付は前の低周波通過フィ
ルタ１４からの出力信号が一定値ｖ１に対して等しいか
あるいけそれ以下のとき・・・・・・擬欠陥
（２） 高圧気体の吹き付は前の低周波通過フィルタ
１４からの出力信号が一定値ｖｙｉｔよシも大きく。(1) In other words, high-pressure gas is sprayed when the output signal from the previous low-frequency pass filter 14 is equal to or less than the constant value v1...Pseudo-defect (2) High-pressure gas In the case of spraying, the output signal from the previous low frequency pass filter 14 is larger than the constant value vyit.
（２，１） 高圧気体吹き付は後の低周波通過フィル
タ１４からの出力信号が一定値ｙ！Ｍ Ｋ対して等しい
かあるいけそれ以下のとき・・・・・・リードの浮き欠
陥
（２，１） 高圧気体吹き付は後の低周波通過フィル
タ１４からの出力信号が一定値Ｖ！重よ）大きく
（イ）高圧気体吹き付は後の高周波通過フィルタ１５か
らの出力信号が振動をして
いるとき・・・・・・リード浮き欠陥
−高圧気体吹き付は後の高周波通過フィルタ１５からの
出力信号が振動をして
いないとき・・・・・・良品
０４種類の状態を識別し、欠陥判定を行なう。欠陥判定
結果は直ちに出力するか、あるいは一旦メモリに蓄積し
たのち、すべての欠陥判定結果が出たとき出力するかは
必要に応じて選択することができる。まえ、欠陥マーク
打刻機構を設置して欠陥リードに欠陥マーりを打刻する
こともできる。(2, 1) When high-pressure gas is blown, the output signal from the low-frequency pass filter 14 is a constant value y! When M is equal to or less than K...Lead floating defect (2, 1) When high pressure gas is blown, the output signal from the low frequency pass filter 14 is a constant value V! Heavy) Large (a) High-pressure gas blowing is when the output signal from the later high-frequency pass filter 15 is vibrating...Lead floating defect - High-pressure gas blowing is the later high-frequency pass filter 15 When the output signal from the oscillator does not vibrate, the condition of 04 non-defective products is identified and a defect is determined. It can be selected as necessary whether to output the defect determination results immediately or to output them once all the defect determination results are output after being stored in the memory. It is also possible to install a defect mark engraving mechanism in advance to engrave a defect mark on the defective lead.
このようにマイクロコンビ為−夕１７が１個のり−ドの
欠陥判定が終了すると、該マイクロコンビーータ１７か
らの指令に基づいてテーブル制御装置１８がモータ１９
１ｆｃ駆動してテーブル７をつぎのリード位置まで移動
し、以下上記作用を繰返すととＫよ〕、すべてのリード
の欠陥判定を行なうことができる。なお１本実施例にお
けるレーザ発信器８はたとえば■・−Ｎｏなどのガスレ
ーザ、ルビーなどの固体レーザ、半導体レーザなど可干
渉性のめるレーザ光を出力するものであればよく、また
上記光電子増幅管１１け光源の波長に感度を有し、スペ
ックル像を検出するのに必要な感度があって、スペック
ル像の光量振動を検出できるものであれば、たとえば光
電管、フォトトランジスタ、フォトダイオードなどを使
用することができ。When the microcombiner 17 finishes determining the defect in one board, the table controller 18 controls the motor 19 based on a command from the microcombiner 17.
If the table 7 is moved to the next read position by 1fc drive and the above operation is repeated, it is possible to judge the defects of all the leads. Note that the laser oscillator 8 in this embodiment may be of any type that outputs coherent laser light, such as a gas laser such as ■ and -No, a solid laser such as a ruby, or a semiconductor laser, and the photoelectron amplifier tube 11 described above may be used. For example, a phototube, phototransistor, photodiode, etc. can be used as long as it is sensitive to the wavelength of the light source, has the sensitivity necessary to detect the speckle image, and can detect fluctuations in the amount of light in the speckle image. can.
とくに受光部の小さいフォトダイオードを使用すればピ
ンホール１２を取除くことができる。さらに検出信号の
フィルタリング（低周波通過フィルタ１４および高周波
通過フィルタ１５）および判定処理（マイクロコンビ凰
−夕１７）などは、上記に述ぺたと同等な機能を有する
ものであれば、上記以外のものに変形することが可能で
あ夛、かつ投光光学系（レーザ発信器８．ビームエキス
パン／９およびレンズ１０ａなど）および受光光学系（
光電子増幅管１１、ピンホール１２．およびレンズ１０
ｂなど）の位置を上記と逆にしたシ、角度関係が上記と
異なったルすることも可能である。In particular, if a photodiode with a small light receiving section is used, the pinhole 12 can be eliminated. Furthermore, filtering of the detection signal (low frequency pass filter 14 and high frequency pass filter 15) and determination processing (microcombi 17) may be performed using a device other than those described above, as long as it has the same functions as those described above. It is possible to transform the light emitting optical system (laser transmitter 8, beam expander/9, lens 10a, etc.) and light receiving optical system (
Photoelectron amplifier tube 11, pinhole 12. and lens 10
It is also possible to reverse the position of (b, etc.) to the above, or to make the angular relationship different from the above.
したがって、本実施例によれば比較的簡単な構成にして
、非接触で、高速、高信頼の接合状態検査を行なうこと
ができる。Therefore, according to this embodiment, it is possible to perform a non-contact, high-speed, and highly reliable bonding state inspection with a relatively simple configuration.
つぎに第６図によシ本発明の他の一実施例について説明
する。本実施例においては被検査はんだ付は部２のリー
ドの加振方法として電磁石２５を用い、マイクｃ１コン
ビ凰−夕１７からの指令に基いて電磁石制御回路２２が
、上記電磁石２３を駆動するもので、上記以外は前記の
実施例と同一であるから、第１図と同一符号を示してい
る。そして上記電磁石２３の駆動は第７１図に示す如＜
、Ｎ極、Ｓ極を交互に反転させて行なうものである。Next, another embodiment of the present invention will be described with reference to FIG. In this embodiment, an electromagnet 25 is used as a method of exciting the leads of the soldering part 2 to be inspected, and the electromagnet control circuit 22 drives the electromagnet 23 based on a command from the microphone c1 combination 17. Since everything other than the above is the same as the previous embodiment, the same reference numerals as in FIG. 1 are used. The electromagnet 23 is driven as shown in FIG.
, N pole, and S pole are alternately reversed.
なお、本実施例における電磁石２３の代）Ｋ永久磁石ま
たは電磁石を回転軸の周ＪＫ回転させて被検査リード上
の磁界を変化させることも可能である。したがって本実
施例によれば、磁性材料で形成された被検査対象部品を
低騒音かつ非接触で。Note that it is also possible to change the magnetic field on the lead to be inspected by rotating a K permanent magnet or an electromagnet (substitute for the electromagnet 23 in this embodiment) around the rotation axis JK. Therefore, according to this embodiment, parts to be inspected made of magnetic materials can be inspected with low noise and without contact.
高速、高信頼の接合状態検査を行なうことができる。High-speed, highly reliable bonding state inspection can be performed.
以上述べた如く、本発明は非接触で接合部の加振、高感
度振動を検出して接合部の接合状態を高速度で高信頼性
のある検査を行なうことができる。As described above, the present invention enables non-contact detection of excitation and high-sensitivity vibration of the joint, and enables high-speed, highly reliable inspection of the joint state of the joint.
また投光光学系と受光光学系との各光軸とを平行にしな
いで、ある角度をもって配置されているので、たとえ被
検査対象部品の取付位置がずれていても、被検査対象部
品の所定位置を正しくレーザ光が照射することができ、
これによって被検査対象部品の欠陥を見逃がすことなく
検査することができる効果を有する。In addition, since the optical axes of the light emitting optical system and the light receiving optical system are not parallel to each other but are arranged at a certain angle, even if the mounting position of the part to be inspected is shifted, the specified position of the part to be inspected can be fixed. The laser beam can be irradiated at the correct position,
This has the effect that defects in the part to be inspected can be inspected without overlooking them.
第１図は本発明の一実施例を示す接合状態検出装置の説
明図、第２図は本発明の検査対象物品を示す斜視図であ
って同図−）はフラットパッケージ形部品のけんだ何部
を示す図、同図ら）はＬＳＩなどのワイヤ・ボンディン
グ箇所を示す図、同−図（ｏｌは同図１ａ）および同図
ｆｂ）の基本的な構成図、第３図は第１図に示す光学系
の作動説明図であって同図ｉ）は正しい被検査リードの
場合、同図らｌＦｉ正しく接合されていない被検査リー
ドの場合を示す図、第４図は高圧気体の吹き付は開始お
よび停止に応じて得られる低周波通過フィルタおよび高
周波通過フィルタの出力信号曲線であって同図（ａｌは
正しくけんだ付けされたリードの場合、同図０３）は正
しくはんだ付けされないリードの場合、同図１ａｌはレ
ーザ光がリードの上面中央部に正しく照射されていない
場合、同図Ｗは高圧気体の吹き付は後リードが位置ずれ
を生じた場合をそれぞれ示す図、第５図はフィルタの特
性を説明する図、第６図は本発明の他の一実施例を示す
接合状態検出装置の説明図、第７図はその電磁石の磁界
曲線図である。
１・・・フラットパッケージ形部品、１ａ・・・はんだ
何部、２・・・ＬＳＩなどのワイヤ・ボンディング箇所
。
３・・・第１の物体、Ｌ・・・第２の物体、５・・・接
合部。
６・・・プリント基板、７・・・テーブル、８・・・レ
ーザ発信器、 ８ａ・・・照射光軸、８ｂ・・・受光軸
、９・・・ビームエキスパンダ％１０ｍ、１０ｂ・・・
レンズ、１０ｏ・・・結像位置、１１・・・光電子増幅
管、１２・・・ピンホール、１３・・・ノズル、１４．
・・・低周波通過フィルタ、１５・・・高周波通過フィ
ルタ、１６ｍ、１ｉＳｂ・・・２個のＡ／ｂ変換器、１
７−・・マイクロコンビ島−タ、１Ｂ・・・テーブル制
御装置、１９・・・モータ、２０・・・ネジ軸、２１・
・・ナツト、２２・・・電磁石制御回路、２３・・・電
磁石。FIG. 1 is an explanatory diagram of a bonding state detection device showing an embodiment of the present invention, and FIG. 2 is a perspective view showing an article to be inspected according to the present invention. Figure 3 is the same as Figure 1. FIG. 4 is an explanatory diagram of the operation of the optical system shown in FIG. The output signal curves of the low-frequency pass filter and high-frequency pass filter obtained in response to the stoppage are shown in the same figure (al is in the case of a correctly soldered lead, and 03 in the same figure) is in the case of a lead that is not properly soldered, Figure 1al shows the case where the laser beam is not correctly irradiated to the center of the upper surface of the lead, Figure W shows the case where the lead is misaligned after high-pressure gas is blown, and Figure 5 shows the case where the lead is misaligned after the high-pressure gas is blown. FIG. 6 is a diagram for explaining the characteristics, FIG. 6 is an explanatory diagram of a bonding state detection device showing another embodiment of the present invention, and FIG. 7 is a diagram of the magnetic field curve of the electromagnet. 1...Flat package type parts, 1a...Solder parts, 2...Wire bonding parts of LSI etc. 3...First object, L...Second object, 5...Joint part. 6... Printed circuit board, 7... Table, 8... Laser transmitter, 8a... Irradiation optical axis, 8b... Light receiving axis, 9... Beam expander %10m, 10b...
Lens, 10o... Image forming position, 11... Photoelectron amplifier tube, 12... Pinhole, 13... Nozzle, 14.
...Low frequency pass filter, 15...High frequency pass filter, 16m, 1iSb...2 A/b converters, 1
7-...Micro combination controller, 1B...Table control device, 19...Motor, 20...Screw shaft, 21...
... Natsu, 22... Electromagnet control circuit, 23... Electromagnet.
Claims (1)
の被検査接合部を照射するレーザ発信系と、このレーザ
発信系からのレーザ光の光軸に対して所定の角度傾斜し
た受光軸上に配置され上記対象物の被検査接合部を検出
する光学的結像手段と、この光学的結像手段で検出され
たスペックル像のうち、予じめ設定された範囲のみのス
ペックル像を選択的に検出してこれを電気的信号に変換
する検出手段と、上記加振手段によって加振された上記
対象物のスペックル像の電気信号の時間的変化を解析す
る解析手段とを設けたことを特徴とする接合状態検出装
置。1. An excitation means that applies an external force to the object without contact, a laser transmission system that irradiates the joint to be inspected of the object, and a laser beam that is tilted at a predetermined angle with respect to the optical axis of the laser beam from this laser transmission system. Optical imaging means arranged on the light receiving axis to detect the joint to be inspected of the object, and specifications of only a preset range of the speckle image detected by this optical imaging means. a detection means for selectively detecting a speckle image of the object and converting it into an electrical signal; and an analysis means for analyzing temporal changes in the electrical signal of the speckle image of the object excited by the vibration excitation means. A bonding state detection device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60144668A JPS627198A (en) | 1985-07-03 | 1985-07-03 | Junction state detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60144668A JPS627198A (en) | 1985-07-03 | 1985-07-03 | Junction state detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS627198A true JPS627198A (en) | 1987-01-14 |
Family
ID=15367453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60144668A Pending JPS627198A (en) | 1985-07-03 | 1985-07-03 | Junction state detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS627198A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5535006A (en) * | 1992-07-16 | 1996-07-09 | Lockheed Idaho Technologies Company | Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate |
| US6181431B1 (en) | 1997-12-19 | 2001-01-30 | Bernard Siu | System and method for laser ultrasonic bond integrity evaluation |
-
1985
- 1985-07-03 JP JP60144668A patent/JPS627198A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5535006A (en) * | 1992-07-16 | 1996-07-09 | Lockheed Idaho Technologies Company | Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate |
| US6181431B1 (en) | 1997-12-19 | 2001-01-30 | Bernard Siu | System and method for laser ultrasonic bond integrity evaluation |
| US6490047B2 (en) | 1997-12-19 | 2002-12-03 | Bernard K. Siu | System and method for laser ultrasonic bond integrity evaluation |
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