JPS6260091U - - Google Patents
Info
- Publication number
- JPS6260091U JPS6260091U JP15073285U JP15073285U JPS6260091U JP S6260091 U JPS6260091 U JP S6260091U JP 15073285 U JP15073285 U JP 15073285U JP 15073285 U JP15073285 U JP 15073285U JP S6260091 U JPS6260091 U JP S6260091U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- chip component
- chip
- conductive
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例にかかる混成集積回路
の斜視図。第２図は同じものの正面図、第３図は
従来例に係る混成集積回路の斜視図。第４図は従
来例に係る混成集積回路の斜視図。
１１……セラミツク基板、１２……導体パター
ン、１３……チツプ部品、１４……チツプ素子、
１５……金線、１６……筐体。
FIG. 1 is a perspective view of a hybrid integrated circuit according to an embodiment of the present invention. FIG. 2 is a front view of the same device, and FIG. 3 is a perspective view of a conventional hybrid integrated circuit. FIG. 4 is a perspective view of a conventional hybrid integrated circuit. 11... Ceramic substrate, 12... Conductor pattern, 13... Chip component, 14... Chip element,
15...gold wire, 16...casing.
Claims (1)
導体パターンが形成され導電性接着剤によつて筐
体に接着された基板と、基板の上の導体パターン
の上に固着されたチツプ部品と、筐体面に固着さ
れた少なくともひとつのチツプ部品又はチツプ素
子とよりなり、チツプ部品、チツプ素子と基本回
路上の導体パターンとは導電性ワイヤによつて接
続されている事を特徴とする混成集積回路。 A metal casing, a board with a conductive pattern formed on its surface excluding the ground part and bonded to the casing with conductive adhesive, and a chip component fixed onto the conductive pattern on the board. and at least one chip component or chip element fixed to the casing surface, and the chip component or chip element and the conductor pattern on the basic circuit are connected by a conductive wire. integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073285U JPS6260091U (en) | 1985-10-01 | 1985-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073285U JPS6260091U (en) | 1985-10-01 | 1985-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260091U true JPS6260091U (en) | 1987-04-14 |
Family
ID=31067138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15073285U Pending JPS6260091U (en) | 1985-10-01 | 1985-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260091U (en) |
-
1985
- 1985-10-01 JP JP15073285U patent/JPS6260091U/ja active Pending