JPS6262738A - Manufacture of laminated plate - Google Patents
Manufacture of laminated plateInfo
- Publication number
- JPS6262738A JPS6262738A JP60203664A JP20366485A JPS6262738A JP S6262738 A JPS6262738 A JP S6262738A JP 60203664 A JP60203664 A JP 60203664A JP 20366485 A JP20366485 A JP 20366485A JP S6262738 A JPS6262738 A JP S6262738A
- Authority
- JP
- Japan
- Prior art keywords
- laminated body
- plastic package
- prepreg
- laminate
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
[技術分野]
本発明は、プリント配線板用の基板などとして用いられ
る積層板の!!遣方法に関するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to a laminated board used as a substrate for a printed wiring board, etc. ! It is related to the method of sending.
[背景技術1
プリント配線板用の基板として用いられる積層板は、フ
ェノール樹脂やエポキシ樹脂、ポリイミド樹脂など熱硬
化性樹脂のフェスを紙や〃ラス地布、〃ラス不織布など
基材に含浸させて加熱乾燥させることによって樹脂をB
ステーノ状態にしたプリプレグ(レシンクロス)を作成
し、このプリプレグを複数枚重ね、さらにこの積agO
の両面あるいは片面に銅箔などの金属箔を重ね、これを
加熱加圧成形することによって製造される。多層のプリ
ント配線板用基板として用いる場合は、このように製造
した片面または両面に金属箔を張った積層板にエツチン
グなどの処理を施して金属箔を蝕刻することによって内
層の回路パターンを作成し、これを内層回路板としてさ
らにこの内層回路板の外面に複数枚のプリプレグを介し
て金属箔を重ね、これを加熱加圧成形することによって
製造される。[Background technology 1] Laminated boards used as substrates for printed wiring boards are made by impregnating a base material such as paper, lath fabric, or lath nonwoven fabric with a thermosetting resin face such as phenol resin, epoxy resin, or polyimide resin. By heating and drying the resin, B
Prepare prepreg (resyncloth) in steno state, stack multiple sheets of this prepreg, and then stack this stacked agO
It is manufactured by layering metal foil such as copper foil on both sides or one side of the plate, and then molding it under heat and pressure. When used as a substrate for a multilayer printed wiring board, the circuit pattern on the inner layer is created by etching the laminate produced in this way with metal foil on one or both sides and etching the metal foil. This is used as an inner layer circuit board, and a metal foil is layered on the outer surface of this inner layer circuit board via a plurality of prepregs, and this is manufactured by heating and press molding.
ここで、成形における加熱加圧は熱源として蒸気や電気
、オイルを用いた油圧プレスなどの8盤によって行なわ
れることになるが、この成形における加圧は通常40
K g/ cm2以上の高圧で行なわれる。すなわち、
プリプレグ内やプリプレグの層間、内層回路板を用いる
ときには内層回路量などに空気が残存しているために、
成形の際に高圧で加圧してこの残存空気を追い出すよう
にしないと積層板にボイドやカスレなどの不良が発生す
ることになるのである。Here, the heating and pressurizing during molding is performed using an 8-press machine such as a hydraulic press that uses steam, electricity, or oil as a heat source, but the pressurizing during this molding is usually 40°C.
It is carried out at high pressures of K g/cm2 or higher. That is,
When using an inner layer circuit board, air may remain inside the prepreg, between the layers of the prepreg, or in the inner layer circuit board.
Unless this residual air is expelled by applying high pressure during molding, defects such as voids and scratches will occur in the laminate.
しかし、このように高圧で加圧を行うと、成形時の樹脂
の流れが大きくなり、また積層板の内部残留歪みが大き
く残り、この結集積層板の板厚のバラツキや寸法変化、
反り、ネジレが大ぎく発生するという問題や、樹脂の多
量の流出で積層板内の樹脂量が実質的に不足して耐熱性
が低下するという問題が生じるものであった。However, when pressurized at such high pressures, the flow of resin during molding becomes large, and a large amount of internal residual strain remains in the laminate, resulting in variations in the thickness and dimensional changes of the assembled laminate.
Problems such as severe warpage and twisting occur, and a problem that a large amount of resin leaks out causes a substantial shortage of resin in the laminate, resulting in a decrease in heat resistance.
[発明の目的]
本発明は、上記の点に鑑みて為されたものであり、低圧
で成形を行うことができ、板厚のバラツキや寸法変化、
反りなどを低減で外ると共に耐熱性を向上させることが
できる積層板の製造方法を提供することを目的とするも
のである。[Object of the Invention] The present invention has been made in view of the above points, and can perform molding at low pressure, and eliminates variations in plate thickness, dimensional changes, and
It is an object of the present invention to provide a method for manufacturing a laminate that can reduce warping and the like and improve heat resistance.
[発明の開示]
しかして、本発明に係る積層板の製造方法は、基材に樹
脂を含浸乾燥して作成されるプリプレグ1を複数枚重ね
ると共にこのプリプレグ積載物4の片側又は両側に金属
i6を積載し、次いでこの積層体5をプラスチック包装
体内2に気密的に収納した後プラスチック包装体2内を
減圧状態とし、その後プラスチック包装体2を熱gI:
3間にセットして熱盤3によって積層体5を加熱加圧し
て成形を行うことを特徴とするものであって、!!層体
5を減圧状態のプラスチック包装体2内に収納した状態
で加熱加圧することにより、積層体5内部の空気などが
スムーズに除去できるようにして上記目的を達成したも
のである。以下本発明の詳細な説明する。[Disclosure of the Invention] Accordingly, the method for producing a laminate according to the present invention involves piling up a plurality of prepregs 1 made by impregnating and drying a base material with a resin, and adding metal i6 on one or both sides of the prepreg stack 4. is loaded, and then this laminate 5 is airtightly stored in the plastic package 2, the inside of the plastic package 2 is reduced in pressure, and then the plastic package 2 is heated to gI:
It is characterized in that the laminate 5 is heated and pressurized by a hot platen 3 to form the laminate 5. ! By heating and pressurizing the layered body 5 housed in the plastic package 2 under reduced pressure, the air inside the layered body 5 can be smoothly removed, thereby achieving the above object. The present invention will be explained in detail below.
プリプレグ1はフェノール樹脂やエポキシ樹脂、ポリイ
ミド樹脂など熱硬化性樹脂のフェスを紙や〃ラス織布、
ガラス不織布など基材に含浸させて加熱乾燥させること
によって樹脂をBステージ状態にし、レシンクロスとし
て511製されるもので、第1図(a)に示すようにこ
のプリプレグ1を複数枚重ねると共にこのようにして得
られるプリプレグ積載物4の片面あるいは両面に銅箔な
どの金属箔6を重ね(第1図(b))、この積層体5を
一段として金型プレート7を介して多数段積載し、加熱
加圧による積層成形に供するものである。そして本発明
においては、上記積層体5の上下面にプレー)7.7を
重ねた後、このものをプラスチック包装体2内に収納し
、この状態でプラスチック包装体2内を真空ポンプなど
の減圧装置を用いてプラスチック包装体2内の空気を抜
(ことにより減圧状態にするのである1次いで、このプ
ラスチック包装体2を第1図(d)から第1図(e)の
ように上下一対のクッシシン材8,8間にはさんでキャ
リアプレート9上に載置し、第2図のようにさらにこれ
を上記一対の熱盤3,3間にセットし、次いで熱盤3,
3によってプラスチック包装体2内の積層体5を加熱加
圧成形するのである。ここで、プラスチック包装体2は
150℃程度の温度に酎える耐熱性と、300Torr
程度以上の真空状態を維持できる気密性を有するフィル
ム、例えばトリアセテートフィルム、ポリエチレンテレ
フタレートフィルム、ポリプロピレンフィルム、ポリア
ミドフィルムなどを用いることができる。また、熱盤3
,3は、熱源として蒸気、電気、オイルなどを用いて加
熱され、また油圧プレス機構などを用いて加圧を行うこ
とができるように形成しである。その後、プラスチック
包装体2内から積層板を取り出して所定寸法に切断する
ものである。Prepreg 1 is a fabric made of thermosetting resin such as phenolic resin, epoxy resin, or polyimide resin, and is made of paper, lath woven cloth,
The resin is made into a B-stage state by impregnating it into a base material such as glass non-woven fabric and heating and drying it, and it is manufactured as Resin Cloth 511. A metal foil 6 such as copper foil is layered on one or both sides of the prepreg loaded material 4 obtained by (FIG. 1(b)), and this laminate 5 is stacked in multiple stages via a mold plate 7 as one layer. It is used for lamination molding by heating and pressurizing. In the present invention, after the layers 7 and 7 are stacked on the upper and lower surfaces of the laminate 5, this is stored inside the plastic package 2, and in this state, the inside of the plastic package 2 is depressurized using a vacuum pump or the like. The air inside the plastic package 2 is evacuated (thereby reducing the pressure) using a device. Next, the plastic package 2 is separated into a pair of upper and lower parts as shown in FIGS. It is placed on the carrier plate 9 between the cushioning materials 8, 8, and further set between the pair of heating plates 3, 3 as shown in FIG.
3, the laminate 5 inside the plastic package 2 is molded under heat and pressure. Here, the plastic packaging body 2 has a heat resistance that can reach a temperature of about 150°C and a temperature of 300 Torr.
A film having airtightness capable of maintaining a vacuum state of a certain level or higher, such as a triacetate film, a polyethylene terephthalate film, a polypropylene film, a polyamide film, etc., can be used. Also, hot plate 3
, 3 are formed so that they can be heated using steam, electricity, oil, etc. as a heat source, and can be pressurized using a hydraulic press mechanism or the like. Thereafter, the laminate is taken out from inside the plastic package 2 and cut into a predetermined size.
このようにしてプリプレグ1と金属M6とを積層した積
層板を得ることができるものであるが、この成形を行う
にあたって、プラスチック包装体2内は減圧状態にある
ためにプラスチック包装体2内の空気が除去され、プリ
プレグ1内やプリプレグ1,1の層間及びプリプレグ1
と金属箔6との間などに残留する空気が除去された状態
で成形が行なわれることになり、従って高圧で加圧して
成形を行って空気の除去を行うような必要がなく、低圧
の加圧でもボイドやカスレなどの不良の発生のおそれな
く成形を行うことができることになるものである0例え
ば、従来40 K g/ 0m2以上の圧力で成形を行
う必要のあったものが、20Kg/c−2以下の圧力に
よる成形が可能になるものである。In this way, a laminate in which the prepreg 1 and the metal M6 are laminated can be obtained, but when performing this molding, the inside of the plastic package 2 is in a reduced pressure state, so the air inside the plastic package 2 is is removed, and inside prepreg 1, between the layers of prepregs 1 and 1, and in prepreg 1
The molding is performed after the air remaining between the metal foil 6 and the metal foil 6 is removed, and therefore there is no need to perform molding under high pressure to remove air. This means that molding can be performed even under high pressure without the risk of defects such as voids and scratches.For example, molding that conventionally required molding at a pressure of 40 Kg/0 m2 or more has been reduced to 20 Kg/cm2. This allows molding with a pressure of -2 or less.
また、減圧装置を熱外3の成形設備の前に設置すること
1こより、プラスチック包装体2内の減圧がイテえるも
のであって、成形設備自体を改良する必要がなく、既存
の熱!13をそのまま用いることができて成形設備を変
更する必要がな(1ものである。In addition, by installing a pressure reducing device in front of the molding equipment in the heat exchanger 3, the pressure inside the plastic packaging body 2 can be reduced, and there is no need to improve the molding equipment itself, and the existing heat exchanger 3 can be used. No. 13 can be used as is, and there is no need to change the molding equipment.
しかも、クッション材8はプラスチック包装体2内に入
れないため、クッション材8から発生する蒸気の特別な
対策を必要としないものである6次に、本発明の評価に
ついて説明すると、FR−=>クラスのエポキシ樹脂を
用いた4wIのプリント配線板用の積層板(サイズ51
0X340non、成形後厚み1.6mIn)を作成す
るにあたって、従来の減圧を伴わないで圧力40 K
g/ cm2の高圧で成形を行った場合(従来例)、減
圧を伴わないで圧力20 K H/ cm2の低圧で成
形を行った場合(比較例)、プラスチック包装体2内に
積層体5を収納した後、プラスチック包装体2内の空気
を抜き、その後熱板3.3間にはさんで20 K g/
cm”の低圧で成形を行った場合(実施例)のそれぞ
れについて特性を測定した結果、次表のような結果を得
た。Moreover, since the cushioning material 8 is not placed inside the plastic package 2, there is no need to take special measures against the steam generated from the cushioning material 8.Next, the evaluation of the present invention will be explained.FR-=> Laminated board for 4wI printed wiring board using class epoxy resin (size 51
0x340non, thickness 1.6 mIn after molding), the pressure was 40 K without the conventional depressurization.
When molding is performed at a high pressure of g/cm2 (conventional example), when molding is performed at a low pressure of 20 KH/cm2 without depressurization (comparative example), the laminate 5 is placed inside the plastic package 2. After being stored, the air inside the plastic package 2 is removed, and then the package is placed between hot plates 3 and 20 Kg/3.
As a result of measuring the characteristics of each of the cases where molding was carried out at a low pressure of "cm" (Example), the results shown in the following table were obtained.
前表の結果、実施例のものではボイドの発生なく成形イ
テうことができ、また板厚のバラツキや反り、寸法変化
が小さく、さらに耐熱性につν・でも優れていることが
確認された。As shown in the table above, it was confirmed that the products of the examples could be molded without voids, had little variation in plate thickness, warpage, and dimensional changes, and had excellent heat resistance in terms of ν. .
[発明の効果]
上述のように本発明は、プリプレグを複数枚重ねて形成
されるプリプレグ積載物の片側又は両側に金属箔を積載
し、次いでこの積層体をプラスチック包装体内に気密的
に収納した後プラスチック包装体内を減圧状態とし、そ
の後プラスチック包装体を熱盤間にセントして熱外tこ
よって積層体を加熱加圧して成形を行うようにしたので
、プリプレグ内やプリプレグの層間及びプリプレグと金
属箔との間などに残留する空気が除去された状態で成形
が行なわれること(こなり、低圧あ加圧でもボイドやカ
スレなどの不良の発生のおそれなく成形を行うことがで
きることになるものであって、積層板の板厚のバラツキ
や寸法変化、反りなどを低減できると共に耐熱性を向上
させることができるものである。[Effects of the Invention] As described above, the present invention has a method in which metal foil is loaded on one or both sides of a prepreg stack formed by stacking a plurality of prepregs, and then this laminate is airtightly housed in a plastic package. After that, the pressure inside the plastic package was reduced, and then the plastic package was placed between hot platens, and the laminate was heated and pressurized to perform molding. Forming is performed with air remaining between the metal foil and the like removed (this means that molding can be performed without the risk of defects such as voids and scratches even under low pressure). Therefore, it is possible to reduce variations in plate thickness, dimensional changes, warpage, etc. of the laminate, and to improve heat resistance.
NS1図(、)乃至(e)は本発明の一実施例の!l!
造Jj法を示す説明図、第2図は同上の分解断面図であ
る。
1はプリプレグ、2はプラスチック包装体、3は熱外、
4はプラスチック積載物、5は積84木、6は金属箔で
ある。NS1 diagrams (,) to (e) are of one embodiment of the present invention! l!
FIG. 2 is an explanatory diagram showing the construction Jj method, and FIG. 2 is an exploded cross-sectional view of the same. 1 is prepreg, 2 is plastic packaging, 3 is extrathermal,
4 is a plastic load, 5 is a stack of 84 wood, and 6 is a metal foil.
Claims (1)
を複数枚重ねると共にこのプリプレグ積載物の片側又は
両側に金属箔を積載し、次いでこの積層体をプラスチッ
ク包装体内に気密的に収納した後プラスチック包装体内
を減圧状態とし、その後プラスチック包装体を熱盤間に
セットして熱盤によって積層体を加熱加圧して成形を行
うことを特徴とする積層板の製造方法。(1) A plurality of prepregs made by impregnating and drying a base material with resin are stacked, metal foil is loaded on one or both sides of the prepreg stack, and then this laminate is airtightly housed in a plastic package. A method for manufacturing a laminate, comprising: reducing the pressure inside the plastic package, then setting the plastic package between hot plates, and heating and pressurizing the laminate with the hot plate to perform molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60203664A JPS6262738A (en) | 1985-09-13 | 1985-09-13 | Manufacture of laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60203664A JPS6262738A (en) | 1985-09-13 | 1985-09-13 | Manufacture of laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6262738A true JPS6262738A (en) | 1987-03-19 |
Family
ID=16477806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60203664A Pending JPS6262738A (en) | 1985-09-13 | 1985-09-13 | Manufacture of laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6262738A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6451942A (en) * | 1987-08-21 | 1989-02-28 | Toshiba Chem Corp | Reduced pressure forming device for laminated plate |
-
1985
- 1985-09-13 JP JP60203664A patent/JPS6262738A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6451942A (en) * | 1987-08-21 | 1989-02-28 | Toshiba Chem Corp | Reduced pressure forming device for laminated plate |
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