JPS6262467U - - Google Patents
Info
- Publication number
- JPS6262467U JPS6262467U JP15415185U JP15415185U JPS6262467U JP S6262467 U JPS6262467 U JP S6262467U JP 15415185 U JP15415185 U JP 15415185U JP 15415185 U JP15415185 U JP 15415185U JP S6262467 U JPS6262467 U JP S6262467U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductor pattern
- mounting surface
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 1
Description
第１Ａ図は本考案の第一実施例によるプリント
基板に部品を実装した状態を示す斜視図、第１Ｂ
図はその断面図、第２Ａ図は絶縁体を形成する前
のプリント基板を示す平面図、第２Ｂ図はその断
面図、第３Ａ図は絶縁体を形成した後のプリント
基板を示す平面図、第３Ｂ図はその断面図、第４
Ａ図は他の実施例によるプリント基板に部品を実
装する状態を示す分解斜視図、第４Ｂ図は実装さ
れた状態を示す斜視図、第５Ａ図は従来のプリン
ト基板に部品が実装された状態を示す斜視図、第
５Ｂ図はその断面図である。
１１……プリント基板、１２ａ，１２ｂ……導
体パターン、１３ａ，１３ｂ……レジスト膜、１
４……絶縁体、１５……部品、１５ａ……取付脚
。
Fig. 1A is a perspective view showing a state in which components are mounted on a printed circuit board according to the first embodiment of the present invention, Fig. 1B
2A is a plan view showing the printed circuit board before forming an insulator, FIG. 2B is a sectional view thereof, and FIG. 3A is a plan view showing the printed circuit board after forming an insulator. Figure 3B is a cross-sectional view of the
Figure A is an exploded perspective view showing a state in which components are mounted on a printed circuit board according to another embodiment, Figure 4B is a perspective view showing a mounted state, and Figure 5A is a state in which components are mounted on a conventional printed circuit board. FIG. 5B is a sectional view thereof. 11...Printed board, 12a, 12b...Conductor pattern, 13a, 13b...Resist film, 1
4...Insulator, 15...Parts, 15a...Mounting leg.
Claims (1)
且つ部品実装面に接する部分が金属製である部品
が、この導体パターン上に実装されるプリント基
板において、部品実装面上の前記部品が接する部
分には、導体パターンを覆う絶縁体が印刷によつ
て付着形成されていることを特徴とするプリント
基板。 A conductor pattern is formed on the component mounting surface.
In addition, in a printed circuit board in which a component whose part that contacts the component mounting surface is made of metal is mounted on this conductor pattern, an insulator covering the conductor pattern is printed on the part of the component mounting surface that is in contact with the component. A printed circuit board characterized in that a printed circuit board is formed by adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15415185U JPS6262467U (en) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15415185U JPS6262467U (en) | 1985-10-07 | 1985-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6262467U true JPS6262467U (en) | 1987-04-17 |
Family
ID=31073683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15415185U Pending JPS6262467U (en) | 1985-10-07 | 1985-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6262467U (en) |
-
1985
- 1985-10-07 JP JP15415185U patent/JPS6262467U/ja active Pending