JPS6267914A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPS6267914A JPS6267914A JP20787385A JP20787385A JPS6267914A JP S6267914 A JPS6267914 A JP S6267914A JP 20787385 A JP20787385 A JP 20787385A JP 20787385 A JP20787385 A JP 20787385A JP S6267914 A JPS6267914 A JP S6267914A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- rectangular plate
- electronic component
- terminals
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ）技術分野
この発明は、水晶基板やセラミック基板等に膜状の電極
を形成した方形板状エレメントを接続固定するための端
子構造に特徴がある電子部品に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to an electronic component characterized by a terminal structure for connecting and fixing a rectangular plate-like element in which a film-like electrode is formed on a crystal substrate, a ceramic substrate, or the like.
（ｂｌ従来技術とその欠点
方形板状エレメントの両主面に形成された電極間を導通
させる必要がある場合、従来は、導電接着剤を塗布して
、これらの電極間を基板の側面を介して接続していた。(bl Prior Art and Its Disadvantages) When it is necessary to establish continuity between the electrodes formed on both main surfaces of a rectangular plate-like element, conventionally, a conductive adhesive is applied to connect these electrodes through the side surfaces of the substrate. was connected.
両主面の電極間を導通させる必要のある方形板状エレメ
ントとじては、例えば一枚のセラミック基板上に負荷容
量としてのコンデンサを一体形成した圧電共振子の場合
等がある。An example of a rectangular plate-shaped element that requires conduction between electrodes on both main surfaces is a piezoelectric resonator in which a capacitor as a load capacitance is integrally formed on a single ceramic substrate.
以下、このような圧電共振子の場合を、第５図〜第８図
に基づいて説明する。この圧電共振子１は、エネルギー
閉じ込め型の厚み縦振動モードのものであり、高電圧印
加により分極させて圧電体とした一枚の方形板状のセラ
ミック基板２の両主面に膜状の電極を形成することによ
り構成される。このセラミック基板２の表側の主面には
、圧電共振子を構成する第１共振子電極３と、一方のコ
ンデンサを構成する第１コンデンサ電極４および他方の
コンデンサを構成する第１コンデンサ電極５とが形成さ
れている。このうち第１共振子電極３と一方のコンデン
サの第１コンデンサ電極４とはこの主面上で引出電極に
よって接続されている。また、他方のコンデンサの第１
コンデンサ電極５は、同じ主面」−に形成された接続用
電極６に引出電極によって接続されている。このセラミ
ック基板２の裏側の主面には、圧電共振子を構成する第
２共振子電極７と、両方のコンデンサをそれぞれ構成す
る連続して一体となった第２コンデンサ電極８とが形成
されている。第２共振子電極７は同じ裏側の主面上に形
成された接続用電極９に引出電極によって接続されてい
る。この裏側の接続用電極９と表側の接続用電極６とが
、セラミック基板２を挟んで端部における表裏の同じ位
置に形成されている。このように構成された圧電共振子
１は、第６図および第７図に示すように、３本のリード
端子１０〜１２に接続固定される。一端側の第１リード
端子１０ば一方のコンデンサの第１コンデンサ電極４に
はんだ等で接続固定され、他端例の第２１Ｊ−ド端子１
１は他方のコンデンサの第１コンデンサ電極５にはんだ
等で接続固定される。また、中央の第３リード端子１２
は裏側の第２コンデンサ電極８にはんだ等で接続固定さ
れる。尚、この第１コンデンサ電極４．５に、はんだ付
けが行われることにより、セラミック基板２の振動がダ
ンピングされるので、コンデンサとして機能させること
ができる。ところが、このように各電極４，５．８と各
リード端子１０〜１２とを接続固定しても第８図に示す
電気回路における接続用電極６，９間がまだ導通してい
ない。このため、従来はこの間を導通させるために、セ
ラミック基板２の表側の接続用電極６から裏側の接続用
電極９にかけてこのセラミック基板２の側面を介して導
電接着剤１４を塗布することにより接続していた。Hereinafter, the case of such a piezoelectric resonator will be explained based on FIGS. 5 to 8. This piezoelectric resonator 1 is of an energy trap type thickness longitudinal vibration mode, and has film-like electrodes on both main surfaces of a rectangular plate-shaped ceramic substrate 2 that is polarized by applying a high voltage and made into a piezoelectric body. It is constructed by forming. A first resonator electrode 3 forming a piezoelectric resonator, a first capacitor electrode 4 forming one capacitor, and a first capacitor electrode 5 forming the other capacitor are formed on the front main surface of the ceramic substrate 2. is formed. Of these, the first resonator electrode 3 and the first capacitor electrode 4 of one of the capacitors are connected on this main surface by an extraction electrode. Also, the first
The capacitor electrode 5 is connected to a connecting electrode 6 formed on the same main surface by an extraction electrode. A second resonator electrode 7 constituting a piezoelectric resonator and a continuous and integrated second capacitor electrode 8 constituting both capacitors are formed on the main surface on the back side of the ceramic substrate 2. There is. The second resonator electrode 7 is connected to a connecting electrode 9 formed on the same rear main surface by an extraction electrode. The connection electrode 9 on the back side and the connection electrode 6 on the front side are formed at the same position on the front and back sides of the end portion with the ceramic substrate 2 in between. The piezoelectric resonator 1 configured in this manner is connected and fixed to three lead terminals 10 to 12, as shown in FIGS. 6 and 7. The first lead terminal 10 at one end is connected and fixed to the first capacitor electrode 4 of one capacitor with solder or the like, and the 21st J-do terminal 1 at the other end is connected to the first capacitor electrode 4 of one capacitor.
1 is connected and fixed to the first capacitor electrode 5 of the other capacitor by soldering or the like. In addition, the third lead terminal 12 in the center
is connected and fixed to the second capacitor electrode 8 on the back side with solder or the like. Note that by soldering the first capacitor electrode 4.5, vibrations of the ceramic substrate 2 are damped, so that the first capacitor electrode 4.5 can function as a capacitor. However, even after each electrode 4, 5.8 and each lead terminal 10-12 are connected and fixed in this manner, there is still no conduction between the connecting electrodes 6, 9 in the electric circuit shown in FIG. For this reason, conventionally, in order to establish continuity between them, the connection was made by applying a conductive adhesive 14 from the connection electrode 6 on the front side of the ceramic substrate 2 to the connection electrode 9 on the back side of the ceramic substrate 2 through the side surface of the ceramic substrate 2. was.
ところが、このような導電接着剤１４の塗布工程は、電
子部品製造の自動化を困難にするばかりでなく、セラミ
ック基板２の両主面と側面との間のエツジ部で導電接着
剤１４の膜厚が薄くなるために断線が生じ易く、製品の
歩留まりを悪化させるという欠点を有していた。However, such a process of applying the conductive adhesive 14 not only makes it difficult to automate the manufacturing of electronic components, but also reduces the film thickness of the conductive adhesive 14 at the edges between both main surfaces and side surfaces of the ceramic substrate 2. Since the wire becomes thinner, wire breakage tends to occur easily, which has the disadvantage of deteriorating the yield of the product.
（Ｃ１発明の目的
この発明はこのような事情に鑑みなされたものであって
、方形板状エレメントの両端部を支持する端子の保持部
分に挟持面と側壁面とを形成することにより、方形板状
エレメントの端子への接続固定と同時に方形板状エレメ
ントの両主面の電極間の接続を行うことができる端子を
有する電子部品を提供することを目的とする。(C1 Purpose of the Invention This invention was made in view of the above circumstances, and by forming a clamping surface and a side wall surface on the holding portion of the terminal that supports both ends of the rectangular plate element, An object of the present invention is to provide an electronic component having a terminal that can simultaneously connect and fix a shaped element to a terminal and connect electrodes on both main surfaces of a rectangular plate-like element.
（ｄ１発明の構成および効果
この発明の電子部品は、２本以上の端子が配置され、両
端の２本の端子が、リード部分と、このリード部分の一
方側にあって、方形板状エレメントの両端部をそれぞれ
支持するための保持部分と、この保持部分に形成され、
支持した方形板状エレメントがリード部分方向に移動す
るのを規制するためのストッパ部分とを有する電子部品
において、両端に配置された２本の端子の各保持部分が
、方形板状エレメントの両主面をそれぞれ両端部におい
てわずかな隙間を開けて挟み込むように形成された向か
い合う２枚の挟持面と、この２枚の挟持面に外側で連続
し且つ方形板状エレメントを支持した場合にそれぞれこ
の方形板状エレメントの両端側面よりわずかに外側に位
置する側壁面とを有することを特徴とする。(d1 Structure and Effect of the Invention The electronic component of the present invention has two or more terminals arranged, the two terminals at both ends are located on a lead portion and one side of this lead portion, and are arranged on a rectangular plate-like element. a holding part for supporting both ends, and a holding part formed on the holding part,
In an electronic component having a stopper portion for restricting movement of the supported rectangular plate-like element toward the lead portion, each holding portion of two terminals arranged at both ends is connected to both main parts of the rectangular plate-like element. Two opposing clamping surfaces are formed to sandwich the surfaces with a slight gap at both ends, and when a rectangular plate-like element is supported on the outside and is continuous with these two clamping surfaces, this square shape is formed. It is characterized by having side wall surfaces located slightly outside of both end side surfaces of the plate-like element.
この発明の電子部品を上記のように構成すると、両端に
配置された２本の端子の各保持部分が方形板状エレメン
トの両端部において、両主面および側面をわずかの隙間
を開けて覆い支持することができ、この隙間部分にはん
だ等を流し込むだけで方形板状エレメントの両主面の各
電極と各端子とをそれぞれ接続することができるので、
これと同時に、はんだまたは端子導体を介して接続を必
要とする両主面の電極間を導通させることができる。こ
のため、この発明の電子部品は、方形板状エレメントの
両主面の電極間を接続するための導電接着剤の塗布工程
が不要となるので、従来の機械装置にわずかな変更を加
えるだけで電子部品の製造の自動化が容易に可能となり
、また、方形板状エレメントの両主面の電極間は保持部
との隙間に満たされたはんだと保持部内体により確実に
導通されるのでエツジ部の断線による製品の歩留まり低
下のおそれもなくなる。When the electronic component of the present invention is configured as described above, each holding portion of the two terminals arranged at both ends covers and supports both main surfaces and side surfaces with a slight gap at both ends of the rectangular plate element. By simply pouring solder etc. into this gap, each electrode and each terminal on both main surfaces of the rectangular plate element can be connected, respectively.
At the same time, electrical continuity can be established between the electrodes on both main surfaces that require connection via solder or a terminal conductor. Therefore, the electronic component of the present invention does not require the process of applying conductive adhesive to connect the electrodes on both main surfaces of the rectangular plate-like element, so only slight changes can be made to the conventional mechanical device. The manufacturing of electronic components can be easily automated, and the electrodes on both main surfaces of the rectangular plate element are electrically connected to each other by the solder filled in the gap with the holding part and the internal body of the holding part. There is also no fear of a drop in product yield due to wire breakage.
ｔｅｌ実施例
以下、この発明の電子部品を、セラミック基板を用いた
圧電共振子の端子に実施した場合を説明する。なお、従
来例と同一部分には同一番号を付して説明を省略する。EXAMPLE A case will be described below in which the electronic component of the present invention is applied to a terminal of a piezoelectric resonator using a ceramic substrate. Note that the same parts as those in the conventional example are given the same numbers and their explanations are omitted.
第１図はこの発明の実施例で用いる電子部品の端子の斜
視図、第２図および第３図は、同電子部品の端子へのセ
ラミック基板の取付作業を説明するための正面図、第４
図は、セラミック基板取付後の同電子部品の端子の平面
図である。FIG. 1 is a perspective view of a terminal of an electronic component used in an embodiment of the present invention, FIGS. 2 and 3 are front views for explaining the work of attaching a ceramic substrate to a terminal of the electronic component,
The figure is a plan view of the terminal of the electronic component after it is attached to the ceramic substrate.
この実施例の電子部品の端子は、フープ１５上に１組３
本の端子１６〜１日が配置されることにより構成される
。両端の２本の第１端子１６および第２端子１７は、リ
ード部分１９と、保持部分２０と、ストッパ部分２１と
からなる。保持部分２０は、リード部分１９の一端側に
あって、リード部分と一体に各リード部分１９より幅広
に形成され、しかも、折曲げ線がリード部分１９の長さ
方向に沿うように一方側を開口して折り曲げることによ
り断面Ｕ字形状に形成されている。また、この保持部分
２０の折り曲がりによるＵ字形状の開口部は、第１端子
１６と第２端子１７との間で対向するように設けられて
いる。このため、この両保持部分２０．２０の開口部内
に圧電共振子１を構成するセラミック基板２の両輪部を
それぞれ挿入することにより、折れ曲がった（１字形状
の両側がセラミック基板２の両主面をわずかな隙間を開
けて挟み込むようになるので、向かい合う２枚の挟持面
２２．２２が構成されるとともに、折れ曲がったＵ字形
状の中央部分がこれら挟持面２２．２２に外側で連続し
、且つ、セラミック基板２の両端側面よりわずかに外側
に位置する側壁面２３が構成されることになる。リード
部分１９の他端側は、フープ１５に一体となって繋がっ
ている。ストッパ部分２１は、リード部分１９に繋がる
保持部分２０の他端をクランク状に折り曲げ、保持部分
２０内に挿入したセラミック基板２の下端両側が当接す
るように形成されている。第３端子１８は、リード部分
１９のみからなり、第１端子１６および第２端子１７の
略中央付近でフープ１５から突出するように設けられて
いる。The terminals of the electronic component in this embodiment are arranged in one set on the hoop 15.
It is constructed by placing book terminals 16-1. The two first terminals 16 and second terminals 17 at both ends consist of a lead portion 19, a holding portion 20, and a stopper portion 21. The holding portion 20 is located on one end side of the lead portion 19, is formed integrally with the lead portion and is wider than each lead portion 19, and has one side such that the bending line runs along the length direction of the lead portion 19. By opening and bending, it is formed into a U-shaped cross section. Further, a U-shaped opening formed by bending the holding portion 20 is provided between the first terminal 16 and the second terminal 17 so as to face each other. For this reason, by inserting the two rings of the ceramic substrate 2 constituting the piezoelectric resonator 1 into the openings of the two holding parts 20 and 20, the bent (both sides of the letter 1 shape are the two main surfaces of the ceramic substrate 2). are sandwiched with a slight gap between them, so that two opposing clamping surfaces 22.22 are formed, and the bent U-shaped central part continues to these clamping surfaces 22.22 on the outside, and , a side wall surface 23 located slightly outside of both end side surfaces of the ceramic substrate 2 is formed.The other end side of the lead portion 19 is integrally connected to the hoop 15.The stopper portion 21 is The other end of the holding part 20 connected to the lead part 19 is bent into a crank shape, and is formed so that both lower ends of the ceramic substrate 2 inserted into the holding part 20 come into contact.The third terminal 18 is connected only to the lead part 19. It is provided so as to protrude from the hoop 15 near the approximate center of the first terminal 16 and the second terminal 17.
上記のように構成されたこの実施例の電子部品の端子に
圧電共振子１を構成するセラミック基板２を接続固定す
るための作業手順を第２図および第３図に基づいて説明
する。The working procedure for connecting and fixing the ceramic substrate 2 constituting the piezoelectric resonator 1 to the terminals of the electronic component of this embodiment configured as described above will be explained based on FIGS. 2 and 3.
このセラミック基板２は、一方のコンデンサを構成する
第１コンデンサ電極４が、表側の主面における一端側の
端辺に沿って全長に亘って形成され、第１共振子電極３
とは２本の引出電極によって接続されている。また、他
方のコンデンサを構成する第１コンデンサ電極５も、表
側の主面における他端側の端辺に沿って全長に亘って形
成され、他端側上方に形成された接続用電極６と連続し
て一体となっている。裏側の主面上の第２共振子電極７
は、裏側の主面における他端側上方に形成された接続用
電極９に２本の引出電極で接続されている。このように
、第１および第２共振子電極３．７を２本の引出電極で
接続しているのは、この引出電極の断線による製品の歩
留まりの低下を防止するためである。In this ceramic substrate 2, a first capacitor electrode 4 constituting one capacitor is formed along the entire length along one end side of the main surface on the front side, and a first resonator electrode 3
and are connected by two extraction electrodes. Further, the first capacitor electrode 5 constituting the other capacitor is also formed along the entire length along the other end side of the main surface on the front side, and is continuous with the connection electrode 6 formed above the other end side. and become one. Second resonator electrode 7 on the main surface on the back side
is connected by two lead electrodes to a connection electrode 9 formed above the other end side of the main surface on the back side. The reason why the first and second resonator electrodes 3.7 are connected by two lead electrodes in this way is to prevent a decrease in product yield due to disconnection of the lead electrodes.
まず、第２図に示すように、両端の２本の第１端子１６
および第２端子１７の１一方を互いに反対側に倒すよう
に押し広げ保持部分２０．２０の間隔を広げておき、セ
ラミック基板２を上方から矢印Ａ、Ａのように挿入する
。挿入されたセラミック基板２の下端両側が第１端子１
６および第２端子１７のストッパ部分２１．２１に当接
して下方への移動を規制されると、第３図に示すように
、これらの端子１６．１７を押し広げていた力を解除し
て元の位置に戻す。この後、第１端子１６および第２端
子１７の保持部分２０．２０の各挟持面２２および側壁
面２３とセラミック基板２との隙間部分にはんだ２４を
流し込めば、第４図に示すように、はんだ２４がこのわ
ずかな隙間部分に十分に廻り込むので、セラミック基板
２の両主面の両端部にある各電極４，５，６．９が確実
に第１端了１６または第２端子１７に接続される。した
がって、両主面の他端側上方の表裏に形成された接続用
電極６と接続用電極９とは、はんだ２４および第２端子
１７の保持部分２０を介して確実に導通し、第８図に示
す従来と同じ電気回路を構成することができる。また、
表側主面両端に全長に亘って形成された第１コンデンサ
電極４，５に導かれて、はんだ２４が下方まで十分に廻
り込み接続固定を確実なものとすることができる。なお
、はんだ付けの方法としてははんだゴテを用いたり、溶
融はんだ槽中に浸漬することが考えられる以」−説明し
たようにこの実施例の電子部品の端子は、従来と略同様
な電子部品の製造工程でセラミック基板２の両主面に形
成された接続用電極６．９を接続することができるので
、負荷容量を同一基板上に一体化した圧電共振子１を構
成するセラミック基板２であっても、製造工程の自りＪ
化が容易に可能となり、また、傳電接着剤を使用した場
合のような断線のおそれも無くなるので製品の歩留まり
同士を図ることができる。さらに、はんだの方が導電性
接着剤より硬化時間が短いため、日程短縮ができる。そ
して、エレメントの両端部が端子で保持されるのでエレ
メント強度が向」ニする。First, as shown in FIG. 2, the two first terminals 16 at both ends
Then, one of the second terminals 17 is pushed to the opposite side to widen the interval between the holding portions 20 and 20, and the ceramic substrate 2 is inserted from above as shown by arrows A and A. Both sides of the lower end of the inserted ceramic board 2 are the first terminals 1
When the terminals 6 and 17 come into contact with the stopper portions 21.21 and are restricted from moving downward, the force that was pushing these terminals 16.17 apart is released, as shown in FIG. Return to original position. After that, if solder 24 is poured into the gaps between the ceramic substrate 2 and each clamping surface 22 and side wall surface 23 of the holding portions 20 and 20 of the first terminal 16 and the second terminal 17, as shown in FIG. Since the solder 24 sufficiently wraps around this small gap, each electrode 4, 5, 6.9 at both ends of both main surfaces of the ceramic substrate 2 is securely connected to the first terminal 16 or the second terminal 17. connected to. Therefore, the connection electrode 6 and the connection electrode 9 formed on the front and back surfaces above the other end side of both main surfaces are reliably electrically connected via the solder 24 and the holding portion 20 of the second terminal 17, as shown in FIG. The same electric circuit as the conventional one shown in can be constructed. Also,
Guided by the first capacitor electrodes 4 and 5 formed over the entire length on both ends of the front main surface, the solder 24 can sufficiently penetrate downward to ensure a secure connection. As a method of soldering, it is possible to use a soldering iron or immerse it in a bath of molten solder.''As explained above, the terminal of the electronic component in this example is similar to that of the conventional electronic component. Since the connection electrodes 6.9 formed on both main surfaces of the ceramic substrate 2 can be connected in the manufacturing process, the ceramic substrate 2 constituting the piezoelectric resonator 1 in which the load capacitance is integrated on the same substrate can be connected. However, the manufacturing process itself
Furthermore, since there is no risk of wire breakage as would be the case when using a dielectric adhesive, it is possible to improve the yield of the product. Furthermore, since solder has a shorter curing time than conductive adhesive, the production schedule can be shortened. Since both ends of the element are held by terminals, the strength of the element is improved.
第１図はこの発明の実施例で用いる電子部品の端子の斜
視図、第２図および第３図は、同電子部品の端子へのセ
ラミック基板の取付作業を説明するための正面図、第４
図は、セラミック基板取付後の同電子部品の端子の平面
図、第５図は、負荷容量一体型の圧電共振子を構成する
セラミック基板の正面図、第６図は、同セラミック基板
を従来の電子部品の端子に取付けた場合の正面図、第７
図は、同平面図、第８図は、同電子部品の電気回略図で
ある。
２−セラミック基板（方形板状ニレメン１〜）、１６−
第１端子、１７−第２端子、
１８−第３端子、１９−リード部分、
２０−保持部分、２１−ストッパ部分、２２−挟持面、
２３〜側壁面。FIG. 1 is a perspective view of a terminal of an electronic component used in an embodiment of the present invention, FIGS. 2 and 3 are front views for explaining the work of attaching a ceramic substrate to a terminal of the electronic component,
The figure is a plan view of the terminal of the electronic component after it is attached to the ceramic board, Figure 5 is a front view of the ceramic board that constitutes the piezoelectric resonator with integrated load capacitance, and Figure 6 is the same ceramic board as the conventional one. Front view when attached to the terminal of an electronic component, No. 7
The figure is a plan view of the same, and FIG. 8 is an electrical schematic diagram of the electronic component. 2-Ceramic substrate (square plate-shaped Niremen 1~), 16-
1st terminal, 17 - 2nd terminal, 18 - 3rd terminal, 19 - lead part, 20 - holding part, 21 - stopper part, 22 - clamping surface,
23 ~ side wall surface.
Claims (1)
、リード部分と、このリード部分の一方側にあって、方
形板状エレメントの両端部をそれぞれ支持するための保
持部分と、この保持部分に形成され、支持した方形板状
エレメントがリード部分方向に移動するのを規制するた
めのストッパ部分とを有する電子部品において、 両端に配置された２本の端子の各保持部分が、方形板状
エレメントの両主面をそれぞれ両端部においてわずかな
隙間を開けて挟み込むように形成された向かい合う２枚
の挟持面と、この２枚の挟持面に外側で連続し且つ方形
板状エレメントを支持した場合にそれぞれこの方形板状
エレメントの両端側面よりわずかに外側に位置する側壁
面とを有することを特徴とする電子部品。(1) Two or more terminals are arranged, and the two terminals at both ends are connected to a lead part and a holding part on one side of the lead part to respectively support both ends of the rectangular plate element. , and a stopper portion formed on the holding portion to restrict movement of the supported rectangular plate-like element toward the lead portion, in which each holding portion of two terminals arranged at both ends is , two opposing clamping surfaces formed to sandwich both main surfaces of the rectangular plate element with a slight gap at both ends, and a rectangular plate element that is continuous with these two clamping surfaces on the outside. and side wall surfaces located slightly outside of both end side surfaces of the rectangular plate-like element when the electronic component is supported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20787385A JPS6267914A (en) | 1985-09-19 | 1985-09-19 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20787385A JPS6267914A (en) | 1985-09-19 | 1985-09-19 | Electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6267914A true JPS6267914A (en) | 1987-03-27 |
Family
ID=16546961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20787385A Pending JPS6267914A (en) | 1985-09-19 | 1985-09-19 | Electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6267914A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428020U (en) * | 1987-08-07 | 1989-02-17 | ||
| JPH0758413A (en) * | 1993-08-13 | 1995-03-03 | Nec Corp | Optical semiconductor device |
-
1985
- 1985-09-19 JP JP20787385A patent/JPS6267914A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6428020U (en) * | 1987-08-07 | 1989-02-17 | ||
| JPH0758413A (en) * | 1993-08-13 | 1995-03-03 | Nec Corp | Optical semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960012700A (en) | Composite electronic component and manufacturing method thereof | |
| JP6597881B2 (en) | Semiconductor device, metal electrode member, and method of manufacturing semiconductor device | |
| JP3099382B2 (en) | Small oscillator | |
| JPS6267914A (en) | Electronic component | |
| JP2000049042A (en) | Capacitor device | |
| JPS6367908A (en) | Electric parts having two-terminal type piezoelectric resonance element and its production | |
| JPS6267913A (en) | Electronic component | |
| JPH02273725A (en) | Connecting structure for liquid crystal display element | |
| JPS596082B2 (en) | Piezoelectric vibrator holding device | |
| JPH03187510A (en) | Piezoelectric vibrator | |
| JP2000021675A (en) | Lead frame and electronic component manufacturing method using the frame | |
| JPS5853031Y2 (en) | display panel | |
| JP3593237B2 (en) | Vibrator support device | |
| JPH08172334A (en) | Piezoelectric vibrator | |
| JPH08130432A (en) | Holding structure for piezoelectric vibrator | |
| JP2001060842A (en) | Small-sized electronic part | |
| JPS6267915A (en) | Electronic component | |
| JPS6242523Y2 (en) | ||
| JPS6123866Y2 (en) | ||
| JPH08298420A (en) | Composite electronic component | |
| JPH09181217A (en) | Electronic component | |
| JPH0219999Y2 (en) | ||
| JPH052774U (en) | Piezoelectric vibrator | |
| JPH0749861Y2 (en) | Piezoelectric parts | |
| JPH0577972U (en) | Connection structure of electronic parts |